CN217691127U - Packaging substrate and laminated packaging structure for preventing solder columns from being broken by impact - Google Patents

Packaging substrate and laminated packaging structure for preventing solder columns from being broken by impact Download PDF

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Publication number
CN217691127U
CN217691127U CN202221395453.5U CN202221395453U CN217691127U CN 217691127 U CN217691127 U CN 217691127U CN 202221395453 U CN202221395453 U CN 202221395453U CN 217691127 U CN217691127 U CN 217691127U
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China
Prior art keywords
substrate
chip
base plate
chute
packaging
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Active
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CN202221395453.5U
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Chinese (zh)
Inventor
黎赛瑶
李轶楠
杨昆
姚昕
梁梦楠
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Wuxi Zhongwei High Tech Electronic Co ltd
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Wuxi Zhongwei High Tech Electronic Co ltd
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Priority to CN202221395453.5U priority Critical patent/CN217691127U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The utility model relates to a prevent packaging substrate and stromatolite packaging structure of welding post impact fracture, including the base plate, the pan feeding mouth is seted up at the base plate top surface center, pan feeding mouth equipartition chute all around, chute inner and pan feeding mouth intercommunication, the chute outer end extends to the base plate top surface edge, is the chip bonding district in the middle of the base plate top surface, installs the chip in the chip bonding district, and the chip bonding district is around setting up the welding post woods all around, and the chute middle part is located the chip below, and the welding post woods are stretched into to the chute outer end. The utility model discloses a fluting to packaging substrate, having accelerated to seal to reach the time of chip and bonding wire position, make the encapsulation material live chip and weld the post parcel under the state that viscosity is minimum, effectively promoted the reliability and the yields of encapsulation. The utility model discloses only at the base plate upper surface fluting, under the installation layout mode condition that does not change current traditional base plate, can solve the problem that the material of encapsulating that often appears breaks the weld column among the packaging process, be applicable to most of integrated circuit's encapsulation.

Description

Packaging substrate and laminated packaging structure for preventing welding column from being broken by impact
Technical Field
The utility model belongs to the technical field of the integrated circuit encapsulation, a prevent packaging substrate and stromatolite packaging structure of weld column break is related to.
Background
Plastic packaged devices are produced in the 60's of the 20 th century, and due to the advantages of low cost, small size, light weight, mass production and the like, plastic packaged microelectronic devices are gradually widely accepted by the industry. Through years of common efforts in the industry, the plastic package device is gradually matured in the aspects of packaging materials, chip passivation, production processes and the like. With the development of plastic packaging technology, various advanced packaging technologies, such as Package on Package (PoP), have appeared. PoP is a packaging technology that can stack two or more packaging components up and down to realize 3D high-density integration, and the upper and lower components are electrically connected by means of a solder column array, a dielectric layer or a flexible substrate, and related technologies have been widely used in information processors of various consumer electronic products such as smart phones, digital cameras, portable wearable devices, and the like. However, in the existing plastic packaging process, the filler for plastic packaging can impact and extrude the welding columns at the edge of the substrate, so that the welding columns are broken; meanwhile, the chip can be displaced to a certain extent, and the reliability of the plastic package chip is greatly influenced.
The utility model discloses a grooved mode on the packaging substrate, the flow path of control plastic envelope in-process plastic envelope material to reduce the impact and the extrusion of plastic envelope material to chip and weld column, reduce the influence to follow-up technology and plastic envelope reliability.
Disclosure of Invention
An object of the utility model is to provide a prevent packaging substrate and stromatolite packaging structure of weld leg impact, the stopping that can solve the plastic envelope can produce impact and extrusion to the weld leg at base plate edge to lead to its problem by the impact.
According to the utility model provides a technical scheme: the utility model provides a prevent packaging substrate of weld column die-cut, includes the base plate, and the pan feeding mouth is seted up at base plate top surface center, and pan feeding mouth equipartition chute all around, the inner and pan feeding mouth intercommunication of chute, chute outer end extend to base plate top surface edge, are the chip bonding district in the middle of the base plate top surface, install the chip in the chip bonding district, the chip bonding district is around setting up the weld column forest all around, and the chute middle part is located the chip below, and the chute outer end stretches into the weld column forest.
As a further improvement, the chip bonding area, the welding column forest, the feeding port and the material flowing groove are filled with the packaging material.
As a further improvement, the welding column forest comprises a plurality of vertical welding columns, and a welding column storage gap is reserved between the welding columns.
As a further improvement of the utility model, the lower part of the welding column is positioned in the chute.
As the utility model discloses a further improvement, the base plate bottom is around setting up BGA ball planting forest all around, and BGA ball planting forest includes the vertical BGA ball planting of a plurality of, leaves the ball planting storage clearance between the BGA ball planting.
As a further improvement of the present invention, the substrate type includes a Core substrate and a Coreless substrate.
As a further improvement of the utility model, the processing method of the chute is one of laser etching, wet chemical etching, high-precision machining or plasma etching.
As a further improvement of the utility model, the processing method of the material flowing groove is various combinations in laser etching, wet chemical etching, high-precision mechanical processing or plasma etching.
As a further improvement of the utility model, the bonding mode of the chip and the substrate comprises Wire Bond bonding connection and flip-chip connection.
The utility model provides a stromatolite packaging structure, includes as above the base plate, the base plate top is equipped with upper substrate, upper substrate top bonding upper chip, upper substrate bottom is equipped with upper BGA plant ball woods, and upper BGA plant ball woods include the vertical upper BGA of a plurality of plant the ball, packs the encapsulation material between base plate and the upper substrate, and the welding column top contacts with upper BGA plants the ball.
The positive progress effect of this application lies in:
the utility model discloses a fluting to packaging substrate, having accelerated to seal to reach the time of chip and bonding wire position, make the encapsulation material live chip and weld the post parcel under the state that viscosity is minimum, effectively promoted the reliability and the yields of encapsulation. The utility model discloses only at the base plate upper surface fluting, under the installation layout mode condition that does not change current traditional base plate, can solve the problem that the material of encapsulating that often appears breaks the weld post in the packaging process. The utility model discloses a packaging substrate product is applicable to most of integrated circuit's encapsulation.
Drawings
Fig. 1 is a front view of the package substrate for preventing the solder columns from being broken.
Fig. 2 is a top view of the package substrate for preventing solder post from being broken.
Fig. 3 is a schematic diagram of the stacked package structure of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate in order to facilitate the embodiments of the invention described herein. Furthermore, "including" and "having," and like terms, mean that "including" and "having," in addition to those already recited in "including" and "having," other content not already recited in the list; for example, a process, method, system, article, or apparatus that may comprise a list of steps or elements is not necessarily limited to those steps or elements explicitly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the following description of the embodiment, the coordinates refer to fig. 1, where the direction from the inside of the vertical paper in fig. 1 is taken as the front, the direction from the outside of the vertical paper in fig. 1 is taken as the rear, the left-right direction in fig. 1 is taken as the left-right direction, and the up-down direction in fig. 1 is taken as the up-down direction.
In fig. 1-3, the substrate 1, the solder columns 2, the runner 3, the chip 4, the BGA balls 5, the encapsulant 6, the upper BGA balls 7, the upper substrate 8, the upper chip 9, the bonding wires 10, etc. are included.
As shown in fig. 1-2, the utility model relates to a prevent packaging substrate of weld-column impact fracture, including base plate 1, pan feeding mouth 11 is seted up at 1 top surface center of base plate, and pan feeding mouth 11 equipartition chute 3 all around, 3 inner and the 11 intercommunications of pan feeding mouth of chute, and 3 outer ends of chute extend to 1 top surface edge of base plate, are the chip bonding district in the middle of 1 top surface of base plate, install chip 4 in the chip bonding district, and the chip bonding district is around setting up the weld-column forest all around, and 3 middle parts of chute are located chip 4 below, and 3 outer ends of chute stretch into the weld-column forest.
And the chip bonding area, the welding column forest, the feeding port 11 and the material flowing groove 3 are filled with an encapsulating material 6.
The welding column forest includes the vertical welding column 2 of a plurality of, is array arrangement, leaves welding column 2 storage gaps between welding column 2. Part of the lower part of the welding column 2 is positioned in the chute 3.
1 bottom of base plate is all around setting up BGA plant ball forest, and BGA plant ball forest includes that the vertical BGA of a plurality of plants ball 5, is the array and arranges, leaves the plant ball storage clearance between 5 BGA plant balls.
The substrate 1 type includes a Core substrate and a Coreless substrate.
The processing method of the material flowing groove 3 is one of laser etching, wet chemical etching, high-precision machining or plasma etching, or the combination of the methods. By means of the drainage effect of the flow trough 3, when the encapsulating material 6 is injected into the feeding hole 11, the encapsulating material rapidly flows to four corners along the flow trough 3, the chip 4 which is well bonded above the flow trough 3 and the welding column forest around the chip are rapidly wrapped, and the chip bonding area is gradually and completely wrapped.
The bonding method of the Chip 4 and the substrate 1 includes Wire Bond connection and Flip Chip connection (Flip Chip).
The encapsulating material 6 is a mixture formed by mixing epoxy resin, a curing agent, inorganic filler, a coloring agent and other auxiliary agents.
Welding column 2 can adopt the solder post, also can adopt the metal column, 2 tip of welding column and base plate 1 are connected, the purpose is in order to realize the circuit intercommunication between two or more base plates, as shown in figure 3, for a stromatolite packaging structure, including upper substrate 8, 8 top bonding upper chip 9 of upper substrate, 8 bottom upper substrate are equipped with upper BGA plant ball woods, upper BGA plant ball woods include the vertical upper BGA plant ball 7 of a plurality of, be the array arrangement, leave upper BGA plant ball storage clearance between upper BGA plant ball 7, base plate 1 is located 8 below upper substrate, pack encapsulation material 6 between the two, welding column 2 top and upper BGA plant ball 7 contact. In the structure, the upper substrate 8 and the upper chip 9 are bonded by Wire Bond bonding, the upper chip 9 is connected to one end of a bonding Wire 10, and the other end of the bonding Wire 10 is connected to the top of the upper substrate 8. The Chip 4 and the substrate 1 are bonded by Flip Chip (Flip Chip). In order to better express the position relationship of the substrate 1 on the upper substrate 8, part of the tops of the solder columns 2 and the upper layer BGA planting balls 7 are omitted in fig. 1 to show the specific positions of the chips 4.
It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (8)

1. The utility model provides a prevent packaging substrate of weld column impact, a serial communication port, including base plate (1), pan feeding mouth (11) are seted up at base plate (1) top surface center, pan feeding mouth (11) equipartition chute (3) all around, chute (3) inner and pan feeding mouth (11) intercommunication, chute (3) outer end extends to base plate (1) top surface edge, be chip bonding district in the middle of base plate (1) top surface, install chip (4) in the chip bonding district, chip bonding district is around setting up the weld column forest all around, chute (3) middle part is located chip (4) below, chute (3) outer end stretches into the weld column forest.
2. The package substrate for preventing solder post from being punched as claimed in claim 1, wherein the chip bonding area, the solder post forest, the feeding opening (11), and the flow channel (3) are filled with the encapsulant (6).
3. The packaging substrate for preventing solder post from being broken as claimed in claim 1, wherein the solder post pillar includes a plurality of vertical solder posts (2), and a solder post (2) storage gap is left between the solder posts (2).
4. The solder bump prevention package substrate of claim 1, wherein a part of the lower portion of the solder bump (2) is located in the runner (3).
5. The packaging substrate for preventing solder post from being punched as claimed in claim 1, wherein the periphery of the bottom of the substrate (1) is surrounded by a BGA ball-planting forest, the BGA ball-planting forest comprises a plurality of vertical BGA balls (5), and a ball-planting storage gap is reserved between the BGA balls (5).
6. The package substrate for preventing solder post from being punched as recited in claim 1, wherein the types of the substrate (1) include a Core substrate and a Coreless substrate.
7. The package substrate for preventing solder post from being broken as claimed in claim 1, wherein the bonding manner of the chip (4) and the substrate (1) includes Wire Bond bonding connection and flip chip connection.
8. A laminated packaging structure, comprising a substrate (1) according to any one of claims 1 to 7, wherein an upper substrate (8) is arranged above the substrate (1), an upper chip (9) is bonded on the top of the upper substrate (8), an upper BGA ball-planting forest is arranged at the bottom of the upper substrate (8), the upper BGA ball-planting forest comprises a plurality of vertical upper BGA balls (7), an encapsulating material (6) is filled between the substrate (1) and the upper substrate (8), and the tops of the welding posts (2) are in contact with the upper BGA balls (7).
CN202221395453.5U 2022-06-07 2022-06-07 Packaging substrate and laminated packaging structure for preventing solder columns from being broken by impact Active CN217691127U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221395453.5U CN217691127U (en) 2022-06-07 2022-06-07 Packaging substrate and laminated packaging structure for preventing solder columns from being broken by impact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221395453.5U CN217691127U (en) 2022-06-07 2022-06-07 Packaging substrate and laminated packaging structure for preventing solder columns from being broken by impact

Publications (1)

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CN217691127U true CN217691127U (en) 2022-10-28

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CN (1) CN217691127U (en)

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