CN217748220U - Synchronous circuit instruction output device based on ARM microprocessor - Google Patents

Synchronous circuit instruction output device based on ARM microprocessor Download PDF

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Publication number
CN217748220U
CN217748220U CN202221416212.4U CN202221416212U CN217748220U CN 217748220 U CN217748220 U CN 217748220U CN 202221416212 U CN202221416212 U CN 202221416212U CN 217748220 U CN217748220 U CN 217748220U
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output device
seat
instruction output
base plate
plate
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CN202221416212.4U
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邓汝敏
夏启潮
洪治
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Shenzhen Taiming Technology Co ltd
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Shenzhen Taiming Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model discloses a synchronous circuit instruction output device based on ARM microprocessor, including bearing seat, the inboard of bearing seat supports there is the medium base plate, and the top fixed mounting of bearing seat has the connecting seat, the inside through connection of connecting seat has the offset, the end position of offset is connected with the offset, the laminating of offset is at the upper surface of medium base plate, the upper surface of medium base plate is close to the intermediate position and is provided with the chip mainboard, the surface of chip mainboard is close to all positions all around and is connected with the pin, the upper surface of medium base plate is close to the border position and is connected with clean mechanism, and the front surface of medium base plate is connected with the receiving terminal, the rear surface of medium base plate is connected with the sending terminal; synchronous circuit instruction output device based on ARM microprocessor, can conveniently clean instruction output device's surface, and can carry out heat conduction in instruction output device's bottom.

Description

Synchronous circuit instruction output device based on ARM microprocessor
Technical Field
The utility model relates to a microprocessor correlation technique field, in particular to synchronous circuit instruction output device based on ARM microprocessor.
Background
The ARM microprocessor is a processor which is small in size, low in power consumption, low in cost and high in performance, two instruction sets are supported in the system structure of the ARM microprocessor, and the synchronous circuit instruction output device based on the ARM microprocessor is a control device for outputting synchronous circuit instructions; however, the existing synchronous circuit instruction output device based on the ARM microprocessor has certain disadvantages to be improved when in use, firstly, the surface of the instruction output device is inconvenient to wipe, dust can affect the instruction output device, secondly, heat conduction can not be carried out at the bottom of the instruction output device, and the instruction output device is easy to overheat when in work.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides synchronous circuit instruction output device based on ARM microprocessor can effectively solve the technical problem that the background art provided.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
synchronous circuit instruction output device based on ARM microprocessor, including bearing seat, bearing seat's inboard support has the medium base plate, and bearing seat's top fixed mounting has the connecting seat, the inside through connection of connecting seat has the offset, the end position of offset is connected with the offset, the upper surface at the medium base plate is laminated to the offset, the upper surface of medium base plate is close to intermediate position and is provided with the chip mainboard, the surface of chip mainboard is close to all positions all around and all is connected with the pin, the upper surface of medium base plate is close to the border position and is connected with clean mechanism, and the front surface of medium base plate is connected with the receiving terminal, the rear surface of medium base plate is connected with the transmitting terminal, and the lower surface of medium base plate is connected with heat conduction mechanism.
As a further aspect of the utility model, clean mechanism includes guide holder, movable plate, cleaning pad, slider and spout, the upper surface that the guide holder is fixed in the medium base plate is close to the position at edge, the movable plate sets up the top at the guide holder, the cleaning pad is fixed in the lower surface of movable plate, the lower surface that the slider is fixed in the movable plate is close to the position of end, and the slider imbeds to the inside of guide holder, the inside at the guide holder is seted up to the spout.
As a further proposal of the utility model, the movable plate slides in the chute through the slide block and is movably connected with the guide seat.
As a further aspect of the present invention, the heat conducting mechanism includes a joint seat, a heat conducting plate, a T-shaped fixture block and a T-shaped clamping groove, the joint seat is fixed to the lower surface of the medium substrate, the heat conducting plate is disposed below the joint seat, the T-shaped fixture block is fixed to the upper surface of the heat conducting plate, the T-shaped fixture block is clamped into the inside of the joint seat, and the T-shaped clamping groove is opened in the inside of the joint seat.
As a further proposal of the utility model, the heat conducting plate is connected with the joint seat block through a T-shaped clamping block and a T-shaped clamping groove.
As a further aspect of the present invention, the wiring groove has been all seted up to the surface of receiving terminal and sending terminal.
Compared with the prior art, the utility model discloses following beneficial effect has: through the cleaning mechanism who sets up, can conveniently clean instruction output device's surface to can prevent that the dust from causing the influence to instruction output device, through the heat conduction mechanism who sets up, can carry out heat conduction in instruction output device's bottom, thereby can prevent that the overheated condition from appearing in the instruction output device during operation.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the synchronous circuit instruction output device based on the ARM microprocessor of the present invention;
FIG. 2 is a top view of the synchronous circuit command output device based on ARM microprocessor;
FIG. 3 is a schematic structural diagram of the cleaning mechanism of the synchronous circuit command output device based on the ARM microprocessor according to the present invention;
fig. 4 is a schematic structural diagram of the heat conducting mechanism of the synchronous circuit instruction output device based on the ARM microprocessor of the present invention.
In the figure: 1. a bearing seat; 2. a dielectric substrate; 3. a connecting seat; 4. a support pin; 5. a resisting plate; 6. a chip main board; 7. a pin; 8. a cleaning mechanism; 801. a guide seat; 802. moving the plate; 803. a cleaning pad; 804. a slider; 805. a chute; 9. a receiving terminal; 10. a transmission terminal; 11. a heat conducting mechanism; 1101. a linking seat; 1102. a heat conducting plate; 1103. a T-shaped fixture block; 1104. t-shaped clamping grooves.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-4, the synchronous circuit instruction output device based on the ARM microprocessor includes a bearing seat 1, a medium substrate 2 is supported on the inner side of the bearing seat 1, a connecting seat 3 is fixedly installed on the top of the bearing seat 1, a resisting pin 4 is penetratingly connected inside the connecting seat 3, a resisting plate 5 is connected to the end of the resisting pin 4, the resisting plate 5 is attached to the upper surface of the medium substrate 2, a chip main board 6 is disposed on the upper surface of the medium substrate 2 near the middle position, pins 7 are connected to the outer surface of the chip main board 6 near the peripheral positions, a cleaning mechanism 8 is connected to the upper surface of the medium substrate 2 near the edge position, a receiving terminal 9 is connected to the front surface of the medium substrate 2, a sending terminal 10 is connected to the rear surface of the medium substrate 2, and a heat conducting mechanism 11 is connected to the lower surface of the medium substrate 2;
in this embodiment, a cleaning mechanism 8 is provided to facilitate wiping of the surface of the instruction output device, the cleaning mechanism 8 includes a guide seat 801, a moving plate 802, a cleaning pad 803, a slider 804 and a sliding groove 805, the guide seat 801 is fixed to a position on the upper surface of the media substrate 2 near the edge, the moving plate 802 is disposed on the top of the guide seat 801, the cleaning pad 803 is fixed to the lower surface of the moving plate 802, the slider 804 is fixed to a position on the lower surface of the moving plate 802 near the end, the slider 804 is embedded into the guide seat 801, the sliding groove 805 is opened inside the guide seat 801, and the cleaning mechanism 8 can facilitate wiping of the surface of the instruction output device, thereby preventing dust from affecting the instruction output device.
In this embodiment, in order to realize the lateral movement of the moving plate 802, the moving plate 802 slides in the sliding slot 805 through the slider 804 and is movably connected with the guide seat 801, and the cleaning pad 803 can be wiped by the lateral movement of the moving plate 802.
In this embodiment, in order to conduct heat at the bottom of the command output device, the heat conducting mechanism 11 is provided, the heat conducting mechanism 11 includes a joint seat 1101, a heat conducting plate 1102, a T-shaped fixture block 1103 and a T-shaped clamping groove 1104, the joint seat 1101 is fixed on the lower surface of the medium substrate 2, the heat conducting plate 1102 is provided at a position below the joint seat 1101, the T-shaped fixture block 1103 is fixed on the upper surface of the heat conducting plate 1102, the T-shaped fixture block 1103 is clamped into the joint seat 1101, the T-shaped clamping groove 1104 is provided inside the joint seat 1101, and the heat conducting mechanism 11 can conduct heat at the bottom of the command output device, so as to prevent the command output device from being overheated during operation.
In this embodiment, in order to mount the heat-conducting plate 1102 below the command output device, the heat-conducting plate 1102 is engaged with the engaging seat 1101 by the T-shaped latch 1103 and the T-shaped latch groove 1104.
In this embodiment, the outer surfaces of the receiving terminal 9 and the transmitting terminal 10 are both provided with wiring grooves, and the wiring grooves can facilitate the wiring of the receiving terminal 9 and the transmitting terminal 10.
It should be noted that, the utility model discloses a synchronous circuit instruction output device based on ARM microprocessor, when using, bearing seat 1, medium base plate 2 and chip mainboard 6 have constituted whole ARM microprocessor's synchronous circuit instruction output device's main part, put medium base plate 2 on bearing seat 1, support tight medium base plate 2 through supporting 4 and support tight board 5, receiving terminal 9 and transmitting terminal 10 are used for the access and the sending of instruction, pulling movable plate 802, movable plate 802 slides in spout 805 through slider 804 and guide holder 801 relative activity, movable plate 802 carries out the sideslip and can drive cleaning pad 803 and clean, can prevent that the dust from leading to the fact the influence to instruction output device, heat-conducting plate 1102 carries out the block through T type fixture block 1103 and T type draw-in groove 1104 and joint seat 1101, heat-conducting plate 1102 can carry out heat conduction in instruction output device's bottom, thereby can prevent the overheated condition from appearing in the instruction output device during operation.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. Synchronous circuit instruction output device based on ARM microprocessor, its characterized in that: including bearing seat (1), the inboard support of bearing seat (1) has medium base plate (2), and the top fixed mounting of bearing seat (1) has connecting seat (3), the inside through connection of connecting seat (3) has offset (4), the end position of offset (4) is connected with and supports tight plate (5), support the upper surface of tight plate (5) laminating at medium base plate (2), the upper surface of medium base plate (2) is close to intermediate position and is provided with chip mainboard (6), the surface of chip mainboard (6) is close to all around the position and all is connected with pin (7), the upper surface of medium base plate (2) is close to marginal position and is connected with clean mechanism (8), and the front surface of medium base plate (2) is connected with receiving terminal (9), the rear surface of medium base plate (2) is connected with transmitting terminal (10), and the lower surface of medium base plate (2) is connected with heat conduction mechanism (11).
2. The ARM microprocessor based synchronous circuit instruction output device of claim 1, wherein: the cleaning mechanism (8) comprises a guide seat (801), a moving plate (802), a cleaning pad (803), a sliding block (804) and a sliding groove (805), wherein the guide seat (801) is fixed at the position, close to the edge, of the upper surface of the medium substrate (2), the moving plate (802) is arranged at the top of the guide seat (801), the cleaning pad (803) is fixed at the lower surface of the moving plate (802), the sliding block (804) is fixed at the position, close to the end, of the lower surface of the moving plate (802), the sliding block (804) is embedded into the guide seat (801), and the sliding groove (805) is formed in the guide seat (801).
3. The ARM microprocessor based synchronous circuit instruction output device of claim 2, wherein: the moving plate (802) slides in the sliding groove (805) through the sliding block (804) and is movably connected with the guide seat (801).
4. The ARM microprocessor based synchronous circuit instruction output device of claim 1, wherein: the heat conduction mechanism (11) comprises a joint seat (1101), a heat conduction plate (1102), a T-shaped clamping block (1103) and a T-shaped clamping groove (1104), the joint seat (1101) is fixed on the lower surface of a medium substrate (2), the heat conduction plate (1102) is arranged at the position below the joint seat (1101), the T-shaped clamping block (1103) is fixed on the upper surface of the heat conduction plate (1102), the T-shaped clamping block (1103) is clamped into the inside of the joint seat (1101), and the T-shaped clamping groove (1104) is arranged inside the joint seat (1101).
5. The ARM microprocessor based synchronous circuit instruction output device of claim 4, wherein: the heat-conducting plate (1102) is connected with the connecting seat (1101) in a clamping mode through a T-shaped clamping block (1103) and a T-shaped clamping groove (1104).
6. The ARM microprocessor based synchronous circuit instruction output device of claim 1, wherein: and the outer surfaces of the receiving terminal (9) and the transmitting terminal (10) are provided with wiring grooves.
CN202221416212.4U 2022-06-08 2022-06-08 Synchronous circuit instruction output device based on ARM microprocessor Active CN217748220U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221416212.4U CN217748220U (en) 2022-06-08 2022-06-08 Synchronous circuit instruction output device based on ARM microprocessor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221416212.4U CN217748220U (en) 2022-06-08 2022-06-08 Synchronous circuit instruction output device based on ARM microprocessor

Publications (1)

Publication Number Publication Date
CN217748220U true CN217748220U (en) 2022-11-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221416212.4U Active CN217748220U (en) 2022-06-08 2022-06-08 Synchronous circuit instruction output device based on ARM microprocessor

Country Status (1)

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CN (1) CN217748220U (en)

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