CN217769070U

CN217769070U - Semiconductor laser

Info

Publication number: CN217769070U
Application number: CN202222116593.0U
Authority: CN
Inventors: 朱兵兵; 周杰
Original assignee: Sansui Optical Technology Suzhou Co ltd
Current assignee: Sansui Optical Technology Suzhou Co ltd
Priority date: 2022-08-12
Filing date: 2022-08-12
Publication date: 2022-11-08
Anticipated expiration: 2032-08-12

Abstract

The application provides a semiconductor laser, includes: the laser device comprises a laser device shell, wherein a positioning hole is formed in the laser device shell; the lens fixing piece is inserted into the positioning hole in the laser shell and is provided with a through hole along the axis; the coupling lens or the coupling lens group is arranged in the through hole of the lens fixing piece; one or more groups of collimation light sources arranged inside the laser shell, wherein the collimation light sources are coaxial with the coupling lens or the coupling lens group; the movable piece, one end of the said movable piece is connected with said lens fixed part, the said movable piece is cylindrical; and the tail fiber component is coaxially spliced with the movable piece. The semiconductor laser takes the tail fiber as an independent part and can couple the optical fiber through the fixed lens. In the coupling process, the coupling adjustment in the up-down, left-right, front-back directions can be realized by adjusting the position of the tail fiber, the adjustable range is larger, and the coupling efficiency is improved.

Description

Semiconductor laser

Technical Field

The utility model relates to a semiconductor laser's coupling technique especially relates to a semiconductor laser.

Background

The semiconductor laser has the advantages of wide wavelength range, high efficiency, long service life, small volume, light weight and the like, and is widely applied to the fields of industry, agriculture, medical treatment, communication and the like, so that the semiconductor laser needs to have diversified characteristics on structure to meet the use requirement.

The tail fiber of the existing semiconductor laser is usually fixed on the shell of the laser before coupling, and light is coupled into the core of the optical fiber by adjusting the coupling lens during coupling. Since the coupling lens is bonded by glue, the movable range of the coupling lens is too small, resulting in low coupling efficiency and high coupling quality requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor laser's tail optical fiber structure through changing tail optical fiber connection structure, can promote coupling efficiency to reduce material cost.

The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

According to the utility model discloses an aspect provides a semiconductor laser, include:

the laser device comprises a laser device shell, wherein a positioning hole is formed in the laser device shell;

the lens fixing piece is inserted into the positioning hole in the laser shell, and a through hole is formed in the lens fixing piece along the axis;

the coupling lens or the coupling lens group is arranged in the through hole of the lens fixing piece;

one or more groups of collimation light sources arranged inside the laser shell, wherein the collimation light sources are coaxial with the coupling lens or the coupling lens group;

the lens fixing piece is connected with the lens fixing piece, and the lens fixing piece is cylindrical; and

and the tail fiber assembly is coaxially spliced with the movable piece.

In one embodiment, the lens holder includes a cylindrical section and a first contact surface extending radially outward from an end of the cylindrical section, and the movable member is connected to the first contact surface.

In one embodiment, the method comprises the following steps: the movable piece is connected with the first contact surface in a welding mode.

In one embodiment, the pigtail assembly comprises:

one end of the metal piece is coaxially inserted into the moving piece and is fixedly connected with the moving piece;

the optical fiber penetrates through the metal piece; and

and the sleeve is sleeved outside the other end of the metal piece.

In one embodiment, the movable member is welded to the metal member.

In an embodiment, the metal member includes a first connection portion, a protruding portion and a second connection portion, the movable member is sleeved outside the first connection portion, the sleeve is sleeved outside the second connection portion, and the protruding portion separates the first connection portion from the second connection portion.

In an embodiment, the metal member and the optical fiber, and the metal member and the sleeve are bonded together by pressing.

In an embodiment, the coupling lens or the coupling lens group is bonded to the lens holder by glue.

In one embodiment, the lens holder is welded to the laser housing.

The embodiment of the utility model provides a beneficial effect is: by arranging the moving part, the optical fiber can be freely adjusted in three directions during coupling, so that the optical fiber can be coupled through the fixed lens, the traditional structure that the fixed optical fiber is used for coupling the lens is replaced, the adjustable range during coupling is large, the concentricity requirement of the collimation light source and the coupling lens is reduced, errors generated by the collimation light source due to the patch precision can be eliminated, and the coupling efficiency is improved. Compared with the traditional mode, the coupling lens has more diversified types; meanwhile, the glue bonding cushion block of the coupling lens during coupling is removed, and the material cost is saved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on these drawings without inventive efforts.

The above features and advantages of the present invention will be better understood after reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components having similar associated characteristics or features may have the same or similar reference numerals.

Fig. 1 is a schematic diagram of the explosion structure of the present invention;

FIG. 2 is a schematic cross-sectional view of an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a pigtail assembly of an embodiment of the present application;

wherein: 100-a laser housing; 110-positioning holes; 200-a collimated light source; 300-coupling lens or lens group; 400-a lens mount; 410-a cylindrical section; 420-a first contact surface; 430-through holes; 500-moving parts; 600-a pigtail assembly; 610-a metal piece; 611-a first connection; 612-a projection; 613-second connection; 620-an optical fiber; 630-sleeve.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It is noted that the aspects described below in connection with the figures and the specific embodiments are only exemplary and should not be understood as imposing any limitation on the scope of the present invention.

As shown in fig. 1 and fig. 2, an embodiment of the present application provides a semiconductor laser, which includes a laser housing 100, and a positioning hole 110 is formed in the laser housing 100. The lens fixing member 400 is disposed in the positioning hole 110, and a through hole 430 is disposed on the lens fixing member 400 along an axis. The coupling lens or coupling lens group 300 is disposed in the through hole 430 of the lens holder 400. The coupling lens or coupling lens group 300 and the lens holder 400 may be bonded by glue. One or more sets of collimated light sources 200 are disposed inside the laser housing 100, and the collimated light sources 200 are coaxial with a coupling lens or coupling lens group 300. A pigtail assembly 600 is disposed outside the laser housing 100, and the pigtail assembly 600 is connected to the laser housing 100 by a movable member 500. The movable member 500 is cylindrical, one end of the movable member is connected to the lens holder 400, and the pigtail assembly 600 is coaxially inserted into the movable member 500.

During assembly, the coupling lens or the coupling lens assembly 300 is first fixedly connected with the lens fixing member 400 in a glue bonding manner. The lens holder 400 is then fixed by welding in the positioning hole 110 of the laser housing 100. Then, one or more groups of devices of the collimated light source 200 are fixed in the laser housing 100 through the processes of surface mounting, routing, coupling and the like. In this case, it is necessary to ensure that the collimated light source 200 is concentric with the lens holder 400 and is kept at a certain distance from the coupling lens or the coupling lens group 300. The light from the collimated light source 200 is focused at a point behind the lens holder 400 by the coupling lens or lens assembly 300. Installation of the pigtail assembly 600 then occurs. First, one end of the movable member 500 is tightly attached to the lens holder 400, and the other end is coaxially inserted into the pigtail assembly 600. At this time, because the fixing is not performed, the movable member 500 can be adjusted in a moving manner in all directions, and the splicing depth of the tail fiber assembly 600 can also be adjusted in the length direction, so that the coupled focus point of the collimated light source 200 can be coupled into the tail fiber assembly. After the coupling is completed, the movable member 500 and the tail fiber assembly 600 are fixed by welding.

In order to ensure a sufficient range of motion of the movable member 500, in a possible embodiment, the lens holder includes a cylindrical section 410 and a first contact surface 420 extending radially outward from an end of the cylindrical section 410, and the movable member 500 is connected to the first contact surface 420 by welding or the like.

As shown in fig. 3, the pigtail assembly 600 comprises a metal piece 610, an optical fiber 620, and a ferrule 630; one end of the metal member 610 is coaxially inserted into the moving member 500 and is welded to the moving member 500. The optical fiber 620 is inserted into the metal member 610, and the sleeve 630 is sleeved outside the other end of the metal member 610.

Specifically, the metal member 610 includes a first connection portion 611, a protruding portion 612 and a second connection portion 613, the movable member 500 is sleeved outside the first connection portion 611, the sleeve 630 is sleeved outside the second connection portion 613, and the protruding portion 612 separates the first connection portion 611 and the second connection portion 613. The metal member 610 and the optical fiber 620, and the metal member 610 and the sleeve 630 are bonded together by pressing.

To sum up, the semiconductor laser that this application embodiment provided, through changing the tail optical fiber structure, lens are fixed during the coupling, have replaced traditional optic fibre to fix and have removed the mode that lens carried out the coupling. The adjustable range of the tail fiber during coupling is large, so that the concentricity requirement of the collimating light source and the coupling lens is reduced, errors of the collimating light source caused by the patch precision can be eliminated, and the coupling efficiency is improved. Compared with the traditional mode, the coupling lens has more diversified types; meanwhile, the glue bonding cushion block of the coupling lens during coupling is removed, and the material cost is saved.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The above description is only a preferred example of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor laser, comprising:

and the tail fiber assembly is coaxially inserted and connected with the moving part.

2. The semiconductor laser of claim 1, wherein said lens holder includes a cylindrical section and a first contact surface extending radially outward from an end of said cylindrical section, said movable member being connected to said first contact surface.

3. A semiconductor laser as claimed in claim 2 wherein the movable member is soldered to the first contact surface.

4. The semiconductor laser of claim 1, wherein the pigtail assembly comprises:

one end of the metal piece is coaxially inserted into the movable piece and is fixedly connected with the movable piece;

the optical fiber is arranged in the metal piece in a penetrating way; and

and the sleeve is sleeved outside the other end of the metal piece.

5. A semiconductor laser as claimed in claim 4 wherein the movable member is soldered to the metallic member.

6. The semiconductor laser of claim 4, wherein the metallic element comprises a first connection portion, a protrusion portion, and a second connection portion, wherein the movable element is sleeved outside the first connection portion, wherein the sleeve is sleeved outside the second connection portion, and wherein the protrusion portion separates the first connection portion from the second connection portion.

7. The semiconductor laser as claimed in claim 4 wherein the metallic member and the optical fiber, and the metallic member and the ferrule are all bonded together by pressure.

8. The semiconductor laser of claim 1, wherein the coupling lens or coupling lens group is bonded to the lens mount by glue.

9. The semiconductor laser of claim 1, wherein the lens mount is soldered to the laser housing.