CN217670788U - Mould with high-efficient heat dissipation - Google Patents
Mould with high-efficient heat dissipation Download PDFInfo
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- CN217670788U CN217670788U CN202221495251.8U CN202221495251U CN217670788U CN 217670788 U CN217670788 U CN 217670788U CN 202221495251 U CN202221495251 U CN 202221495251U CN 217670788 U CN217670788 U CN 217670788U
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- water tank
- heat dissipation
- condenser
- fixedly connected
- die cavity
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Abstract
The utility model discloses a mould with high-efficient radiating, the on-line screen storage device comprises a base, the last fixed surface of base is connected with the backup pad, the last fixed surface of backup pad is connected with the water tank, first recess has been seted up at the upper surface middle part of water tank, sunken die cavity has been placed to the upper surface of first recess, spacing hole has been seted up to the upper surface of die cavity, the inner wall swing joint in spacing hole has the screw. This kind of mould with high-efficient radiating, through the condenser, the inlet tube, the outlet pipe, the water tank, the water inlet, the setting of sealing plug, take off the sealing plug from the water inlet, lead the water incasement portion with the condensate from the water inlet department, open the condenser, the condensate cools off in flowing into the condenser through the inlet tube, the water pump in the condenser is taken out the condensate that the cooling is good to the water tank through the outlet pipe in, thereby keep always being refrigerated condensate in the water tank, cyclic utilization, thereby reach the temperature that reduces the mould rapidly and radiating purpose.
Description
Technical Field
The utility model relates to a heat dissipation mould technical field, in particular to mould with high-efficient heat dissipation.
Background
The mould is used for producing the tool used for shaping articles in industrial production by injection moulding, blow moulding, extrusion, die casting or forging forming, smelting, stamping and other methods, the mould is a tool used for manufacturing shaped articles, the tool is composed of various parts, different moulds are composed of different parts, the processing of the shapes of the articles is realized mainly by changing the physical states of the shaped materials, the mould is widely used for blanking, die forging, cold heading, extrusion, powder metallurgy part pressing and pressure casting, and the forming processing of compression moulding or injection moulding of engineering plastics, rubber, ceramics and other products, the mould generally comprises a movable mould and a fixed mould (or a male mould and a female mould), the movable mould and the fixed mould can be combined, the finished products are taken out when separated, blanks are injected into a mould cavity for forming when being combined, and the development level of mould production is one of important marks of the mechanical manufacturing level.
However, the method still has the disadvantages in practical use: injecting the raw materials into the die cavity from the hole of moulding plastics, cooperating heat radiation structure dispels the heat to the mould cavity is around for the cooling shaping of module, the operation is complicated, and the heat dissipation is slow, and current high-efficient heat dissipation mould goes up the lower mould and is difficult to dismantle the equipment moreover to it is relatively poor to lead to its design effect. Therefore, the existing high-efficiency heat dissipation mold cannot meet the requirements in practical use, so that an improved technology is urgently needed in the market to solve the problems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a mould with high-efficient heat dissipation can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a mold with efficient heat dissipation comprises a base, wherein a supporting plate is fixedly connected to the upper surface of the base, a water tank is fixedly connected to the upper surface of the supporting plate, a first groove is formed in the middle of the upper surface of the water tank, a sunken mold cavity is arranged on the upper surface of the first groove, a limiting hole is formed in the upper surface of the mold cavity, a screw is movably connected to the inner wall of the limiting hole, a forming top plate is arranged on the upper surface of the mold cavity, and the mold cavity and the forming top plate are fixedly connected through the screw; one side fixedly connected with condenser of water tank lower surface, the left surface fixedly connected with inlet tube of condenser, one side fixedly connected with outlet pipe of inlet tube is kept away from to the condenser, inlet tube and outlet pipe all run through in the left side of condenser and water tank and personally submit the symmetry setting.
In order to make the purpose that reaches the cooling of casting liquid, conduct the utility model relates to a mould with high-efficient radiating, the inner wall fixedly connected with semiconductor cooling fin of die cavity.
In order to make and reach the purpose of leading-in casting liquid, conduct the utility model relates to a mould with high-efficient heat dissipation, the upper surface middle part of shaping roof is equipped with the casting liquid mouth, the second recess has been seted up at the lower surface middle part of shaping roof.
In order to make and reach stable accurate purpose, as the utility model relates to a mould with high-efficient radiating, the length and the width of second recess are the same with the length and the width of die cavity, the length and the width of shaping roof are the same with the length and the width of water tank and base.
In order to make and prevent the excessive purpose of comdenstion water, conduct the utility model relates to a mould with high-efficient heat dissipation, the water inlet has been seted up near the middle part of inlet tube one side to the water tank upper surface, the inner wall swing joint of water inlet has the sealing plug.
In order to make reach the fixed and convenient purpose of dismantling, conduct the utility model relates to a mould with high-efficient heat dissipation, the screw runs through in the shaping roof, the quantity of screw is four, four the screw is with the inner wall in spacing hole of the mode swing joint of rectangle array.
In order to make the purpose that reaches the outrigger, conduct the utility model relates to a mould with high-efficient heat dissipation, the quantity of backup pad is two, two the backup pad sets up the upper surface at the base with the horizontal direction symmetry.
In order to make reach the stable purpose of increase frictional force holding device, conduct the utility model relates to a mould with high-efficient radiating, the lower fixed surface of base is connected with the slipmat.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses in, through the condenser, the inlet tube, the outlet pipe, the water tank, the water inlet, the setting of sealing plug, take off the sealing plug from the water inlet, guide into water incasement portion with the condensate from the water inlet, leading-in back that finishes, advance the inner wall of water inlet with the sealing plug stopper, thereby reach the excessive purpose of preventing the condensate, open the condenser, the condensate cools off in flowing into the condenser through the inlet tube, the water pump in the condenser is with the condensate that cools off well taking out the water tank through the outlet pipe, thereby keep being refrigerated condensate in the water tank always, cyclic utilization, thereby reach the temperature and the radiating purpose that reduce the mould rapidly.
2. The utility model discloses in, through the semiconductor cooling fin, the die cavity, first recess, the second recess, the screw, the setting of shaping roof and casting liquid mouth, installation semiconductor cooling fin, thereby can cool down the cooling with the liquid that injects, put into first recess with sunken die cavity, then the mounting screw is fixed into an organic whole with shaping roof and die cavity, then it is leading-in to locate the casting liquid from casting liquid mouth, it reachs the cooling shaping of preparing between first recess and the second recess to cast the liquid, when needing to take out the die cavity that cooling shaping is good, only need unscrew the screw from the upper surface of shaping roof, then take off the screw, can take off the shaping roof, thereby reach the mesh of taking out the die cavity, convenient dismantlement and equipment.
Drawings
Fig. 1 is a schematic front view of a mold with efficient heat dissipation according to embodiment 1 of the present invention;
fig. 2 is a schematic view of a first groove structure of a mold with efficient heat dissipation according to embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a forming top plate of a mold with efficient heat dissipation according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a sealing plug of a mold with efficient heat dissipation according to embodiment 1 of the present invention;
fig. 5 is an installation schematic view of the non-slip mat structure according to embodiment 2 of the present invention.
In the figure: 1. a base; 2. a support plate; 3. a water tank; 4. a first groove; 5. a mold cavity; 6. a screw; 7. forming a top plate; 8. a condenser; 9. a water inlet pipe; 10. a water outlet pipe; 11. a semiconductor cooling fin; 12. casting liquid port; 13. a second groove; 14. a water inlet; 15. a sealing plug; 16. a non-slip mat; 17. and a limiting hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Example 1
As shown in fig. 1-4, a mold with high-efficiency heat dissipation comprises a base 1, wherein a supporting plate 2 is fixedly connected to the upper surface of the base 1, a water tank 3 is fixedly connected to the upper surface of the supporting plate 2, a first groove 4 is formed in the middle of the upper surface of the water tank 3, a recessed mold cavity 5 is placed on the upper surface of the first groove 4, a limiting hole 17 is formed in the upper surface of the mold cavity 5, a screw 6 is movably connected to the inner wall of the limiting hole 17, a molding top plate 7 is placed on the upper surface of the mold cavity 5, and the mold cavity 5 and the molding top plate 7 are fixedly connected through the screw 6;
in this embodiment, one side fixedly connected with condenser 8 of water tank 3 lower surface, the left surface fixedly connected with inlet tube 9 of condenser 8, one side fixedly connected with outlet pipe 10 that inlet tube 9 was kept away from to condenser 8, and inlet tube 9 and outlet pipe 10 all run through in condenser 8 and the left surface of water tank 3 and personally submit the symmetry setting.
When the cooling device is used, firstly, the concave die cavity 5 is placed into the first groove 4, then the forming top plate 7 is placed on the upper surface of the water tank 3, then the forming top plate 7 and the die cavity 5 are fixed into a whole by the aid of the mounting screws 6, the screws 6 are screwed into and fixed on the inner wall of the limiting hole 17, the screws 6 play a role in fixing the forming top plate 7 and the die cavity 5, then casting liquid is introduced from a casting liquid port 12, the casting liquid reaches a position between the first groove 4 and the second groove 13 to be cooled and formed, at the moment, condensate is introduced into the water inlet tank 3 from the water inlet 14, the condenser 8 is started, the condensate flows into the condenser 8 through the water inlet pipe 9 to be cooled, then a water pump in the condenser 8 pumps the cooled condensate into the water tank 3 through the water outlet pipe 10, the condensate which is cooled all the time in the water tank 3 is kept, and the condensate is recycled, and the purposes of quickly reducing the temperature of the die and dissipating heat are achieved.
In this embodiment, a semiconductor cooling fin 11 is fixedly connected to the inner wall of the cavity 5.
In particular, the semiconductor cooling fin 11 is installed so that the injected liquid can be cooled.
In this embodiment, a casting liquid port 12 is formed in the middle of the upper surface of the top molding plate 7, and a second groove 13 is formed in the middle of the lower surface of the top molding plate 7.
When the casting device is used specifically, the casting liquid port 12 is provided, and the casting liquid is introduced into the space between the first groove 4 and the second groove 13 through the casting liquid port 12 for cooling.
In this embodiment, the length and width of the second groove 13 are the same as those of the cavity 5, and the length and width of the molded top plate 7 are the same as those of the water tank 3 and the base 1.
When the device is used specifically, the die cavity 5 is as long as and as wide as the second groove 13, so that the precision of the die can be guaranteed, the length and the width of the forming top plate 7 are as long as those of the water tank 3 and the base 1, the stability of the device can be kept, and the device can be kept firm.
In this embodiment, a water inlet 14 is provided at the middle part of the upper surface of the water tank 3 near one side of the water inlet pipe 9, and the inner wall of the water inlet 14 is movably connected with a sealing plug 15.
During the specific use, when needing to channel into water tank 3 with the condensate, take off sealing plug 15 from water inlet 14 to with the leading-in 3 insides of water tank of intaking of condensate, leading-in back that finishes, fill in sealing plug 15 into the inner wall of water inlet 14, thereby reach the excessive purpose of preventing the condensate.
In the embodiment, the screws 6 penetrate through the molded top plate 7, the number of the screws 6 is four, and the four screws 6 are movably connected to the inner wall of the limiting hole 17 in a rectangular array mode.
During the specific use, mounting screw 6 puts first recess 4 with die cavity 5 on, screws into the inner wall of spacing hole 17 from shaping roof 7 upper surface with four screws 6 to reach shaping roof 7 and die cavity 5 and become integrative purpose, when needing to take out die cavity 5, only need unscrew screw 6 from the upper surface of shaping roof 7, then take off screw 6, can take off shaping roof 7, thereby reach the purpose of taking out die cavity 5.
In the present embodiment, the number of the support plates 2 is two, and the two support plates 2 are symmetrically disposed in the horizontal direction on the upper surface of the base 1.
During the specific use, the installation backup pad 2 sets up two backup pads 2 and can the stable support water tank 3, is that water tank 3 keeps steady.
Working principle; firstly, a sunken die cavity 5 is placed into a first groove 4, then a forming top plate 7 is placed on the upper surface of a water tank 3, then a screw 6 is installed to fix the forming top plate 7 and the die cavity 5 into a whole, the screw 6 is screwed into and fixed on the inner wall of a limiting hole 17, the screw 6 plays a role in fixing the forming top plate 7 and the die cavity 5, then casting liquid is led in from a casting liquid port 12, the casting liquid reaches a position between the first groove 4 and a second groove 13 to be cooled and formed, at the moment, a sealing plug 15 is taken down from a water inlet 14, condensate is led into a water inlet tank 3 from the water inlet 14, after the leading-in is finished, the sealing plug 15 is plugged into the inner wall of the water inlet 14, so that the purpose of preventing the condensate from overflowing is achieved, then a condenser 8 is started, the condensate flows into the condenser 8 through a water inlet pipe 9 to be cooled, then a water pump in the condenser 8 pumps the cooled condensate into the water tank 3 through a water outlet pipe 10, so that the condensate is kept in the water tank 3 and is recycled, and the purpose of rapidly reducing the temperature of the die and dissipating heat is achieved; when the cooled and molded mold cavity 5 needs to be taken out, the screw 6 is loosened from the upper surface of the molding top plate 7, and then the screw 6 is taken down, so that the molding top plate 7 can be taken down, and the purpose of taking out the mold cavity 5 is achieved.
Example 2
As shown in fig. 5, the distinguishing features of this embodiment that distinguish embodiment 1 are: the lower surface of the base 1 is fixedly connected with a non-slip mat 16.
When the device is used specifically, the anti-slip mat 16 is installed, so that the friction force between the base 1 and the ground can be increased, and the stable operation of the device is kept.
The basic principles and the main features of the present invention and the advantages of the present invention have been shown and described above, and it should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and only the description in the above embodiments and the description illustrates the principles of the present invention, without departing from the spirit and scope of the present invention, the present invention can also have various changes and modifications, and these changes and modifications all fall into the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The utility model provides a mould with high-efficient heat dissipation, includes base (1), its characterized in that: the upper surface of the base (1) is fixedly connected with a supporting plate (2), the upper surface of the supporting plate (2) is fixedly connected with a water tank (3), a first groove (4) is formed in the middle of the upper surface of the water tank (3), a sunken die cavity (5) is placed on the upper surface of the first groove (4), a limiting hole (17) is formed in the upper surface of the die cavity (5), a screw (6) is movably connected to the inner wall of the limiting hole (17), a forming top plate (7) is placed on the upper surface of the die cavity (5), and the die cavity (5) is fixedly connected with the forming top plate (7) through the screw (6);
one side fixedly connected with condenser (8) of water tank (3) lower surface, the left surface fixedly connected with inlet tube (9) of condenser (8), one side fixedly connected with outlet pipe (10) of inlet tube (9) are kept away from in condenser (8), inlet tube (9) and outlet pipe (10) all run through in the left side of condenser (8) and water tank (3) and personally submit the symmetry setting.
2. The mold with high heat dissipation efficiency as recited in claim 1, wherein: and the inner wall of the die cavity (5) is fixedly connected with a semiconductor cooling fin (11).
3. The mold with high heat dissipation efficiency as recited in claim 1, wherein: the middle of the upper surface of the forming top plate (7) is provided with a casting liquid port (12), and the middle of the lower surface of the forming top plate (7) is provided with a second groove (13).
4. The mold with high heat dissipation efficiency as recited in claim 3, wherein: the length and the width of the second groove (13) are the same as those of the die cavity (5), and the length and the width of the forming top plate (7) are the same as those of the water tank (3) and the base (1).
5. The mold with high heat dissipation efficiency as recited in claim 1, wherein: the middle part of the upper surface of the water tank (3) close to one side of the water inlet pipe (9) is provided with a water inlet (14), and the inner wall of the water inlet (14) is movably connected with a sealing plug (15).
6. The mold with high heat dissipation efficiency as recited in claim 1, wherein: the screw (6) penetrates through the forming top plate (7), the number of the screws (6) is four, and the four screws (6) are movably connected to the inner wall of the limiting hole (17) in a rectangular array mode.
7. The mold with high heat dissipation efficiency as recited in claim 1, wherein: the number of the supporting plates (2) is two, and the two supporting plates (2) are symmetrically arranged on the upper surface of the base (1) in the horizontal direction.
8. The mold with high heat dissipation efficiency as recited in claim 1, wherein: the lower surface of the base (1) is fixedly connected with an anti-skid pad (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221495251.8U CN217670788U (en) | 2022-06-15 | 2022-06-15 | Mould with high-efficient heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221495251.8U CN217670788U (en) | 2022-06-15 | 2022-06-15 | Mould with high-efficient heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217670788U true CN217670788U (en) | 2022-10-28 |
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ID=83709146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221495251.8U Active CN217670788U (en) | 2022-06-15 | 2022-06-15 | Mould with high-efficient heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217670788U (en) |
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2022
- 2022-06-15 CN CN202221495251.8U patent/CN217670788U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 10-4-7, Northeast Seventh Street, Economic and Technological Development Zone, Dalian City, Liaoning Province, 116000 Patentee after: Dalian Junhong Xinyu Technology Co.,Ltd. Address before: No. 10-4-7, Northeast Seventh Street, Economic and Technological Development Zone, Dalian City, Liaoning Province, 116000 Patentee before: Renhe (Dalian) Information Technology Consulting Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230713 Address after: No. 12-1, Northeast Seventh Street, Dalian Economic and Technological Development Zone, Liaoning Province, 116000 Patentee after: DALIAN FUHUA RENHE PRECISION MOULD Co.,Ltd. Address before: No. 10-4-7, Northeast Seventh Street, Economic and Technological Development Zone, Dalian City, Liaoning Province, 116000 Patentee before: Dalian Junhong Xinyu Technology Co.,Ltd. |