CN217691209U

CN217691209U - Light-emitting substrate, backlight module and display device

Info

Publication number: CN217691209U
Application number: CN202221177587.XU
Authority: CN
Inventors: 王康丽; 张冰; 高亮; 孙一丁; 康萍; 王晨阳; 王肖
Original assignee: BOE Technology Group Co Ltd; Hefei BOE Ruisheng Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei BOE Ruisheng Technology Co Ltd
Priority date: 2022-05-16
Filing date: 2022-05-16
Publication date: 2022-10-28
Anticipated expiration: 2032-05-16

Abstract

The application discloses luminous base plate, backlight unit and display device relates to and shows technical field to improve luminous base plate's holistic luminous efficacy, improve display device's display effect. The light emitting substrate includes a substrate, a reflective layer, and support posts. The reflecting layer is arranged on the substrate; the reflecting layer is provided with a plurality of first openings, and at least two sections of the first openings exist in a plurality of sections parallel to the plane of the substrate, wherein the area of the section relatively close to the substrate is smaller than the area of the section relatively far away from the substrate. The supporting columns are fixed on the substrate; the orthographic projection of the supporting column on the substrate is a first projection, the orthographic projection of the minimum section of the first opening on the substrate in a plurality of sections parallel to the plane of the substrate is a second projection, and the second projection is within the range of the first projection. The application is used for manufacturing the display device.

Description

Light-emitting substrate, backlight module and display device

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a light-emitting substrate, a backlight module and a display device.

Background

With the development of Light Emitting Diode technology, backlight sources using Light-Emitting diodes (LEDs) of sub-millimeter level or even micrometer level are widely used. Therefore, the contrast of the picture of a product such as a transmission-type Liquid Crystal Display (LCD) utilizing the backlight can reach the level of an Organic Light-Emitting Diode (OLED) Display product, the technical advantages of Liquid Crystal Display can be retained by the product, the Display effect of the picture is further improved, and better visual experience is provided for users.

In the related art, the overall light extraction efficiency of a display device using an LED backlight source with a submillimeter level or even a micrometer level still needs to be improved.

BRIEF SUMMARY OF THE PRESENT DISCLOSURE

The present disclosure provides a light-emitting substrate, a backlight module and a display device, so as to improve the overall light-emitting efficiency of the light-emitting substrate and improve the display effect of the display device.

In order to achieve the purpose, the technical scheme adopted by the disclosure is as follows:

in one aspect, a light emitting substrate is provided. The light emitting substrate includes a substrate, a reflective layer, and support pillars. The reflecting layer is arranged on the substrate; the reflecting layer is provided with a plurality of first openings, at least two sections of the first openings exist in a plurality of sections parallel to the plane of the substrate, and the area of the section relatively close to the substrate is smaller than the area of the section relatively far away from the substrate. The supporting columns are fixed on the substrate; the orthographic projection of the supporting column on the substrate is a first projection, the orthographic projection of the minimum section of the first opening on the substrate in a plurality of sections parallel to the plane of the substrate is a second projection, and the second projection is within the range of the first projection.

In some embodiments, a smallest cross section of the plurality of cross sections parallel to the plane of the substrate is a cross section closest to the substrate.

In some embodiments, the support post has a maximum dimension D1 toward the surface of the substrate, and the support post has a mounting tolerance T1; the maximum dimension of the minimum cross section is D2, and the dimensional tolerance of the second sub-hole is T2;

in some embodiments, an edge of the support post facing the surface of the substrate is arcuate with a tolerance R;

in some embodiments, the support posts have a maximum dimension D of a surface facing the substrate ₁ The installation tolerance of the support column is T ₁ (ii) a The first opening is in a plurality of cross sections parallel to the plane of the substrateHas a maximum cross section of maximum size D ₃ The tolerance of the radial dimension of the maximum section is T ₃ ；

in some embodiments, the light emitting substrate further includes a fixing portion, and the supporting pillar is fixed on the substrate through the fixing portion.

In some embodiments, the material of the fixation portion comprises a hot melt adhesive.

In some embodiments, the reflective layer includes a first sub reflective layer and a second sub reflective layer disposed on the substrate, the first opening includes a first sub hole and a second sub hole communicated with each other, the first sub hole penetrates through the first sub reflective layer, and the second sub hole penetrates through the second sub reflective layer. The first sub-hole is far away from the substrate compared with the second sub-hole, and the aperture of one end, close to the second sub-hole, of the first sub-hole is larger than that of one end, close to the first sub-hole, of the second sub-hole, so that the side wall of the first opening forms a step structure.

In some embodiments, a maximum dimension of the surface of the support post facing the substrate is greater than a maximum dimension of the second sub-aperture and less than a maximum dimension of the first sub-aperture. The shape of the second sub-hole is approximately a cylinder, the depth of the second sub-hole is H, the bottom area of the second sub-hole is S, and the tolerance of the depth of the second sub-hole is T4; the mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T5;

M＝S×(H-T ₄ )ρ-T ₅ 。

in some embodiments, the support column includes a support body and a support frame, the support frame being located on a side of the support body near the substrate. The support frame is positioned in the second sub-hole, and the thickness of the support frame is approximately equal to that of the second sub-reflecting layer along the direction perpendicular to the substrate.

In some embodiments, the second sub-hole is substantially cylindrical in shape, the second sub-hole has a depth H, the second sub-hole has a base area S, and the second sub-hole has a depth tolerance T4; the mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T5; the volume of the support frame is V;

M＝[S×(H-T ₄ )-V]ρ-T ₅ 。

in some embodiments, the light-emitting substrate further includes at least one alignment mark, and at least one alignment mark is disposed in the first opening.

In some embodiments, the base plate includes a substrate and a plurality of conductive layers disposed on the substrate, and the alignment mark is disposed in the same layer as at least one of the conductive layers.

In some embodiments, the reflectivity of the support posts is substantially the same as the reflectivity of the reflective layer.

In some embodiments, the reflective layer is further provided with a plurality of second openings, at least two of the second openings have a cross section parallel to the plane of the substrate, and the area of the cross section relatively close to the substrate is smaller than the area of the cross section relatively far from the substrate. The light-emitting substrate further comprises a light-emitting device, and the light-emitting device is fixed on the substrate. The orthographic projection of the light-emitting device on the substrate is a third projection, the orthographic projection of the minimum section of the second opening on the substrate in a plurality of sections parallel to the plane of the substrate is a fourth projection, and the third projection falls into the fourth projection.

In some embodiments, the light emitting substrate further includes a reflective portion at least partially disposed in the second opening and covering at least a portion of the substrate exposed between the second opening and the light emitting device.

In some embodiments, the reflectivity of the reflective portion is substantially the same as the reflectivity of the reflective layer.

The light-emitting substrate provided by the embodiment of the disclosure, the second projection (the orthographic projection of the first opening on the substrate at the minimum section of the plurality of sections parallel to the plane of the substrate) is in the range of the first projection (the orthographic projection of the support column on the substrate), so that the support column can shield the minimum section, and the problem that the reflection area is reduced due to the fact that the area between the boundary of the first opening of the reflection layer and the support column cannot reflect is solved, thereby improving the overall light-emitting efficiency of the light-emitting substrate and improving the display effect of the display device.

In another aspect, a backlight module is provided. The backlight module comprises the light-emitting substrate and a plurality of optical films in any embodiment. The light-emitting substrate is provided with a light-emitting side and a non-light-emitting side which are opposite to each other, and the plurality of optical films are arranged on the light-emitting side of the light-emitting substrate.

In yet another aspect, a display device is provided. The display device comprises the backlight module and the display panel, wherein the display panel is arranged on one side, far away from the light-emitting substrate, of the optical films in the backlight module.

The beneficial effects of the backlight module and the display device provided by the embodiment of the disclosure are the same as those of the light-emitting substrate provided by the above technical scheme, and are not repeated herein.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings required to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to these drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a block diagram of a display device according to some embodiments;

FIG. 2 is a cross-sectional view of a display device according to some embodiments;

fig. 3A is a top view of a light emitting substrate according to some embodiments;

FIG. 3B is a top view of a light emitting substrate according to other embodiments;

FIG. 4 is a cross-sectional view of the light-emitting substrate of FIG. 3B taken along line Q-Q';

FIG. 5 is a cross-sectional view of the light-emitting substrate of FIG. 3A taken along line Q-Q';

FIG. 6 is an enlarged view of a portion of FIG. 5 at N2;

FIG. 7 is a partial enlarged view at M2 in FIG. 5;

FIG. 8 is a partial magnified view of the light emitting substrate of FIG. 4 at N1 according to some embodiments;

FIG. 9 is a top view of FIG. 8;

FIG. 10 is an enlarged partial view of the light emitting substrate of FIG. 4 at N1 according to further embodiments;

FIG. 11 is a structural view of the support column of FIG. 10;

FIG. 12 is a partial magnified view of the light emitting substrate of FIG. 4 at N1 according to still further embodiments;

FIG. 13 is a structural view of the support column of FIG. 12;

FIG. 14 is a partial magnified view of the light emitting substrate of FIG. 4 at M1 according to some embodiments;

FIG. 15 is a top view of FIG. 14;

FIG. 16 is a schematic illustration of the location of various test site locations;

fig. 17 is a graph showing the results of the test of the high uniformity of each support pillar.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the terms used above are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "at least one of A, B or C" and includes the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

As used herein, the term "if" is optionally interpreted to mean "when … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrase "if it is determined … …" or "if [ stated condition or event ] is detected" is optionally interpreted to mean "at determination … …" or "in response to determination … …" or "upon detection [ stated condition or event ] or" in response to detection [ stated condition or event ] ", depending on the context.

The use of "adapted to" or "configured to" herein means open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or values beyond those stated.

As used herein, "parallel," "perpendicular," and "equal" include the recited case and cases that approximate the recited case to within an acceptable range of deviation as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where an acceptable deviation from approximately parallel may be, for example, within 5 °; "perpendicular" includes absolute perpendicular and approximately perpendicular, where an acceptable deviation from approximately perpendicular may also be within 5 °, for example. "equal" includes absolute and approximate equality, where the difference between the two, which may be equal within an acceptable deviation of approximately equal, is less than or equal to 5% of either.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Referring to fig. 1, some embodiments of the present disclosure provide a display device 1000, the display device 1000 may be any device that displays images, whether in motion (e.g., video) or stationary (e.g., still images), and whether textual or textual. The display device 1000 may be, for example, any product or component having a display function, such as a television, a notebook computer, a tablet computer, a mobile phone, a Personal Digital Assistant (PDA), a navigator, a wearable device, an Augmented Reality (AR) device, a Virtual Reality (VR) device, and the like.

In some embodiments, the Display device 1000 may be a Liquid Crystal Display (LCD).

Referring to fig. 2, the display device 1000 may include a backlight module 100, a display panel 200, and a glass cover 300. The display panel 200 includes a light emitting side and a non-light emitting side disposed opposite to each other. The light emitting side refers to a side of the display panel 200 (an upper side of the display panel 200 in fig. 2) for displaying a screen, and the non-light emitting side refers to another side opposite to the light emitting side. The backlight module 100 is disposed on a non-light-emitting side of the display panel 200 (a lower side of the display panel 200 in fig. 2), and the backlight module 100 is used for providing a light source for the display panel 200.

As shown in fig. 2, the backlight module 100 may include a light emitting substrate 110 and a plurality of optical films 120. The light-emitting substrate 110 has opposite light-emitting and non-light-emitting sides, and the plurality of optical films 120 are disposed on the light-emitting side of the light-emitting substrate 110. At this time, the light emitting substrate 110 may directly emit white light, and the white light is irradiated to the display panel 200 after being subjected to a light uniformizing process. Alternatively, the light emitting substrate 110 may emit other color lights, and then emit the lights to the display panel 200 after color conversion and light uniformization.

Illustratively, referring to fig. 2, the plurality of optical films 120 includes a diffusion plate 121, a quantum dot film 122, a diffusion sheet 123, and a composite film 124, which are sequentially disposed in a direction away from the light emitting substrate 110. The diffusion plate 121 and the diffusion sheet 123 can mix the white light uniformly to improve the light shadow generated by the light emitting substrate 110, thereby improving the display image quality of the display device 1000. The composite film 124 can improve the light-emitting efficiency of the backlight module 100 and improve the display brightness of the display device 1000. The quantum dot film 122 can convert a certain color of light emitted by the light-emitting substrate 110 into white light under the excitation of the light, so as to improve the utilization rate of light energy of the light-emitting substrate 110.

For example, the light emitting substrate 110 emits blue light, and the quantum dot film 122 may include a red quantum dot material, a green quantum dot material, and a transparent material. When the blue light emitted from the light emitting substrate 110 passes through the red quantum dot material, the blue light is converted into red light; when the blue light passes through the green quantum dot material, the blue light is converted into green light; blue light can pass through the transparent material directly; then, the blue light, the red light and the green light are mixed and superimposed in a certain proportion to form white light.

In some embodiments, referring to fig. 2, 3B and 4, the light emitting substrate 110 includes a substrate 10, a reflective layer 20, a support pillar 30 and a light emitting device 40.

As shown in fig. 2 and 3B, the base plate 10 may include a substrate 11.

The substrate 11 includes any one such as a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, or the like; or a semiconductor substrate such as a single crystal semiconductor substrate or a polycrystalline semiconductor substrate made of Silicon, silicon carbide, or the like, a compound semiconductor substrate such as Silicon germanium, or a Silicon On Insulator (SOI); the substrate 11 may also include an organic resin material such as epoxy, triazine, silicone, or polyimide. In the above case, at least one conductive layer is also provided on the substrate 11.

Exemplarily, referring to fig. 4, the base plate 10 further includes, on one side of the substrate 11, a buffer layer 12, a second conductive layer 13, an insulating layer 14, a first conductive layer 15, a passivation layer 16, and a planarization layer 17, which are sequentially stacked in a direction perpendicular to the substrate 11 and away from the substrate 11. The first conductive layer 15 may include a pad to be connected with the light emitting device and/or a wire connecting different pads, and the second conductive layer 13 may include a trace for transmitting a signal. The material of the first conductive layer 15 includes at least one of copper, molybdenum-niobium alloy (MoNb), nickel, and indium tin oxide. The material of the second conductive layer 13 includes at least one of copper, molybdenum-niobium alloy (MoNb), nickel, and indium tin oxide.

In other examples, the substrate 11 may be an FR4 type Printed Circuit Board (PCB), or may be a flexible PCB that is easily deformed. In some example embodiments, the substrate may include, for example, silicon nitride, alN or Al ₂ O ₃ Or a Metal compound, or any one of a Metal Core printed circuit board (Metal Core PCB) or a Metal Copper Clad Laminate (MCCL).

As shown in fig. 3B and 4, at least a partial boundary of the reflective layer 20 coincides with at least a partial boundary of the substrate 10.

Exemplarily, as shown in fig. 3B and 4, the substrate 10 includes a light emitting region 10A and a functional region 10B, the light emitting region 10A is configured to dispose the light emitting device 40, and a microchip (not shown in the figure), and the functional region 10B is configured to bind a circuit board. The microchip comprises a sensing chip and a driving chip, wherein the sensing chip can be a photosensitive sensor chip, a thermosensitive sensor chip and the like, and the driving chip is used for providing a driving signal for the light-emitting device.

The boundary of the reflective layer 20 coincides with the boundary of the light emitting region 10A of the substrate 10, that is, the reflective layer 20 is not provided in the functional region 10B of the substrate 10. Fig. 2 and 3B are illustrated by taking an example in which a part of the boundary of the reflective layer 20 overlaps with a part of the boundary of the substrate 10.

As shown in fig. 4 and 5, the reflective layer 20 is provided with a plurality of first openings 210 and a plurality of second openings 220. The supporting posts 30 are fixed on the substrate 10 through the first openings 210, and the light emitting devices 40 are fixed on the substrate 10 through the second openings 220.

It should be noted that the shape of the outline of the orthographic projection of the first opening 210 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the disclosure is not limited in this respect. The shape of the outline of the orthographic projection of the second opening 220 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the present disclosure is not particularly limited herein.

Here, the reflectivity of the reflective layer 20 is greater than or equal to 90%. Illustratively, the material of the reflective layer 20 may include white ink and/or silicon-based white glue. For example, the material of the reflective layer 20 may include a resin (e.g., epoxy resin, polytetrafluoroethylene resin), titanium dioxide (formula TiO 2), an organic solvent (e.g., dipropylene glycol methyl ether), and the like.

Referring to fig. 2 and 4, the supporting posts 30 are used for supporting the optical film 120 on the light emitting side of the light emitting substrate 110, so that a light mixing distance is formed between the reflective layer 20 in the light emitting substrate 110 and the optical film 120, thereby improving the light shadow generated by the light emitting substrate 110 and improving the display quality of the display device 1000.

The reflectance of the supporting pillars 30 may be substantially equal to the reflectance of the reflective layer 20, that is, the reflectance of the supporting pillars 30 is greater than or equal to 90%, so that the display luminance of the entire screen is substantially the same, and the uniformity of the screen luminance is improved. Illustratively, the material of the support column 30 may include a white high molecular polymer. For example, the material of the support post 30 may include white polycarbonate.

In some embodiments, as shown in fig. 5 and 6, the first opening 210 has at least two cross sections among a plurality of cross sections parallel to the plane of the substrate 10, wherein the area of the cross section relatively close to the substrate 10 is smaller than the area of the cross section relatively far from the substrate 10.

The term "plane of the substrate 10" refers to a surface of the substrate 10 having the largest plane area.

Further, a smallest cross section of the first opening 210 among a plurality of cross sections parallel to the plane of the substrate 10 is one of the plurality of cross sections closest to the substrate 10.

Illustratively, as shown in fig. 5 and 6, the first opening 210 includes a sub-hole that forms a substantially inverted trapezoid in a cross-section perpendicular to the plane of the substrate 10.

Illustratively, as shown in fig. 5 and 6, the first opening 210 includes a plurality of sub-holes communicating with each other, and sidewalls of at least two sub-holes of the plurality of sub-holes are not flush, and an area of a cross section relatively close to the substrate 10 is smaller than an area of a cross section relatively far from the substrate 10.

For example, as shown in fig. 5 and 6, the reflective layer 20 includes a first sub reflective layer 21 and a second sub reflective layer 22 disposed on the substrate 10, the second sub reflective layer 22 is in direct contact with the substrate 10, and the first sub reflective layer 21 is located on a side of the second sub reflective layer 22 away from the substrate 10. The first opening 210 includes a first sub-hole 211 and a second sub-hole 212 which are connected, the first sub-hole 211 is farther from the substrate 10 than the second sub-hole 212, the first sub-hole 211 penetrates the first sub-reflective layer 21, and the second sub-hole 212 penetrates the second sub-reflective layer 22. The aperture of the first sub-hole 211 near the end of the second sub-hole 212 is larger than the aperture of the second sub-hole 212 near the end of the first sub-hole 211, so that the sidewall of the first opening 210 forms a step structure 230.

In this case, in the process of forming the first sub-hole 211 and the second sub-hole 212, the second sub-hole 212 may be directly formed after the second sub-reflective layer 22 is prepared; after the first sub-reflective layer 21 is prepared, the first sub-apertures 211 are directly formed. That is, the depth of the first sub-hole 211 is determined by the thickness of the first sub-reflective layer 21, and the depth of the second sub-hole 212 is determined by the thickness of the second sub-reflective layer 22, so that the depths of the first sub-hole 211 and the second sub-hole 212 can be controlled, and the process difficulty is low.

It should be noted that, the shape of the outline of the orthographic projection of the first sub-hole 211 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the disclosure is not limited in detail here. The shape of the orthographic projection outline of the second sub-hole 212 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the present disclosure is not particularly limited herein.

The depth of the first sub-holes 211 is 25 to 35 μm; illustratively, the depth of the first sub-holes 211 is any one of 25 μm, 28 μm, 30 μm, 32 μm, and 35 μm. The depth of the second sub-hole 212 is 25 to 35 μm; illustratively, the depth of the second sub-holes 212 is any one of 25 μm, 28 μm, 30 μm, 32 μm, and 35 μm.

On the basis, referring to fig. 6, 8 and 9, the orthographic projection of the supporting column 30 on the substrate 10 is a first projection, the orthographic projection of the first opening 210 on the substrate 10 in a minimum section of a plurality of sections parallel to the plane of the substrate 10 is a second projection, and the second projection is within the range of the first projection, so that the supporting column 30 can shield the minimum section, and the problem that the area between the boundary of the first opening 210 of the reflective layer 20 and the supporting column 30 cannot be reflected to reduce the reflection area is avoided, thereby improving the overall light extraction efficiency of the light-emitting substrate 100 and improving the display effect of the display device 1000.

The second projection is within the range of the first projection, and a boundary including the second projection substantially coincides with a boundary of the first projection.

Illustratively, as shown in fig. 6, 8 and 9, in the case where the first opening 210 includes a first sub-hole 211 and a second sub-hole 212 communicating with each other, an orthogonal projection (second projection) of the second sub-hole 212 on the substrate 10 is located within a range of an orthogonal projection (first projection) of the support column 30 on the substrate 10.

For example, the area of the first projection is at least 1.16 times the area of the second projection, so as to avoid that the support pillar 30 cannot block the minimum cross section due to the installation tolerance of the support pillar 30 and the dimensional tolerance of the minimum cross section, and further a part of the area of the first opening 210 is exposed, and the area of the first opening 210 exposed has no reflective layer, which may cause light loss at this position. The area of the first projection is at least 1.16 times of the area of the second projection, and a partial area of the first opening 210 can be prevented from being exposed, so that light loss is avoided, the overall light emitting efficiency of the light emitting substrate 100 is improved, and the display effect is improved.

Illustratively, as shown in fig. 9, the maximum dimension of the surface of the support post 30 facing the substrate 10 is D ₁ The mounting tolerance of the support column 30 is T ₁ (ii) a The maximum dimension of the smallest cross section is D ₂ The dimensional tolerance of the smallest cross section is T ₂ 。

In some embodiments, referring to FIG. 8, the edge of the surface of support column 30 facing substrate 10 is curved, with the largest dimension of the smallest cross-section being D ₂ The following formula should be satisfied:

wherein the tolerance of the arc is R, and the tolerance R comprises the variation between the actual dimension and the designed dimension caused by manufacturing and/or material surface roughness.

The following description is given by way of example of the support column 30 being generally conical, the first opening 210 comprising a first sub-bore 211 and a second sub-bore 212 communicating with each other.

As shown in fig. 5, 8 and 9, the surface of the support post 30 facing the substrate 10 is circular, and the maximum dimension D of the support post 30 is ₁ The maximum radial dimension of the support column 30; the first opening 210 has a circular cross section parallel to the plane of the substrate 10, and the first opening 21 is formed by the circular cross section0 maximum dimension D of minimum cross section ₂ I.e., the radial dimension of the second sub-bore 212, the dimensional tolerance T of the smallest cross-section ₂ I.e., the radial dimensional tolerance of the second sub-aperture 212.

In this case, the radial dimension D of the second sub-hole 212 ₂ According to the radial dimension D of the supporting column 30 ₁ And the mounting tolerance T of the support post 30 ₁ And the radial dimensional tolerance T of the second sub-bore 212 ₂ The supporting posts 30 can block the second sub-holes 212, so that the reduction of the reflection area of the reflection layer 11 caused by the second sub-holes 212 arranged in the reflection layer 11 can be avoided, and the influence on the overall light extraction efficiency of the light-emitting substrate 100 can be avoided.

Illustratively, the maximum radial dimension D of the support column 30 ₁ 5mm, mounting tolerance T of support post 30 ₁ Is +/-0.02 mg; radial dimension tolerance T of second sub-bore 212 ₂ Is +/-0.3 mm; the tolerance R of the support column 30 is ± 0.04mm.

The radial dimension D of the second sub-bore 212 can be derived from the above equation ₂ Substantially less than or equal to 4.2mm. For example, the radial dimension D of the second sub-aperture 212 ₂ Approximately equal to 4.2mm, so that the bonding area between the fixing part 60 and the supporting column 30 is large, and the bonding strength between the supporting column 30 and the fixing part 60 is improved.

In addition, an orthogonal projection of the maximum cross section of the first opening 210 on the substrate 10 in a plurality of cross sections parallel to the plane of the substrate 10 is a fifth projection within a range of the fifth projection (the orthogonal projection of the supporting pillars 30 on the substrate 10), so as to reduce a difference in reflection brightness caused by a difference in reflectivity of different reflection surfaces (for example), and to improve uniformity of the light mixing distance at each position of the reflection layer 20.

In addition, the first projection is within the range of the fifth projection, and a boundary including the first projection and a boundary of the fifth projection substantially overlap.

Illustratively, as shown in fig. 6, 8 and 9, in the case where the first opening 210 includes a first sub-hole 211 and a second sub-hole 212 communicating with each other, an orthogonal projection (first projection) of the support column 30 on the substrate 10 is located within an orthogonal projection (fifth projection) of the first sub-hole 211 on the substrate 10.

Moreover, the area of the fifth projection is at least 1.14 times the area of the first projection, so as to avoid that the supporting column 30 cannot extend into the first opening 210 due to the installation tolerance of the supporting column 30 and the dimensional tolerance of the largest cross section.

Illustratively, referring to FIG. 9, the support posts 30 have a maximum dimension D of the surface facing the substrate 10 ₁ The mounting tolerance of the support column 30 is T ₁ (ii) a Maximum dimension of maximum cross section D ₃ The dimensional tolerance of the largest cross section is T ₃ 。

In some embodiments, referring to fig. 8, the edge of the surface of the support post 30 facing the substrate 10 is curved, and the maximum dimension of the minimum cross-section is D in consideration of dimensional manufacturing tolerance and surface roughness of the curve ₂ The following formula should be satisfied:

At this time, as shown in fig. 5, 8 and 9, the surface of the supporting beam 30 facing the substrate 10 is rounded, and the maximum dimension D of the supporting beam 30 is set to be large ₁ The maximum radial dimension of the support column 30; a plurality of cross sections of the first opening 210 in a plane parallel to the substrate 10 are all circular, and then the maximum dimension D of the maximum cross section of the first opening 210 is ₃ I.e. the first sub-aperture211 radial dimension, maximum cross-sectional dimension tolerance T ₃ I.e., the radial dimensional tolerance of the first sub-aperture 211.

In this case, the radial dimension D of the first sub-hole 211 ₃ According to the radial dimension D of the supporting column 30 ₁ And the mounting tolerance T of the support post 30 ₁ And the radial dimensional tolerance T of the first sub-aperture 211 ₃ The setting is made such that the supporting pillars 30 extend into the first opening 210, for example, the supporting pillars 30 extend into the first opening 210 and directly contact with the first surface of the step structure 230, which is the surface of the step structure 230 located in the first opening 210 and approximately parallel to the plane of the substrate 10, so that all the supporting pillars 30 close to the end surface of the substrate 10 are located on the same reference plane, i.e., the first surface of the step structure 230. In this way, the heights of the end portions of all the supporting columns 30 for supporting the optical film 120 are uniform, and the supporting heights of the supporting columns 30 for the corresponding areas of the optical film 120 are substantially equal, so that the surface flatness of the optical film 120 can be improved, and the risk of poor optical uniformity can be reduced.

Illustratively, the maximum radial dimension D of the support column 30 ₁ 5mm, mounting tolerance T of support post 30 ₁ Is +/-0.02 mg; radial dimensional tolerance T of the first sub-aperture 211 ₃ Is +/-0.3 mm; the tolerance R of the support column 30 is ± 0.04mm.

The radial dimension D of the first sub-aperture 211 can be derived from the above equation ₃ Substantially greater than or equal to 5.8mm. For example, the radial dimension D of the first sub-aperture 211 ₃ Approximately equal to 5.8mm, so that the radial dimension of the first sub-aperture 211 can be minimized, thereby reducing the reflection area of the second sub-reflection layer 22, reducing the difference in reflection brightness caused by the difference in reflectivity between the first sub-reflection layer 21 and the second sub-reflection layer 22, and improving the uniformity of the light mixing distance at each position of the reflection layer 20.

In some embodiments, as shown in fig. 5 and 8, the supporting post 30 and the substrate 10 may be connected by a fixing portion 60. Illustratively, the light emitting substrate 110 further includes a fixing portion 60, and the supporting pillar 30 is fixed on the substrate 10 through the fixing portion 60.

It should be noted that the material of the fixing portion 60 may include glue, and the glue forms the fixing portion 60 after curing. For example, the material of the fixing portion 60 may include a hot melt adhesive, for example, the material of the fixing portion 60 includes a Polyurethane Resin (PUR), which has a high temperature resistance characteristic and can ensure the stability of the fixing portion 60 at a high temperature.

In some embodiments, referring to fig. 5 and 8, the maximum dimension of the surface of the support post 30 facing the substrate 10 is greater than the maximum dimension of the second sub-aperture 212 and less than the maximum dimension of the first sub-aperture 211.

On the basis, a plurality of cross sections of the second sub-hole 212 parallel to the plane of the substrate 10 are mutually congruent figures, the depth of the second sub-hole 212 is H, the bottom area of the second sub-hole 212 is S, and the tolerance of the depth of the second sub-hole 212 is T ₄ (ii) a The mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T ₅ 。

M＝S×(H-T ₄ )ρ-T ₅ 。

In the case where the reflective layer 20 includes the first sub reflective layer 21 and the second sub reflective layer 22, and the second sub hole 212 correspondingly penetrates through the second sub reflective layer 22, the depth of the second sub hole 212 is the thickness of the second sub reflective layer 22, and the tolerance of the depth of the second sub hole 212 is the thickness tolerance of the second sub reflective layer 22.

In this case, the glue amount of the hot melt adhesive is set according to the volume of the second sub-hole 212 and the tolerance of the glue amount, so that the glue amount of the hot melt adhesive for forming the fixing portion 60 substantially fills the second sub-hole 212, and when the connection reliability of the hot melt adhesive with the substrate 10 and the supporting columns 30 is ensured, the hot melt adhesive is prevented from overflowing from the second sub-hole 212, and further the situation that the hot melt adhesive overflows from the second sub-hole 212 to cause the supporting columns 30 to incline to affect the surface flatness of the optical film 120 is avoided, the risk of poor optical uniformity is reduced, and the problem of color cast caused by the hot melt adhesive overflowing from the edges of the supporting columns 30 is avoided.

Exemplarily, the second mentioned aboveThe orthographic projection of the sub-hole 212 on the substrate 10 is circular, a plurality of sections of the second sub-hole 212 parallel to the plane of the substrate 10 are congruent circles, the diameter of the second sub-hole 212 is 4.2mm, the thickness of the second sub-reflecting layer 22 is 0.03mm, the thickness tolerance of the second sub-reflecting layer 22 is +/-0.005 mm, and the density rho of the hot melt adhesive is 1.1g/cm ³ Tolerance T of the amount of sprayed hot melt adhesive ₅ . + -. 0.02mg.

M＝π(4.2×4.2÷4)×(0.03-0.005)×1.1÷1000-0.2。

From the above equation, it can be derived that the mass M of the hot melt adhesive is approximately 0.36mg.

It should be noted that, according to the shape of the second sub-hole 212, the corresponding calculation formula is different. Here, regardless of the overall shape of the second sub-hole 212, such as a cylinder or a prism, the depth of the second sub-hole 212 may be taken into consideration by a tolerance in a corresponding volume formula.

In other embodiments, referring to fig. 5, 10 and 11, the supporting column 30 includes a supporting body 31 and a supporting frame 32, and the supporting frame 32 is disposed on a side of the supporting body 31 close to the substrate 10. The supporting frame 32 is located in the second sub-hole 212, so that the bonding area of the supporting column 30 and the fixing portion 60 can be increased, the bonding strength can be improved, the displacement of the supporting column 30 along the direction S parallel to the plane of the substrate 10 can be limited, and the installation of the supporting column 30 is facilitated.

It should be noted that the shape of the orthographic projection of the supporting frame 31 on the substrate 10 is a circle, a ring or a plurality of fan rings arranged at intervals, and the embodiment of the disclosure is not limited in this respect.

In addition, referring to fig. 5, 10 and 11, the thickness of the supporting frame 32 is substantially equal to that of the second sub-reflective layer 22 along the direction perpendicular to the substrate 10, so that the supporting frame 31 is in direct contact with the substrate 10, and the supporting columns 30 can be in direct contact with the step structure 230 (see fig. 6), thereby ensuring the uniformity of the installation heights of the plurality of supporting columns 30.

In addition, orthographic projections of a plurality of cross sections of the second sub-holes 212 parallel to the plane of the substrate 10 on the substrate 10 are completely or approximately overlapped, the depth of the second sub-holes 212 is H, the bottom area of the second sub-holes 212 is S, and the area of the second sub-holes 212 isTolerance of depth T ₄ (ii) a The mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T ₅ The volume of the support frame 31 is V.

M＝[S×(H-T ₄ )-V]ρ-T ₅ 。

In still other embodiments, referring to fig. 5, 12 and 13, a surface of the supporting pillar 30 close to the substrate 10 is provided with at least one groove 310, and a portion of the fixing portion 60 is located in the groove 310 of the supporting pillar 30, so as to increase the bonding area between the supporting pillar 30 and the fixing portion 60, improve the bonding strength between the supporting pillar 30 and the fixing portion 60, and further reduce the risk of the hot melt adhesive overflowing the edge of the supporting pillar 30.

It should be noted that the shape of the orthographic projection of the groove 310 on the substrate 10 is a circle, a ring, or a plurality of fan rings arranged at intervals, and the embodiment of the disclosure is not limited in this respect.

In some embodiments, referring to fig. 2 and 3B, the plurality of supporting columns 30 may be arranged in a plurality of rows and a plurality of columns, each row includes a plurality of supporting columns 30 arranged along the first direction X, and each column includes a plurality of supporting columns 30 arranged along the second direction Y, so as to provide a relatively uniform supporting force for the optical film 120, reduce the deformation difference of different areas of the optical film 120 supported by the supporting columns 30, further improve the surface flatness of the optical film 120, and improve the uniformity of the display. That is, the plurality of first openings 210 may be arranged in a plurality of rows and a plurality of columns, each row including the plurality of first openings 210 arranged in the first direction X, and each column including the plurality of first openings 210 arranged in the second direction Y.

Furthermore, the support column 30 comprises a plurality of sections along a direction S parallel to the plane of the substrate 10; along the thickness direction of the substrate 10 and from the substrate 10 to the reflective layer 20, the areas of the plurality of cross sections gradually decrease; for example, the support column 30 is in the shape of a cone. By this arrangement, the volume of the supporting pillars 30 can be reduced, so that the blocking effect of the supporting pillars 30 on light is reduced, and the light extraction efficiency of the light emitting substrate 100 is improved.

It should be noted that the shape of the supporting column 30 may also be other shapes, such as a circular truncated cone or a cylinder, and the embodiments of the present disclosure are not limited in this respect.

In some embodiments, referring to fig. 3B, the plurality of light emitting devices 40 may be arranged in a plurality of rows and a plurality of columns, each row including a plurality of light emitting devices 40 arranged in the first direction X, and each column including a plurality of light emitting devices 40 arranged in the second direction Y.

As shown in fig. 3B, the supporting pillar 30 may be located at a center C of an area surrounded by central lines of four adjacent light emitting devices 40, so that distances between the supporting pillar 30 and each light emitting device 40 are substantially equal, and blocking of light emitted from any light emitting device 40 due to too close distance between the supporting pillar 30 and any light emitting device 40 is avoided, thereby avoiding uneven light emitted from the light emitting substrate 110.

In addition, the light emitting substrate 110 may include a plurality of light emitting cells 50, and the light emitting cells 50 include a plurality of light emitting devices 40 connected in series and/or in parallel.

Illustratively, as shown in fig. 3B, each light emitting unit 50 includes 4 light emitting devices 40 connected in series in sequence. Of course, each light emitting unit 50 may further include 2, 3, 5, or 6 light emitting devices 40, and the connection manner of the plurality of light emitting devices 40 in the light emitting unit 50 is not limited to series connection, and may also be parallel connection or a combination of series connection and parallel connection, and the embodiment of the disclosure is not limited thereto.

It should be noted that the Light Emitting device 40 may include a Micro Light Emitting Diode (Micro LED) and a sub-millimeter Light Emitting Diode (Mini LED). Here, the size (e.g., length) of the Micro LED is less than 50 micrometers, e.g., 10 micrometers to 50 micrometers; the Mini LED has a size (e.g., length) of 50 microns to 150 microns, such as 80 microns to 120 microns.

In some embodiments, referring to fig. 5, 7 and 15, the second opening 220 has at least two cross-sections in a plurality of cross-sections parallel to the plane of the substrate 10, wherein the area of the cross-section relatively close to the substrate 10 is smaller than the area of the cross-section relatively far from the substrate 10.

Illustratively, as shown in fig. 5, 7 and 15, the reflective layer 20 includes a first sub reflective layer 21 and a second sub reflective layer 22 disposed on the substrate 10, the second sub reflective layer 22 is in direct contact with the substrate 10, and the first sub reflective layer 21 is located on a side of the second sub reflective layer 22 away from the substrate 10. The second opening 220 includes a third sub-hole 221 and a fourth sub-hole 222 communicated with each other, the third sub-hole 221 is farther from the substrate 10 than the fourth sub-hole 222, the third sub-hole 221 penetrates through the first sub-reflective layer 21, and the fourth sub-hole 222 penetrates through the second sub-reflective layer 22. The aperture of the end of the third sub-hole 221 close to the fourth sub-hole 222 is larger than the aperture of the end of the fourth sub-hole 222 close to the third sub-hole 221.

It should be noted that the shape of the outline of the orthographic projection of the third sub-hole 221 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the disclosure is not limited in detail herein. The shape of the outline of the orthographic projection of the fourth sub-hole 222 on the substrate 10 may be a circle, a triangle, a rectangle, or the like, and the embodiment of the present disclosure is not particularly limited herein.

The depth of the third sub-hole 221 is 25 μm to 35 μm; illustratively, the depth of the third sub-hole 221 is any one of 25 μm, 28 μm, 30 μm, 32 μm, and 35 μm. The depth of the fourth sub-hole 222 is 25 to 35 μm; illustratively, the depth of the fourth sub-hole 222 is any one of 25 μm, 28 μm, 30 μm, 32 μm, and 35 μm.

On this basis, referring to fig. 4, 14 and 15, an orthogonal projection of the light emitting device 40 on the substrate 10 is a third projection, an orthogonal projection of the second opening 220 on the substrate 10 at a smallest cross section of a plurality of cross sections parallel to a plane in which the substrate 10 is located is a fourth projection, and the third projection falls within the fourth projection, that is, a boundary of the third projection is located within a boundary of the fourth projection.

In the case where the second opening 220 includes the third sub-hole 221 and the fourth sub-hole 222 communicating with each other, a boundary of an orthogonal projection of the light emitting device 40 on the substrate 10 is located within a boundary of an orthogonal projection of the fourth sub-hole 222 on the substrate 10.

In this case, the distance between the light emitting device 40 and the portion of the reflective layer 20 far from the substrate 10 is relatively long, that is, the distance between the light emitting device 40 and the first sub-reflective layer 21 is relatively long, so that the risk of mutual interference between the light emitting device 40 and the reflective layer 20 can be reduced and the difficulty in mounting the light emitting device 40 can be reduced in the process of fixing the light emitting device 40 on the substrate 10.

On this basis, as shown in fig. 4, 5 and 14, the light emitting substrate 110 further includes a reflective portion 70, the reflective portion 70 is disposed in the second opening 220 and covers at least a portion of the substrate 10 exposed between the second opening 220 and the light emitting device 40, so as to increase a reflective area and improve the overall light extraction efficiency of the light emitting substrate 100.

Exemplarily, as shown in fig. 4, 14 and 15, an orthogonal projection of the reflection portion 70 on the substrate 10 is substantially annular, and an inner boundary of the annular is located between a boundary of an orthogonal projection of the fourth sub-hole 222 on the substrate 10 and a boundary of an orthogonal projection of the light emitting device 40 on the substrate 10; the outer boundary of the ring shape is located between the boundary of the orthographic projection of the third sub-hole 221 on the substrate 10 and the boundary of the orthographic projection of the fourth sub-hole 222 on the substrate 10.

The reflectance of the reflection portion 70 is substantially the same as the reflectance of the reflection layer 20. Illustratively, the reflectivity of the reflective portion 70 is greater than or equal to 90%. For example, the material of the reflection portion 70 includes silicon-based white glue.

In some embodiments, as shown in fig. 4 and 14, the light emitting substrate 110 further includes encapsulation portions 18 disposed on the light emitting devices 40 and the micro chips at a side away from the substrate 10, and each encapsulation portion 18 encapsulates at least one light emitting device 40 and/or micro chip. The packaging part 18 for packaging the light emitting device 40 is made of transparent material, specifically transparent silica gel; the packaging portion for wrapping the microchip may be made of transparent material or reflective material, the transparent material may be made of transparent silica gel, and the reflective material may be the same as or similar to the reflective layer 20.

As shown in fig. 4, 5 and 8, the light-emitting substrate 100 further includes at least one alignment mark 80, and the alignment mark 80 is disposed in the at least one first opening 210.

Illustratively, referring to fig. 3A, 5 and 6, the reflective layer 20 is provided with a plurality of first openings 210, the plurality of first openings 210 includes an edge opening 213 and a central opening 214, and the edge opening 213 surrounds the central opening 214. Wherein at least one of the edge openings 213 is provided with an alignment mark 80.

For example, as shown in fig. 3A and 5, the outline of the orthographic projection of the reflective layer 20 on the substrate 10 is substantially quadrangular in shape having four corners. The plurality of first openings 210 are arranged in a plurality of rows and a plurality of columns, one edge opening 213 is corresponding to each corner of the quadrangle, and the four edge openings 213 corresponding to the four corners are all provided with the alignment marks 80. In this way, the alignment mark 80 is disposed at the edge of the substrate 10, so as to capture the image of the alignment mark 80 for alignment.

It is understood that the alignment mark 80 may be disposed at any position in the first opening 210, for example, the alignment mark 80 may be disposed at the center of the first opening 210, or disposed at other positions in the first opening 210 except for the center, so as to ensure that the first opening 210 exposes the alignment mark 80, so as to facilitate capturing an image of the alignment mark 80 for alignment.

As can be seen from the above, the base plate 10 may include a substrate 11, and a plurality of conductive layers disposed on the substrate 11. In this case, the alignment mark 80 is made of the same material and is provided in the same layer as at least one of the plurality of conductive layers.

The "same layer" refers to a layer structure formed by forming a film layer for forming a specific pattern by the same film formation process and then performing a patterning process once using the same mask plate. Depending on the specific pattern, the single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and the specific patterns may be at different heights or have different thicknesses.

Exemplarily, referring to fig. 4, the base plate 10 further includes a second conductive layer 13, an insulating layer 14, a first conductive layer 15, a passivation layer 16, and a planarization layer 17, which are sequentially stacked, on one side of the substrate 11 in a direction perpendicular to the substrate 11 and away from the substrate 11. The alignment mark 80 may be formed of one of the first conductive layer 15 and the second conductive layer 13, or may be formed of both the first conductive layer 15 and the second conductive layer 13. For example, the alignment mark 80 may be formed by the first conductive layer 15 to reduce the distance between the alignment mark 80 and the surface of the reflective layer 20 far from the substrate 10, so that the image acquired from the upper side of the substrate 10 of the alignment mark 80 is clearer, which is beneficial to improving the alignment accuracy.

In order to objectively evaluate the technical effects of the embodiments of the present disclosure, the light emitting substrates provided in the above embodiments were subjected to a thrust test, and the test results are shown in table 1 below.

Table 1 thrust test meter for support column

Test point location	Correlation technique	1	Correlation technique 2	The disclosure of the invention
					1	33	35	28
2	27	28	29
				3	29	29	39
4	30	30	33
				5	30	36	36
6	31	35	28
				7	29	27	27
8	37	30	31
				9	33	32	30
MAX	37	36	39
				MIN	27	27	27
AVE	31	31.3	31.2
				Spec	20	20	20

The related art 1 represents a support column which is fixedly bonded to the reflective layer in the related art, the related art 2 represents a support column which is fixedly bonded to the substrate in the related art, MAX represents a maximum value of the 9 test point locations, MIN represents a minimum value of the 9 test point locations, AVE represents an average value of the 9 test point locations, and Spec represents a maximum thrust which a single support column needs to bear.

As can be seen from table 1, the thrust result test at each point position of the embodiment of the present disclosure is greater than 20N, and the thrust requirement that a single support column needs to bear the maximum is satisfied. Meanwhile, the thrust test results at each point of the embodiments of the present disclosure are substantially the same as those of the related art, and do not drop.

In order to objectively evaluate the technical effects of the embodiments of the present disclosure, the light emitting substrate provided in the above embodiments is subjected to a high uniformity test, and the test results are shown in fig. 16 and 17. Fig. 16 is a schematic diagram of the positions of the respective test points, and fig. 17 is a diagram of the test result of the high uniformity of the respective support pillars.

As shown in fig. 16 and 17, in the related art, the heights of the

test points

1 and 7 are significantly lower, and in the present disclosure, in the case where there is no dip in the heights of the

test points

1 and 7, the fluctuation of the plurality of test points is small, and the uniformity of the heights of the support columns is good.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art will appreciate that changes or substitutions within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A light-emitting substrate, comprising:

a substrate;

a reflective layer disposed on the substrate; the reflecting layer is provided with a plurality of first openings, at least two sections exist in a plurality of sections parallel to the plane of the substrate, and the area of the section relatively close to the substrate is smaller than the area of the section relatively far away from the substrate;

the supporting column is fixed on the substrate; the orthographic projection of the supporting column on the substrate is a first projection, the orthographic projection of the minimum section of the first opening on the substrate in a plurality of sections parallel to the plane of the substrate is a second projection, and the second projection is within the range of the first projection.

2. The light-emitting substrate according to claim 1, wherein a smallest cross section of the first opening in a plurality of cross sections parallel to a plane of the substrate is a cross section closest to the substrate among the plurality of cross sections.

3. The light-emitting substrate according to claim 2, wherein the maximum dimension of the surface of the support posts facing the substrate is D ₁ The mounting tolerance of the support column is T ₁ (ii) a The maximum dimension of the minimum cross section is D ₂ The dimensional tolerance of the minimum section is T ₂ ；

4. The light-emitting substrate according to claim 3, wherein the edge of the surface of the support pillar facing the substrate is an arc, and the tolerance of the arc is R;

5. the light-emitting substrate according to claim 1, wherein the maximum dimension of the surface of the support posts facing the substrate is D ₁ The mounting tolerance of the support column is T ₁ (ii) a The largest dimension of the first opening in the largest cross section of a plurality of cross sections parallel to the plane of the substrate is D ₃ The dimensional tolerance of the maximum section is T ₃ ；

6. The light-emitting substrate according to claim 5, wherein the edge of the surface of the support pillar facing the substrate is an arc, and the tolerance of the arc is R;

7. the luminescent substrate according to claim 1, further comprising:

the supporting column is fixed on the substrate through the fixing part.

8. The luminescent substrate as claimed in claim 7, wherein the material of the fixing portion comprises a hot melt adhesive.

9. The light-emitting substrate according to claim 8, wherein the reflective layer comprises a first sub-reflective layer and a second sub-reflective layer disposed on the substrate, the first opening comprises a first sub-hole and a second sub-hole which are communicated with each other, the first sub-hole penetrates through the first sub-reflective layer, and the second sub-hole penetrates through the second sub-reflective layer;

the first sub-hole is far away from the substrate compared with the second sub-hole, and the aperture of one end of the first sub-hole close to the second sub-hole is larger than that of one end of the second sub-hole close to the first sub-hole, so that the side wall of the first opening forms a step structure.

10. The light-emitting substrate according to claim 9, wherein the maximum dimension of the surface of the support pillar facing the substrate is larger than the maximum dimension of the second sub-hole and smaller than the maximum dimension of the first sub-hole;

the shape of the second sub-hole is approximately a cylinder, the depth of the second sub-hole is H, the bottom area of the second sub-hole is S, and the tolerance of the depth of the second sub-hole is T ₄ (ii) a The mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T ₅ ；

M＝S×(H-T ₄ )ρ-T ₅ 。

11. The light-emitting substrate according to claim 9, wherein the supporting posts comprise a supporting body and a supporting frame, and the supporting frame is located on one side of the supporting body close to the substrate;

the support frame is positioned in the second sub-hole, and the thickness of the support frame is approximately equal to that of the second sub-reflecting layer along the direction perpendicular to the substrate.

12. The light-emitting substrate according to claim 11, wherein the second sub-hole has a substantially cylindrical shape, a depth H, and a bottom area S,the tolerance of the depth of the second sub-hole is T ₄ (ii) a The mass of the hot melt adhesive is M, the density of the hot melt adhesive is rho, and the glue amount tolerance of the hot melt adhesive is T ₅ (ii) a The volume of the support frame is V;

M＝[S×(H-T ₄ )-V]ρ-T ₅ 。

13. the luminescent substrate according to any one of claims 1 to 12, further comprising:

at least one alignment mark is arranged in at least one first opening.

14. The light-emitting substrate according to claim 13, wherein the substrate comprises a substrate and a plurality of conductive layers disposed on the substrate, and the alignment mark is made of the same material and disposed in the same layer as at least one of the conductive layers.

15. The light-emitting substrate according to any one of claims 1 to 12, wherein the reflectance of the support posts is substantially the same as the reflectance of the reflective layer.

16. The light-emitting substrate according to any one of claims 1 to 12, wherein the reflective layer is further provided with a plurality of second openings, the second openings having at least two cross sections among a plurality of cross sections parallel to a plane of the substrate, an area of a cross section relatively close to the substrate being smaller than an area of a cross section relatively far from the substrate;

the light emitting substrate further includes:

a light emitting device fixed on the substrate; the orthographic projection of the light-emitting device on the substrate is a third projection, the orthographic projection of the second opening on the substrate in the smallest section of the plurality of sections parallel to the plane where the substrate is located is a fourth projection, and the third projection falls into the fourth projection.

17. The light-emitting substrate according to claim 16, further comprising:

and the reflecting part is at least partially arranged in the second opening and at least covers the part of the substrate exposed between the second opening and the light-emitting device.

18. The light-emitting substrate according to claim 17, wherein a reflectance of the reflective portion is substantially the same as a reflectance of the reflective layer.

19. A backlight module, comprising:

a light-emitting substrate as claimed in any one of claims 1 to 18 having opposite light-exiting and non-light-exiting sides;

and the optical films are arranged on the light-emitting side of the light-emitting substrate.

20. A display device, comprising:

a backlight module according to claim 19;

and the display panel is arranged on one side of the plurality of optical films in the backlight module, which is far away from the light-emitting substrate.