CN217707672U

CN217707672U - Conveyer is used in semiconductor material production

Info

Publication number: CN217707672U
Application number: CN202220894193.XU
Authority: CN
Inventors: 陈龙; 陈瑜
Original assignee: Shaanxi Yinjie Semiconductor Co ltd
Current assignee: Shaanxi Yinjie Semiconductor Co ltd
Priority date: 2022-04-18
Filing date: 2022-04-18
Publication date: 2022-11-01
Anticipated expiration: 2032-04-18

Abstract

The utility model discloses a conveyer is used in semiconductor material production, including body frame structure and supporting structure, the body frame structure includes the base, two support columns, two have been installed to the top surface of base the outside of support column is all overlapped and is equipped with first spring, two first backup pad has all been installed to the outside of support column, the top surface of first spring links to each other with the bottom surface of first backup pad, driving motor has been installed to the top surface of first backup pad, driving motor's output shaft facial make-up is equipped with drive gear, drive gear's outside meshing has the driving band, the inside toothing of driving band has driven gear shaft, the transmission shaft has been installed at the back of driven gear shaft. This conveyer is used in semiconductor material production, first spring and damping device install, and at driving motor during operation, drive the transportation area through the driving band and rotate, all very big reduction the rotation that the drive of motor brought influences the operation of transportation area, and can alleviate the vibrations that the external world brought.

Description

Conveyer is used in semiconductor material production

Technical Field

The utility model relates to a semiconductor material technical field specifically is a conveyer is used in semiconductor material production.

Background

Semiconductor materials are a class of electronic materials that have semiconducting properties (electrical conductivity between conductor and insulator, resistivity in the range of about 1m Ω -cm to 1G Ω -cm) and can be used to fabricate semiconductor devices and integrated circuits.

The semiconductor conveying device in the prior art can vibrate when conveying semiconductor materials, so that the semiconductor materials can fall off in the conveying process, the conveying belt can generate a large amount of dust and other articles after long-time conveying and operation, the semiconductor materials can generate dirt and dust in the conveying process, the working efficiency and quality of machine operation can be influenced, and the working environment is poor.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a conveyer is used in semiconductor material production possesses advantages such as shock attenuation cleanness, has solved and has not possessed the clear problem of shock attenuation.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a conveyer is used in semiconductor material production, includes body frame structure and supporting structure, the body frame structure includes the base, two support columns, two have been installed to the top surface of base the outside of support column all is equipped with first spring, two first backup pad has all been installed to the outside of support column, the top surface of first spring links to each other with the bottom surface of first backup pad, driving motor has been installed to the top surface of first backup pad, driving motor's output shaft facial make-up is equipped with drive gear, drive gear's outside meshing has the driving band, the inside meshing of driving band has driven gear shaft, the transmission shaft has been installed at the back of driven gear shaft, and the external contact of device axis of rotation has the transportation area.

The supporting structure is including being located the clearance pole of conveying area top surface, the right side of clearance pole is connected with rotates the cover, it has the drive gear to rotate the inside meshing of cover, the bottom that drives the gear is connected with the release shaft, the bull gear has been installed to the bottom of release shaft, the outside meshing of bull gear has the rotation band, the inside meshing of rotation band has the drive gear, the bottom that drives the gear is connected with driving motor, the third bracing piece has been installed to the outside of release shaft, it is located the outside of third bracing piece to drive the gear, the third backup pad has been installed to the bottom of third bracing piece, the collecting box has been installed to the top surface of third backup pad, damping device has been installed to the bottom of third backup pad.

Furthermore, damping device is including being located the first bracing piece of third backup pad bottom, the second backup pad has been installed to the bottom of first bracing piece, two damping rings have been installed to the bottom surface of second backup pad.

Furthermore, a second support rod is arranged inside each of the two damping rings, the bottoms of the damping rings are connected with the top surface of the base, and two support blocks are arranged on the top surface of the second support plate.

Furthermore, the top surfaces of the two supporting blocks are respectively connected with the bottom surfaces of the two first supporting plates, the second supporting plate is positioned between the two supporting columns, and the bottom of the second supporting plate is provided with two bottom supporting rods.

Furthermore, the bottom of the bottom support rod is contacted with a second spring, the bottom of the second spring is provided with a spring cylinder, the bottom surface of the spring cylinder is connected with the top surface of the base, and the two spring cylinders are positioned between the two damping rings.

Furthermore, the outside of the front surface of the driven gear shaft is connected with the top of the supporting column through a shaft, the bottom surface of the cleaning rod is provided with a cleaning strip, and the collecting box is positioned below the cleaning rod.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this conveyer is used in semiconductor material production, first spring and damping device install, and at driving motor during operation, drive the transportation area through the driving band and rotate, all very big reduction the rotation that the drive of motor brought influences the operation of transportation area, and can alleviate the vibrations that the external world brought.

2. This conveyer is used in semiconductor material production, the installation of clearance pole and collecting box, through the drive that the driving motor brought, the rubbish dust of clearance pole on with the surface of conveyer belt is cleared up to the collecting box in through the cleaning strip to prevent to pollute semiconductor material.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is an enlarged view of a portion a in fig. 1 according to the present invention.

In the figure: the automatic cleaning machine comprises a base 1, a first spring 2, a driving gear 3, a driving belt 4, a driven gear shaft 5, a conveying belt 6, a collecting box 7, a cleaning rod 8, a driving gear 9, a third supporting rod 10, a reset shaft 11, a supporting column 12, a first supporting plate 13, a spring barrel 14, a bottom supporting rod 15, a second spring 16, a second supporting plate 17, a damping ring 18, a driving motor 19 and a third supporting plate 20.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the conveyor for producing semiconductor material in this embodiment includes a main frame structure and a support structure, the main frame structure includes a base 1, two supporting columns 12 are installed on a top surface of the base 1, a first spring 2 is sleeved outside each of the two supporting columns 12, a first supporting plate 13 is installed outside each of the two supporting columns 12, a top surface of the first spring 2 is connected to a bottom surface of the first supporting plate 13, a driving motor is installed on a top surface of the first supporting plate 13, a driving gear 3 is installed on an output shaft of the driving motor, a driving belt 4 is engaged outside the driving gear 3, a driven gear shaft 5 is engaged inside the driving belt 4, a transmission shaft is installed on a back surface of the driven gear shaft 5, and a conveying belt 6 is contacted outside a rotating shaft of the apparatus.

In this embodiment, the outside of the front surface of the driven gear shaft 5 is connected with the top of the supporting column 12 through a shaft, the bottom surface of the cleaning rod 8 is provided with a cleaning strip, and the collecting box 7 is positioned below the cleaning rod 8.

The driving motor is started to drive the driving gear 3 to rotate, the driving belt 4 meshed with the driving gear 3 rotates along with the driving gear, the driving belt 4 drives the driven gear shaft 5 to rotate, and the conveying belt 6 starts to transmit.

The support structure comprises a cleaning rod 8 positioned on the top surface of a conveying belt 6, a rotating sleeve is connected to the right side of the cleaning rod 8, a driving gear 9 is meshed inside the rotating sleeve, the bottom of the driving gear 9 is connected with a reset shaft 11, a rotating gear is installed at the bottom of the reset shaft 11, a rotating belt is meshed outside the rotating gear, a driving gear is meshed inside the rotating belt, the bottom of the driving gear is connected with a driving motor 19, a third supporting rod 10 is installed outside the reset shaft 11, the driving gear 9 is positioned outside the third supporting rod 10, a third supporting plate 20 is installed at the bottom of the third supporting rod 10, a collecting box 7 is installed on the top surface of the third supporting plate 20, and a damping device is installed at the bottom of the third supporting plate 20.

In this embodiment, the damping device comprises a first support rod located at the bottom of the third support plate 20, a second support plate 17 is installed at the bottom of the first support rod, and two damping rings 18 are installed at the bottom of the second support plate 17.

In this embodiment, the second support rod is installed inside each of the two damping rings 18, the bottom of the damping ring 18 is connected to the top surface of the base 1, and the top surface of the second support plate 17 is installed with two support blocks.

The cleaning strip of 8 bottoms of clearance pole cleans 6 surfaces in the transportation area, drives reset shaft 11 through the drive of CD-ROM drive motor 19 and rotates for clearance pole 8 is reciprocating motion, and collecting box 7 collects the rubbish that the clearance got off, and first spring 2 plays absorbing effect to whole device, and the shock attenuation is alleviated to the vibrations at middle part to damping ring 18 and second spring 16, and does the effect that the middle part supported.

In this embodiment, the top surfaces of the two supporting blocks are respectively connected to the bottom surfaces of the two first supporting plates 13, the second supporting plate 17 is located between the two supporting columns 12, and the bottom of the second supporting plate 17 is provided with two bottom supporting rods 15.

In this embodiment, the bottom of the bottom support rod 15 contacts with a second spring 16, the bottom of the second spring 16 is provided with a spring cylinder 14, the bottom surface of the spring cylinder 14 is connected with the top surface of the base 1, and the two spring cylinders 14 are located between two damping rings 18.

The working principle of the embodiment is as follows:

drive motor starts to drive gear 3 and rotates, with the driving band 4 of drive gear 3 engaged with thereupon rotate, driving band 4 drives driven gear shaft 5 and rotates, transport area 6 begins to transmit, the clean strip of clearance rod 8 bottom is taken 6 surfaces to the transport and is cleaned, drive reset shaft 11 through the drive of CD-ROM drive motor 19 rotates, make clearance rod 8 be reciprocating motion, collecting box 7 is collected the rubbish that the clearance got off, first spring 2 plays absorbing effect to whole device, the shock attenuation is alleviated to the vibrations at middle part to shock attenuation ring 18 and second spring 16, and the effect of middle part support is made.

Has the advantages that:

1. this conveyer is used in semiconductor material production, first spring 2 and damping device install, and at driving motor during operation, drive conveyer belt 6 through driving band 4 and rotate, and the rotation that the drive that has all very big reduction the motor brought influences the operation of conveyer belt 6, and can alleviate the vibrations that the external world brought.

2. In the conveying device for producing the semiconductor material, the cleaning rod 8 and the collection box 7 are arranged, and the cleaning rod 8 cleans the garbage dust on the surface of the conveying belt 6 into the collection box 7 through the cleaning strip by the driving of the driving motor 19 so as to prevent the semiconductor material from being polluted.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A conveyer is used in semiconductor material production, includes body frame structure and supporting structure, its characterized in that: the main frame structure comprises a base (1), two supporting columns (12) are arranged on the top surface of the base (1), first springs (2) are sleeved outside the two supporting columns (12), first supporting plates (13) are arranged outside the two supporting columns (12), the top surfaces of the first springs (2) are connected with the bottom surfaces of the first supporting plates (13), driving motors are arranged on the top surfaces of the first supporting plates (13), driving gears (3) are arranged on output shafts of the driving motors, driving belts (4) are meshed with the outsides of the driving gears (3), driven gear shafts (5) are meshed with the insides of the driving belts (4), transmission shafts are arranged on the back surfaces of the driven gear shafts (5), and conveying belts (6) are contacted with the outsides of rotating shafts of the devices;

the supporting structure is including being located clearance pole (8) of conveyer belt (6) top surface, the right side of clearance pole (8) is connected with the rotation cover, it has drive gear (9) to rotate cover intermeshing, the bottom that drives gear (9) is connected with reset shaft (11), rotary gear has been installed to the bottom of reset shaft (11), rotary gear's outside meshing has the rotation area, the inside meshing that rotates the area has the drive gear, the bottom that drives the gear is connected with driving motor (19), third bracing piece (10) have been installed to the outside of reset shaft (11), it is located the outside of third bracing piece (10) to drive gear (9), third backup pad (20) have been installed to the bottom of third bracing piece (10), collecting box (7) have been installed to the top surface of third backup pad (20), damping device has been installed to the bottom of third backup pad (20).

2. The conveying device for producing semiconductor material according to claim 1, wherein: the damping device comprises a first supporting rod positioned at the bottom of a third supporting plate (20), a second supporting plate (17) is arranged at the bottom of the first supporting rod, and two damping rings (18) are arranged on the bottom surface of the second supporting plate (17).

3. The conveying device for producing semiconductor material according to claim 2, wherein: second support rods are arranged inside the two damping rings (18), the bottoms of the damping rings (18) are connected with the top surface of the base (1), and two support blocks are arranged on the top surface of the second support plate (17).

4. A conveyor for semiconductor material production as claimed in claim 3, wherein: the top surfaces of the two supporting blocks are respectively connected with the bottom surfaces of the two first supporting plates (13), the second supporting plate (17) is positioned between the two supporting columns (12), and the bottom of the second supporting plate (17) is provided with two bottom supporting rods (15).

5. The conveying device for producing semiconductor materials according to claim 4, wherein: the bottom of the bottom supporting rod (15) is in contact with a second spring (16), the bottom of the second spring (16) is provided with a spring cylinder (14), the bottom surface of the spring cylinder (14) is connected with the top surface of the base (1), and the two spring cylinders (14) are located between the two damping rings (18).

6. The conveying device for producing semiconductor materials according to claim 1, wherein: the outside of the front face of the driven gear shaft (5) is connected with the top of the supporting column (12) through a shaft, the bottom face of the cleaning rod (8) is provided with a cleaning strip, and the collecting box (7) is located below the cleaning rod (8).