CN217704519U - Internal mold die for USB CM interface - Google Patents
Internal mold die for USB CM interface Download PDFInfo
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- CN217704519U CN217704519U CN202221764560.0U CN202221764560U CN217704519U CN 217704519 U CN217704519 U CN 217704519U CN 202221764560 U CN202221764560 U CN 202221764560U CN 217704519 U CN217704519 U CN 217704519U
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Abstract
The utility model provides a USB CM interface internal mold, which comprises a mold strip, an upper mold and a lower mold matched with the upper mold; the die is provided with an upper die strip groove and a plurality of upper die cavities, a pouring gate is arranged in the upper die strip groove, each upper die cavity is connected with an upper injection groove, the upper injection grooves are positioned at two sides of the die cavity, the upper injection grooves are also connected with upper injection ports, and the upper injection grooves are communicated with the pouring gate; the lower die is provided with a lower die strip groove and a plurality of lower die cavities, each lower die cavity is connected with a lower injection groove, the lower injection grooves are positioned at two sides of the lower die cavity, and the lower injection grooves are also connected with lower injection ports; a plurality of grooves are formed in one side, close to the lower die cavity, of the die strip, locating pieces are arranged inside each groove, a runner matched with a pouring gate is further arranged on the die strip, and the runner is communicated with the upper injection groove and the lower injection groove. The utility model discloses a there is the problem that shaping is inefficient and the forming process is complicated in the USB customization forming process has been solved to the mould.
Description
Technical Field
The utility model relates to a USB processing technology field, concretely relates to USB CM interface centre form mould.
Background
USB is an abbreviation for Universal Serial Bus (USB), an external Bus standard, used to standardize the connection and communication between computers and external devices, and is an interface technology applied in the field of PCs. The universal serial bus is a new data communication mode which gradually replaces other interface standards, the extremely high transmission speed of the universal serial bus can meet the application environment requirement of high-speed data transmission, and the universal serial bus also has the advantages of simple power supply, convenient installation and configuration, simple and easy expansion port, diversified transmission modes and good compatibility.
The mould is various moulds and tools for obtaining required products by injection molding, blow molding, extrusion, die casting or forging forming, smelting, stamping and other methods in industrial production. Injection molding, also known as injection molding, is a method of molding by injection and molding. The injection molding has the advantages of high production speed, high efficiency, automation of operation, various colors and varieties, various shapes from simple to complex, small sizes, accurate product size, easy replacement of products, capability of forming products with complex shapes, and suitability for the fields of mass production, products with complex shapes and the like.
With the development of society, people have higher demands on the shape of the USB, and in order to meet the demands of people, USB manufacturers launch USB customized services. In the prior art, the mold used for the USB customized production has the problems of low molding efficiency and complex molding process.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a USB CM interface centre form mould for there is the technical problem that shaping is inefficient and the shaping technology is complicated in solving prior art USB customization shaping.
In order to achieve the above object, an embodiment of the present invention provides an internal mold for a USB CM interface, including a mold strip, an upper mold, and a lower mold matching with the upper mold;
an upper die strip groove and a plurality of upper die cavities are formed in the upper die, a runner is arranged in the upper die strip groove, each upper die cavity is connected with an upper injection groove, the upper injection grooves are located on two sides of the die cavity, the upper injection grooves are also connected with upper injection ports, and the upper injection grooves are communicated with the runner;
the lower die is provided with a lower die strip groove and a plurality of lower die cavities, each lower die cavity is connected with a lower injection groove, the lower injection grooves are positioned at two sides of the lower die cavity, and the lower injection grooves are also connected with lower injection ports;
a plurality of grooves are formed in one side, close to the lower die cavity, of the die strip, a positioning piece is arranged inside each groove, a runner matched with the pouring gate is further arranged on the die strip, and the runner is communicated with the upper injection groove and the lower injection groove;
the upper die cavity is matched with the lower die cavity, and the die strip is arranged in the upper die strip groove and the lower die strip groove.
In order to solve the problem of large trace of a product feeding point, an upper glue injection hole is preferably arranged at the joint of an upper glue injection groove and an upper die cavity, and the upper glue injection hole is communicated with the upper glue injection groove and the upper die cavity; the joint of the lower pouring trough and the lower die cavity is provided with a lower pouring hole which is communicated with the lower pouring trough and the lower die cavity.
Preferably, the upper injection groove comprises an upper injection groove initial section, and the upper injection groove initial section is communicated with the upper injection port; the lower injection groove comprises a lower injection groove initial section which is communicated with the lower injection port.
Preferably, the number of the grooves is the same as that of the upper die cavity and the lower die cavity, and the grooves correspond to the positions of the upper die cavity and the lower die cavity one by one.
Preferably, the upper die is provided with a plurality of positioning pieces.
Preferably, the lower die is provided with a plurality of positioning holes, and the positioning piece is embedded into the positioning holes.
Preferably, the upper die and the lower die are both provided with a plurality of wire grooves, and each wire groove is connected with the die cavity.
Preferably, the upper die and the lower die are both provided with a placing cavity.
Preferably, a plurality of water cooling holes are formed in the upper die and the lower die, and each water cooling hole is located on the front surface and the rear surface of the upper die and the lower die.
To sum up, the beneficial effects of the utility model are that:
1. the utility model discloses an all seted up die cavity, mould strip groove and notes silo on last mould and the bed die to it communicates with each other with the sprue to annotate the silo, has seted up the runner on the mould strip, still is provided with the recess, and the recess is inside to be provided with the spacer. When the USB is formed, the mold strip is placed between the upper mold strip groove and the lower mold strip groove, the mold cavity corresponds to the groove, and forming materials flow into the material injection groove, the pouring channel and the flow channel through the material injection port and then flow into the mold cavity, so that the forming of a product is completed. The whole forming process is simple and the forming efficiency is high.
2. The utility model discloses an upper die and lower die's notes silo all are provided with the notes hole of gluing with the junction of die cavity to the notes hole of gluing all communicates with each other with notes silo and die cavity. The glue injection holes are arranged to reduce and furl the feeding points of the product, so that the feeding point traces on the appearance of the product are small, and the quality of the molded product is guaranteed.
3. The utility model discloses an upper die is last to be provided with a plurality of setting elements, has seted up a plurality of locating holes on the bed die to in the setting element embedding locating hole. Be equipped with locating hole and setting element and be convenient for the connection cooperation between last mould and the bed die for the contact between last mould and the bed die is more compact not hard up, thereby has increased the fashioned stability of product, has reduced the defective rate of product.
Drawings
Fig. 1 is a top view of a lower mold according to an embodiment of the present invention;
fig. 2 is a top view of an upper mold in an embodiment of the present invention;
fig. 3 is a top view of a mold strip in an embodiment of the present invention;
FIG. 4 is a front view of a die strip in an embodiment of the present invention;
fig. 5 is a schematic view of the groove and the positioning plate on the mold strip according to an embodiment of the present invention.
The mold comprises a mold strip 1, a mold strip 2, a lower mold 3, a mold strip groove 4, an upper mold cavity 5, a pouring gate 6, an upper injection groove 7, an upper injection port 8, a lower mold strip groove 9, a lower mold cavity 10, a lower injection groove 11, a lower injection port 12, a groove 13, a positioning sheet 14, a flow channel 15, a lower injection hole 16, an upper injection groove initial section 17, a lower injection groove initial section 18, a positioning piece 19, a positioning hole 20, a wire material groove 21 and a placing cavity 22.
Detailed Description
The utility model provides a USB CM interface shell forming die is applicable to the shaping of USB3.1 CM interface centre form, and it includes mould strip 1, go up mould 2 and with last mould 2 matched with bed die 3, during the compound die, mould strip 1 is fixed respectively in the mould strip groove of following last mould 2 and bed die 3.
An upper mold strip groove 4 for fixedly placing the mold strip 1 and a plurality of upper mold cavities 5 are formed in the upper mold 2, and the upper mold cavities 5 are matched with a lower mold cavity 10 to jointly complete the molding of the USB3.1 CM interface inner mold. A pouring channel 6 is arranged in the upper mould strip groove 4, and the pouring channel 6 is communicated with an upper material injection groove 7. Every goes up die cavity 5 and is connected with last silo 7, goes up silo 7 and is located the both sides of die cavity, goes up silo 7 and includes silo initial segment 17 of annotating, goes up silo initial segment 17 and is linked together with last sprue 8, and during silo initial segment 17 was annotated in the sizing material got into through last sprue 8, and then reentrant notes in the silo. When the product is molded, the two sides of the mold cavity are provided with the material injection grooves, so that the rubber material can enter the same mold cavity through the material injection grooves on the two sides, the molding time of the product is greatly shortened, and the molding efficiency of the product is improved.
Lower mould strip groove 9 and a plurality of die cavity 10 have been seted up on the bed die 3, and every die cavity 10 is connected with down the silo 11 of making a bet, and the silo 11 of making a bet is located the both sides of die cavity 10, and the silo 11 of making a bet is including making a bet silo initial segment 18, and it is linked together to make a bet silo initial segment 18 and make a bet material mouthful 12.
A plurality of grooves 13 are formed in one side, close to the lower die cavity 10, of the die strip 1, the number of the grooves 13 is the same as that of the upper die cavity 5 and that of the lower die cavity 10, the positions of the grooves correspond to those of the lower die cavity 10 one by one, and positioning pieces 14 are arranged inside each groove 13. During molding, the glue inside the mold cavity can enter the gap between the groove 13 and the positioning piece 14 on the mold strip 1. The mould strip 1 is also provided with a runner 15 matched with the pouring gate 6, and the runner 15 is communicated with the upper injection groove 7 and the lower injection groove 11. When a product is molded, a rubber material enters the mold through the injection port, further enters the initial section of the injection groove communicated with the injection port, enters the pouring channel 6 and the flow channel 15 under the pressure of injection molding, then enters the injection groove communicated with the pouring channel 6 and the flow channel 15, and finally reaches the mold cavity to complete the molding of the inside of the USB3.1 CM interface.
An upper glue injection hole is formed at the joint of the upper glue injection groove 7 and the upper die cavity 5, and the upper glue injection hole is communicated with both the upper glue injection groove 7 and the upper die cavity 5; the joint of the lower pouring trough 11 and the lower die cavity 10 is provided with a lower pouring hole 16, and the lower pouring hole 16 is communicated with the lower pouring trough 11 and the lower die cavity 10. The size of the glue injection hole is smaller and smaller from the material injection groove to the die cavity, and the feeding point of the product is reduced and folded, so that the trace of the feeding point on the appearance of the product is small, and the quality of the molded product is ensured. The glue injection hole is also connected with the bottom of the die cavity, and because the formed product is a metal shell, only the bottom has a space for allowing glue to enter.
The upper die 2 is provided with a plurality of positioning parts 19, the lower die 3 is provided with a plurality of positioning holes 20, and the positioning parts 19 are embedded into the positioning holes 20. The positioning holes 20 and the positioning pieces 19 are arranged, so that the upper die 2 and the lower die 3 can be connected and matched conveniently, the upper die 2 and the lower die 3 can be contacted more compactly and cannot be loosened, the stability of product forming is improved, and the reject ratio of products is reduced.
The parting surfaces of the upper die 2 and the lower die 3 are respectively provided with a plurality of wire grooves 21, each wire groove 21 is connected with the die cavity, and the wire grooves 21 are used for connecting and fixing wires and USB interfaces in the product forming process. All seted up on last mould 2 and the bed die 3 and placed chamber 22, placed chamber 22 and be connected with wire rod groove 21, placed chamber 22 and be used for placing the wire rod for can not cause the damage to the wire rod when the mould compound die. Go up and all seted up a plurality of water-cooling holes on mould 2 and the bed die 3, every water-cooling hole all is located the front and back surface of mould 2 and bed die 3, and the water-cooling hole is used for letting in cold water, cools off the product after accomplishing the shaping.
The working principle and the process are as follows: fixing the mould strip 1 in a lower mould strip groove 9 of a lower mould 3, moving the upper mould 2 to complete the mould closing of the upper mould 2 and the lower mould 3, after the mould closing is completed, injecting the material for product forming into the mould through a material injection port, sequentially injecting the sizing material in the mould into a material channel formed by a runner 15 and a pouring gate 6 and the material injection groove through the initial section of the material injection groove, and finally flowing into the mould cavity from the material injection grooves on two sides of the mould cavity to complete the forming of the USB interface.
While the present invention has been described in detail and with reference to the accompanying drawings, it is not to be considered as limited to the scope of the invention. Various modifications and changes may be made by those skilled in the art without inventive step within the scope of the appended claims.
Claims (9)
1. The utility model provides a USB CM interface centre form mould which characterized in that: comprises a mould strip, an upper mould and a lower mould matched with the upper mould;
the upper die is provided with an upper die strip groove and a plurality of upper die cavities, pouring gates are arranged in the upper die strip groove, each upper die cavity is connected with an upper injection groove, the upper injection grooves are positioned on two sides of the die cavity, the upper injection grooves are also connected with upper injection ports, and the upper injection grooves are communicated with the pouring gates;
the lower die is provided with a lower die strip groove and a plurality of lower die cavities, each lower die cavity is connected with a lower injection groove, the lower injection grooves are positioned at two sides of the lower die cavity, and the lower injection grooves are also connected with lower injection ports;
a plurality of grooves are formed in one side, close to the lower die cavity, of the die strip, a positioning sheet is arranged inside each groove, a runner matched with the pouring channel is further arranged on the die strip, and the runner is communicated with the upper injection groove and the lower injection groove;
the upper die cavity is matched with the lower die cavity, and the die strip is arranged in the upper die strip groove and the lower die strip groove.
2. The internal mold die for a USB CM interface according to claim 1, wherein: an upper glue injection hole is formed at the joint of the upper glue injection groove and the upper die cavity, and the upper glue injection hole is communicated with the upper glue injection groove and the upper die cavity; and a lower glue pouring hole is formed at the joint of the lower glue pouring groove and the lower die cavity, and the lower glue pouring hole is communicated with the lower glue pouring groove and the lower die cavity.
3. The internal mold die for a USB CM interface according to claim 1, wherein: the upper material injection groove comprises an upper material injection groove initial section, and the upper material injection groove initial section is communicated with the upper material injection port; the lower injection groove comprises a lower injection groove initial section, and the lower injection groove initial section is communicated with the lower injection port.
4. The internal mold die for a USB CM interface according to claim 1, wherein: the number of the grooves is the same as that of the upper die cavity and the lower die cavity, and the grooves correspond to the positions of the upper die cavity and the lower die cavity one to one.
5. The internal mold die for a USB CM interface according to claim 1, wherein: the upper die is provided with a plurality of positioning pieces.
6. The internal mold die for a USB CM interface according to claim 5, wherein: a plurality of positioning holes are formed in the lower die, and the positioning pieces are embedded into the positioning holes.
7. The internal mold die for a USB CM interface according to claim 1, wherein: and a plurality of wire grooves are formed in the upper die and the lower die, and each wire groove is connected with the die cavity.
8. The internal mold die for a USB CM interface according to claim 1, wherein: the upper die and the lower die are both provided with placing cavities.
9. The internal mold die for a USB CM interface according to claim 1, wherein: a plurality of water cooling holes are formed in the upper die and the lower die, and each water cooling hole is located in the front surface and the rear surface of the upper die and the lower die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221764560.0U CN217704519U (en) | 2022-07-08 | 2022-07-08 | Internal mold die for USB CM interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221764560.0U CN217704519U (en) | 2022-07-08 | 2022-07-08 | Internal mold die for USB CM interface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217704519U true CN217704519U (en) | 2022-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221764560.0U Active CN217704519U (en) | 2022-07-08 | 2022-07-08 | Internal mold die for USB CM interface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217704519U (en) |
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2022
- 2022-07-08 CN CN202221764560.0U patent/CN217704519U/en active Active
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