CN217701722U - Assembly tool for reflow soldering of heat dissipation module - Google Patents

Abstract

The utility model relates to a heat dissipation module assembly for reflow soldering, including upper substrate and infrabasal plate, the upper substrate lock is provided with the die cavity that is used for placing the heat dissipation module on the infrabasal plate under on the base plate, the shape of die cavity and the shape of heat dissipation module suit, and the inner wall upper portion of die cavity all leans out and forms the inclined plane. The utility model discloses an equipment frock can conveniently carry out the drawing of patterns of heat dissipation module, has improved drawing of patterns efficiency, also is more convenient for place the heat dissipation module in the die cavity fast when the equipment, has improved the packaging efficiency.

Description

Assembly tool for reflow soldering of heat dissipation module

Technical Field

The utility model belongs to the technical field of the equipment tool technique and specifically relates to indicate a radiating module assembly frock for reflow soldering.

Background

The execution speed of the electronic chip is faster and faster, the heat generated along with the execution speed is higher and higher, and in order to ensure that the electronic chip can normally work in an allowable temperature environment, a heat dissipation module is required to be configured in the system to assist in heat dissipation, so that the heat generated by the electronic chip is quickly subjected to heat exchange with the external environment.

The heat dissipation module generally comprises four parts, namely a heating component, a heat conduction component, a condensation component and a fan (independent), wherein the heating component generally comprises a hardware stamping part or a die casting part, the heat conduction component is made of a heat conduction material, and the condensation component generally comprises a fin fan, so that a loop-shaped cold and heat circulation system is formed, and the heat dissipation purpose of the electronic chip is achieved. When the heat dissipation module is assembled, the heating assembly, the heat conduction assembly and the condensation assembly are required to be welded together, generally, the welding flux is coated on the surface of each assembly, then the assembly tool is used for pressing and combining all the parts together, then the parts are sent into the reflow soldering furnace, the welding flux is melted by the high temperature of the reflow soldering furnace to realize welding, so that the heating assembly, the heat conduction assembly and the condensation assembly are connected into a whole, and then the whole assembly is taken out of the furnace and separated from the assembly tool.

But the drawing of patterns of thermal module is not convenient for carry out to current equipment frock, and drawing of patterns efficiency is lower, can't satisfy the processing demand.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model discloses the technical problem that will solve lies in overcoming the defect that the equipment frock of heat dissipation module is not convenient for carry out the drawing of patterns among the prior art.

In order to solve the technical problem, the utility model provides a heat dissipation module assembly for reflow soldering equipment frock, including upper substrate and infrabasal plate, the upper substrate lock is in on the infrabasal plate, its characterized in that: the lower substrate is provided with a die cavity for placing the heat dissipation module, the shape of the die cavity is matched with that of the heat dissipation module, and the upper part of the inner wall of the die cavity is inclined outwards to form an inclined plane.

In an embodiment of the present invention, the inclined surface is provided with an auxiliary notch.

In an embodiment of the present invention, the inclined surface is provided with a plurality of the auxiliary notches.

In an embodiment of the present invention, the auxiliary notch is arc-shaped.

The utility model discloses an embodiment, the heat dissipation module includes heat-conducting component, heating element and condensation subassembly, heat-conducting component one end with condensation subassembly hot melt welding, the other end with heating element hot melt welding.

In an embodiment of the present invention, the mold cavity includes a first cavity, a second cavity and a third cavity, which are sequentially disposed, the inner wall upper portions of the first cavity, the second cavity and the third cavity are all formed with the inclined surface, the shape of the first cavity is adapted to the shape of the condensing assembly, the shape of the second cavity is adapted to the shape of the heat conducting assembly, and the shape of the third cavity is adapted to the shape of the heating assembly.

In an embodiment of the present invention, the bottom surface of the upper substrate is provided with a pressure block, and the shape of the pressure block is adapted to the shape of the heat conducting component.

In an embodiment of the present invention, the heat conducting component is a heat conducting pipe or a heat conducting plate.

In an embodiment of the present invention, a fastening groove is disposed on the lower substrate, and a fastening bump is disposed on the upper substrate, the fastening bump being used for fastening in the fastening groove.

In an embodiment of the present invention, the fastening groove is rectangular.

Compared with the prior art, the technical scheme of the utility model have following advantage:

radiating module assembly for reflow soldering, can conveniently carry out the drawing of patterns of radiating module, improve drawing of patterns efficiency, also be more convenient for place radiating module in the die cavity fast when the equipment, improved and placed and packaging efficiency.

Drawings

In order to make the content of the present invention more clearly understood, the present invention will be described in further detail with reference to the following embodiments of the present invention, in conjunction with the accompanying drawings.

Fig. 1 is a schematic structural view of the assembly tool for reflow soldering of a heat dissipation module according to the present invention;

FIG. 2 is a schematic diagram of the three-dimensional structure of the lower substrate of FIG. 1;

FIG. 3 is a top view of the lower substrate of FIG. 2;

FIG. 4 is a cross-sectional view at B-B of FIG. 2;

FIG. 5 is a cross-sectional view at C-C of FIG. 2;

FIG. 6 is a cross-sectional view at E-E in FIG. 2;

FIG. 7 is a schematic three-dimensional structure of the upper substrate of FIG. 1;

FIG. 8 is a top view of the heat dissipation module;

FIG. 9 is an exploded view of the heat sink module and the assembly fixture;

the specification reference numbers indicate: 1. an upper substrate; 11. a compression joint block; 12. buckling the convex block; 2. a lower substrate; 21. a mold cavity; 211. an inclined surface; 212. a first cavity; 213. a second cavity; 214. a third cavity; 22. a buckling groove; 3. a heat dissipation module; 31. a condensing assembly; 32. a heat conducting component; 33. and a heating assembly.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not limited to the present invention.

Referring to fig. 1 to 6, the present embodiment discloses an assembly fixture for reflow soldering of a heat dissipation module 3, including an upper substrate 1 and a lower substrate 2, the upper substrate 1 is fastened on the lower substrate 2, a mold cavity 21 for placing the heat dissipation module 3 is disposed on the lower substrate 2, the shape of the mold cavity 21 is adapted to the shape of the heat dissipation module 3, and the upper portion of the inner wall of the mold cavity 21 is inclined outward to form an inclined surface 211.

Through the arrangement of the inclined surface 211, the upper part of the die cavity 21 is in a trapezoid shape, and the heat dissipation module 3 can be quickly separated from the die cavity 21 after the hot melting welding is finished; in addition, the heat radiation module 3 can be placed in the die cavity 21 quickly during assembly, and the placement efficiency is improved.

The shape of die cavity 21 and the shape of thermal module 3 suit, can play fine limiting displacement to thermal module 3, prevent to take place offset, improve the equipment precision.

The inclined plane 211 processing is different from the conventional chamfering processing, and the inclined plane 211 changes along with the height change of the product, so that the inclined plane 211 is irregularly linearly changed and can be processed and realized by adopting a spiral progressive programming processing technology, the spiral progressive programming processing technology needs to calculate the cutting amount of the progressive processing before and after a cutting tool, and stepped sawteeth are generated if the calculation is wrong, so that the placement and the demoulding of product parts are influenced.

In one embodiment, the inclined surface 211 is provided with an auxiliary notch, which can perform a flow guiding function and facilitate the insertion of an auxiliary tool to assist the separation between the upper substrate 1 and the lower substrate 2.

Wherein, the opening direction of the auxiliary gap faces the heat dissipation module 3.

Further, a plurality of auxiliary notches are formed on the inclined surface 211 to provide better flow guiding and assist in separating the upper substrate 2 from the lower substrate 2.

In one embodiment, the auxiliary notch is arcuate.

In one embodiment, as shown in fig. 8 to 9, the heat dissipation module 3 includes a heat conduction member 32, a heating member 33, and a condensation member 31, wherein one end of the heat conduction member 32 is thermally welded to the condensation member 31, and the other end is thermally welded to the heating member 33. The contact surfaces of the heat conduction assembly 32 and the condensation assembly 31 are filled with solder, the contact surfaces of the heat conduction assembly 32 and the heating assembly 33 are filled with solder, and the solder is melted through high-temperature hot melting so that the heat conduction assembly 32, the heating assembly 33 and the condensation assembly 31 are fixed together.

In one embodiment, as shown in fig. 2 to 6, the mold cavity 21 includes a first cavity 212, a second cavity 213 and a third cavity 214, which are sequentially disposed, wherein the upper portions of the inner walls of the first cavity 212, the second cavity 213 and the third cavity 214 are each formed with an inclined surface 211, the shape of the first cavity 212 is adapted to the shape of the condensation component 31, the shape of the second cavity 213 is adapted to the shape of the heat conduction component 32, and the shape of the third cavity 214 is adapted to the shape of the heating component 33, so as to better position the components of the heat dissipation module 3.

In one embodiment, as shown in fig. 7, the bottom surface of the upper substrate 1 is provided with a pressure welding block 11, and the shape of the pressure welding block 11 is adapted to the shape of the heat conducting assembly 32, so as to better press the heat conducting assembly 32, the heating assembly 33 and the condensing assembly 31 together, and improve the effect of the subsequent thermal welding.

In one embodiment, the heat conducting component 32 is a heat conducting tube or plate.

In one embodiment, the lower substrate 2 is provided with a fastening groove 22, the upper substrate 1 is provided with a fastening protrusion 12, and the fastening protrusion 12 is used for fastening in the fastening groove 22.

In one embodiment, the snap-in groove 22 is rectangular.

Further, one end of the buckling protrusion 12 inserted into the buckling groove 22 is trapezoidal, so that the buckling protrusion 12 is more easily inserted into the buckling groove 22.

The following specifically describes the process of performing the welding assembly of the heat dissipation module 3 by using the assembly tool: as shown in fig. 9, the heat dissipation module 3 includes a heat conduction module 32, a heating module 33 and a condensation module 31, the condensation module 31 is placed in a first cavity 212 of a cavity 21 on a lower substrate 2, the heating module 33 is placed in a third cavity 214 of the cavity 21, the heat conduction module 32 is then placed on the upper portion, the heat conduction module 32 between the heating module 33 and the condensation module 31 is partially placed in a second cavity 213, solder is additionally filled between the heat conduction module 32 and the condensation module 31, solder is filled between the heat conduction module 32 and the heating module 33, then the upper substrate 1 is fastened to the lower substrate 2, so that the heat conduction module 32, the heating module 33 and the condensation module 31 are compressed, then the fastened assembly tool is placed in a reflow soldering furnace, the solder is melted by using the high temperature of the reflow soldering furnace, so that the heating module 33, the heat conduction module 32 and the condensation module 31 are soldered into a whole, then the assembly tool is taken out of the reflow soldering furnace, and the whole heat dissipation module is taken out of the cavity 21.

The solder in the process can adopt low-temperature solder paste.

The assembly tool for reflow soldering of the heat dissipation module can conveniently demold the heat dissipation module, improves demolding efficiency, is more convenient to place the heat dissipation module in a mold cavity quickly during assembly, and improves placement and assembly efficiency.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Various other modifications and alterations will occur to those skilled in the art upon reading the foregoing description. And are neither required nor exhaustive of all embodiments. And obvious changes and modifications can be made without departing from the scope of the invention.

Claims (10)

1. The utility model provides a thermal module assembly frock for reflow soldering, includes upper substrate and infrabasal plate, the upper substrate lock is in on the infrabasal plate, its characterized in that: be provided with on the infrabasal plate and be used for placing the die cavity of heat dissipation module, the shape of die cavity with the shape phase adaptation of heat dissipation module, the inner wall upper portion of die cavity all leans out and forms the inclined plane.

2. The assembly fixture for reflow soldering of the heat dissipation module set according to claim 1, wherein: an auxiliary notch is arranged on the inclined surface.

3. The assembly tool for reflow soldering of the heat dissipation module set according to claim 2, wherein: the inclined surface is provided with a plurality of auxiliary notches.

4. The assembly tool for reflow soldering of the heat dissipation module set according to claim 3, wherein: the auxiliary notch is arc-shaped.

5. The assembly fixture for reflow soldering of the heat dissipation module set according to claim 1, wherein: the heat dissipation module comprises a heat conduction assembly, a heating assembly and a condensation assembly, wherein one end of the heat conduction assembly is in hot-melt welding with the condensation assembly, and the other end of the heat conduction assembly is in hot-melt welding with the heating assembly.

6. The assembly tool for reflow soldering of the heat dissipation module set according to claim 5, wherein: the die cavity is including the first cavity, second cavity and the third cavity that set gradually, the inner wall upper portion of first cavity, second cavity and third cavity all is formed with the inclined plane, the shape of first cavity with condensation component's shape suits, the shape of second cavity with heat-conducting component's shape suits, the shape of third cavity with heating component's shape suits.

7. The assembly fixture for reflow soldering of the heat dissipation module set according to claim 5, wherein: and a pressure joint block is arranged on the bottom surface of the upper substrate, and the shape of the pressure joint block is matched with that of the heat conduction assembly.

8. The assembly fixture for reflow soldering of the heat dissipation module set according to claim 5, wherein: the heat conducting component adopts a heat conducting pipe or a heat conducting plate.

9. The assembly fixture for reflow soldering of the heat dissipation module set according to claim 1, wherein: the lower substrate is provided with a buckling groove, the upper substrate is provided with a buckling lug, and the buckling lug is used for buckling in the buckling groove.

10. The assembly tool for reflow soldering of the heat dissipation module set according to claim 9, wherein: the buckling groove is rectangular.

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