CN217688638U

CN217688638U - Sorting machine detection mechanism for high-precision silicon wafers

Info

Publication number: CN217688638U
Application number: CN202221755940.8U
Authority: CN
Inventors: 冯震坤; 周裕吉
Original assignee: Wuxi Jingyuntong Technology Co Ltd
Current assignee: Wuxi Jingyuntong Technology Co Ltd
Priority date: 2022-07-07
Filing date: 2022-07-07
Publication date: 2022-10-28
Anticipated expiration: 2032-07-07

Abstract

The utility model relates to a sorter detection mechanism for high accuracy silicon chip, be in including support and setting imaging device and conveyor on the support, imaging device includes camera, backlight, the camera sets up the support near-end, the backlight sets up the support distal end, conveyor sets up between camera and backlight, conveyor is used for carrying the silicon chip, the camera is right the silicon chip is made a video recording. The utility model discloses a background when LED is shaded and makes a video recording as the silicon chip, the formation of image is black end white limit, and clear and the surperficial luminance of formation of image is even.

Description

Sorting machine detection mechanism for high-precision silicon wafers

Technical Field

The utility model relates to a silicon chip detects technical field, especially relates to a sorter detection mechanism for high accuracy silicon chip.

Background

The silicon chip is one of important materials in the photovoltaic industry and is used as a carrier of the solar cell, and the quality of the silicon chip determines the conversion efficiency of the solar cell. Therefore, in a high-precision silicon wafer sorting machine, the detection of defects such as subfissure on a silicon wafer is an important link.

Chinese utility model patent with document No. CN215812463U discloses a silicon wafer detection device, which comprises a transmission unit, a collection member, an infrared light source and an adjusting component. According to the technical scheme, the imaging definition is improved through the adjusting range of the relative angle between the acquisition part and the infrared light source, but the edge of the silicon wafer is blackened after imaging and the surface brightness is uneven, so that the judgment of the silicon wafer subfissure is influenced.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide an apparatus to solve one or more problems in the prior art.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the detection mechanism comprises a support, and an imaging device and a conveying device which are arranged on the support, wherein the imaging device comprises a camera and a backlight lamp, the camera is arranged at the near end of the support, the backlight lamp is arranged at the far end of the support, the conveying device is arranged between the camera and the backlight lamp, the conveying device is used for conveying a silicon wafer, and the camera is used for shooting the silicon wafer.

Furthermore, the imaging device further comprises a light supplement lamp, and the light supplement lamp is arranged between the camera and the conveying device.

Further, the light supplement lamp is an infrared lamp.

Further, the light supplement lamp is of a frame shape with a hollow structure, and the inner diameter of the hollow structure is larger than the outer diameter of the silicon wafer.

Furthermore, the light of the light supplementing lamp and the silicon wafer form an included angle of 45 degrees.

Furthermore, the conveying device comprises an active driving part and a passive driving part, the active driving part is connected with the passive driving part through a transmission belt, and the active driving part is connected with the output end of the motor.

Further, the driving part comprises at least two driving wheels, and the driving wheels are connected through a rotating shaft; the passive driving part comprises at least two driven wheels which are connected through a rotating shaft.

Further, a shell is arranged on the top of the support, and the camera is arranged in the shell.

Furthermore, the support comprises four vertical rods arranged in parallel, and the vertical rods are arranged at four corners of the far end of the shell.

Furthermore, a slide rail is arranged between the adjacent vertical rods, and the backlight lamp is slidably arranged on the slide rail.

Further, the sorter detection mechanism for the high-precision silicon wafer further comprises a processor and a display, wherein one part of the processor is connected with the camera, and the other part of the processor is connected with the display.

Compared with the prior art, the utility model discloses a beneficial technological effect as follows:

(one) the utility model discloses a background when LED is shaded as the silicon chip and makes a video recording, the formation of image is black end white limit, and the formation of image is clear and surface brightness is even.

And (II) further, the backlight lamp can be arranged on the sliding rail in a sliding manner, so that the position of the backlight lamp can be adjusted according to the size of the silicon wafer, and the background brightness of the silicon wafer during photographing is ensured.

Further, light of the light supplementing lamp and the silicon wafer have an included angle of 45 degrees, and when the silicon wafer passes through the hollow structure, the light of the light supplementing lamp just irradiates the silicon wafer, so that imaging is clearer.

And fourthly, the light supplementing lamp is of a frame type with a hollow structure, the inner diameter of the hollow structure is larger than the outer diameter of the silicon wafer, and the hollow structure is used for limiting the size of imaging when the camera takes pictures.

Drawings

Fig. 1 shows a schematic structural diagram of a sorting machine detection mechanism for high-precision silicon wafers according to an embodiment of the present invention.

Fig. 2 shows an axonometric view of a sorting machine detection mechanism for high-precision silicon wafers according to an embodiment of the present invention.

Fig. 3 shows a connection relationship diagram of a sorting machine detection mechanism for high-precision silicon wafers according to an embodiment of the present invention.

Fig. 4 shows the embodiment of the present invention provides a schematic structural diagram of a light supplement lamp in a sorting machine detection mechanism for high-precision silicon wafers.

FIG. 5 is a diagram illustrating the effect of silicon wafer detection in the prior art.

Fig. 6 shows a detection effect diagram of a sorting machine detection mechanism for high-precision silicon wafers according to an embodiment of the present invention.

In the drawings, the reference numbers:

1. an imaging device; 11. a camera; 12. a housing; 13. a light supplement lamp; 131. a hollow structure; 14. a backlight; 2. a conveying device; 21. a conveyor belt; 22. a driving wheel; 23. a driven wheel; 24. a rotating shaft; 31. a vertical rod; 32. a slide rail; 4. a processor; 5. a display; 6. and (3) a silicon wafer.

Detailed Description

To make the objects, features and advantages of the present invention more comprehensible, please refer to the attached drawings. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limitation of the implementation of the present invention, so that the present invention does not have the essential significance in the technology, and any modification of the structure, change of the ratio relationship or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention.

In the description of the present invention, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like are defined to indicate an orientation or positional relationship based on that shown in the drawings, merely to facilitate the description of the present invention and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In order to describe the above-mentioned sorting machine detection mechanism for high-precision silicon wafers more clearly, the present invention defines the terms "distal end" and "proximal end", which are special terms in the field of medical devices, specifically, the term "distal end" refers to the end away from the operator during the operation, the term "proximal end" refers to the end close to the operator during the operation, taking fig. 1 as an example, the right side of the first spring unit in fig. 1 is the proximal end, and the left side of the first spring unit in fig. 1 is the distal end.

Example one

Referring to fig. 1 and 2, a sorter detection mechanism for high-precision silicon wafers includes a support, and an imaging device 1 and a conveying device 2 which are arranged on the support, wherein the imaging device 1 includes a camera 11 and a backlight 14, the camera 11 is arranged at a proximal end of the support, the backlight 14 is arranged at a distal end of the support, the conveying device 2 is arranged between the camera 11 and the backlight 14, the conveying device 2 is used for conveying a silicon wafer 6, and the camera 11 is used for taking an image of the silicon wafer 6.

Preferably, in the inspection mechanism of the handler for high-precision silicon wafers in the embodiment, the camera 11 is a basler industrial camera, which has the advantages of high resolution and high frame rate.

With continuing reference to fig. 1 and 2, further, a housing 12 is disposed on the top of the stand, and the camera 11 is disposed in the housing 12.

With continued reference to fig. 1 and 2, further, the support includes four vertical rods 31 arranged in parallel, and the vertical rods 31 are arranged at four corners of the distal end of the housing 12.

With continuing reference to fig. 1 and fig. 2, further, a sliding rail 32 is disposed between adjacent vertical rods 31, and the backlight 14 is slidably disposed on the sliding rail 32, so that the position of the backlight 14 can be adjusted according to the size of the silicon wafer 6, and the background brightness of the silicon wafer 6 during photographing is ensured.

Referring to fig. 1 and 2, further, the imaging device 1 further includes a light supplement lamp 13, the light supplement lamp 13 is disposed between the camera 11 and the conveying device 2, and two sides of the light supplement lamp 13 in the length direction are fixed on a vertical rod 31 through screws (not shown in the figure).

Preferably, in this embodiment one a sorter detection mechanism for high accuracy silicon chip, light filling lamp 13 is the infrared lamp, and more specifically, adopts infrared emitting diode, adopts infrared lamp light filling low power dissipation, light even, can restrain contrary light, glare, and the light filling performance is good.

Referring to fig. 2 and 4, further, the fill light 13 is a frame shape having a hollow structure 131, an inner diameter of the hollow structure 131 is larger than an outer diameter of the silicon wafer 6, and the hollow structure 131 is used for limiting an imaging size of the camera 11 during photographing.

Referring to fig. 2, further, an included angle of 45 ° is formed between the light of the light supplement lamp 13 and the silicon wafer 6, and when the silicon wafer 6 passes through the hollow structure 131, the light of the light supplement lamp 13 just irradiates the silicon wafer 6.

Referring to fig. 1 and 2, further, the conveying device 2 includes an active driving member and a passive driving member, the active driving member is connected to the passive driving member through a transmission belt, and the active driving member is connected to an output end (not shown) of a motor.

Specifically, with continued reference to fig. 1 and fig. 2, the driving member includes at least two driving wheels 22, and the driving wheels 22 are connected by a rotating shaft 24; the passive driving part comprises at least two driven wheels 23, and the driven wheels 23 are connected through a rotating shaft 24.

Referring to fig. 3, further, the sorter detection mechanism for the high-precision silicon wafer 6 further includes a processor 4 and a display 5, the processor 4 has an ADC interface connected to the camera 11, and the processor 4 has an SPI interface connected to the display 5. The processor 4 is used for receiving the image obtained by the camera 11 and sending the image to the display 5 for displaying, and the function belongs to the basic function of the processor 4 and is the prior art.

The utility model discloses a concrete work flow as follows:

referring to fig. 1 to 6, the backlight lamp 14 and the light supplement lamp 13 are turned on, the position of the backlight lamp 14 is adjusted to ensure the background brightness of the silicon wafer 6 during photographing, the silicon wafer 6 is transmitted to the detection mechanism through the conveyor belt 21, when the silicon wafer 6 passes through the lower part of the hollow structure 131 of the light supplement lamp 13, the camera 11 photographs the silicon wafer 6, the processor 4 receives imaging information and transmits the imaging information to the display 5 for displaying, and after photographing, the silicon wafer 6 is sent to the sorting machine through the conveyor belt 21.

Referring to fig. 5, when the backlight 14 and the fill-in light 13 are not used, the silicon wafer 6 is imaged as a white background black edge, and it can be clearly seen after amplification that the edge of the silicon wafer 6 is blackened and the surface brightness is not uniform, which affects the judgment of the quality of the silicon wafer 6.

Referring to fig. 6, when the backlight 14 and the fill-in light 13 are adopted, the silicon wafer 6 is imaged as a black-background white edge, the image is clear, and the surface brightness is uniform.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a sorter detection mechanism for high accuracy silicon chip which characterized in that: the silicon wafer imaging device comprises a support, and an imaging device and a conveying device which are arranged on the support, wherein the imaging device comprises a camera and a backlight lamp, the camera is arranged at the near end of the support, the backlight lamp is arranged at the far end of the support, the conveying device is arranged between the camera and the backlight lamp, the conveying device is used for conveying a silicon wafer, and the camera shoots the silicon wafer.

2. A handler testing mechanism for high precision silicon wafers according to claim 1, wherein: the imaging device further comprises a light supplement lamp, and the light supplement lamp is arranged between the camera and the conveying device.

3. The inspection mechanism of a handler for high-precision silicon wafers according to claim 2, wherein: the light supplement lamp is an infrared lamp.

4. The inspection mechanism of a handler for high-precision silicon wafers according to claim 3, wherein: the light supplementing lamp is of a frame shape with a hollow structure, and the inner diameter of the hollow structure is larger than the outer diameter of the silicon wafer.

5. The inspection mechanism of a handler for high-precision silicon wafers according to claim 4, wherein: the light of the light supplementing lamp and the silicon wafer form an included angle of 45 degrees.

6. A handler testing mechanism for high precision silicon wafers according to claim 1, wherein: the conveying device comprises an active driving part and a passive driving part, the active driving part is connected with the passive driving part through a transmission belt, and the active driving part is connected with the output end of the motor.

7. The inspection mechanism of a handler for high-precision silicon wafers according to claim 1, wherein: the top of the bracket is provided with a shell, and the camera is arranged in the shell.

8. The inspection mechanism of a handler for high-precision silicon wafers according to claim 7, wherein: the support includes four parallel arrangement's montant, the montant setting is in the four corners of casing distal end.

9. The inspection mechanism of a handler for high-precision silicon wafers according to claim 8, wherein: and a sliding rail is arranged between the adjacent vertical rods, and the backlight lamp can be arranged on the sliding rail in a sliding manner.

10. The inspection mechanism of a handler for high-precision silicon wafers according to claim 1, wherein: the sorting machine detection mechanism for the high-precision silicon wafer further comprises a processor and a display, wherein one part of the processor is connected with the camera, and the other part of the processor is connected with the display.