CN217750932U - Silicon wafer polishing device - Google Patents

Abstract

The application provides a silicon chip burnishing device belongs to the solar cell field of making. The device comprises a box body, an adsorption piece and a polishing component. The box body is provided with a polishing cavity for containing polishing solution, and the adsorption piece is used for adsorbing the silicon wafer; the polishing component is used for polishing the silicon wafer. The polishing assembly comprises a first driving piece, a connecting frame, a second driving piece, a mounting piece, a third driving piece and a polishing piece. The power output end of the first driving piece is connected with the connecting frame and can drive the connecting frame to move along a first preset direction and reach the upper part of the adsorption piece; the power output end of the second driving piece is provided with a driving piece, and the driving piece is in driving connection with the mounting piece and can drive the mounting piece to reciprocate along the height direction of the box body under the driving of the second driving piece; the power output end of the third driving piece is connected with the polishing piece and can drive the polishing piece to rotate so as to polish the silicon wafer, and the device can improve the polishing effect under the condition that the back of the silicon wafer is only polished, so that the conversion efficiency of the battery is ensured.

Description

Silicon wafer polishing device

Technical Field

The application relates to the field of solar cell manufacturing, in particular to a silicon wafer polishing device.

Background

In the prior art, in order to improve the conversion efficiency of the solar cell, an electrolyte passivation layer needs to be added on the back surface of the cell, and before the process is carried out, a polishing device is generally used for polishing the single surface of the back surface of a silicon wafer. However, the conventional polishing device has the problem of poor polishing effect, so that the quality of the battery is affected.

SUMMERY OF THE UTILITY MODEL

The application aims to provide a silicon wafer polishing device which can improve the polishing effect to a certain extent and further guarantee the quality of a battery.

The embodiment of the application is realized as follows:

the embodiment of the application provides a silicon chip burnishing device, including box, absorption piece and polishing subassembly. The box body is provided with a polishing cavity for containing polishing liquid; the adsorption piece is connected in the polishing cavity and used for adsorbing the silicon wafer; the polishing assembly comprises a first driving member, a connecting frame, a second driving member, a mounting member, a third driving member and a polishing member.

The first driving piece is connected to the side wall of the box body, the power output end of the first driving piece is located in the box body and connected with the connecting frame, the first driving piece is configured to drive the connecting frame to move along a first preset direction, so that the connecting frame can move along the first preset direction and reach the upper portion of the adsorption piece, and the first preset direction is perpendicular to the height direction of the box body.

The second driving piece is connected to the connecting frame, and the power take off end of second driving piece is equipped with the driving medium, and the driving medium is connected with the installed part transmission, and the driving medium is configured to can drive the installed part and be reciprocating motion along the direction of height of box under the drive of second driving piece.

The third driving piece is connected with the mounting piece, the power output end of the third driving piece is connected with the polishing piece, and the third driving piece is configured to drive the polishing piece to rotate so as to polish the silicon wafer.

Among the above-mentioned technical scheme, first driving piece is used for the drive link frame to be reciprocating motion in predetermineeing the first direction, and the reality is in order to drive the top that polishes the piece and reach the absorption piece, on this basis, the second driving piece sets up the driving medium and is connected it with the installed part transmission, makes the one side butt that polishes the piece can carry out the polishing with the silicon chip needs in order to cooperate through driving medium and installed part, and the third driving piece is then for the rotation of drive polishing piece to the realization is to the polishing of silicon chip. The polishing cavity of the box body is used for containing polishing liquid, the adsorption piece is used for adsorbing and fixing the silicon wafer, and the polishing piece is used for polishing the silicon wafer fixed on the adsorption piece. Through the cooperation of polishing solution and polishing piece, can combine together chemical polishing and physical polishing simultaneously, compare in the mode that adopts chemical polishing or physical polishing alone, can improve polishing effect to guarantee battery quality.

In some alternative embodiments, the power output end of the first driving member is connected to the middle of the side of the connection frame adjacent to the first driving member in the height direction of the case.

Among the above-mentioned technical scheme, the power take off end of first driving piece is connected with the middle part of the one side that the connection frame is close to first driving piece, is owing to be in under this connected mode, and connection frame overall structure atress is more even, structural stability is better.

In some optional embodiments, two side walls of the box body, which are distributed oppositely along the second preset direction, are provided with linear guide rails extending along the first preset direction, the second preset direction is perpendicular to the first preset direction and the height direction of the box body, and the connecting frame is provided with a sliding block in sliding fit with the linear guide rails, so that the connecting frame can reciprocate along the first preset direction.

Among the above-mentioned technical scheme, the form that sets up linear guide and slide rail realizes connecting frame at the reciprocating motion of predetermineeing first direction, is because linear guide and slide rail matched with form can provide better stability for connecting frame's removal.

In some alternative embodiments, the transmission is a screw.

Among the above-mentioned technical scheme, set up the driving medium into the lead screw, because this mode of setting can drive the installed part better and reciprocate along the direction of height of box to the simple structure of lead screw is convenient for carry out technology manufacturing.

In some alternative embodiments, the connecting frame comprises a frame body and a limit rod, and the second driving member is connected to the frame body; in the height direction of the box body, the frame body is provided with frame edges which are distributed oppositely, and two ends of the limiting rod are respectively connected with the frame edges on two sides of the connecting frame; spacing hole has been seted up to the installed part near the one end of linking frame, and the gag lever post wears to locate spacing downthehole and with spacing hole sliding fit.

In the technical scheme, the connecting frame is provided with the limiting rod, the mounting piece is provided with the limiting hole, and the limiting rod and the mounting piece are arranged in a sliding fit mode, so that the connection stability of the mounting piece and the transmission piece can be enhanced; in addition, the both ends of gag lever post are connected with the frame limit of connected frame's both sides respectively, and the gag lever post can also play the effect of supporting connected frame to further improve connected frame's stability.

In some optional embodiments, the power output end of the third driving member is provided with a fixed member, a telescopic member and an elastic member; on the direction of height of box, the mounting is connected with the power take off end of third driving piece, and the extensible member is connected with the mounting downside, and the orthographic projection of extensible member is located the mounting, and the downside of extensible member is connected with polishing, and the extensible member is configured to can drive polishing and reciprocates, and elastic component elastic support is between mounting and polishing.

In the technical scheme, the elastic piece is arranged and elastically supported between the fixed piece and the polishing piece, and the distance between the polishing piece and the fixed plate can be basically fixed through the elasticity of the elastic piece, so that the polishing piece is convenient to be close to a silicon wafer for polishing; in addition, the orthographic projection of the telescopic piece is positioned in the fixed piece, so that the stability of the elastic piece is enhanced; on this basis, set up the form that can drive polishing spare and reciprocate with the extensible member, be in elastic contact's state for when making polishing spare and silicon chip butt, thereby play the effect of alleviating impact force, protection silicon chip.

In some alternative embodiments, the lower side of the extensible member is detachably connected to the upper side of the polishing member in the height direction of the housing.

Among the above-mentioned technical scheme, the downside of extensible member and the upside of polishing the piece can dismantle the form of being connected, be convenient for appear wearing and tearing, lead to polishing effect not good the condition in polishing piece self under, only change polishing the piece can to material saving cost.

In some optional embodiments, the first driving member includes a driving base and a driving main body, the driving main body is movably accommodated in the driving base, the driving base is located outside the box body and connected with the side wall of the box body, the driving main body is located in the box body, and the power output end of the driving main body is connected with the connecting frame.

Among the above-mentioned technical scheme, set up first driving piece into including drive base and drive main part to set up drive base outside the box lateral wall, set up the drive main part in the box, compare in with the whole setting of first drive main part in the box, this mode of setting can also save the inside space of box satisfying under the condition that can drive the connected frame and reacing the absorption piece top, thereby be favorable to the overall arrangement of the inside other components of box.

In some optional embodiments, the silicon wafer polishing apparatus further includes a fourth driving member, the fourth driving member is fixed to the bottom of the box body, a power output end of the fourth driving member is connected to the suction member, and the fourth driving member is configured to drive the suction member to move up and down along the height direction of the box body.

Among the above-mentioned technical scheme, silicon chip burnishing device adds the fourth drive spare to dispose the fourth drive spare and can drive the adsorption piece and reciprocate along the direction of height of box, this setting makes the position of adsorption piece on the direction of height of box adjustable, thereby can cooperate with the polishing piece better, and then improve silicon chip burnishing device and carry out the suitability of polishing to different silicon chips.

In some optional embodiments, the power output end of the fourth driving member is provided with a connecting member, the adsorption member is connected with the power output end of the fourth driving member through the connecting member, and an orthographic projection of the power output end of the fourth driving member in the height direction of the box body is located in the connecting member.

Among the above-mentioned technical scheme, the power take off end that adsorbs the piece through connecting piece and fourth drive piece is indirectly connected to set up to in the direction of height of box, the orthographic projection of the power take off end of fourth drive piece is located the connecting piece, compare in adsorbing the direct power take off end with fourth drive piece and be connected, should set up and can provide bigger support area for adsorbing the piece, thereby improve the structural stability who adsorbs the piece.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

FIG. 1 is a schematic structural diagram of a silicon wafer polishing apparatus according to an embodiment of the present disclosure;

fig. 2 is a partial enlarged view of II in fig. 1.

Icon: 10-a silicon wafer polishing device; 100-a box body; 110-a polishing chamber; 120-linear guide rail; 200-an adsorption member; 300-a polishing assembly; 310-a first driver; 311-power take off of first drive; 312-a drive mount; 313-a drive body; 320-a connection frame; 321-a frame body; 322-frame side; 323-a limiting rod; 324-a slider; 330-a second driver; 331-the power take-off of the second drive; 332-a transmission member; 340-a mount; 341-a limiting hole; 350-a third driving member; 351-the power output end of the third driving piece; 352-a fixing member; 353-a telescopic piece; 354-a resilient member; 360-polishing member; 400-a fourth drive; 410-a power take off of the fourth drive; 420-a connector;

a-the height direction of the box body; b-a first predetermined direction.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally placed when products of the application are used, and are only used for convenience of description and simplification of the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, detachable connections, or integral connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

In the prior art, in order to improve the conversion efficiency of the solar cell, an electrolyte passivation layer needs to be added on the back surface of the cell, and before the process is carried out, a polishing device is generally used for carrying out single-side polishing on the back surface of a silicon wafer. At present, technicians generally fill additives in a groove type machine table, and react the additives with phosphorosilicate glass on the front side of a silicon wafer to generate a protective layer to protect the front side of the silicon wafer, so that the aim of only corroding and polishing the back side of the silicon wafer is fulfilled. However, the effect of polishing the silicon wafer only by using a chemical agent is not good, so that the quality of the battery is easily affected, and the conversion efficiency of the battery is further affected.

The inventor researches and discovers that the silicon wafer fixing piece and the polishing piece are additionally arranged on the basis of the conventional silicon wafer polishing device, so that two polishing modes such as chemical polishing, physical polishing and the like can be combined together, and the polishing efficiency is improved.

An embodiment of the present invention provides a silicon wafer polishing apparatus 10, which includes a housing 100, an absorption member 200, and a polishing assembly 300, as shown in fig. 1 to 2. The housing 100 has a polishing chamber 110 for containing a polishing liquid; the adsorption piece 200 is connected in the polishing chamber 110, and the adsorption piece 200 is used for adsorbing a silicon wafer; the polishing assembly 300 includes a first driving member 310, a connection frame 320, a second driving member 330, a mounting member 340, a third driving member 350, and a polishing member 360.

The first driving member 310 is connected to a side wall of the box 100, a power output end 311 of the first driving member is located in the box 100 and connected to the connecting frame 320, and the first driving member 310 is configured to drive the connecting frame 320 to move along a first preset direction b, so that the connecting frame 320 can move along the first preset direction b and reach above the suction member 200, where the first preset direction b is perpendicular to a height direction a of the box.

The second driving member 330 is connected to the connecting frame 320, a power output end 331 of the second driving member is provided with a transmission member 332, the transmission member 332 is in transmission connection with the mounting member 340, and the transmission member 332 is configured to drive the mounting member 340 to reciprocate along the height direction a of the box body under the driving of the second driving member 330.

The third driving member 350 is connected to the mounting member 340, the power output end 351 of the third driving member is connected to the polishing member 360, and the third driving member 350 is configured to drive the polishing member 360 to rotate so as to polish the silicon wafer.

In this application, the first driving member 310 is used for driving the connection frame 320 to reciprocate in a predetermined first direction, in fact, in order to drive the polishing member 360 to reach the upper side of the absorption member 200, on this basis, the second driving member 330 is provided with the transmission member 332 and is in transmission connection with the mounting member 340, in order to enable the polishing member 360 to abut against the side of the silicon wafer to be polished through the cooperation of the transmission member 332 and the mounting member 340, and the third driving member 350 is used for driving the polishing member 360 to rotate, thereby polishing the silicon wafer. The polishing cavity 110 of the box 100 is used for containing polishing liquid, the adsorbing member 200 is used for adsorbing and fixing a silicon wafer, and the polishing member 360 is used for polishing the silicon wafer fixed on the adsorbing member 200. Through the cooperation of polishing solution and polishing piece 360, can combine together chemical polishing and physical polishing simultaneously, compare in the mode that adopts chemical polishing or physical polishing alone, can improve polishing effect, and then guarantee battery quality.

It should be noted that the silicon wafer polishing apparatus 10 provided in the present application is not limited to polishing only silicon wafers, and may also be applied to other objects to be polished.

It is understood that the silicon wafer polishing apparatus 10 may be provided with an automatic sample feeding device in order to improve the automation of the suction member 200.

As an example, the automatic sample feeding device is an external manipulator.

In this embodiment, the automatic sample feeding device may directly transport the silicon wafer to be polished to the adsorption member 200, thereby improving polishing efficiency.

It should be noted that the specific types of the first driving member 310, the second driving member 330, and the third driving member 350 are not limited.

As an example, the first driving member 310 is a telescopic cylinder, and the second driving member 330 and the third driving member 350 are all motor-driven.

It should be noted that the specific connection position of the second driving member 330 and the connection frame 320 is not limited, and the second driving member 330 may be connected to an end of the connection frame 320 close to the first driving member 310, or may be connected to an end of the connection frame 320 far from the first driving member 310.

As an example, the second driving member 330 is connected to an end of the connection frame 320 far from the first driving member 310.

It should be noted that the specific connection position of the third driving member 350 and the mounting member 340 is not limited.

As an example, the third driver 350 is connected to an end of the mounting member 340 remote from the first driver 310.

It is to be understood that the specific composition of the polishing solution is not limited.

As an example, the polishing liquid is a mixture of sodium hydroxide and potassium hydroxide.

It should be noted that, when polishing the silicon wafer, since the adsorbing member 200 and the polishing member 360 are both located in the polishing liquid, both the adsorbing member 200 and the polishing member 360 need to be made of alkali-resistant material.

As an example, the material of the absorption member 200 and the polishing member 360 is quartz.

It should be noted that the specific shape and size of the polishing member 360 are not limited.

As an example, the cross-sectional shape of the polishing member 360 is rectangular in the height direction a of the housing and the cross-sectional area of the polishing member 360 is larger than that of the silicon wafer.

In this embodiment, this arrangement enables the polishing member 360 to cover the entire polishing surface of the silicon wafer, thereby making the polishing more uniform.

As an example, in the height direction a of the case, the power take-off 311 of the first driving member is connected to the middle of the side of the connection frame 320 adjacent to the first driving member 310.

In this embodiment, the power output end 311 of the first driving member is connected to the middle of the connecting frame 320 near the first driving member 310, because in this connection mode, the overall structure of the connecting frame 320 is stressed more uniformly and has better structural stability.

It should be noted that the first predetermined direction b is not particularly limited, and may be a longitudinal direction of the box 100, or may be a width direction of the box 100.

As an example, two side walls of the box 100, which are oppositely distributed along a second predetermined direction (not shown in the figure), are provided with linear guide rails 120 extending along the first predetermined direction b, the second predetermined direction is perpendicular to the first predetermined direction b and the height direction a of the box, and the connection frame 320 is provided with a slider 324 slidably engaged with the linear guide rails 120, so that the connection frame 320 can reciprocate along the first predetermined direction b.

In this embodiment, the linear guide 120 and the slide rail are provided to realize the reciprocating motion of the connection frame 320 in the preset first direction, and the linear guide 120 and the slide rail are matched to provide better stability for the movement of the connection frame 320.

It should be noted that the position where the slider 324 is disposed is not particularly limited.

As an example, in the height direction a of the box body, the sliding member is disposed at the lower frame edge 322 of the connection frame 320 and is disposed corresponding to the linear guide 120.

It is to be noted that the form of the transmission member 332 is not particularly limited.

As an example, the transmission 332 is a lead screw.

In this embodiment, the driving member 332 is a screw rod, so that the installation member 340 can be driven to move up and down along the height direction a of the box body, and the screw rod has a simple structure, thereby facilitating the process manufacturing.

It should be noted that the transmission member 332 may be in the form of a screw rod as a whole, or in the form of a screw rod as a part, and it should be understood that the transmission member can drive the mounting member 340 to move up and down along the height direction a of the box.

As an example, the connection frame 320 includes a frame body 321 and a stopper bar 323, and the second driving member 330 is connected to the frame body 321; in the height direction a of the box body, the frame body 321 has frame edges 322 which are distributed oppositely, and two ends of the limiting rod 323 are respectively connected with the frame edges 322 on two sides of the connecting frame 320; one end of the mounting member 340 near the connecting frame 320 is provided with a limiting hole 341, and the limiting rod 323 penetrates through the limiting hole 341 and is in sliding fit with the limiting hole 341.

In this embodiment, the connecting frame 320 is provided with the limiting rod 323, the mounting member 340 is provided with the limiting hole 341, and the limiting rod 323 and the mounting member 340 are arranged in a slidable fit manner, so that the connection stability between the mounting member 340 and the transmission member 332 can be enhanced; in addition, two ends of the limiting rod 323 are respectively connected with the frame edges 322 at two sides of the connecting frame 320, and the limiting rod 323 can also play a role in supporting the connecting frame 320, so as to further improve the stability of the connecting frame 320.

In some exemplary embodiments, the opening position of the position-limiting hole 341 and the connection position of the third driving element 350 and the mounting element 340 are respectively located at two ends of the mounting element 340, that is, the position-limiting hole 341 is opened at one end of the mounting element 340 close to the connection frame 320, the third driving element 350 is connected to one end of the mounting element 340 far from the connection frame 320, and the transmission element 332 is in transmission fit with the middle part of the mounting element 340.

It should be noted that the specific form of the mounting member 340 is not limited.

As one example, the mount 340 is provided as a mounting plate.

As an example, the power output end 351 of the third driving member is provided with a fixed member 352, a telescopic member 353 and an elastic member 354; in the height direction a of the box body, the fixing part 352 is connected with the power output end 351 of the third driving part, the telescopic part 353 is connected with the lower side of the fixing part 352, the orthographic projection of the telescopic part 353 is positioned in the fixing part 352, the lower side of the telescopic part 353 is connected with the polishing part 360, the telescopic part 353 is configured to be capable of driving the polishing part 360 to move up and down, and the elastic part 354 is elastically supported between the fixing part 352 and the polishing part 360.

The elastic member 354 is elastically supported between the fixed member 352 and the polishing member 360, which means that when the side of the polishing member 360 close to the silicon wafer abuts against the silicon wafer, the elastic member 354 has an elastic force for driving the fixed plate and the polishing member 360 to move away from each other.

In this embodiment, the elastic member 354 is provided and the elastic member 354 is configured to be elastically supported between the fixed member 352 and the polishing member 360, and this configuration enables the distance between the polishing member 360 and the fixed plate to be substantially fixed by the elastic force of the elastic member 354, thereby facilitating the polishing of the polishing member 360 close to the silicon wafer; in addition, the front projection of the telescopic component 353 is positioned in the fixed component 352, so as to enhance the stability of the elastic component 354; on this basis, set up extensible member 353 for the form that can drive polishing piece 360 and reciprocate, be in elastic contact's state for when making polishing piece 360 and silicon chip butt, thereby play the effect of alleviating impact force, protection silicon chip. It should be noted that the specific form of the telescopic member 353 is not limited.

As an example, referring to fig. 2, the telescopic member 353 is in the form of a telescopic rod, i.e. one end of the telescopic member 353 close to the polishing member 360 is slidably received at one end of the telescopic member 353 away from the polishing member 360.

It should be noted that the specific arrangement form of the elastic member 354 is not limited, and the elastic member 354 may be directly sandwiched between the fixed member 352 and the polishing member 360; it is also possible to provide the elastic member 354 with both ends connected to the fixed member 352 and the polishing member 360, respectively, and it is understood that the connection may be a fixed connection or a detachable connection.

As an example, the elastic member 354 is interposed between the fixed member 352 and the polishing member 360.

In this embodiment, the elastic member 354 can be easily attached and detached by direct clamping.

It should be noted that the form of the elastic member 354 is not particularly limited.

As an example, the elastic member 354 is a spring.

On this basis, the connection form of the polishing member 360 can also be adjusted in consideration of the polishing cost.

As an example, the lower side of the expansion member 353 is detachably coupled to the upper side of the polishing member 360 in the height direction a of the housing. In this embodiment, the lower side of the telescopic piece 353 and the upper side of the polishing piece 360 are detachably connected, so that the polishing piece 360 is convenient to replace only under the condition that the polishing effect is not good due to abrasion of the polishing piece 360, and the material cost is saved. As an example, the first driving member 310 includes a driving base 312 and a driving body 313, the driving body 313 is movably accommodated in the driving base 312, the driving base 312 is located outside the box body 100 and is connected with a side wall of the box body 100, the driving body 313 is located in the box body 100, and a power output end of the driving body 313 is connected with the connection frame 320.

In this embodiment, the first driving unit 310 is configured to include the driving base 312 and the driving body 313, the driving base 312 is configured outside the sidewall of the box 100, and the driving body 313 is configured inside the box 100, so that the space inside the box 100 can be saved in comparison with the case that the first driving body 313 is entirely configured inside the box 100, and the space inside the box 100 can be saved, thereby facilitating the layout of other components inside the box 100.

As an example, the silicon wafer polishing apparatus 10 further includes a fourth driving member 400, the fourth driving member 400 is fixed to the bottom of the housing 100, a power output end 410 of the fourth driving member is connected to the suction member 200, and the fourth driving member 400 is configured to drive the suction member 200 to move up and down in a height direction a of the housing. In this embodiment, the silicon wafer polishing apparatus 10 is additionally provided with the fourth driving part 400, and the fourth driving part 400 is configured to be able to drive the adsorbing part 200 to move up and down along the height direction a of the box, so that the position of the adsorbing part 200 in the height direction a of the box is adjustable, and the adsorbing part can better cooperate with the polishing part 360, thereby improving the applicability of the silicon wafer polishing apparatus 10 in polishing different silicon wafers. In some possible embodiments, the fourth driver 400 is a telescopic cylinder, and the fourth driver 400 is provided with a waterproof protector.

It should be noted that, when the silicon wafer is polished, since the fourth driver 400 is located in the polishing liquid, the fourth driver 400 needs to be made of a material resistant to alkali corrosion.

As an example, the fourth driver 400 is provided with a casing resistant to alkali corrosion.

As an example, the power take-off end 410 of the fourth driving member is provided with a connecting member 420, the suction member 200 is connected with the power take-off end 410 of the fourth driving member through the connecting member 420, and an orthographic projection of the power take-off end 410 of the fourth driving member in the height direction a of the case is located in the connecting member 420.

In this embodiment, the suction member 200 is indirectly connected to the power output end 410 of the fourth driving member through the connecting member 420, and the arrangement is such that the orthographic projection of the power output end 410 of the fourth driving member is located in the connecting member 420 in the height direction a of the box body, compared with the arrangement in which the suction member 200 is directly connected to the power output end 410 of the fourth driving member, the arrangement can provide a larger support area for the suction member 200, thereby improving the structural stability of the suction member 200. It should be noted that, when polishing a silicon wafer, the connecting member 420 needs to be made of a material resistant to alkali corrosion because the connecting member 420 is located in the polishing solution.

As an example, the material of the connecting member 420 is quartz.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A silicon wafer polishing apparatus, comprising:

the polishing device comprises a box body, a polishing head and a polishing head, wherein the box body is provided with a polishing cavity for containing polishing liquid;

the adsorption piece is connected in the polishing cavity and used for adsorbing the silicon wafer; and

the polishing assembly comprises a first driving piece, a connecting frame, a second driving piece, a mounting piece, a third driving piece and a polishing piece;

the first driving piece is connected to the side wall of the box body, the power output end of the first driving piece is located in the box body and connected with the connecting frame, the first driving piece is configured to drive the connecting frame to move along a first preset direction, so that the connecting frame can move along the first preset direction and reach the upper part of the adsorption piece, and the first preset direction is perpendicular to the height direction of the box body;

the second driving piece is connected to the connecting frame, a driving piece is arranged at the power output end of the second driving piece, the driving piece is in transmission connection with the mounting piece, and the driving piece is configured to drive the mounting piece to reciprocate along the height direction of the box body under the driving of the second driving piece;

the third driving piece is connected with the mounting piece, a power output end of the third driving piece is connected with the polishing piece, and the third driving piece is configured to drive the polishing piece to rotate so as to polish the silicon wafer.

2. The silicon wafer polishing apparatus as set forth in claim 1, wherein the power take-off of the first driving member is connected to a middle portion of a side of the connection frame adjacent to the first driving member in a height direction of the case.

3. The silicon wafer polishing device according to claim 1 or 2, wherein linear guide rails extending in the first preset direction are disposed on two side walls of the box body which are distributed oppositely along a second preset direction, the second preset direction is perpendicular to the first preset direction and the height direction of the box body, and the connecting frame is provided with a slider which is slidably matched with the linear guide rails so that the connecting frame can reciprocate along the first preset direction.

4. The silicon wafer polishing apparatus according to claim 1 or 2, wherein the transmission member is a lead screw.

5. The silicon wafer polishing device according to claim 4, wherein the connection frame comprises a frame body and a stopper rod, and the second driving member is connected to the frame body; in the height direction of the box body, the frame body is provided with frame edges which are distributed oppositely, and two ends of the limiting rod are respectively connected with the frame edges on two sides of the connecting frame; the mounting part is close to one end of the connecting frame is provided with a limiting hole, and the limiting rod penetrates through the limiting hole and is in sliding fit with the limiting hole.

6. The silicon wafer polishing device according to claim 1 or 2, wherein the power output end of the third driving member is provided with a fixed member, an expansion member and an elastic member; in the height direction of the box body, the fixing piece is connected with the power output end of the third driving piece, the telescopic piece is connected with the lower side of the fixing piece, the orthographic projection of the telescopic piece is located in the fixing piece, the lower side of the telescopic piece is connected with the polishing piece, the telescopic piece is configured to be capable of driving the polishing piece to move up and down, and the elastic piece is elastically supported between the fixing piece and the polishing piece.

7. The silicon wafer polishing apparatus as set forth in claim 6, wherein a lower side of said expansion member is detachably connected to an upper side of said polishing member in a height direction of said case.

8. The silicon wafer polishing device according to claim 1 or 2, wherein the first driving member comprises a driving base and a driving body, the driving body is movably accommodated in the driving base, the driving base is located outside the box body and connected with the side wall of the box body, the driving body is located in the box body, and the power output end of the driving body is connected with the connecting frame.

9. The silicon wafer polishing device according to claim 1, further comprising a fourth driving member fixed to the bottom of the housing, wherein a power output end of the fourth driving member is connected to the suction member, and the fourth driving member is configured to drive the suction member to move up and down in a height direction of the housing.

10. The silicon wafer polishing apparatus according to claim 9, wherein a connecting member is provided at the power output end of the fourth driving member, the suction member is connected to the power output end of the fourth driving member through the connecting member, and an orthographic projection of the power output end of the fourth driving member in the height direction of the housing is located within the connecting member.

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