CN217694107U - Heat management integrated control device and vehicle - Google Patents
Heat management integrated control device and vehicle Download PDFInfo
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- CN217694107U CN217694107U CN202220295433.4U CN202220295433U CN217694107U CN 217694107 U CN217694107 U CN 217694107U CN 202220295433 U CN202220295433 U CN 202220295433U CN 217694107 U CN217694107 U CN 217694107U
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- 239000003507 refrigerant Substances 0.000 claims description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 24
- 238000011161 development Methods 0.000 abstract description 6
- 238000012827 research and development Methods 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
The disclosure relates to the technical field of vehicles, in particular to a heat management integrated control device and a vehicle. The heat management integrated control device comprises a heat management integrated circuit board, wherein a main micro-control unit and a plurality of sub-micro-control units are arranged on the heat management integrated circuit board, and the plurality of sub-micro-control units are electrically connected with the main micro-control unit; and the waterway control assembly is electrically connected with the at least one sub-micro control unit. In the device that this disclosure provided, through being connected sub-micro-control unit and main micro-control unit electricity, realize the setting of integrating to the micro-control unit of water route control assembly. When the waterway control assembly needs to be replaced, the sub-micro control unit for controlling the waterway control assembly does not need to be replaced; when the waterway control assembly is upgraded and updated, software upgrading is carried out on the main micro-control unit and the sub-micro-control unit after the waterway control assembly is replaced, so that the upgrading and updating of the waterway control assembly can be realized, the research and development cost of the main micro-control unit and the sub-micro-control unit is effectively reduced, and the development efficiency is improved.
Description
Technical Field
The disclosure relates to the technical field of vehicles, in particular to a heat management integrated control device and a vehicle.
Background
In the prior art, most of the thermal management integrated control devices are integrally assembled by directly connecting a plurality of control units directly through structural connection, wherein each control unit comprises a micro control unit and a control mechanism. When the control mechanism needs to be replaced, the control unit needs to be replaced, the micro control unit needs to be replaced synchronously with the control mechanism, the micro control units in the control units are developed in a scattered mode, the development efficiency is reduced, and the cost is improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the present disclosure provides a thermal management integrated control device and a vehicle.
The present disclosure provides a thermal management integrated control device, comprising:
the heat management integrated circuit board is provided with a main micro-control unit and a plurality of sub-micro-control units, and the sub-micro-control units are electrically connected with the main micro-control unit;
and the waterway control assembly is electrically connected with at least one sub-micro control unit.
Optionally, the waterway control assembly includes a plurality of driving motors, and each driving motor is electrically connected to one of the sub-micro control units.
Optionally, a plurality of bridge circuits are further disposed on the thermal management integrated circuit board, and the bridge circuits are disposed between the sub micro-control units and the driving motors.
Optionally, the system further comprises a refrigerant side control assembly, and the refrigerant side control assembly is electrically connected with the main micro control unit.
Optionally, the refrigerant side control assembly comprises a plurality of control components, and at least part of the control components are electrically connected with the sub-micro control unit.
Optionally, the control component includes an electromagnetic valve, a driving unit is disposed on the thermal management integrated circuit board, and the electromagnetic valve is electrically connected to the main micro-control unit through the driving unit.
Optionally, the control component includes a driving motor, and the driving motor is electrically connected with the sub micro-control unit.
Optionally, the control component further comprises a refrigerant temperature sensor electrically connected with the main micro-control unit.
Optionally, the control component further comprises a refrigerant pressure sensor electrically connected with the main micro-control unit.
The present disclosure also provides a vehicle including the above-mentioned thermal management integrated control device.
The technical scheme provided by the embodiment of the disclosure has the following advantages:
in the heat management integrated control device provided by the disclosure, the main micro-control unit and the plurality of sub-micro-control units are integrated in the heat management integrated circuit board, and then the water path control assembly is electrically connected with the heat management integrated circuit board so as to realize the electrical connection between the water path control assembly and the sub-micro-control units. The integrated setting of the micro-control units of the water path control assembly is realized by electrically connecting all the sub-micro-control units with the main micro-control unit. That is to say, when the waterway control assembly needs to be replaced, the sub-micro control unit for controlling the waterway control assembly does not need to be replaced, and when the waterway control assembly is upgraded and updated, software upgrading is carried out on the main micro control unit and the sub-micro control unit after the waterway control assembly is replaced, so that the upgrading and updating of the waterway control assembly can be realized, the research and development costs of the main micro control unit and the sub-micro control unit are effectively reduced, and the development efficiency is improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a first thermal management integrated control device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a second thermal management integrated control device according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of a third structure of the thermal management integrated control device according to the embodiment of the present disclosure.
Reference numerals:
10. a thermal management integrated circuit board; 101. a main micro control unit; 102. a sub micro control unit; 103. a bridge circuit; 104. a drive unit; 20. a waterway control component; 201. a brushless DC motor; 202. a stepping motor; 203. a water temperature sensor; 30. a refrigerant side control assembly; 301. a stepping motor; 302. an electromagnetic valve; 303. a refrigerant temperature sensor; 304. a refrigerant pressure sensor; 305. a brushless DC motor; 306. refrigerant pressure and temperature sensors; 40. a power supply assembly.
Detailed Description
In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced otherwise than as described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.
In the prior art, most of the thermal management integrated control devices are integrally assembled by directly connecting a plurality of control units directly through structural connection, wherein each control unit comprises a micro control unit and a control mechanism. When the control mechanism needs to be replaced, the control unit needs to be replaced, the micro control unit needs to be replaced synchronously with the control mechanism, the micro control units in the control units are dispersedly developed, the development efficiency is reduced, and the cost is improved.
In view of this, the disclosed embodiments provide a thermal management integrated control apparatus and a vehicle, which can solve the above technical problems.
As shown in fig. 1 to 3, an embodiment of the present disclosure provides a thermal management integrated control device, including:
the heat management integrated circuit board 10 is provided with a main micro-control unit 101 and a plurality of sub-micro-control units 102, and the plurality of sub-micro-control units 102 are electrically connected with the main micro-control unit 101;
the waterway control assembly 20, the waterway control assembly 20 is electrically connected with at least one sub-micro control unit 102.
In the thermal management integrated control device provided by the embodiment of the present disclosure, the main micro control unit 101 and the plurality of sub-micro control units 102 are integrally disposed in the thermal management integrated circuit board 10, and then the water path control assembly 20 is electrically connected to the thermal management integrated circuit board 10, so as to achieve the electrical connection between the water path control assembly 20 and the sub-micro control units 102. By electrically connecting all the sub-micro control units 102 to the main micro control unit 101, the integrated arrangement of the micro control units of the water path control assembly 20 is realized. That is to say, when the waterway control assembly 20 needs to be replaced, the sub-micro control unit 102 for controlling the waterway control assembly 20 does not need to be replaced, and when the waterway control assembly 20 is upgraded and updated, after the waterway control assembly 20 is replaced, software upgrade is performed on the main micro control unit 101 and the sub-micro control unit 102, and then the upgrading and updating of the waterway control assembly 20 can be realized, so that the research and development costs of the main micro control unit 101 and the sub-micro control unit 102 are effectively reduced, and the development efficiency is improved.
In addition, the control unit for controlling the waterway control assembly 20 is arranged on the thermal management integrated circuit board 10 as the sub micro-control unit 102 and is controlled by the main micro-control unit 101, so that the number of communication transceivers, EMC circuits, anti-reverse circuits and MCUs is effectively saved, the control risk is reduced, the cost is reduced, the software and hardware are separated, and the after-sale maintenance is facilitated.
The heat management integrated control device further comprises a refrigerant side control assembly 30, and the refrigerant side control assembly 30 is electrically connected with the main micro-control unit 101.
That is to say, the thermal management integrated circuit board 10 is arranged to electrically control the water path control assembly 20 and the refrigerant side control assembly 30, when components included in the water path control assembly 20 and the refrigerant side control assembly 30 need to be replaced, the components can be directly replaced, and the main micro control unit 101 is updated, so that the components can be upgraded and replaced, and the research and development cost of the thermal management integrated circuit board 10 is effectively reduced.
Furthermore, the integration degree of the device can be effectively improved by controlling the water path control unit 20 and the refrigerant side control unit 30 through the heat management integrated circuit board 10. In addition, the control unit for controlling the water path control assembly 20 and the refrigerant side control assembly 30 is arranged on the heat management integrated circuit board 10 as a sub micro control unit 102 and is controlled by the main micro control unit 101, so that the number of communication transceivers, EMC circuits, anti-reverse circuits and MCUs is effectively reduced, the control risk is reduced, the cost is reduced, the after-sale maintenance is facilitated, and the separation of software and hardware is realized.
Specifically, the waterway control assembly 20 includes a plurality of driving motors, each driving motor being electrically connected to one of the sub-micro control units 102.
In this embodiment, the waterway control assembly 20 may include five driving motors, and the five driving motors are respectively used for controlling the warm air loop water pump, the battery loop water pump, the motor loop water pump and the two multi-way valves, wherein the driving motor for controlling the warm air loop water pump, the battery loop water pump and the motor loop water pump may select the brushless dc motor 201, and the driving motor for controlling the multi-way valves may select the stepping motor 202.
The multi-way valve is used for realizing waterway switching so as to realize refrigeration or heating switching. For example, the refrigerant absorbing the heat of the motor is conducted into the battery assembly to heat the battery assembly, so that the electric quantity of the battery is prevented from being reduced at low temperature, the speed is increased, the motor is cooled, and the heat is recovered and applied.
Specifically, five sub-micro-control units 102 for electrically connecting with the waterway control assembly 20 are disposed on the thermal management integrated circuit board 10, and the five sub-micro-control units 102 correspond to and are electrically connected with the driving motors one by one.
Specifically, the thermal management integrated circuit board 10 is further provided with a plurality of bridge circuits 103, and the bridge circuits 103 are disposed between the sub-micro control units 102 and the driving motors. In this embodiment, the bridge circuit 103 is disposed between the brushless dc motor 201 and the sub micro control unit 102.
By electrically connecting each driving motor with one sub-micro control unit 102, respective control of each driving motor is realized, and respective control of each part in the water path control assembly 20 is facilitated.
Specifically, a water temperature sensor 203 is further included, and the water temperature sensor 203 is electrically connected to the thermal management integrated circuit board 10.
As shown in fig. 2 to 3, in some embodiments, the refrigerant-side control assembly 30 includes a plurality of control components, at least some of which are electrically connected to the sub-micro control unit 102.
Specifically, the control component includes an electromagnetic valve 302, such as an SOV, a driving unit 104 is disposed on the thermal management integrated circuit board 10, and the electromagnetic valve 302 is electrically connected to the main micro-control unit 101 through the driving unit 104.
The number of the electromagnetic valves 302 is multiple, and the electromagnetic valves are used for controlling the on-off condition of the circuit. The number of the specific solenoid valves 302 is not limited in this embodiment.
Specifically, the control unit further includes a driving motor electrically connected to the sub micro control unit 102.
The driving motor is used for controlling the opening state of the refrigerant expansion valve and realizing different opening degrees of the refrigerant expansion valve, wherein the electromagnetic valve 302 can be selected from EXV and ERV.
Specifically, the driving component may be a stepping motor 301 or a brushless dc motor 305, the number of the stepping motors 301 and the number of the brushless dc motors 305 may be multiple, and the number of the driving component is the same as the number of the refrigerant expansion valves, so as to realize the individual control of each refrigerant expansion valve.
Specifically, the control component further includes one or more of a refrigerant temperature sensor 303, a refrigerant pressure and temperature sensor 306 and a refrigerant pressure sensor 304, and the refrigerant temperature sensor 303, the refrigerant pressure sensor 304 and the refrigerant pressure and temperature sensor 306 are respectively electrically connected with the main micro-control unit 101, so that the monitoring of the pressure and the temperature of the refrigerant is realized.
In some embodiments, a power supply assembly 40 is also included, and the power supply assembly 40 is electrically connected to the main micro-control unit 101 and the sub-micro-control unit 102.
The embodiment of the disclosure also provides a vehicle which comprises the thermal management integrated control device.
The vehicle provided by the embodiment of the disclosure comprises a thermal management integrated control device, wherein the thermal management integrated control device integrates a main micro-control unit 101 and a plurality of sub-micro-control units 102 in a thermal management integrated circuit board 10, and then electrically connects a water path control assembly 20 with the thermal management integrated circuit board 10, so as to realize the electrical connection between the water path control assembly 20 and the sub-micro-control units 102. By electrically connecting all the sub-micro control units 102 to the main micro control unit 101, the integrated arrangement of the micro control units of the water path control assembly 20 is realized. That is to say, when the waterway control assembly 20 needs to be replaced, the sub-micro control unit 102 for controlling the waterway control assembly 20 does not need to be replaced, and when the waterway control assembly 20 is upgraded and updated, after the waterway control assembly 20 is replaced, software upgrade is performed on the main micro control unit 101 and the sub-micro control unit 102, and then the upgrading and updating of the waterway control assembly 20 can be realized, so that the research and development costs of the main micro control unit 101 and the sub-micro control unit 102 are effectively reduced, the development efficiency is improved, and the research and development costs of the vehicle are reduced.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A thermal management integrated control apparatus, comprising:
the heat management integrated circuit board is provided with a main micro-control unit and a plurality of sub-micro-control units, and the sub-micro-control units are electrically connected with the main micro-control unit;
and the waterway control assembly is electrically connected with at least one sub-micro control unit.
2. The integrated control device for thermal management according to claim 1, wherein the waterway control assembly comprises a plurality of driving motors, and each driving motor is electrically connected with one of the sub-micro control units.
3. The integrated control device for thermal management according to claim 2, wherein a plurality of bridge circuits are further disposed on the integrated circuit board, and the bridge circuits are disposed between the sub-micro control units and the driving motor.
4. The thermal management integrated control device of claim 1, further comprising a refrigerant side control assembly electrically connected to the main micro-control unit.
5. The thermal management integrated control device of claim 4, wherein the refrigerant-side control assembly comprises a plurality of control components, at least some of which are electrically connected to the sub-micro control unit.
6. The integrated control device for thermal management according to claim 5, wherein the control component comprises an electromagnetic valve, a driving unit is arranged on the integrated circuit board for thermal management, and the electromagnetic valve is electrically connected with the main micro-control unit through the driving unit.
7. The thermal management integrated control device of claim 5, wherein the control component comprises a drive motor, and the drive motor is electrically connected with the sub-micro control unit.
8. The thermal management integrated control device of claim 5, wherein the control component comprises a refrigerant temperature sensor electrically connected to the main micro-control unit.
9. The thermal management integrated control device of claim 5, wherein the control component comprises a refrigerant pressure sensor electrically connected to the main micro-control unit.
10. A vehicle characterized by comprising the thermal management integrated control apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220295433.4U CN217694107U (en) | 2022-02-14 | 2022-02-14 | Heat management integrated control device and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220295433.4U CN217694107U (en) | 2022-02-14 | 2022-02-14 | Heat management integrated control device and vehicle |
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| Publication Number | Publication Date |
|---|---|
| CN217694107U true CN217694107U (en) | 2022-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220295433.4U Active CN217694107U (en) | 2022-02-14 | 2022-02-14 | Heat management integrated control device and vehicle |
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- 2022-02-14 CN CN202220295433.4U patent/CN217694107U/en active Active
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