CN217704247U

CN217704247U - Processing die for electronic equipment shell

Info

Publication number: CN217704247U
Application number: CN202221563534.1U
Authority: CN
Inventors: 龙红辉; 寇彪; 杜军红; 葛振纲; 李成祥
Original assignee: Shanghai Longcheer Technology Co Ltd
Current assignee: Shanghai Longcheer Technology Co Ltd
Priority date: 2022-06-21
Filing date: 2022-06-21
Publication date: 2022-11-01
Anticipated expiration: 2032-06-21

Abstract

The application discloses mold processing of electronic equipment casing includes: the mold comprises a first mold core, a second mold core, a first line position, a second line position, a third line position and a fourth line position; the first mold core and the second mold core are arranged oppositely, and the first line position, the second line position, the third line position and the fourth line position are connected end to end and arranged between the first mold core and the second mold core; a product die cavity is formed among the first die core, the second die core, the first line position, the second line position, the third line position and the fourth line position; and the first row position, the second row position, the third row position and the fourth row position are respectively provided with a continuous first parting surface. This application has set up first profile, has avoided the electronic equipment casing to take place to shift at the finishing impression line in the course of working, has also avoided the finishing impression line to produce the condition such as sawtooth, irregularity, has promoted the stability and the product yield of finishing impression line.

Description

Processing die for electronic equipment shell

Technical Field

The application belongs to the technical field of moulds, concretely relates to processing mould of electronic equipment casing.

Background

The battery cover of the electronic equipment has texture effect on the appearance surface, namely convex ribs and the like protruding on a smooth plane, such as a vacant space reserved for a camera by the battery cover and a protrusion arranged along the circumferential direction of the vacant space. The fine engraving is to process the texture on the back mold core of the mold by laser, and then transfer the texture on the appearance surface of the battery cover by the back mold core. The existing mould does not have a parting surface, and the carved grain is easy to influence a high light surface beside due to dislocation during transfer printing, so that sawteeth at the boundary of the carved grain of the battery cover are poor, lines are not smooth enough, and the like.

SUMMERY OF THE UTILITY MODEL

In view of the above disadvantages, the present disclosure provides a mold for processing a housing of an electronic device.

In order to solve the technical problem, the application is realized by the following technical scheme:

the application provides a mold processing of electronic equipment casing, includes: the mold comprises a first mold core, a second mold core, a first line position, a second line position, a third line position and a fourth line position; the first mold core and the second mold core are arranged oppositely, and the first line position, the second line position, the third line position and the fourth line position are connected end to end and arranged between the first mold core and the second mold core; a product die cavity is formed among the first die core, the second die core, the first line position, the second line position, the third line position and the fourth line position; and the first row position, the second row position, the third row position and the fourth row position are respectively provided with a continuous first parting surface.

Further, in the processing mold for the electronic device shell, a first included angle between the first parting surface and the horizontal plane is 5 ° to 15 °.

Further, the processing mold of the electronic device housing further includes: and the second parting surface is arranged on the first line position, the second line position, the third line position and the fourth line position.

Further, in the processing mold for an electronic device housing, the second parting surface is connected to the first parting surface.

Further, in the processing mold of the electronic device housing, the second parting surface is an arc surface structure.

Further, in the processing mold for the electronic device housing, a distance of 0.10mm to 0.20mm is left between the first mold core and the first parting surface.

Further, in the processing mold for the electronic device housing, protrusions are arranged on the first line position, the second line position, the third line position and the fourth line position; the first die core is provided with a groove corresponding to the bulge.

Further, in the processing mold for the electronic device housing, the protrusion and the groove are provided with mutually matched inclined structures.

Further, in the processing mold for the electronic device housing, a second included angle between the inclined structure and the vertical direction is 10 ° to 20 °.

Further, in the processing mold for the electronic device housing, a difference between the first mold core and the first row, the second row, the third row, and the fourth row is less than or equal to 0.03mm.

Compared with the prior art, the method has the following technical effects:

this application has set up first profile, has avoided the electronic equipment casing to take place to shift at the finishing impression line in the course of working, has also avoided the finishing impression line to produce the condition such as sawtooth, irregularity, has promoted the stability and the product yield of finishing impression line.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1: a schematic cross-sectional view of an embodiment of the present application;

FIG. 2: a partial enlarged view of the structure shown in fig. 1;

FIG. 3: in an embodiment of the present disclosure, a connection diagram of a first column, a second column, a third column, a fourth column, and a second cavity is shown;

in the figure: the mold comprises a first mold core 1, a second mold core 2, a first row position 3, a second row position 4, a third row position 5, a fourth row position 6, a product mold cavity 7, a first parting surface 8, a second parting surface 9, a first included angle 10, an arc surface structure 11, a protrusion 12, a groove 13, an inclined structure 14 and a second included angle 15.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As shown in fig. 1 and 2, according to one embodiment of the present application, a mold for processing an electronic device housing includes: a first mold core 1, a second mold core 2, a first line position 3, a second line position 4, a third line position 5 and a fourth line position 6; the first mold core 1 and the second mold core 2 are arranged oppositely, and the first line position 3, the second line position 4, the third line position 5 and the fourth line position 6 are connected end to end and arranged between the first mold core 1 and the second mold core 2; a product mold cavity 7 is formed among the first mold core 1, the second mold core 2, the first row position 3, the second row position 4, the third row position 5 and the fourth row position 6; the first row bit 3, the second row bit 4, the third row bit 5 and the fourth row bit 6 are respectively provided with a continuous first parting surface 8.

In this embodiment, the first mold core 1 and the second mold core 2 are disposed opposite to each other, and the first row position 3, the second row position 4, the third row position 5 and the fourth row position 6 are connected end to end and disposed between the first mold core 1 and the second mold core 2; a product die cavity 7 is formed among the first die core 1, the second die core 2, the first line position 3, the second line position 4, the third line position 5 and the fourth line position 6; the first row 3, the second row 4, the third row 5 and the fourth row 6 are respectively provided with a continuous first profile 8, and the first profile 8 is specifically used for processing a continuous rib on the circumferential direction of the shell of the electronic device. Through having set up first profile 8, avoided the electronic equipment casing in the course of working finishing impression line to take place to shift, also avoided the finishing impression line to produce the condition such as sawtooth, irregularity, promoted the stability and the product yield of finishing impression line.

Specifically, a first included angle 10 between the first parting surface 8 and the horizontal plane is 5-15 degrees, so that the corner dislocation is prevented from being pulled and damaged, and the rubbing area is reduced. The first included angle 10 is less than 5 degrees, which is inconvenient to process, and the first included angle 10 is more than 15 degrees, which is not favorable for the first mold core 1 to cooperate with the first line position 3, the second line position 4, the third line position 5 and the fourth line position 6.

In the present embodiment, the first included angle 10 is 10 °.

Specifically, the processing mold of the electronic device shell further comprises: a second facet 9, the second facet 9 disposed on the first row bit 3, the second row bit 4, the third row bit 5, and the fourth row bit 6.

In the present embodiment, the first row position 3, the second row position 4, the third row position 5, and the fourth row position 6 are further provided with a second parting plane 9, and the second parting plane 9 is specifically used for processing an edge of the electronic device housing.

Specifically, the second parting surface 9 is an arc-shaped structure 11, so that the electronic device housing has an arc shape, and a better holding feeling is provided for a user.

In particular, the second parting plane 9 is connected to the first parting plane 8 to form a unitary structure.

Optionally, a distance of 0.10mm to 0.20mm is left between the first mold core 1 and the first parting surface 8.

In this embodiment, a distance is left between the first mold core 1 and the first parting surface 8, so that a safety distance is left between the outermost side of the finish-carved pattern on the first mold core 1 and the first parting surface 8, and the finish-carved pattern is prevented from affecting the convex edge processed by the first parting surface 8.

As shown in fig. 3, the first row position 3, the second row position 4, the third row position 5 and the fourth row position 6 are provided with protrusions 12; the first die core 1 is provided with a groove 13 corresponding to the protrusion 12.

In the embodiment, the first row position 3, the second row position 4, the third row position 5 and the fourth row position 6 are provided with bulges 12; the first mold core 1 is provided with a groove 13 corresponding to the protrusion 12. Through the arrangement, the mold core and the slide can be conveniently and quickly closed, and the working efficiency is improved.

In particular, the projection 12 and the recess 13 are provided with mutually matching inclined structures 14. By arranging the inclined structure 14, the first line 3, the second line 4, the third line 5 and the first mold core 1 can be prevented from having sharp corners to bruise or crush the product, so that the appearance of the product is prevented from being damaged.

Optionally, the second included angle 15 between the inclined structure 14 and the vertical direction is 10 ° to 20 °. The second included angle 15 is less than 10 degrees, which is not convenient for processing, and the second included angle 15 is more than 20 degrees, which is not favorable for the first mold core 1 to cooperate with the first line position 3, the second line position 4, the third line position 5 and the fourth line position 6.

In the present embodiment, the second included angle 15 is 15 °.

Specifically, the step difference between the first mold core 1 and the first row position 3, the second row position 4, the third row position 5, and the fourth row position 6 is less than or equal to 0.03mm, so as to ensure the processing precision of the product.

Optionally, the electronic device includes, but is not limited to, a mobile phone, a tablet or a wearable device, etc.

This application has set up first profile 8, has avoided the electronic equipment casing to take place to shift at the finishing impression line in the course of working, has also avoided the finishing impression line to produce the condition such as sawtooth, irregularity, has promoted the stability and the product yield of finishing impression line.

In the description of the present application, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. "beneath," "under" and "beneath" a first feature includes the first feature being directly beneath and obliquely beneath the second feature, or simply indicating that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

The above embodiments are merely to illustrate the technical solutions of the present application and are not limitative, and the present application is described in detail with reference to preferred embodiments. It will be understood by those skilled in the art that various modifications and equivalent arrangements may be made in the present invention without departing from the spirit and scope of the present invention and shall be covered by the appended claims.

Claims

1. A mold for machining a housing of an electronic device, comprising: the mold comprises a first mold core, a second mold core, a first line position, a second line position, a third line position and a fourth line position; the first mold core and the second mold core are arranged oppositely, and the first line position, the second line position, the third line position and the fourth line position are connected end to end and arranged between the first mold core and the second mold core; a product die cavity is formed among the first die core, the second die core, the first line position, the second line position, the third line position and the fourth line position;

the first line position, the second line position, the third line position and the fourth line position are respectively provided with continuous first parting surfaces.

2. The electronic device housing processing mold of claim 1, wherein the first parting surface has a first angle of 5 ° to 15 ° with respect to the horizontal plane.

3. The mold for processing an electronic device housing according to claim 1, further comprising: and the second parting surface is arranged on the first line position, the second line position, the third line position and the fourth line position.

4. The electronic device housing processing mold as recited in claim 3, wherein the second parting surface is continuous with the first parting surface.

5. The processing mold for electronic device housings according to claim 3, wherein the second parting surface is a cambered surface structure.

6. The mold for processing an electronic device shell as claimed in any one of claims 1 to 5, wherein a distance of 0.10mm to 0.20mm is left between the first mold core and the first parting surface.

7. The mold for processing an electronic device shell according to any one of claims 1 to 5, wherein the first row, the second row, the third row and the fourth row are provided with protrusions; the first die core is provided with a groove corresponding to the bulge.

8. The mold for processing electronic device shell according to claim 7, wherein the protrusion and the groove are provided with mutually matching inclined structures.

9. The mold for processing an electronic device housing according to claim 8, wherein the second angle between the inclined structure and the vertical direction is 10 ° to 20 °.

10. The mold for processing an electronic device shell as recited in any one of claims 1 to 5, wherein a difference between the first mold core and the first row, the second row, the third row and the fourth row is less than or equal to 0.03mm.