CN217726848U

CN217726848U - LED paster support stamping die

Info

Publication number: CN217726848U
Application number: CN202221478768.6U
Authority: CN
Inventors: 梅学海
Original assignee: Dongguan Guanteng Electronic Co ltd
Current assignee: Dongguan Guanteng Electronic Co ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2022-11-04
Anticipated expiration: 2032-06-14

Abstract

The utility model belongs to the technical field of LED paster support processing, especially, be a LED paster support stamping die, the on-line screen storage device comprises a base, the bottom of base is provided with the mould and places the chamber, the mould is placed the inside in chamber and is placed the lower mould, the last fixed surface of base has the U template, the top of U template is run through there is the depression bar rather than sliding connection, the lower extreme of depression bar is fixed with mounting panel one, the lower surface of mounting panel one is provided with the punching press board. The utility model discloses a set up electric putter, mounting panel two and scraper blade, can promote to extrude the semiconductor material of the paster support above base and the lower mould when the punching press and remove the inside that holds the chamber, because the lower mould sinks the mould and places the inside in chamber and the upper surface of base and flushes for the clearance effect of scraper blade is better, is convenient for retrieve the leftover bits and pieces, through setting up the heating pipe holding the intracavity, avoids the leftover bits and pieces to solidify and can't flow holding the inside in chamber.

Description

LED paster support stamping die

Technical Field

The utility model relates to a LED paster support processing technology field specifically is a LED paster support stamping die.

Background

As a very effective novel light source, the LED has the advantages of high brightness, small power consumption, long service life, stable performance, easy combination, background screen, street lamp, indoor illumination and the like, and along with the cost reduction and wide application of the surface mount type LED, the LED surface mount bracket is also synchronously and widely applied.

In the production of LED paster support, need process through the mode of punching press, make its material more firm, in stamping process, the raw materials that adds in the mould inslot spills over easily and produces the leftover bits and pieces, and common LED paster support stamping die is convenient for retrieve the collection to the leftover bits and pieces for the efficiency of punching press receives the reduction, therefore we have proposed an LED paster support stamping die and have solved above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides a LED paster support stamping die has solved the problem of the leftover bits and pieces that produce when inconvenient collection paster support punching press that proposes in the above-mentioned background art.

(II) technical scheme

The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:

the utility model provides a LED paster support stamping die, includes the base, the bottom of base is provided with the mould and places the chamber, the mould is placed the inside in chamber and has been placed the lower mould, the last fixed surface of base has the U template, the top of U template runs through there is the depression bar rather than sliding connection, the lower extreme of depression bar is fixed with mounting panel one, the lower surface of mounting panel one is provided with the punching press board, the both sides wall of U template has all been seted up and has been run through the mouth, and its both sides outer wall all has the guide arm through connection piece fixed mounting, the lower extreme of guide arm and the last fixed surface of base are connected, equal sliding connection has the direction slider on the guide arm, direction slider and a mounting panel fixed connection, be fixed with the riser between the both sides wall of U template, the one end fixed mounting of riser has electric putter, electric putter's drive end runs through the riser and extends to the inboard of U template and is fixed with mounting panel two, one side of mounting panel two is provided with the scraper blade, the lower surface of scraper blade is laminated with the upper surface of base and lower mould, and the both ends of U template respectively, be provided with the both sides inner wall laminating of U on the base, it holds the chamber, it is provided with the discharge gate to hold, the heating pipe is provided with the discharge gate.

Furthermore, the bottom of the base is provided with a port communicated with the mold placing cavity.

Furthermore, bolts I penetrate through two side walls of the mold placing cavity, are in threaded connection with two side walls of the lower mold, and can be detachably fixed with the stamping plate through bolts II.

Furthermore, the guide rod is sleeved with a spring and a gasket, the upper end of the spring is fixedly connected with the gasket, and the lower end of the spring is fixedly connected with the upper surface of the base.

Further, a third bolt penetrates through two ends of the scraper, the third bolt is in threaded connection with the second mounting plate, guide rods are fixed at two ends of the second mounting plate, and the guide rods penetrate through the vertical plate and are in sliding connection with the vertical plate.

Further, the upper end of depression bar is fixed with installed part one, the four corners of base lower surface all is fixed with installed part two, all seted up the mounting hole on installed part one and the installed part two.

(III) advantageous effects

Compared with the prior art, the utility model provides a LED paster support stamping die possesses following beneficial effect:

the utility model discloses, through setting up electric putter, two mounting panels and scraper blade, can promote to push the semiconductor material who extrudees the paster support above base and the lower mould when the punching press and remove the inside that holds the chamber, because the lower mould sinks to the mould and places the inside in chamber and flush with the upper surface of base for the clearance effect of scraper blade is better, is convenient for retrieve the leftover bits and pieces, sets up the heating pipe through holding the intracavity, avoids the leftover bits and pieces to solidify and can't flow holding the inside in chamber.

Drawings

FIG. 1 is a schematic view of the appearance structure of the present invention;

fig. 2 is a schematic view of another appearance structure of the present invention;

FIG. 3 is a sectional view of the internal structure of the present invention;

fig. 4 is a sectional view of another internal structure of the present invention.

In the figure: 1. a base; 2. a mold placement cavity; 3. a port; 4. a lower die; 5. a first bolt; 6. a U-shaped plate; 7. a pressure lever; 8. a first mounting plate; 9. stamping the plate; 10. a second bolt; 11. a through opening; 12. a guide bar; 13. a guide slider; 14. a spring; 15. a gasket; 16. a vertical plate; 17. an electric push rod; 18. a second mounting plate; 19. a squeegee; 20. a third bolt; 21. a guide bar; 22. an accommodating chamber; 23. a discharge port; 24. heating a tube; 25. a first mounting part; 26. and a second mounting part.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, an embodiment of the present invention provides a stamping die for an LED chip mounting bracket, including a base 1, a die placing cavity 2 is disposed at the bottom of the base 1, a lower die 4 is disposed inside the die placing cavity 2, a U-shaped plate 6 is fixed on the upper surface of the base 1, a press rod 7 slidably connected to the top of the U-shaped plate 6 penetrates through the top of the U-shaped plate 6, a first mounting plate 8 is fixed at the lower end of the press rod 7, a stamping plate 9 is disposed on the lower surface of the first mounting plate 8, through holes 11 are disposed on both side walls of the U-shaped plate 6, guide rods 12 are fixedly mounted on the outer walls of both sides of the U-shaped plate 6 through connecting pieces, the lower end of each guide rod 12 is fixedly connected to the upper surface of the base 1, a guide slider 13 is slidably connected to the guide rod 12, a vertical plate 16 is fixed between the two side walls of the U-shaped plate 6, an electric push rod 17 is fixedly mounted at one end of the vertical plate 16, a driving end of the electric push rod 17 extends to the inner side of the vertical plate 16 and is fixed to the inner side of the U-shaped plate 6 and is fixed with two mounting plates 18, a scraper 19, a heating pipe 22 is disposed on one side of the lower surface of the mounting plate 1, two side of the mounting plate 22, and two side of the mounting plate is disposed in the cavity, and a heating pipe 22 is disposed in the mounting cavity, and a heating pipe 22 disposed in the upper surface of the mounting plate 1; through placing lower mould 4 in the inside that chamber 2 was placed to the mould, make the upper surface of lower mould 4 flush with the upper surface of base 1, extrude the fashioned semiconductor material liquid as paster support of base 1 upper surface when being convenient for strike off the punching press, it removes to drive two 18 of mounting panel through setting up electric putter 17, can make scraper blade 19 remove the inside that holds chamber 22 at the surface of base 1 drive the semiconductor liquid that flows, hold the inside heating pipe 24 of chamber 22 inside and can heat semiconductor liquid, make its flow property improve so that flow from discharge gate 23, be used for being connected with stamping equipment's punching press head through setting up depression bar 7, punching press board 9 can with the die cavity cooperation punching press on lower mould 4 surface, because

guide slider

13 and 12 sliding connection are passed through at the both ends of mounting panel 8, make more accurate when punching press board 9 punching press, the deviation is difficult for appearing.

As shown in fig. 2 and 4, in some embodiments, the bottom of the base 1 is provided with a through port 3 communicated with the mold placing cavity 2; the lower die 4 can be conveniently taken out of the die placing cavity 2 through the arrangement of the through port 3.

As shown in fig. 4, in some embodiments, a first bolt 5 penetrates through two side walls of the mold placing cavity 2, the first bolt 5 is in threaded connection with two side walls of the lower mold 4, and the first mounting plate 8 and the punching plate 9 are detachably fixed through a second bolt 10; the lower die 4 is fixed in the die placing cavity 2 through the first bolt 5, and the first mounting plate 8 and the stamping plate 9 are fixed through the second bolt 10, so that the lower die 4 and the stamping plate 9 can be replaced conveniently.

As shown in fig. 1 and 2, in some embodiments, a spring 14 and a washer 15 are sleeved on the guide rod 12, an upper end of the spring 14 is fixedly connected with the washer 15, and a lower end thereof is fixedly connected with an upper surface of the base 1; the spring 14 has a buffering effect, when the stamping plate 9 approaches the lower die 4, the guide sliding block 13 is in contact with the gasket 15, and as the guide sliding block 13 continues to move downwards, the pressure applied to the spring 14 is gradually increased, so that the reaction force applied to the guide sliding block 13 by the spring 14 is continuously increased, the speed of the stamping plate 9 is reduced, the shock caused by impact when the stamping plate 9 and the lower die 4 are stamped is reduced, and meanwhile, the gasket 15 can also absorb a part of the shock.

As shown in fig. 3, in some embodiments, a third bolt 20 penetrates through both ends of the scraper 19, the third bolt 20 is in threaded connection with a second mounting plate 18, guide rods 21 are fixed at both ends of the second mounting plate 18, and the guide rods 21 penetrate through and are slidably connected with the vertical plate 16; the mounting plate II 18 is connected with the scraper 19 through the third bolt 20, so that the scraper 19 is convenient to replace, and the electric push rod 17 is more stable when pushing the mounting plate II 18 to move through the guide rod 21, and the scraper 19 is not easy to incline when the upper surface of the base 1 slides.

As shown in fig. 1 and 2, in some embodiments, a first mounting part 25 is fixed at the upper end of the pressure lever 7, second mounting parts 26 are fixed at four corners of the lower surface of the base 1, and mounting holes are formed in the first mounting part 25 and the second mounting parts 26; through setting up installed part one 25, be convenient for with the mould with stamping equipment's drift installation, through setting up installed part two 26, be convenient for with mould monolithic stationary.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a LED paster support stamping die, includes base (1), its characterized in that: the bottom of base (1) is provided with mould placing cavity (2), the inside in mould placing cavity (2) has placed lower mould (4), the last fixed surface of base (1) has U template (6), the top of U template (6) runs through there is depression bar (7) rather than sliding connection, the lower extreme of depression bar (7) is fixed with mounting panel (8), the lower surface of mounting panel (8) is provided with ram-plate (9), the both sides wall of U template (6) has all been seted up runs through mouthful (11), and its both sides outer wall all has guide arm (12) through connection piece fixed mounting, the lower extreme of guide arm (12) and the last fixed surface of base (1) are connected, equal sliding connection has direction slider (13) on guide arm (12), direction slider (13) and mounting panel (8) fixed connection, be fixed with riser (16) between the both sides wall of U template (6), the one end fixed mounting of riser (16) has electric putter (17), the drive end (16) of electric putter (17) extends to the inboard of U template (6) and the lower surface of mounting panel (18) and the scraper blade (19) is provided with two lower surface (18) of mounting panel (18) and scraper blade (19), and both ends of the base are respectively attached to the inner walls of the two sides of the U-shaped plate (6), a containing cavity (22) is formed in the base (1), a discharge hole (23) is formed in one side wall of the containing cavity (22), and a heating pipe (24) is arranged inside the containing cavity (22).

2. The LED patch support stamping die of claim 1, wherein: the bottom of the base (1) is provided with a through hole (3) communicated with the mold placing cavity (2).

3. The LED patch bracket stamping die of claim 1, wherein: the two side walls of the mold placing cavity (2) are all penetrated by a first bolt (5), the first bolt (5) is in threaded connection with the two side walls of the lower mold (4), and the first mounting plate (8) and the stamping plate (9) are detachably fixed through a second bolt (10).

4. The LED patch support stamping die of claim 1, wherein: the guide rod (12) is sleeved with a spring (14) and a gasket (15), the upper end of the spring (14) is fixedly connected with the gasket (15), and the lower end of the spring is fixedly connected with the upper surface of the base (1).

5. The LED patch bracket stamping die of claim 1, wherein: the both ends of scraper blade (19) all run through bolt three (20), bolt three (20) and mounting panel two (18) threaded connection, the both ends of mounting panel two (18) all are fixed with guide bar (21), guide bar (21) all run through riser (16) and rather than sliding connection.

6. The LED patch support stamping die of claim 1, wherein: the upper end of depression bar (7) is fixed with installed part one (25), the four corners of base (1) lower surface all is fixed with installed part two (26), all seted up the mounting hole on installed part one (25) and the installed part two (26).