CN217656293U

CN217656293U - High-voltage high-capacity SVG heat dissipation device

Info

Publication number: CN217656293U
Application number: CN202221612372.6U
Authority: CN
Inventors: 杨世兵
Original assignee: Xiangyang Zhenghao Electronic Technology Co ltd
Current assignee: Xiangyang Zhenghao Electronic Technology Co ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2022-10-25
Anticipated expiration: 2032-06-27

Abstract

The utility model relates to a SVG heat dissipation technical field especially relates to a high pressure large capacity SVG heat abstractor. The method comprises the following steps: a cabinet body and a heat dissipation device; an installation cavity for installing the SVG is formed in the cabinet body; a heat dissipation cavity for mounting a heat dissipation device is formed in the cabinet body, and the heat dissipation cavity penetrates from one side of the cabinet body to the other side; the heat dissipation device comprises a heat collection device and a fan; the heat collecting device extends into the mounting cavity to be attached to the SVG; the fan corresponds to the heat collecting device to reduce the temperature of the heat collecting device. In the prior art, heat dissipation is carried out in a mode of promoting air in a cabinet body to exchange with air outside the cabinet body, but the service environment of the SVG is special, and the SVG is easy to work abnormally due to the mode. Compared with the prior art, the utility model discloses keep apart circulation of air and SVG, effectually avoided outside air and SVG direct contact to make the operation of SVG more stable.

Description

High-voltage large-capacity SVG heat dissipation device

Technical Field

The utility model relates to a SVG heat dissipation technical field especially relates to a high pressure large capacity SVG heat abstractor.

Background

SVG is a static var generator, also called a high-voltage dynamic var compensation generator, or a static synchronous compensator. The device is a device for performing dynamic reactive power compensation by a power semiconductor bridge type converter with free phase change. The method is mainly used with equipment with lower power factor, such as: the electric welding machine, the punch press, the lathe group, the press machine and the crane lead to the complicated service environment of the SVG, and the air state around the SVG can be in special states of much dust, high humidity and the like. Meanwhile, SVG is a kind of electrical equipment, which necessarily generates heat during operation. In actual use, a plurality of SVGs are usually installed in the same cabinet body, which further aggravates the heat dissipation requirement of the SVG. Generally, adopt the fan as main heat-dissipating equipment, and the heat dissipation mechanism essence of fan is for making the external gas of cabinet and the internal gas of cabinet exchange to realize the heat dissipation purpose at the exchange in-process, nevertheless receive the service environment of SVG, this kind of radiating mode very easily causes SVG unusual work, seriously reduces the utility life of SVG, can cause the incident when serious.

SUMMERY OF THE UTILITY MODEL

To the technical problem of prior art, the utility model provides a high pressure large capacity SVG heat abstractor.

In order to solve the technical problem, the utility model provides a following technical scheme:

a high-pressure large-capacity SVG heat dissipation device comprises: a cabinet body and a heat dissipation device; an installation cavity for installing the SVG is formed in the cabinet body; a heat dissipation cavity for mounting a heat dissipation device is formed in the cabinet body, and the heat dissipation cavity penetrates from one side of the cabinet body to the other side; the heat dissipation device comprises a heat collection device and a fan; the heat collecting device extends into the mounting cavity to be attached to the SVG; the fan corresponds to the heat collecting device to reduce the temperature of the heat collecting device.

In actual operation, heat collection device laminates with SVG mutually to absorb the heat that SVG gived off, when the fan starts, under the drive of fan, the air gets into by the opposite side discharge of the cabinet body by one side of the cabinet body, at the in-process that the air flows, cools down heat collection device, and then cools down SVG. Wherein, a setting is separated with the heat dissipation chamber that is used for installing heat abstractor to the installation cavity for installing SVG, this just makes the fan blow in the heat dissipation chamber with outside air when dispelling the heat to heat collecting device, and outside air can not directly get into in the installation cavity to effectual SVG and the outside air direct contact of having avoided, and then can carry out radiating prerequisite to SVG under, the effectual probability that reduces SVG and operation trouble appears.

Further, the heat collecting device comprises a heat collecting plate and a heat conducting pipe; the heat conduction pipe penetrates through the heat collection plate; a heat conduction channel is formed in the heat dissipation cavity and is communicated with the heat dissipation cavity and the mounting cavity; the heat pipe stretches into the installation cavity through the heat conduction channel to be attached to the SVG.

Furthermore, the number of the heat collecting plates is multiple, and the heat collecting plates are stacked layer by layer from bottom to top; the heat conduction pipe penetrates through the heat collection plate layer by layer; the one end that the heat pipe is close to SVG is provided with the heat conduction face, and the heat conduction face can laminate mutually with SVG.

Furthermore, the heat collecting device also comprises a mounting plate; the mounting plate is detachably connected with the fan; the mounting plate is provided with a positioning stud which is fixedly connected with the mounting plate; the heat collecting plate is provided with a nut corresponding to the positioning stud.

Furthermore, one side of the mounting plate, which is far away from the heat collecting plate, is also provided with a sliding guide rail; a sliding groove corresponding to the sliding guide rail is formed in the heat dissipation cavity; the sliding guide rail is slidably embedded in the sliding groove.

Furthermore, a handle is also arranged on the mounting plate; the handle is fixedly connected with the mounting plate; the handle is attached to one side of the fan.

Further, the fan is arranged at one end of the heat collecting device, so that the air flows from one side of the cabinet body to the other side along the heat dissipation cavity.

Furthermore, the cabinet body is also provided with a dust screen; the dust screens are respectively arranged at two ends of the heat dissipation cavity.

Drawings

FIG. 1: the overall structure.

FIG. 2 is a schematic diagram: explosion diagram of heat sink.

FIG. 3: the heat dissipation cavity and the installation cavity are in sectional view.

In the figure: 1. a cabinet body; 11. a mounting cavity; 12. a heat dissipation cavity; 121. a chute; 122. a heat conducting channel; 13. a dust screen; 2. a heat sink; 21. a heat collecting device; 211. a heat collecting plate; 212. a heat conduction pipe; 2121. a heat conducting surface; 213. mounting a plate; 2131. positioning a stud; 2132. a sliding guide rail; 2133. a handle; 22. a fan.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

A high-pressure large-capacity SVG heat dissipation device comprises: cabinet body 1, heat abstractor 2. The cabinet body 1 is of an approximate cuboid structure, and the materials selected for the cabinet body 1 at least meet the installation requirements of the SVG. An installation cavity 11 for installing the SVG is arranged in the cabinet body 1. The cabinet body 1 is also provided with a heat dissipation cavity 12 for installing the heat dissipation device 2. The heat dissipation chamber 12 penetrates from one side to the other side of the cabinet 1. The cabinet body 1 is further provided with a dustproof net 13, and the dustproof nets 13 are respectively arranged at two ends of the heat dissipation cavity 12. Meanwhile, a heat conduction channel 122 is formed in the heat dissipation cavity 12, and the heat conduction channel 122 communicates the mounting cavity 11 with the heat dissipation cavity 12.

The heat dissipation device 2 includes a heat collection device 21 and a fan 22. The heat collecting device 21 includes a heat collecting plate 211, a heat conductive pipe 212, and a mounting plate 213. The mounting plate 213 is provided with four positioning studs 2131, and the positioning studs 2131 are perpendicular to the mounting plate 213. The mounting plate 213 is detachably connected to the fan 22 by screws. The heat collecting plate 211 is a rectangular parallelepiped plate member. The heat collecting plate 211 is made of aluminum. Nuts corresponding to the positioning studs 2131 are arranged at four vertex angles of the heat collecting plate 211, so that the heat collecting plate 211 can be detachably connected with the mounting plate 213 through the positioning studs 2131. The number of the heat collecting plates 211 is plural, and the plural heat collecting plates 211 are installed on the installation plate 213 step by step from the bottom up. A gap exists between adjacent two heat collecting plates 211 due to the nut of the heat collecting plates 211 to facilitate the flow of air between the heat collecting plates 211, thereby enhancing a heat radiating effect. The heat pipe 212 is made of copper, the heat pipe 212 is n-type, and the number of the heat pipes 212 is plural. The heat pipe 212 penetrates the heat collecting plate 211 layer by layer. The end of the heat pipe 212 remote from the mounting plate 213 is provided with a heat conducting surface 2121. The heat conduction pipe 212 extends into the mounting cavity 11 through the heat conduction channel 122, so that the heat conduction surface 2121 is attached to the SVG in the mounting cavity 11. Meanwhile, the fan 22 is located at one end of the heat collecting device 21, so that the air can flow along the heat dissipation chamber 12 from one side to the other side of the cabinet 1.

In an actual state, a plurality of SVGs are installed in the installation cavity 11, and the SVGs gradually generate heat as the running time of the SVGs increases. The heat generated by the SVG is transferred to the heat pipe 212 through the heat conduction surface 2121, and then transferred to the heat collection plate 211 through the heat pipe 212. The temperature of the air in the heat dissipation chamber 12 gradually rises as the amount of transferred heat gradually increases. By the structure of the heat dissipation cavity 12, air can only flow from one end of the heat dissipation cavity 12 to the other end, and then the air can spontaneously flow from the high-density area to the low-density area in combination with the lower density of the higher temperature gas, so that the air outside the cabinet body 1 can spontaneously exchange with the air in the heat dissipation cavity 12 to a certain extent, and thus can spontaneously cool the heat collection plate 211, and further cool the SVG. This reduces the power consumption of the heat sink 2 to some extent.

When the autonomous heat dissipation cannot meet the heat dissipation requirement, the fan 22 is activated. Under the driving of the fan 22, the external air continuously moves from one end of the heat dissipation chamber 12 to the other end, so that the continuous exchange between the air in the heat dissipation chamber 12 and the air outside the cabinet 1 is realized, the temperature of the heat collection plate 211 is reduced through the aforementioned process, and finally the temperature of the SVG is reduced through the heat conduction pipe 212.

To summer up, the utility model discloses can effectively satisfy the heat dissipation demand of SVG. Simultaneously, no matter independently dispel the heat or initiatively dispel the heat, the outer air of the cabinet body 1 is only limited in the heat dissipation chamber 12 to can not directly get into in the installation cavity 11 to effectual SVG and the outer air direct contact of the cabinet body 1 of having avoided, and then the effectual outside dust, water droplet etc. of having avoided influences SVG's normal operating with SVG direct contact.

Meanwhile, a sliding guide rail 2132 is fixedly arranged on one side of the mounting plate 213 far away from the heat collecting plate 211. A sliding groove 121 corresponding to the sliding rail 2132 is formed in the heat dissipation cavity 12, and the sliding rail 2132 is slidably inserted into the sliding groove 121. A handle 2133 is fixedly arranged at one end of the mounting plate 213 close to the fan 22, and the handle 2133 is attached to one side of the fan 22.

In actual use, even if the two sections of the heat dissipation chamber 12 are provided with the dust screens 13, as the practical time increases, a part of the external impurities may be accumulated on the heat collecting plate 211, which may affect the overall heat dissipation efficiency of the heat dissipation device 2. When the impurities on the heat collecting plate 211 need to be removed, the dust screen 13 is removed, the handle 2133 is pulled, and the mounting plate 213 is pulled, so that the sliding guide rail 2132 starts to slide along the sliding slot 121, and the heat collecting plate 211, the heat conducting pipe 212, and the fan 22 are driven to slide synchronously. Finally, the heat dissipation device 2 is pulled out of the heat dissipation chamber 12 by the handle 2133. At this time, the heat pipe 212 may be removed from the heat collecting plate 211, and then the heat collecting plate 211 may be removed from the positioning stud 2131 by a nut on the heat collecting plate 211. Thereby, the heat collecting plate 211 can be cleaned. Depending on the actual requirements, the fan 22 may also be removed to facilitate maintenance and replacement of the fan 22.

On the other hand, the handle 2133 is attached to the fan 22, and can assist the mounting plate 213 in limiting the fan 22, so as to avoid excessive vibration of the fan 22 during operation, which leads to high noise.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides a high pressure large capacity SVG heat abstractor which characterized in that: the method comprises the following steps: a cabinet body (1) and a heat dissipation device (2);

a mounting cavity (11) for mounting SVG is formed in the cabinet body (1);

a heat dissipation cavity (12) for mounting the heat dissipation device (2) is formed in the cabinet body (1), and the heat dissipation cavity (12) penetrates from one side to the other side of the cabinet body (1);

the heat dissipation device (2) comprises a heat collection device (21) and a fan (22);

the heat collection device (21) extends into the mounting cavity (11) to be attached to the SVG;

the fan (22) corresponds to the heat collection device (21) to reduce the temperature of the heat collection device (21).

2. The high-voltage high-capacity SVG heat dissipating device according to claim 1, wherein: the heat collecting device (21) comprises a heat collecting plate (211) and a heat conducting pipe (212);

the heat conducting pipe (212) penetrates through the heat collecting plate (211);

a heat conduction channel (122) is formed in the heat dissipation cavity (12), and the heat conduction channel (122) is communicated with the heat dissipation cavity (12) and the installation cavity (11);

heat pipe (212) pass through heat conduction passageway (122) stretch into in installation cavity (11), with SVG laminates mutually.

3. The high-voltage high-capacity SVG heat dissipating device according to claim 2, wherein: the number of the heat collecting plates (211) is multiple, and the heat collecting plates (211) are stacked layer by layer from bottom to top;

the heat conduction pipe (212) penetrates through the heat collection plate (211) layer by layer;

heat pipe (212) are close to the one end of SVG is provided with heat conduction face (2121), heat conduction face (2121) can with the SVG is laminated mutually.

4. The high-voltage high-capacity SVG heat dissipating device as claimed in claim 2, wherein: the heat collection device (21) further comprises a mounting plate (213);

the mounting plate (213) is detachably connected with the fan (22);

the mounting plate (213) is provided with a positioning stud (2131), and the positioning stud (2131) is fixedly connected with the mounting plate (213);

and a nut corresponding to the positioning stud (2131) is arranged on the heat collecting plate (211).

5. The high-voltage high-capacity SVG heat dissipating device of claim 4, wherein: a sliding guide rail (2132) is further arranged on one side, away from the heat collecting plate (211), of the mounting plate (213);

a sliding groove (121) corresponding to the sliding guide rail (2132) is formed in the heat dissipation cavity (12);

the sliding guide rail (2132) is slidably embedded in the sliding groove (121).

6. The high-voltage high-capacity SVG heat dissipating device according to claim 4, characterized in that: the mounting plate (213) is also provided with a handle (2133);

the handle (2133) is fixedly connected with the mounting plate (213);

the handle (2133) is attached to one side of the fan (22).

7. The high-voltage high-capacity SVG heat dissipating device as claimed in claim 1, wherein: the fan (22) is arranged at one end of the heat collecting device (21) so that the air flows from one side to the other side of the cabinet body (1) along the heat dissipation cavity (12).

8. The high-voltage high-capacity SVG heat dissipating device according to claim 1, wherein: the cabinet body (1) is also provided with a dust screen (13);

the dustproof nets (13) are respectively arranged at two ends of the heat dissipation cavity (12).