CN217704748U

CN217704748U - Jacking mechanism and three-dimensional printer

Info

Publication number: CN217704748U
Application number: CN202221251981.3U
Authority: CN
Inventors: 谢平
Original assignee: Shenzhen Ruifeng Technology Co ltd
Current assignee: Shenzhen Ruifeng Technology Co ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-11-01
Anticipated expiration: 2032-05-23

Abstract

The utility model discloses a jack-up mechanism and three-dimensional inkjet printer sets up the baffle in the thimble plate is provided with the one side of thimble, and the baffle is seted up with the via hole of thimble one-to-one, and the via hole can keep away a position thimble to make the baffle can be close to the stiff end of thimble; when the jacking mechanism works, the scraps of the workpiece can be deposited on the partition plate and can not be deposited on the plate body of the ejector plate; when the jacking mechanism needs to be cleaned, the partition plate can be detached from the ejector plate firstly, and then the partition plate is cleaned independently. Compared with an ejector plate with ejector pins, the cleaning difficulty of the partition plate with the through holes is smaller, and the ejector plate can not accumulate scraps under the isolation effect of the partition plate, so that the cleaning difficulty of the jacking mechanism can be reduced, and the cleaning efficiency is improved. In addition, the flexible sealing layer can enter the gap between the through hole and the ejector pin through deformation so as to block the gap between the through hole and the ejector pin, so that scraps on the partition plate can be prevented from falling on the plate body from the gap, and the scrap breakage prevention effect on the ejector pin plate is improved.

Description

Jacking mechanism and three-dimensional printer

Technical Field

The utility model relates to a three-dimensional inkjet printer technical field, in particular to jack-up mechanism and three-dimensional inkjet printer.

Background

Three-dimensional printing is a technique for constructing an object by layer-by-layer printing using a bondable material such as powdered metal, plastic, or photocurable resin based on a digital model file.

The three-dimensional photocuring forming method is an important branch of three-dimensional printing technology, and is characterized in that laser with specific wavelength and intensity is used for irradiating the surface of liquid photosensitive resin to cure a layer of resin in a specific area on the surface, after one layer of resin is cured, a lifting platform is lowered for a certain distance, a coating scraper is used for uniformly covering a layer of liquid resin on the cured layer, the laser irradiation curing of the next layer is carried out, and the steps are repeated to finally obtain a three-dimensional workpiece which is formed by stacking layers.

In the existing three-dimensional printer, after the three-dimensional workpiece is printed, the workpiece is separated from a printing platform through ejector pins of a jacking mechanism, but workpiece fragments can be deposited on the jacking mechanism, and the ejector pins are distributed on the jacking mechanism, so that the difficulty in cleaning the jacking mechanism is high.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing a jack-up mechanism aims at solving the technical problem that current jack-up mechanism is difficult to the clearance.

In order to achieve the above object, the present invention provides a jack-up mechanism comprising:

the thimble plate comprises a plate body and a plurality of thimbles distributed on the plate body;

the partition plate is detachably mounted on the ejector plate, a plurality of through holes are formed in the partition plate, and the ejector pins can penetrate through the through holes, so that the partition plate is close to the ejector pins and is connected to one end of the plate body;

and the flexible sealing layer is arranged between the hole wall of the through hole and the peripheral wall of the thimble so as to plug a gap between the through hole and the thimble.

Optionally, the flexible sealing layer is cylindrical and extends along a circumferential direction of the thimble.

Optionally, the flexible sealing layer is fixed to the hole wall of the via hole.

Optionally, a seal groove is formed in the hole wall of the via hole, and the flexible seal layer is arranged in the seal groove and protrudes out of the notch of the seal groove.

Optionally, the flexible sealing layer is arranged as a plastic film layer, a cotton layer or a silica gel layer.

Optionally, the partition abuts against the plate body.

Optionally, the thickness of the separator is set to 2mm to 5mm.

Optionally, the partition plate is further provided with a threaded hole, and the threaded hole is used for being in threaded fit with a threaded tool, so that the partition plate can move in a direction away from the plate body.

Optionally, one end of the via hole close to the plate body is flared.

The utility model also provides a three-dimensional printer, which comprises a fixed plate, a material groove, a printing platform and a jacking mechanism; the jack-up mechanism includes: the ejector pin plate comprises a plate body and a plurality of ejector pins distributed on the plate body; the partition plate is detachably mounted on the ejector plate and is provided with a plurality of through holes for the ejector pins to pass through, so that the partition plate is close to the ejector pins and is connected to one end of the plate body; the flexible sealing layer is arranged between the hole wall of the through hole and the peripheral wall of the ejector pin so as to seal a gap between the through hole and the ejector pin;

the printing platform is connected with the fixed plate in a sliding mode in a direction perpendicular to the bottom of the trough, and the printing platform is used for bearing a formed workpiece; the ejection mechanism is arranged at the bottom of the trough, and when the printing platform moves towards the bottom of the trough, an ejector pin of the ejection mechanism penetrates through the printing platform and ejects the formed workpiece.

In the technical scheme of the jacking mechanism of the utility model, a baffle plate is arranged at one side of the thimble plate provided with the thimble, the baffle plate is provided with through holes which are in one-to-one correspondence with the thimble, and the thimble can be avoided by the through holes so that the baffle plate can be close to the fixed end of the thimble; when the jacking mechanism works, the scraps of the workpiece can be deposited on the partition plate and can not be deposited on the plate body of the ejector plate; when the jacking mechanism needs to be cleaned, the partition plate can be detached from the ejector plate firstly, and then the partition plate is cleaned independently. Compared with an ejector plate with ejector pins, the cleaning difficulty of the partition plate with the through holes is smaller, and the ejector plate can not accumulate scraps under the isolation effect of the partition plate, so that the cleaning difficulty of the jacking mechanism can be reduced, and the cleaning efficiency is improved.

In addition, the flexible sealing layer can enter the gap between the through hole and the ejector pin through deformation so as to block the gap between the through hole and the ejector pin, so that scraps on the partition plate can be prevented from falling on the plate body from the gap, and the scrap breakage prevention effect on the ejector pin plate is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of an embodiment of a jacking mechanism of the present invention;

fig. 2 is an exploded view of an embodiment of the jacking mechanism of the present invention;

fig. 3 is a schematic side projection view of an embodiment of the jacking mechanism of the present invention;

fig. 4 is a schematic cross-sectional view of an embodiment of the jacking mechanism of the present invention;

fig. 5 is a partially enlarged view of a portion a in fig. 4 according to the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)	Reference numerals	Name (R)
						100	Jacking mechanism	11	Plate body	12	Thimble
20	Partition board	21	Via holes	22	Threaded hole
						10	Ejector plate	30	Flexible sealing layer

The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are provided in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a jack-up mechanism 100 and three-dimensional inkjet printer.

The utility model discloses a three-dimensional printer is used for implementing three-dimensional printing technique, and three-dimensional printing technique is blue book with computer three-dimensional design model, through software layering dispersion and numerical control molding system, utilizes modes such as laser beam, hot melt nozzle to carry out the successive layer with special materials such as metal powder, ceramic powder, plastics, cell tissue and piles up cohering, and final stack shaping produces the emerging manufacturing technology of entity product. Different from the traditional manufacturing industry that the raw materials are shaped and cut through machining modes such as a die and a turn-milling mode to finally produce a finished product, the three-dimensional printing technology changes a three-dimensional entity into a plurality of two-dimensional planes, and the three-dimensional printing technology carries out production through material treatment and layer-by-layer superposition, so that the manufacturing complexity is greatly reduced. Therefore, the digital manufacturing mode has the natural advantages of simple process, low customization cost, short production period and the like, and can be extended to a wider production crowd.

The utility model discloses a three-dimensional inkjet printer can include the fixed plate, silo, print platform, jack-up mechanism 100 and get the material subassembly.

The fixing plate is an integral frame of the three-dimensional printer; the feed trough is connected with the fixing plate and used for containing source liquid; print platform and fixed plate sliding connection, print platform is used for bearing the weight of the shaping part. A light machine of the three-dimensional printer emits laser beams to irradiate source liquid, and the source liquid is solidified and formed on the printing platform. The fixing plate is an integral frame of the three-dimensional printer; the feed trough is connected with the fixing plate and used for containing source liquid; print platform and fixed plate sliding connection, print platform is used for bearing the weight of the shaping part. A light machine of the three-dimensional printer emits laser beams to irradiate source liquid, and the source liquid is solidified and formed on the printing platform. The jacking mechanism 100 is arranged at the bottom of the material groove, and the jacking mechanism 100 is used for jacking the formed workpiece after penetrating through the printing platform; get material subassembly and fixed plate sliding connection, get the material subassembly and be used for scraping from print platform and get the shaping work piece.

In order to make this technical field personnel right the utility model discloses a three-dimensional inkjet printer has a more audio-visual understanding, will use specific implementation process as the example right the utility model discloses a three-dimensional inkjet printer's printing principle explains.

1: the optical machine platform emits laser beams to irradiate source liquid in the material groove, and the source liquid is solidified and formed on the printing platform to obtain a formed part; 2: the printing platform moves towards the bottom of the material groove until the jacking mechanism 100 penetrates through the printing platform, and the jacking mechanism 100 exerts force on the formed part to separate the formed part from the printing platform; 3: the material taking assembly sweeps the printing platform transversely to scrape the formed part from the printing platform. And (4) repeating the steps 1 to 3 by the three-dimensional printer, thereby realizing the automatic production of the formed workpiece.

Referring to fig. 1, fig. 2, fig. 4 and fig. 5, fig. 1 is a schematic structural diagram of an embodiment of a jacking mechanism 100 of the present invention; fig. 2 is an exploded view of an embodiment of the jacking mechanism 100 of the present invention; fig. 4 is a schematic cross-sectional view of an embodiment of the jacking mechanism 100 of the present invention; fig. 5 is a partially enlarged view of a portion a in fig. 4 according to the present invention. The utility model provides a jack-up mechanism 100 includes: the ejector pin plate 10 comprises a plate body 11 and a plurality of ejector pins 12 distributed on the plate body 11; the partition plate 20 is detachably mounted on the ejector plate 10, the partition plate 20 is provided with a plurality of through holes 21, and the through holes 21 are used for the ejector pins 12 to pass through so that the partition plate 20 is connected to one end of the plate body 11 close to the ejector pins 12; and the flexible sealing layer 30 is arranged between the hole wall of the through hole 21 and the peripheral wall of the thimble 12, so as to seal the gap between the through hole 21 and the thimble 12.

In the present embodiment, specifically, the plurality of ejector pins 12 are distributed on the upper surface of the plate body 11 in a matrix. The overall shape and size of the partition 20 may be the same as the overall shape and size of the plate body 11 so that the partition 20 can entirely cover the plate body 11. The number, shape, size and distribution density of the through holes 21 on the partition 20 are consistent with those of the ejector pins 12, so that all the ejector pins 12 of the ejector plate 10 can pass through the partition 20. The through holes 21 may help the partition 20 avoid the ejector pins 12, so that the partition 20 may be close to the fixed ends of the ejector pins 12, i.e., abut against or be close to the upper surface of the plate body 11; that is, the partition 20 can effectively cover the upper surface of the plate body 11.

The jacking mechanism 100 is arranged at the bottom of the trough, and workpiece fragments fall into the trough and then fall onto the jacking mechanism 100 and finally onto the partition plate 20 without directly depositing on the upper surface of the plate body 11. When the jacking mechanism 100 needs to be cleaned, the partition plate 20 can be detached from the ejector plate 10, and then the partition plate 20 and the ejector plate 10 are cleaned separately, so that the cleaning effect on the partition plate 20 and the ejector plate 10 can be improved simultaneously, and the cleaning difficulty on the jacking mechanism 100 is reduced. The separator 20 may be provided as a metal plate, so that the corrosion resistance of the separator 20 can be improved to allow the separator 20, which is immersed in the source liquid for a long period of time, to maintain its shape. The material and shape of the flexible sealing layer 30 are not limited, and only the gap between the via hole 21 and the thimble 12 can be blocked. For example, flexible sealing layer 30 may be provided as a plastic film layer, a cotton layer, or a silicone layer.

In the technical solution of the jacking mechanism 100 of the present invention, a partition plate 20 is disposed on one side of the thimble plate 10 where the thimble 12 is disposed, the partition plate 20 is provided with through holes 21 corresponding to the thimbles 12 one by one, and the through holes 21 can avoid the thimble 12, so that the partition plate 20 can be close to the fixed end of the thimble 12; when the jacking mechanism 100 is operated, the workpiece scraps are deposited on the partition plate 20 and are not deposited on the plate body 11 of the ejector plate 10; when the jacking mechanism 100 needs to be cleaned, the partition plate 20 can be detached from the ejector plate 10, and then the partition plate 20 can be cleaned independently. Compared with the ejector plate 10 distributed with the ejector pins 12, the partition plate 20 provided with the through holes 21 is less difficult to clean, and the ejector plate 10 does not accumulate fragments under the isolation action of the partition plate 20, so that the cleaning difficulty of the jacking mechanism 100 can be reduced, and the cleaning efficiency is improved.

In addition, the flexible sealing layer 30 can enter the gap between the through hole 21 and the thimble 12 by deforming to seal the gap between the through hole 21 and the thimble 12, so that the debris on the partition plate 20 can be prevented from falling onto the plate body 11 from the gap, and the effect of preventing the debris from falling on the thimble plate 10 is improved.

The flexible sealing layer 30 may extend in an arc shape or may be disposed in a cylindrical shape. Illustratively, the flexible sealing layer 30 is cylindrical and extends along the circumferential direction of the thimble 12 to substantially seal the gap between the thimble 12 and the via hole 21. In addition, when the flexible sealing layer 30 is disposed, the tubular flexible sealing layer 30 may be firstly sleeved on the thimble 12 or fixed on the hole wall of the via hole 21, so as to reduce the difficulty of disposing the flexible sealing layer 30.

The flexible sealing layer 30 may be fixed to the circumferential wall of the thimble 12 in advance, or may be fixed to the hole wall of the through hole 21 in advance, and after the thimble 12 and the through hole 21 are assembled in place, the flexible sealing layer 30 can be directly sandwiched between the thimble 12 and the through hole 21 without being plugged in later stage. Illustratively, as shown in fig. 5, the flexible sealing layer 30 is fixed to the hole wall of the via hole 21. The flexible sealing layer 30 may be adhesively secured to the walls of the via 21. The partition 20 is movable relative to the thimble 12 during installation, so that the flexible sealing layer 30 is fixed on the wall of the through hole 21, so that the flexible sealing layer 30 moves along with the partition 20 and is finally installed in place along with the partition 20. The flexible sealing layer 30 can also reduce the friction between the wall of the through hole 21 and the circumferential wall of the thimble 12, so that the installation process of the partition board 20 is smoother, and the installation difficulty is reduced. When the partition plate 20 is disassembled, the partition plate 20 moves along the length direction of the thimble 12 until the partition plate is separated from the tail end of the thimble 12; in this process, the flexible sealing layer 30 has a wiping effect on the peripheral wall of the thimble 12, so that the scraps adhered to the peripheral wall of the thimble 12 can be wiped off together, the cleaning effect on the thimble 12 is improved, and the difficulty in cleaning the thimble 12 in the later period is reduced.

For example, a sealing groove (not shown) is formed on a hole wall of the via hole 21, and the flexible sealing layer 30 is disposed in the sealing groove and protrudes from a notch of the sealing groove. The groove wall of the sealing groove can limit the flexible sealing layer 30 to prevent the flexible sealing layer 30 from being easily separated from the hole wall of the via hole 21, so that the installation stability of the flexible sealing layer 30 can be improved.

A gap can be formed between the partition board 20 and the board body 11, and the whole body can be abutted against the board body 11; if a gap is formed between the partition plate 20 and the plate body 11, debris easily enters the gap from other places. For example, please refer to fig. 3, fig. 3 is a schematic side projection diagram of an embodiment of the jacking mechanism 100 of the present invention. The partition plate 20 abuts against the plate body 11 so that no gap is formed between the partition plate 20 and the plate body 11, thereby preventing the entry of chips and improving the effect of blocking the chips from the upper surface of the plate body 11. The partition plate 20 and the plate body 11 may be connected by a fastener or may be abutted only by gravity, which is not limited herein.

Illustratively, the thickness D of the separator 20 is set to be 2mm to 5mm, such as 2mm, 3mm, 4mm, 5mm. If the thickness D of the partition board 20 is less than 2mm, the partition board 20 has low structural strength and is easy to damage or deform after being disassembled and assembled for many times; if the thickness of the partition plate 20 is greater than 5mm, the difficulty in mounting and dismounting the partition plate 20 is increased, and the exposed size of the thimble 12 is affected. Therefore, the thickness D of the partition board 20 is set to be 2mm to 5mm, so that the structural stability of the partition board 20 can be ensured, the difficulty in dismounting the partition board 20 can be reduced, and the influence on the working process of the ejector pin 12 can be reduced.

When the partition plate 20 needs to be detached from the ejector plate 10, a pulling force may be applied from the upper side of the partition plate 20, and a pushing force may also be applied from the lower side of the partition plate 20. Illustratively, as shown in fig. 2, the partition board 20 further defines a threaded hole 22, and the threaded hole 22 is configured to be threadedly engaged with a threaded tool, so that the partition board 20 can move in a direction away from the board body 11. The screw thread instrument has certain length, and the screw thread instrument can follow the baffle 20 and deviate from the one side of plate body 11 and screw hole 22 spiral normal running fit, and the one end butt of screw thread instrument is in plate body 11 in the rotation process, and along with the screw propulsion process of screw thread instrument, baffle 20 can be driven towards the direction of keeping away from plate body 11 to make baffle 20 tear the plate body 11 apart gradually. That is, by providing the threaded hole 22 on the plate body 11 and by means of the cooperation of the threaded tool, the rotation of the threaded tool can be converted into the ascending movement of the partition plate 20, so as to reduce the difficulty in detaching the partition plate 20 and improve the convenience in detaching the partition plate 20.

Illustratively, one end of the through hole 21 close to the board body 11 is flared. When the partition board 20 is installed, the thimble 12 extends into the through hole 21 from the flaring end of the through hole 21 and then extends out from the other end, so that the thimble 12 can extend into the through hole 21 more quickly and smoothly, the installation difficulty of the partition board 20 and the thimble board 10 is reduced, and the installation efficiency is improved.

The above is only the optional embodiment of the present invention, and not the scope of the present invention is limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.

Claims

1. A jacking mechanism is applied to a three-dimensional printer, and is characterized by comprising:

the ejector pin plate comprises a plate body and a plurality of ejector pins distributed on the plate body;

the partition plate is detachably mounted on the ejector plate and is provided with a plurality of through holes for the ejector pins to pass through, so that the partition plate is close to the ejector pins and is connected to one end of the plate body;

and the flexible sealing layer is arranged between the hole wall of the through hole and the peripheral wall of the ejector pin so as to seal the gap between the through hole and the ejector pin.

2. The lift mechanism of claim 1, wherein said flexible sealing layer is cylindrical and extends circumferentially of said pin.

3. The jacking mechanism of claim 1, wherein the flexible sealing layer is secured to a wall of the via.

4. The jacking mechanism as claimed in claim 3, wherein a sealing groove is formed in a wall of said via hole, and said flexible sealing layer is disposed in said sealing groove and protrudes from a notch of said sealing groove.

5. The jacking mechanism as claimed in any one of claims 1 to 4, wherein said flexible sealing layer is provided as a plastic film layer, a cotton layer or a silicone layer.

6. The jacking mechanism as claimed in any one of claims 1 to 4, wherein said spacer abuts against said plate.

7. A jack-up mechanism as claimed in any one of claims 1 to 4, wherein the thickness of the spacer is set to 2mm to 5mm.

8. The jacking mechanism as claimed in any one of claims 1 to 4, wherein said spacer plate further defines a threaded aperture for threadably engaging a threaded tool to enable said spacer plate to be moved in a direction away from said plate body.

9. A jacking mechanism as claimed in any one of claims 1 to 4, wherein said via is flared adjacent one end of said plate body.

10. A three-dimensional printer comprising a holding plate, a hopper, a printing platform and the jacking mechanism of any one of claims 1 to 9; the material tank is connected with the fixing plate and used for containing source liquid, the printing platform is in sliding connection with the fixing plate in the direction perpendicular to the bottom of the material tank, and the printing platform is used for bearing a formed workpiece; the ejection mechanism is arranged at the bottom of the trough, and when the printing platform moves towards the bottom of the trough, an ejector pin of the ejection mechanism penetrates through the printing platform and ejects the formed workpiece.