CN217740484U - Diode assembly sintering mould - Google Patents

Abstract

The utility model provides a diode assembly sintering mould, mould include the base plate, are equipped with a plurality of die holders of align to grid on the base plate, and the die holder is including the rectangular hole that runs through the base plate, and the rectangular hole top surface is equipped with the round platform, and round platform one side is seted up flutedly, the recess includes two sides and a bottom surface, two sides flush with the long limit lateral wall of rectangular hole, and the bottom surface flushes with a minor face lateral wall of rectangular hole, and two side symmetries are equipped with the lug, and the lug top surface is less than the first step of round platform top surface formation, and the lug bottom surface extends to the rectangular hole bottom and flushes with the rectangular hole bottom surface, and the round platform top surface is equipped with the riser along outer periphery, both ends all are equipped with the boss of symmetry around the die holder, and the boss opposite side is equipped with the second step of symmetry, and second step top surface and riser top surface are on same horizontal plane. The utility model provides the high sintering quality of product has reduced the defective percentage, has improved production efficiency.

Description

Diode assembly sintering mould

Technical Field

The utility model relates to a semiconductor device's encapsulation technical field, concretely relates to diode assembly sintering mould.

Background

At present, when the assembly sintering process of the diodes is carried out by the company, the method generally adopted is to clamp a tube seat, a tube core and an outer pole piece by a clamp, solder is coated, each group of diodes is assembled and placed on a special turnover appliance, then the diodes are sent to a sintering team to be sintered, the tube seat, the tube core and the outer pole piece form a whole by high-temperature sintering, the clamp can fall off frequently in the process of sending to the sintering team, the positions of the outer pole piece, the tube core and the tube seat deviate, so that a plurality of products can not meet the quality requirements, rework is carried out, meanwhile, the assembly efficiency of the clamp is low, and the production efficiency is greatly influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a diode assembly sintering mould to the not enough of prior art existence, with tube socket, tube core and outer pole piece fixed mounting on the mould, positional deviation can not appear sending to the sintering transport in-process, has improved the sintering quality.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides a diode assembly sintering mould, the mould includes the base plate, be equipped with a plurality of die holders of align to grid on the base plate, the die holder is including the rectangular hole that runs through the base plate, and the rectangular hole top surface is equipped with the round platform, round platform one side is seted up flutedly, the recess includes two sides and a bottom surface, two sides flush with the long limit lateral wall of rectangular hole, the bottom surface flushes with a minor face lateral wall of rectangular hole, two side symmetries are equipped with the lug, the lug top surface is less than the first step of round platform top surface formation, and the lug bottom surface extends to rectangular hole bottom and flushes with the rectangular hole bottom surface, the round platform top surface is equipped with the riser along outer the periphery, both ends all are equipped with the boss of symmetry around the die holder, and the boss opposite side is equipped with the second step of symmetry, second step top surface and riser top surface are on same horizontal plane, and the boss top surface is higher than second step top surface. Before sintering, the outer pole piece, the tube core and the tube seat are sequentially assembled with the die, the bottom surface of the outer pole piece is placed on the first step, the position of the outer pole piece is fixed by the rectangular hole and the first step, the tube core is placed in the vertical plate, the position of the tube core is fixed by the vertical plate, the tube seat is reversely buckled on the die, the circular baffle of the tube seat is in clearance fit with the vertical plate, the two ends of the tube seat are respectively placed on the second step, the position of the tube seat is fixed, and finally the whole die is conveyed to a sintering team to be sintered.

Preferably, adjacent bosses are connected with each other, and each row of bosses are arranged into an integrated structure. And the adjacent bosses are integrally designed, so that the casting of the die is facilitated.

Preferably, the height difference between the top surface of the first step and the top surface of the circular truncated cone is 2.5 millimeters.

Preferably, the total height of the circular truncated cone and the vertical plate is 9.2 millimeters.

Preferably, the radius of the circular truncated cone is 11.25 mm.

Preferably, the thickness of the vertical plate is 0.75 mm.

Compared with the prior art, the utility model, have following advantage:

use the utility model discloses, can be with outer pole piece, tube core and tube socket fixed assembly, in the transportation of being sent to the sintering, can not take place the skew of outer pole piece, tube core and tube socket, improved the sintering quality of product, reduced the defective percentage, simultaneously, improved the assembly speed of outer pole piece, tube core and tube socket, improved production efficiency.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a top view of the present invention;

FIG. 3 is a schematic view of a single die holder of the present invention;

FIG. 4 is a cross-sectional view of a single die holder of the present invention;

wherein, 1-round platform, 2-vertical plate, 3-convex block, 4-first step, 5-convex block, 6-second step

Detailed Description

The present invention will be further clarified by the following description in conjunction with the accompanying drawings, which are to be understood as illustrative only and not as limiting the scope of the invention, and modifications of the various equivalent forms of the invention by those skilled in the art after reading the present invention are within the scope defined by the appended claims.

As shown in fig. 1-4, a diode assembly sintering mold, the mold comprises a substrate, a plurality of mold bases are uniformly arranged on the substrate, each mold base comprises a rectangular hole penetrating through the substrate, a circular truncated cone 1 with a radius of 11.25 mm is arranged on the top surface of the rectangular hole, a groove is formed in one side of the circular truncated cone 1 and comprises two side surfaces and a bottom surface, the two side surfaces are flush with long side walls of the rectangular hole, the bottom surface is flush with a short side wall of the rectangular hole, two side surfaces are symmetrically provided with a lug 3, the top surface of the lug 3 is lower than the top surface of the circular truncated cone to form a first step 4, the height difference between the top surface of the first step 4 and the top surface of the circular truncated cone 1 is 2.5 mm, the bottom surface of the lug 3 extends to the bottom of the rectangular hole and is flush with the bottom surface of the rectangular hole, the top surface of the circular truncated cone 1 is provided with a vertical plate 2 with a thickness of 0.75 mm along the outer periphery of the circular truncated cone 1, the total height of the vertical plate 2 and the circular truncated cone 1 is 9.2 mm, the front end and the rear end of the mold base are provided with symmetrical bosses 5, the same row of the same horizontal plane, the same row of the die base is provided with the same row of the integrated boss 5, and the boss is arranged on the same row of the die base, and the die, and the integrated die, and the difficulty of the die is reduced.

The specific working process and principle of the diode assembling and sintering mold are as follows: when the diode prepares to assemble and sinter, the rectangular bottom surface of the outer pole piece is lapped on the first step 4, the welding flux is coated on the rectangular bottom surface, then the circular tube core is placed in the vertical plate 2 on the top surface of the circular truncated cone 1, the welding flux is also coated on the upper surface of the circular tube core, finally, the tube base is buckled on the die holder in an inverted mode, the circular baffle of the tube base is in clearance fit with the vertical plate, two ends of the tube base are placed on the second step 6, after all the components of the diode are fixedly assembled, the back surface of the tube base is pressed by a pressing plate, the whole die is overturned for 180 degrees, and is conveyed to a sintering team for sintering, in the sintering process, the gravity action is utilized, the outer pole piece is made to fall on the tube core, the outer pole piece is connected and fastened with the tube core through the welding flux, the tube core is connected and fastened with the tube base through the welding flux, and finally, the outer pole piece, the tube core and the tube base are connected into a whole.

While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims (6)

1. The diode assembling and sintering mold is characterized in that: the die comprises a base plate, wherein a plurality of die holders are uniformly arranged on the base plate, each die holder comprises a rectangular hole penetrating through the base plate, a round table is arranged on the top surface of each rectangular hole, a groove is formed in one side of each round table, each groove comprises two side surfaces and a bottom surface, the two side surfaces are flush with the long side wall of each rectangular hole, the bottom surfaces are flush with the short side wall of each rectangular hole, the two side surfaces are symmetrically provided with a convex block, the top surface of each convex block is lower than the top surface of each round table to form a first step, the bottom surface of each convex block extends to the bottom of each rectangular hole and is flush with the bottom surface of each rectangular hole, vertical plates are arranged on the top surface of each round table along the outer periphery, symmetrical bosses are arranged at the front end and the rear end of each die holder, symmetrical bosses are arranged on the opposite sides of the second steps, the top surfaces of the second steps and the top surfaces of the vertical plates are on the same horizontal plane, and the top surfaces of the bosses are higher than the top surfaces of the second steps.

2. The diode-mount sintering mold of claim 1, wherein: adjacent boss interconnect, and each row of boss sets up to integral structure.

3. The diode-mount sintering mold of claim 1, wherein: the first step height is 2.5 millimeters.

4. The diode mount sintering mold of claim 1, wherein: the total height of the round platform and the vertical plate is 9.2 mm.

5. The diode-mount sintering mold of claim 1, wherein: the radius of the circular truncated cone is 11.25 mm.

6. The diode-mount sintering mold of claim 1, wherein: the thickness of the vertical plate is 0.75 mm.

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