CN217694121U - Electronic equipment and heat dissipation system - Google Patents
Electronic equipment and heat dissipation system Download PDFInfo
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- CN217694121U CN217694121U CN202220906759.6U CN202220906759U CN217694121U CN 217694121 U CN217694121 U CN 217694121U CN 202220906759 U CN202220906759 U CN 202220906759U CN 217694121 U CN217694121 U CN 217694121U
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Abstract
The application provides an electronic device and a heat dissipation system. The electronic device includes: the mainboard is provided with a first heating piece, a second heating piece and a third heating piece; the air guide cover is positioned on one side of the main board and comprises a side wall, an upper wall and a rear wall, the side wall is in contact with the main board, the upper wall and the side wall are connected to one side far away from the main board, the upper wall is provided with a first air opening, a second air opening and a third air opening which are separated, the first air opening exposes the first heating element, the second air opening exposes the second heating element, the third air opening exposes the third heating element, the rear wall is connected with the side wall and the upper wall, and the rear wall is arranged in an extending mode from the side wall close to the main board to the side far away from the main board; the wind scooper further comprises a flow guide cover and a wind guide wall, the wind guide wall is connected with the rear wall and extends towards the first wind opening, the flow guide cover is connected with the upper wall, the rear wall and the wind guide wall, the wind guide wall and the rear wall are matched to form a first wind guide cavity, the flow guide cover, the upper wall and the rear wall are matched to form a second wind guide cavity, and the second wind opening is communicated with the first wind guide cavity through the second wind guide cavity.
Description
Technical Field
The present application relates to the field of electronic devices, and in particular, to an electronic device and a heat dissipation system.
Background
The current electronic products have stronger functions, but the volumes of the electronic products are miniaturized. This makes the arrangement of electronic components (active components or passive components) on the motherboard inside the electronic product more and more compact, and the more compact arrangement and the larger heat dissipation capacity make the internal temperature of the electronic product extremely easy to rise. How to solve the above problems is to provide an electronic device and a heat dissipation system with reasonable element arrangement and heat dissipation layout, which needs to be considered by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the present application provides an electronic device and a heat dissipation system, which have a more reasonable layout, are suitable for a compact motherboard design, and can dissipate heat of a CPU and a memory.
An embodiment of the present application provides an electronic device, including:
the main board is provided with a first heating part, a second heating part and a third heating part, the second heating part and the third heating part are arranged on two sides of the first heating part, and the first heating part, the second heating part and the third heating part are arranged on one side of the main board;
the air guide cover is positioned on one side of the mainboard and matched with the mainboard to form a containing cavity, the first heating part, the second heating part and the third heating part are arranged in the containing cavity, the air guide cover comprises a side wall, an upper wall and a rear wall, the side wall is contacted with the mainboard, the upper wall and the side wall are connected to one side far away from the mainboard, the upper wall is provided with a first air opening, a second air opening and a third air opening which are separated, the first air opening exposes the first heating part, the second air opening exposes the second heating part, the third air opening exposes the third heating part, the rear wall is connected with the side wall and the upper wall, and the rear wall extends to be higher than the upper wall from the side of the side wall close to the mainboard to the side far away from the mainboard;
the air guide cover further comprises a flow guide cover and an air guide wall, the air guide wall is connected with the rear wall and extends towards the first air opening, the flow guide cover is connected with the upper wall, the rear wall and the air guide wall, the air guide wall and the rear wall are matched to form a first air guide cavity, the flow guide cover is matched with the upper wall and the rear wall to form a second air guide cavity, and the second air opening is communicated with the first air guide cavity through the second air guide cavity.
In an embodiment, the flow guiding cover and the upper wall are connected to the second air opening, and an orthographic projection of the air guiding cover on the upper wall covers the second air opening.
In an embodiment, the flow guide cover includes a connecting plate and an arc-shaped plate, the connecting plate is fastened to the second air opening and connected to the upper wall, and the arc-shaped plate is connected to the rear wall and the air guide wall.
In an embodiment, the arc-shaped plate includes a peripheral wall and a top wall, the peripheral wall is connected to the connecting plate, the peripheral wall is further connected to the wind guide wall on a side close to the second air inlet, the peripheral wall is further connected to the rear wall, the top wall is connected to the peripheral wall and the rear wall, and the top wall is bent from the connecting plate to the rear wall.
In an embodiment, the first air guiding cavity includes a first opening and a second opening, the first opening is disposed on a side of the first air guiding cavity facing the second air opening, and the second opening is disposed on a side of the first air guiding cavity facing the third air opening.
In an embodiment, the air guiding wall extends along a first direction, and a length of the air guiding wall in the first direction is not longer than a length of the first air opening.
In an embodiment, one side of the accommodating cavity, which is away from the rear wall, includes a main opening, the first heat generating element, the second heat generating element and the third heat generating element are exposed from the main opening, the second air opening and the third air opening are disposed on one side of the upper wall, which is away from the main opening, and the second air opening and the third air opening are disposed on one side of the upper wall, which is close to the rear wall.
In one embodiment, the electronic device further includes:
the first fan is arranged at the first air inlet;
the second fan is arranged at the second air opening and used for leading the air flow from the accommodating cavity into the second air guide cavity and the first air guide cavity through the second air opening;
the third fan is arranged at the third air opening and used for leading out the air flow from the inside of the accommodating cavity;
and the heat dissipation assembly is arranged at the first air opening and is matched with the first fan.
In one embodiment, the first heat generating element includes a cpu, and the second and third heat generating elements include a memory.
In an embodiment, the second heat generating element and the third heat generating element are symmetrically disposed at two sides of the first heat generating element, the second air opening and the third air opening are symmetrically disposed at two sides of the first air opening, and a size of the first air opening is larger than a size of the second air opening or the third air opening.
An embodiment of the present application further provides a heat dissipation system, including:
the main board is provided with a first heating part, a second heating part and a third heating part, the second heating part and the third heating part are arranged on two sides of the first heating part, and the first heating part, the second heating part and the third heating part are arranged on one side of the main board;
the air guide cover is positioned on one side of the mainboard and matched with the mainboard to form an accommodating cavity, the first heating element, the second heating element and the third heating element are arranged in the accommodating cavity, the air guide cover comprises a side wall, an upper wall and a rear wall, the side wall is contacted with the mainboard, the upper wall and the side wall are connected to one side far away from the mainboard, the upper wall is provided with a first air opening, a second air opening and a third air opening which are separated, the first air opening enables the first heating element to be exposed, the second air opening enables the second heating element to be exposed, the third air opening enables the third heating element to be exposed, the rear wall is connected with the side wall and the upper wall, and the rear wall extends to be higher than the upper wall from the side of the side wall close to the mainboard to the side far away from the mainboard;
the air guide cover further comprises a flow guide cover and an air guide wall, the air guide wall is connected with the rear wall and extends towards the first air opening, the flow guide cover is connected with the upper wall, the rear wall and the air guide wall, the air guide wall and the rear wall are matched to form a first air guide cavity, the flow guide cover is matched with the upper wall and the rear wall to form a second air guide cavity, and the second air opening is communicated with the first air guide cavity through the second air guide cavity.
Compared with the prior art, the electronic equipment and the heat dissipation system have the advantages that aiming at the design of the mainboard with multiple memories and the processor which are closely arranged, in the heat dissipation process of one part of the memories, airflow flowing through the memories passes through one flow guide cover and one air guide wall and bypasses the processor and then is directly discharged by the other rear end fan for cooling the other memories, the condition that hot air after cooling the memories is sucked into an air field for cooling the processor again is improved, the heat dissipation efficiency of the processor is improved, and the working temperature and the heat dissipation of the processors and the memories are more balanced.
Drawings
Fig. 1 is a schematic perspective exploded view of an electronic device according to an embodiment of the present application.
Fig. 2 is a partial perspective view of an electronic device according to an embodiment of the present application.
Fig. 3 is a schematic perspective view of a drainage cover of an electronic device according to an embodiment of the present application.
Fig. 4 is a partial perspective view of an electronic device according to an embodiment of the present application.
Fig. 5 is a partial perspective view of an electronic device according to an embodiment of the present application.
Description of the main elements
First heat generating member 111
Second heat generating member 112
Third heat generating member 113
Wind scooper 12
The upper wall 122
Connecting plate 126
Arc plate 127
First air guiding cavity 134
Second air guiding cavity 135
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The following description refers to the accompanying drawings to more fully describe the present disclosure. There is shown in the drawings exemplary embodiments of the present application. This application may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like reference numerals designate identical or similar components.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, as used herein, "comprises" and/or "comprising" and/or "having," integers, steps, operations, components, and/or components, but does not preclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Furthermore, unless otherwise defined herein, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application and will not be interpreted in an idealized or overly formal sense.
The following description of exemplary embodiments refers to the accompanying drawings. It should be noted that the components depicted in the referenced drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar terms.
Embodiments of the present application will now be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present application provides an electronic device 10.
The electronic device 10 includes a main board 11, and a first heat generating component 111, a second heat generating component 112, and a third heat generating component 113 are disposed on the main board 11. The second heat generating member 112 and the third heat generating member 113 are disposed on both sides of the first heat generating member 111, and the first heat generating member 111, the second heat generating member 112 and the third heat generating member 113 are disposed on one side of the main board 11.
The electronic device 10 includes an air guiding cover 12, which is located on one side of the motherboard 11 and cooperates with the motherboard 11 to form an accommodating cavity 13. The first heat generating member 111, the second heat generating member 112 and the third heat generating member 113 are disposed in the accommodating cavity 13. The wind scooper 12 includes a side wall 121, an upper wall 122 and a rear wall 123, the side wall 121 contacts the main board 11, and the upper wall 122 and the side wall 121 are connected to a side away from the main board 11. The upper wall 122 is provided with a first air opening 131, a second air opening 132 and a third air opening 133 which are separated from each other, the first air opening 131 exposes the first heating member 111, the second air opening 132 exposes the second heating member 112, and the third air opening 133 exposes the third heating member 113. The rear wall 123 is connected to the side wall 121 and the upper wall 122, and the rear wall 123 extends from the side of the side wall 121 close to the main board 11 to the side far from the main board 11 to be higher than the upper wall 122.
The wind scooper 12 further includes a wind scooper 125 and a wind guide wall 124, and the wind guide wall 124 is connected to the rear wall 123 and extends toward the first wind gap 131. The flow guiding cover 125 is connected to the upper wall 122, the rear wall 123 and the air guiding wall 124, the air guiding wall 124 and the rear wall 123 are matched to form a first air guiding cavity 134, the flow guiding cover 125, the upper wall 122 and the rear wall 123 are matched to form a second air guiding cavity 135, and the second air opening 132 is communicated with the first air guiding cavity 134 through the second air guiding cavity 135.
In one embodiment, the flow-guiding hood 125 is connected to the upper wall 122 at the second wind opening 132, and the orthographic projection of the wind-guiding hood 12 on the upper wall 122 covers the second wind opening 132.
In an embodiment, the flow guiding cover 125 includes a connecting plate 126 and an arc-shaped plate 127, the connecting plate 126 is fastened to the second air opening 132 and connected to the upper wall 122, and the arc-shaped plate 127 is connected to the rear wall 123 and the air guiding wall 124.
In one embodiment, the arc plate 127 includes a peripheral wall 128 and a top wall 129, the peripheral wall 128 is connected to the connecting plate 126, the peripheral wall 128 is further connected to the wind guiding wall 124 near the second wind opening 132, the peripheral wall 128 is further connected to the rear wall 123, the top wall 129 is connected to the peripheral wall 128 and the rear wall 123, and the top wall 129 is bent from the connecting plate 126 to the rear wall 123.
In an embodiment, the first air guiding cavity 134 includes a first opening 136 and a second opening 137, the first opening 136 is disposed on a side of the first air guiding cavity 134 facing the second air opening 132, and the second opening 137 is disposed on a side of the first air guiding cavity 134 facing the third air opening 133.
In one embodiment, the air guiding wall 124 extends along the first direction, and the length of the air guiding wall 124 in the first direction is greater than the length of the first opening 131.
In one embodiment, the side of the accommodating cavity 13 away from the rear wall 123 includes a main opening, and the first heat generating element 111, the second heat generating element 112 and the third heat generating element 113 are exposed through the main opening. The second opening 132 and the third opening 133 are disposed on a side of the upper wall 122 away from the main opening, and the second opening 132 and the third opening 133 are disposed on a side of the upper wall 122 close to the rear wall 123.
In one embodiment, the electronic device 10 further includes:
a first fan 141 disposed at the first air opening 131;
the second fan 142 is disposed at the second air opening 132, and configured to introduce the airflow from the accommodating cavity 13 into the second air guiding cavity 135 and the first air guiding cavity 134 through the second air opening 132;
the third fan 143 is disposed at the third air opening 133, and is configured to draw out the air flow from the inside of the accommodating cavity 13;
the heat dissipation assembly 144 is disposed at the first air opening 131 and is matched with the first fan 141.
In one embodiment, the first heat generating element 111 includes a processor, and the second heat generating element 112 and the third heat generating element 113 include a memory.
In one embodiment, the second heat generating element 112 and the third heat generating element 113 are symmetrically disposed on two sides of the first heat generating element 111, and the second opening 132 and the third opening 133 are symmetrically disposed on two sides of the first opening 131. The size of the first tuyere 131 is larger than that of the second tuyere 132 or the third tuyere 133.
An embodiment of the present application further provides a heat dissipation system, including:
the main board 11, the main board 11 is provided with a first heating element 111, a second heating element 112 and a third heating element 113, the second heating element 112 and the third heating element 113 are arranged at two sides of the first heating element 111, and the first heating element 111, the second heating element 112 and the third heating element 113 are arranged at one side of the main board 11;
the air guide cover 12 is located on one side of the main board 11 and is matched with the main board 11 to form an accommodating cavity 13, the first heating element 111, the second heating element 112 and the third heating element 113 are arranged in the accommodating cavity 13, the air guide cover 12 comprises a side wall 121, an upper wall 122 and a rear wall 123, the side wall 121 is in contact with the main board 11, the upper wall 122 and the side wall 121 are connected to one side far away from the main board 11, the upper wall 122 is provided with a first air opening 131, a second air opening 132 and a third air opening 133 which are separated, the first air opening 131 exposes the first heating element 111, the second air opening 132 exposes the second heating element 112, the third air opening 133 exposes the third heating element 113, the rear wall 123 is connected with the side wall 121 and the upper wall 122, and the rear wall 123 extends to the side far away from the main board 11 from one side of the side 121 to the side far away from the main board 11 and is higher than the upper wall 122;
the air guiding cover 12 further includes a flow guiding cover 125 and an air guiding wall 124, the air guiding wall 124 is connected to the rear wall 123 and extends toward the first air opening 131, the flow guiding cover 125 is connected to the upper wall 122, the rear wall 123 and the air guiding wall 124, the air guiding wall 124 and the rear wall 123 are matched to form a first air guiding cavity 134, the flow guiding cover 125 is matched to the upper wall 122 and the rear wall 123 to form a second air guiding cavity 135, and the second air opening 132 is communicated with the first air guiding cavity 134 through the second air guiding cavity 135.
Compared with the prior art, the electronic device 10 and the heat dissipation system of the present application are designed for the motherboard 11 having multiple memories and the processors being closely arranged, and in the heat dissipation process of a part of the memories, the airflow flowing through the memories passes through one flow guide cover 125 and one air guide wall 124 and bypasses the processors and then is directly discharged by another rear end fan for cooling other memories, so that the probability that the hot air after cooling the memories is sucked into the wind field for cooling the processors again is reduced, the heat dissipation efficiency of the processors is improved, and the working temperatures and heat dissipation of the processors and the memories are more balanced.
Hereinbefore, specific embodiments of the present application are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present application without departing from the spirit and scope of the application. Such modifications and substitutions are intended to be within the scope of the present application.
Claims (11)
1. An electronic device, comprising:
the main board is provided with a first heating part, a second heating part and a third heating part, the second heating part and the third heating part are arranged on two sides of the first heating part, and the first heating part, the second heating part and the third heating part are arranged on one side of the main board;
the air guide cover is positioned on one side of the mainboard and matched with the mainboard to form an accommodating cavity, the first heating element, the second heating element and the third heating element are arranged in the accommodating cavity, the air guide cover comprises a side wall, an upper wall and a rear wall, the side wall is contacted with the mainboard, the upper wall and the side wall are connected to one side far away from the mainboard, the upper wall is provided with a first air opening, a second air opening and a third air opening which are separated, the first air opening enables the first heating element to be exposed, the second air opening enables the second heating element to be exposed, the third air opening enables the third heating element to be exposed, the rear wall is connected with the side wall and the upper wall, and the rear wall extends to be higher than the upper wall from the side of the side wall close to the mainboard to the side far away from the mainboard;
the air guide cover further comprises a flow guide cover and an air guide wall, the air guide wall is connected with the rear wall and extends towards the first air opening, the flow guide cover is connected with the upper wall, the rear wall and the flow guide cover, the air guide cover and the rear wall are matched to form a first air guide cavity, the flow guide cover is matched with the upper wall and the rear wall to form a second air guide cavity, and the second air opening is communicated with the first air guide cavity through the second air guide cavity.
2. The electronic device of claim 1, wherein the flow-guiding hood is connected to the upper wall at the second air opening, and an orthographic projection of the flow-guiding hood on the upper wall covers the second air opening.
3. The electronic device of claim 2, wherein the flow-guiding cover comprises a connecting plate and an arc-shaped plate, the connecting plate is buckled with the second air opening and connected with the upper wall, and the arc-shaped plate is connected with the rear wall and the air-guiding wall.
4. The electronic device according to claim 3, wherein the arc-shaped plate includes a peripheral wall and a top wall, the peripheral wall is connected to the connecting plate, the peripheral wall is further connected to the air guide wall on a side close to the second air inlet, the peripheral wall is further connected to the rear wall, the top wall is connected to the peripheral wall and the rear wall, and the top wall is bent from the connecting plate toward the rear wall.
5. The electronic device of claim 1, wherein the first air-guiding cavity comprises a first opening and a second opening, the first opening is disposed on a side of the first air-guiding cavity facing the second air opening, and the second opening is disposed on a side of the first air-guiding cavity facing the third air opening.
6. The electronic device according to claim 1, wherein the air guide wall extends in a first direction, and a length of the air guide wall in the first direction is greater than a length of the first port.
7. The electronic device of claim 1, wherein the receiving cavity includes a main opening on a side thereof away from the rear wall, the first heat generating element, the second heat generating element and the third heat generating element are exposed from the main opening, the second air opening and the third air opening are disposed on a side of the upper wall away from the main opening, and the second air opening and the third air opening are disposed on a side of the upper wall close to the rear wall.
8. The electronic device of claim 1, further comprising:
the first fan is arranged at the first air inlet;
the second fan is arranged at the second air opening and used for leading the air flow from the accommodating cavity into the second air guide cavity and the first air guide cavity through the second air opening;
the third fan is arranged at the third air inlet and used for leading out air flow from the inner part of the accommodating cavity;
and the heat dissipation assembly is arranged at the first air opening and is matched with the first fan.
9. The electronic device of claim 1, wherein the first heat generating component includes a central processing unit, and the second and third heat generating components include a memory.
10. The electronic device of claim 9, wherein the second heat generating element and the third heat generating element are symmetrically disposed on two sides of the first heat generating element, the second air opening and the third air opening are symmetrically disposed on two sides of the first air opening, and a size of the first air opening is larger than a size of the second air opening or the third air opening.
11. A heat dissipation system, comprising:
the heating device comprises a mainboard, wherein a first heating part, a second heating part and a third heating part are arranged on the mainboard, the second heating part and the third heating part are arranged on two sides of the first heating part, and the first heating part, the second heating part and the third heating part are arranged on one side of the mainboard;
the air guide cover is positioned on one side of the mainboard and matched with the mainboard to form an accommodating cavity, the first heating element, the second heating element and the third heating element are arranged in the accommodating cavity, the air guide cover comprises a side wall, an upper wall and a rear wall, the side wall is contacted with the mainboard, the upper wall and the side wall are connected to one side far away from the mainboard, the upper wall is provided with a first air opening, a second air opening and a third air opening which are separated, the first air opening enables the first heating element to be exposed, the second air opening enables the second heating element to be exposed, the third air opening enables the third heating element to be exposed, the rear wall is connected with the side wall and the upper wall, and the rear wall extends to be higher than the upper wall from the side of the side wall close to the mainboard to the side far away from the mainboard;
the air guide cover further comprises a flow guide cover and an air guide wall, the air guide wall is connected with the rear wall and extends towards the first air opening, the flow guide cover is connected with the upper wall, the rear wall and the flow guide cover, the air guide cover and the rear wall are matched to form a first air guide cavity, the flow guide cover is matched with the upper wall and the rear wall to form a second air guide cavity, and the second air opening is communicated with the first air guide cavity through the second air guide cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220906759.6U CN217694121U (en) | 2022-04-19 | 2022-04-19 | Electronic equipment and heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220906759.6U CN217694121U (en) | 2022-04-19 | 2022-04-19 | Electronic equipment and heat dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217694121U true CN217694121U (en) | 2022-10-28 |
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ID=83734746
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220906759.6U Active CN217694121U (en) | 2022-04-19 | 2022-04-19 | Electronic equipment and heat dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217694121U (en) |
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2022
- 2022-04-19 CN CN202220906759.6U patent/CN217694121U/en active Active
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