CN217689873U

CN217689873U - Modularized hardware integration development testing device based on temperature controller

Info

Publication number: CN217689873U
Application number: CN202221586193.XU
Authority: CN
Inventors: 沈晓亮; 刘恒; 李海清
Original assignee: Beijing Hailin Automatic Control Technology Co ltd
Current assignee: Beijing Hailin Automatic Control Technology Co ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2022-10-28
Anticipated expiration: 2032-06-23

Abstract

The application discloses a temperature controller-based modularized hardware integration development testing device, which comprises a bottom plate, a main processor module plate, a plurality of function module plates and a plurality of plate-to-plate connectors; the board-to-board connector comprises a plug female head and a plug male head, the bottom board is provided with the plug male heads for plugging the main processor module board and the plurality of function module boards, and the plug male heads of the plurality of function module boards are electrically connected with the plug male heads of the main processor module board; the main processor module board and the plurality of function module boards are provided with female plug-in heads corresponding to the male plug-in heads on the bottom board. The modular circuit design is adopted, different functional circuits are made into different module board cards, if problems are found in the production process, the test of corresponding modules can be carried out firstly, and then the modules are transplanted to actual products, so that the resource waste in the production process is reduced, and the product development period is shortened.

Description

Modularized hardware integration development testing device based on temperature controller

Technical Field

The application relates to the technical field of temperature controller testing, concretely relates to modularization hardware integration development testing arrangement based on temperature controller.

Background

The temperature controller is used for automatically turning on or off various heating equipment and setting and adjusting indoor temperature, and can automatically adjust the indoor temperature according to a preset program under the condition of people or no people so as to enable the indoor temperature to reach comfortable temperature. In the current temperature controller development, all functional circuit designs are integrated in the whole hardware design, the same function is realized by different products, and the used circuit designs are different.

A new temperature controller is developed by hardware, which is designed by a complete machine schematic diagram and a PCB according to functional requirements and a mechanical structure, and is produced in batch after being upgraded by multiple iterations of hardware versions. Because the developed new temperature controller is not combined with the practical application of the product, the hardware version can be upgraded for many times due to insufficient verification when relevant verification tests are carried out, and in the production engineering, the whole circuit board can be changed for many times due to the function verification and the packaging change of new materials. For example, when the design requirements of products can be met by various processor chips, only part of circuits of the processor are replaced, other functional circuits do not need to be adjusted, and the existing design can only be verified by adjusting the design of the whole processor; causing a large amount of repeated circuit design work, wasting manpower and material resources, and increasing development period and risk.

Disclosure of Invention

Therefore, the application provides a modularization hardware integration development testing arrangement based on temperature controller to solve the problem that the prior art exists and change the board because of the many times of complete machine circuit board in the temperature controller verification test process, cause a large amount of redesign circuit.

In order to achieve the above purpose, the present application provides the following technical solutions:

a modularized hardware integration development testing device based on a temperature controller comprises a bottom plate, a main processor module plate, a plurality of function module plates and a plurality of plate-to-plate connectors; the board-to-board connector comprises a plug female head and a plug male head, the bottom board is provided with the plug male heads for plugging the main processor module board and the plurality of function module boards, and the plug male heads of the plurality of function module boards are electrically connected with the plug male heads of the main processor module board; the main processor module board and the plurality of function module boards are respectively provided with a female plug-in head corresponding to the male plug-in head on the bottom board.

Preferably, two plug-in male connectors for plugging the main processor module board are arranged on the bottom board.

Preferably, the board-to-board connector is a 2.54 pitch dual or single row connector.

Preferably, the bottom plate is further provided with a male plug for plugging the power module board, and the male plug for plugging the power module board is electrically connected with the male plug of the main processor module board.

Preferably, the plurality of function module boards include an audio module board, a display module board, a key module board, a relay module board, a sensor module board, an IO extension module board, a UART extension module board, and a 12C extension module board.

Preferably, the IO expansion module board is an expansion chip of a 12C or SPI interface.

Preferably, the key module board is a mechanical key or a touch key in an I2C or GPIO mode.

Preferably, the sensor module board adopts a sensor chip of an I2C interface.

Compared with the prior art, the method has the following beneficial effects:

the application provides a temperature controller-based modularized hardware integration development testing device, which comprises a bottom plate, a main processor module plate, a plurality of function module plates and a plurality of plate-to-plate connectors; the board-to-board connector comprises a plug female head and a plug male head, the bottom board is provided with the plug male heads for plugging the main processor module board and the plurality of function module boards, and the plug male heads of the plurality of function module boards are electrically connected with the plug male heads of the main processor module board; the main processor module board and the plurality of function module boards are provided with female plug-in heads corresponding to the male plug-in heads on the bottom board. The modular circuit design is adopted, different functional circuits are made into different module board cards, if problems are found in the production process, the test of corresponding modules can be carried out firstly, and then the modules are transplanted to actual products, so that the resource waste in the production process is reduced, and the product development period is shortened.

Drawings

To more intuitively explain the prior art and the present application, several exemplary drawings are given below. It should be understood that the specific shapes, configurations, shown in the drawings, are not generally considered limitations on the practice of the present application; for example, it is within the ability of those skilled in the art to make routine adjustments or further optimizations based on the technical concepts disclosed in the present application and the exemplary drawings, for the increase/decrease/attribution of certain units (components), specific shapes, positional relationships, connection manners, dimensional ratios, and the like.

Fig. 1 is a schematic block diagram of a modular hardware integration development testing apparatus based on a thermostat provided in the present application;

FIG. 2 is a schematic diagram of a host processor module board interface on a backplane according to the present application;

FIG. 3 is a schematic diagram of an interface of an audio module board on a backplane according to the present application;

FIG. 4 is a schematic diagram of an on-board display module board interface provided by the present application;

FIG. 5 is a schematic diagram of a key module board interface on a backplane according to the present application;

FIG. 6 is a schematic diagram of an IO expansion module board interface on a backplane according to the present disclosure;

FIG. 7 is a schematic diagram of a UART extension module board interface on a backplane according to the present application;

FIG. 8 is a schematic diagram of an on-backplane 12 expansion module board interface provided by the present application;

FIG. 9 is a schematic diagram of an on-board power module board interface provided by the present application;

fig. 10 is a schematic diagram of a relay module board interface on a backplane provided by the present application;

FIG. 11 is a schematic diagram of a first interface of a sensor module board on a backplane as provided herein;

fig. 12 is a schematic diagram of a second interface of a sensor module board on a backplane as provided herein.

Description of reference numerals:

1. a main processor module board; 2. an audio module board; 3. a display module board; 4. a key module board; 5. a relay module board; 6. a sensor module board; 7. 12C expansion module boards; 8. a UART extension module board; 9. IO expansion module board.

Detailed Description

The present application will be described in further detail below with reference to specific embodiments thereof, with reference to the accompanying drawings.

In the description of the present application: "plurality" means two or more unless otherwise specified. The terms "first", "second", "third", and the like in this application are intended to distinguish one referenced item from another without having a special meaning in technical connotation (e.g., should not be construed as emphasizing a degree or order of importance, etc.). The terms "comprising," "including," "having," and the like, are intended to be inclusive and mean "not limited to" (some elements, components, materials, steps, etc.).

In the present application, terms such as "upper", "lower", "left", "right", "middle", and the like are generally used for easy visual understanding with reference to the drawings, and are not intended to absolutely limit the positional relationship in an actual product. Changes in these relative positional relationships are also considered to be within the scope of the present disclosure without departing from the technical concepts disclosed in the present disclosure.

The application provides a modularization hardware integration development testing arrangement based on temperature controller carries out the modularization split with all functional circuits that the temperature controller used, comprises bottom plate and each functional module board, and each functional module integrated circuit board and bottom plate pass through board to board connector connection, make up into a complete hardware development system.

Referring to fig. 1 to 12, the present application provides a modular hardware integration development testing device based on a temperature controller, which includes a base plate, a main processor module board 1, a plurality of function module boards and a plurality of board-to-board connectors; the board-to-board connector comprises a plug female head and a plug male head, the bottom board is provided with the plug male heads for plugging the main processor module board 1 and the plurality of function module boards, and the plug male heads of the plurality of function module boards are electrically connected with the plug male heads of the main processor module board 1; the main processor module board 1 and the plurality of function module boards are provided with female plug-in heads corresponding to the male plug-in heads on the bottom board. If the relevant products of the temperature controller are in trouble in the production engineering, the testing of the corresponding modules can be carried out on the modular hardware integration development testing device based on the temperature controller, and then the testing device is transplanted to the actual product, so that the resource waste in the production process is reduced; the mature circuit module can be directly applied to any product design using the same function without redesigning, and the product development period is shortened.

Specifically, the plurality of function module boards include an audio module board 2, a display module board 3, a key module board 4, a relay module board 5, a sensor module board 6, an IO extension module board, a UART extension module board 8, and a 12C extension module board 7.

Further, be equipped with on the bottom plate and be used for grafting audio module board 2, display module board 3, key module board 4, relay module board 5, sensor module board 6, IO extension module board, UART

extension module board

8 and 12C extension module board 7 peg graft public head, it is corresponding, all be equipped with the female head of pegging graft on audio module board 2, display module board 3, key module board 4, relay module board 5, sensor module board 6, IO extension module board, UART extension module board 8 and the 12C extension module board 7.

The bottom plate is also provided with a male plug for plugging the power module board, the male plug for plugging the power module board is electrically connected with the male plug of the main processor module board 1, correspondingly, the power module board is provided with a corresponding female plug, and the power module board is arranged on the bottom plate through the female plug and the male plug to supply power for the whole device.

In the application, a power supply is supplied to the power module board through the external power interface, and the power module board can be configured with different DCDCDCDCDC to convert the externally input power into 5V and 3.3V to supply power to the whole device. The main processor module board 1 can be configured with different processor chips, FLASH chips and power conversion chips, all available pins of the main processor module board 1 are sent to the bottom board through the board-to-board connector, and corresponding pin resources of the main processor module board 1 are distributed to each functional module board card through the wiring of the PCB of the bottom board; the IO expansion module board 9 is used for expanding IO resources of the main processor module board 1 and can be configured with an expansion chip of an I2C or SPI interface; the audio module board 2 is connected through an I2S or analog audio signal and is used for verifying the audio function design of the system; the display module board 3 can be externally connected with an LCD (liquid crystal display) of an MCU-8 bit parallel RGB (red, green and blue) interface or a camera and the like by connecting display interface related signals of the main processor module board 1 and is used for verifying the display function of the system; the key module board 4 can be configured with mechanical keys and touch keys of I2C or GPIO modes of different models for verifying the functions of the test keys; the relay module board 5 is mounted on the bottom board, and various mechanical or solid relays can be tested by GPIO connected with the main processor module board 1; the sensor module board 6 can be configured with various sensor chips of I2C interfaces for verifying the functions of the sensor circuit; the device is also provided with a UART extension module board 8 and an I2C extension module board 7, and tests and verifies corresponding functions, such as RS485, R422 and the like, through connecting various devices of UART or I2C interfaces.

In the application, two plug-in male connectors for plugging the main processor module board 1 are arranged on the bottom board, the two plug-in units connect available pins of the main processor to connector interfaces of the board cards of the functional modules, and the functional modules are connected with the bottom board in a 2.54-pitch double-row or single-row pin seat mode. Only one module with single-row or double-row sockets is provided with two 2P grounding sockets for fixed connection. The functional module board cards can realize module functions through different design schemes according to respective interfaces. The development period of a new product is shortened, the inheritance of a mature circuit is ensured, the reliability of the product is improved, and the maintenance cost of the BOM is reduced.

All the technical features of the above embodiments can be arbitrarily combined (as long as there is no contradiction between the combinations of the technical features), and for the sake of brevity, all the possible combinations of the technical features in the above embodiments are not described; such non-explicitly written embodiments should be considered as being within the scope of the present description.

The present application has been described in considerable detail with reference to the foregoing general description and specific examples. It should be understood that several conventional adaptations or further innovations of these specific embodiments may also be made based on the technical idea of the present application; however, such conventional modifications and further innovations may also fall within the scope of the claims of the present application as long as they do not depart from the technical idea of the present application.

Claims

1. A modularized hardware integration development testing device based on a temperature controller is characterized by comprising a bottom plate, a main processor module plate, a plurality of function module plates and a plurality of plate-to-plate connectors; the board-to-board connector comprises a female plug-in head and a male plug-in head, the bottom board is provided with male plug-in heads for plugging the main processor module board and the plurality of function module boards, and the male plug-in heads of the plurality of function module boards are electrically connected with the male plug-in head of the main processor module board; the main processor module board and the plurality of function module boards are respectively provided with a female plug-in head corresponding to the male plug-in head on the bottom board.

2. The temperature controller-based modular hardware integration development testing device of claim 1, wherein there are two male connectors on the base board for plugging the main processor module board.

3. The modular hardware integration development tester based on thermostat of claim 1, wherein the board-to-board connector is a 2.54 pitch double or single row connector.

4. The temperature controller-based modular hardware integration development testing device of claim 1, wherein the base board is further provided with a male plug for plugging a power module board, and the male plug for plugging the power module board is electrically connected with the male plug of the main processor module board.

5. The modular hardware integration development tester based on thermostat of claim 1, wherein the plurality of function module boards include an audio module board, a display module board, a key module board, a relay module board, a sensor module board, an IO extension module board, a UART extension module board, and a 12C extension module board.

6. The temperature controller-based modular hardware integration development testing device of claim 5, wherein the IO expansion module board is an expansion chip of 12C or SPI interface.

7. The temperature controller-based modular hardware integration development testing device of claim 5, wherein the key module board is a mechanical key or a touch key of I2C or GPIO mode.

8. The temperature controller-based modular hardware integration development testing device of claim 5, wherein the sensor module board employs a sensor chip of an I2C interface.