CN217770463U

CN217770463U - Low-power consumption integrated circuit mechanism

Info

Publication number: CN217770463U
Application number: CN202221360134.0U
Authority: CN
Inventors: 顾卫钢; 郭巍; 李跃威; 苏申
Original assignee: Nanjing Rui Tu Youte Mdt Infotech Ltd
Current assignee: Nanjing Rui Tu Youte Mdt Infotech Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-11-08
Anticipated expiration: 2032-05-31

Abstract

The utility model discloses a low-power consumption integrated circuit mechanism, including two long backplate and two short backplate, long backplate both sides are equipped with first guide way and second guide way respectively, the inside first centre gripping groove that is equipped with of long backplate, long backplate both ends are equipped with a first telescopic shaft respectively, first telescopic shaft includes first thick axis body and first thin axis body, first thin axis body stretches into first guide way, and the outer lane of first thin axis body is equipped with first compression spring, short backplate both sides are equipped with third guide way and fourth guide way respectively, the inside second centre gripping groove that is equipped with of short backplate, short backplate both ends are equipped with a second telescopic shaft respectively, the second telescopic shaft includes the thick axis body of second and the thin axis body of second, the thin axis body of second stretches into the third guide way, and the outer lane of the thin axis body of second is equipped with second compression spring, adjacent long backplate and end backplate are connected through connecting the tube head, connecting tube head lower part is equipped with bradyseism pad foot.

Description

Low-power consumption integrated circuit mechanism

Technical Field

The utility model relates to a low-power consumption integrated circuit field, especially a low-power consumption integrated circuit mechanism.

Background

The low-power consumption integrated circuit generally comprises a circuit board and a circuit board framework, wherein the circuit board is mounted on the circuit board framework through screws, a plurality of components are welded on the circuit board, and if the circuit board framework receives vibration or extrusion, the circuit board is easily damaged, and the use is influenced.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: the utility model aims to solve the technical problem that to prior art not enough, provide a low-power consumption integrated circuit mechanism.

In order to solve the technical problem, the utility model discloses a low-power consumption integrated circuit mechanism, including two long backplate and two short backplates, long backplate both sides are equipped with first guide way and second guide way respectively, the inside first centre gripping groove that is equipped with of long backplate, long backplate both ends are equipped with a first telescopic shaft respectively, first telescopic shaft includes first thick axis body and first thin axis body, first thin axis body stretches into first guide way, and the outer lane of first thin axis body is equipped with first compression spring, short backplate both sides are equipped with third guide way and fourth guide way respectively, the inside second centre gripping groove that is equipped with of short backplate, short backplate both ends are equipped with a second telescopic shaft respectively, the second telescopic shaft includes the thick axis body of second and the thin axis body of second, the thin axis body of second stretches into the third guide way, and the outer lane of the thin axis body of second is equipped with second compression spring, adjacent long backplate and connection end backplate are connected through connecting tube head, the tube head lower part is equipped with bradyseism and fills up the foot.

The utility model discloses in, the cushioning pad foot includes bellows, damping spring, upper junction plate and bottom suspension fagging, and damping spring sets up inside the bellows, and damping spring and bellows are connected respectively from top to bottom and are connected connecting plate and bottom suspension fagging, and the upper junction plate is connected to connector head bottom.

The utility model discloses in, first compression spring both ends respectively the butt in first thick axis body and long backplate side.

The utility model discloses in, second compression spring both ends respectively the butt in the thick axis body of second and short backplate side.

The utility model discloses in, long backplate and short backplate are the rubber material.

Has the beneficial effects that: the utility model discloses can realize the bradyseism on circuit skeleton both sides and the vertical side, omnidirectional protection circuit board prevents that the circuit board from damaging because of receiving the vibrations.

Drawings

These and/or other advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings and the following detailed description.

Fig. 1 is a schematic structural view.

Detailed Description

Example (b):

referring to fig. 1, the embodiment provides a low power consumption integrated circuit mechanism, which includes a long guard plate 1, a short guard plate 2, a first guide groove 3, a first clamping groove 4, a first telescopic shaft 5, a first compression spring 6, a third guide groove 7, a second clamping groove 8, a second telescopic shaft 9, a second compression spring 10, a connector 11, and a shock absorption pad 12;

the two short guard plates 2 are arranged on the two sides of the long guard plate, a first guide groove 3 and a second guide groove are formed in the two sides of the long guard plate respectively, a first clamping groove 4 is formed in the long guard plate, first telescopic shafts 5 are arranged at the two ends of the long guard plate respectively, each first telescopic shaft comprises a first thick shaft body 5a and a first thin shaft body 5b, each first thin shaft body extends into the corresponding first guide groove, a first compression spring 6 is arranged on the outer ring of each first thin shaft body, third guide grooves 7 and fourth guide grooves are formed in the two sides of the short guard plate respectively, a second clamping groove 8 is formed in the short guard plate, second telescopic shafts 9 are arranged at the two ends of the short guard plate respectively, each second telescopic shaft comprises a second thick shaft body 9a and a second thin shaft body 9b, each second thin shaft body extends into the corresponding third guide groove, a second compression spring 10 is arranged on the outer ring of each second thin shaft body, the adjacent long guard plates and the adjacent end guard plates are connected through a connecting pipe head 11, and cushioning pad feet 12 are arranged on the lower portion of the connecting pipe head.

In this embodiment, the shock pad foot includes bellows, damping spring, upper junction plate and bottom suspension fagging, and damping spring sets up inside the bellows, and damping spring and bellows are connected upper and lower connecting plate and bottom suspension fagging respectively from top to bottom, and the upper junction plate is connected to connector tube head bottom.

In this embodiment, two ends of the first compression spring respectively abut against the first thick shaft and the side surface of the long guard plate.

In this embodiment, two ends of the second compression spring respectively abut against the second thick shaft and the side surface of the short guard plate.

In this embodiment, the long guard plate and the short guard plate are made of rubber.

When the circuit board is used, as shown in fig. 1, the first clamping groove 4 and the second clamping groove 8 of the long guard plate 1 and the short guard plate 2 are respectively and correspondingly inserted into four sides of the circuit board framework 13, then the adjacent first telescopic shaft 5 and the second telescopic shaft 9 are respectively connected by four connector heads, after the circuit board framework 13 is installed, the side extrusion force of the circuit board framework can be buffered by the first compression spring 6 and the second compression spring 10, and the pressure in the vertical direction is buffered by the corrugated pipe and the damping spring of the damping pad foot 12.

The utility model provides a thinking and method of low-power consumption integrated circuit mechanism specifically realize this technical scheme's method and approach many, above only the utility model discloses a preferred embodiment should point out, to the ordinary skilled person in this technical field, is not deviating from the utility model discloses under the prerequisite of principle, can also make a plurality of improvements and moist decorations, these improvements should also be regarded as with moist decorations the utility model discloses a protection scope. All the components not specified in this embodiment can be implemented by the prior art.

Claims

1. The utility model provides a low-power consumption integrated circuit mechanism, a serial communication port, including two long backplate and two short backplate, long backplate both sides are equipped with first guide way and second guide way respectively, the inside first centre gripping groove that is equipped with of long backplate, long backplate both ends are equipped with a first telescopic shaft respectively, first telescopic shaft includes first thick axis body and first thin axis body, first thin axis body stretches into first guide way, and the outer lane of first thin axis body is equipped with first compression spring, short backplate both sides are equipped with third guide way and fourth guide way respectively, the inside second centre gripping groove that is equipped with of short backplate, short backplate both ends are equipped with a second telescopic shaft respectively, the second telescopic shaft includes thick axis body of second and the thin axis body of second, the thin axis body of second stretches into the third guide way, and the outer lane of the thin axis body of second is equipped with second compression spring, adjacent long backplate and end are connected through the connector tube head, connector tube head lower part is equipped with the bradyseism foot pad.

2. The low power consumption integrated circuit mechanism of claim 1, wherein the shock absorption pad comprises a corrugated tube, a shock absorption spring, an upper connection plate and a lower support plate, the shock absorption spring is disposed inside the corrugated tube, the shock absorption spring and the corrugated tube are respectively connected with the upper connection plate and the lower support plate at the upper and lower sides, and the upper connection plate is connected to the bottom of the connector.

3. The IC mechanism of claim 1, wherein two ends of the first compression spring are respectively abutted against the first thick shaft and the side surface of the long guard plate.

4. The IC mechanism of claim 1, wherein two ends of the second compression spring abut against the second thick shaft and the side surface of the short guard plate, respectively.

5. A mechanism as claimed in claim 1, wherein the long shield and the short shield are made of rubber.