CN217646131U - A absorbing device for silicon chip pickling waste gas - Google Patents
A absorbing device for silicon chip pickling waste gas Download PDFInfo
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- CN217646131U CN217646131U CN202221394659.6U CN202221394659U CN217646131U CN 217646131 U CN217646131 U CN 217646131U CN 202221394659 U CN202221394659 U CN 202221394659U CN 217646131 U CN217646131 U CN 217646131U
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- absorption
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- absorption cover
- nitrogen oxide
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Abstract
The utility model discloses an absorbing device for silicon chip pickling waste gas belongs to the nitrogen oxide waste gas treatment field that semiconductor trade silicon chip pickling link produced, and its technical scheme main points include the device body, the device body includes absorption cover and absorption tank, the absorption cover is located the top of absorption tank, and the lower extreme of absorption cover is hugged closely with the inside bottom of absorption tank, two rows of drum cells have been run through to the below of absorption cover lateral wall, the equal fixedly connected with handle in the left and right sides of absorption cover up end, the below fixedly connected with baffle cover of absorption cover lateral wall puts into the pickling basket of flowers and puts into the descaling bath with the sample piece, injects water in the absorption tank, puts into the descaling bath that will place the sample piece in the absorption tank, covers the nitrogen oxide that the absorption cover reaction produced along tympanic bulla hole absorption part, and nonabsorbent nitrogen oxide sprays the tower secondary through fan suction afterwards, and last nitrogen oxide thoroughly absorbs.
Description
Technical Field
The utility model relates to a nitrogen oxide exhaust-gas treatment field that semiconductor trade silicon chip pickling link produced, in particular to an absorbing device for silicon chip pickling waste gas.
Background
The nitrogen oxides combine with water in the air to form acid rain; it can produce photochemical smog pollution with other pollutants under certain conditions. Including direct and potential harm to human health, ecosystems and building facilities.
In the semiconductor industry, nitric oxide is generated in the acid washing process of monocrystalline silicon sample wafers. The nitrogen oxide treatment currently adopts the mode that nitrogen oxide directly enters a spray tower through a fan to be sprayed, so that the nitrogen oxide is absorbed.
The prior device has the following defects:
1. the smoke is large, and the two-stage absorption of the spray tower is not thorough;
2. the absorption does not reach the standard, and accidental yellow smoke can be generated in the absorption tower.
SUMMERY OF THE UTILITY MODEL
The utility model provides an above-mentioned problem is solved to the absorbing device who is used for silicon chip pickling waste gas to above problem.
The utility model discloses a realize like this, an absorbing device for silicon chip pickling waste gas, the device comprises a device body, the device body includes absorbing cover and absorption tank, the absorbing cover is located the top of absorption tank, and the lower extreme of absorbing cover and the inside bottom of absorption tank are hugged closely, the below of absorbing cover lateral wall is run through and is seted up two rows of drum alveoles, the equal fixedly connected with in the left and right sides of absorbing cover up end carries the ear, the below fixedly connected with baffler of absorbing cover lateral wall.
In order to prolong the service life of the device body, the absorption device for silicon wafer pickling waste gas is preferred as the utility model discloses a polytetrafluoroethylene material is adopted to the device body.
In order to cover the pickling tank, the generated nitrogen oxide is collected in the absorption cover to form a water seal, and the absorption device for silicon wafer pickling waste gas is preferred, and the thickness of the absorption cover is larger than 10mm.
In order to prevent that silicon chip and acid reaction from splashing because of heat or nitrogen oxide in aqueous, as the utility model discloses an absorbing device for silicon chip pickling waste gas is preferred, two rows the distance of bulging bubble and absorption cover lower extreme is 20-30mm, the aperture of bulging bubble is less than 8mm.
Compared with the prior art, the beneficial effects of the utility model are that:
1. according to the absorption device for the silicon wafer pickling waste gas, partial nitric oxide is absorbed by bubbling in the clamp, the concentration of the nitric oxide is reduced, the spraying tower is subsequently beneficial to full absorption, and the standard emission is realized;
2. the absorption device for the silicon wafer pickling waste gas is continuously used for 3 months by clamping the pre-absorption device, and the condition that yellow smoke is emitted cannot occur in the absorption tower.
Drawings
FIG. 1 is an overall structure diagram of the absorption device for silicon wafer pickling waste gas of the present invention;
FIG. 2 is a cross-sectional structural view of the absorption tank of the present invention;
FIG. 3 is a cross-sectional structural view of the absorption cover and the absorption tank of the present invention;
fig. 4 is a sectional structure view of the absorption cover and the absorption tank of the present invention.
In the figure, 1, an apparatus body; 101. an absorbent cover; 102. an absorption tank; 103. bulging holes; 104. lifting the ears; 105. a baffle sleeve.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-4, an absorption device for silicon wafer pickling waste gas comprises a device body 1, wherein the device body 1 comprises an absorption cover 101 and an absorption tank 102, the absorption cover 101 is located above the absorption tank 102, the lower end of the absorption cover 101 is tightly attached to the bottom end inside the absorption tank 102, two rows of foaming holes 103 are formed in the lower portion of the outer side wall of the absorption cover 101 in a penetrating manner, lifting lugs 104 are fixedly connected to the left side and the right side of the upper end face of the absorption cover 101, and a baffle sleeve 105 is fixedly connected to the lower portion of the outer side wall of the absorption cover 101.
In this embodiment: the pickling basket is put into to the sample wafer and the descaling bath is put into, inject water in absorption tank 102, the descaling bath that will place the sample wafer is put into absorption tank 102, cover absorption cover 101, absorption cover 101 adopts the polytetrafluoroethylene material, absorption cover 101 can cover the descaling bath through the weight of self, the heat that silicon chip and acid reaction produced is about 200 degrees centigrade, can reduce the descaling bath in reaction temperature, and simultaneously, the nitrogen oxide that does benefit to the reaction production absorbs partial nitrogen oxide along drum hole 103, unabsorbed nitrogen oxide sprays through fan suction spray column secondary afterwards, make nitrogen oxide thoroughly absorb, make the absorption column be difficult for appearing the condition of exhausting yellow smoke, it is convenient for carry absorption cover 101 to carry ear 104, baffle cover 105 plays and hinders the effect, prevent that nitrogen oxide from splashing in aqueous.
As a technical optimization scheme of the utility model, the device body 1 is made of polytetrafluoroethylene materials.
In this embodiment: the device body 1 is made of polytetrafluoroethylene materials which are high temperature resistant and corrosion resistant, and the service life of the device body 1 can be prolonged.
As a technical optimization scheme of the utility model, the thickness of absorption cover 101 is greater than 10mm.
In this embodiment: the thickness of absorption cover 101 is greater than 10mm, adopts the polytetrafluoroethylene material, and polytetrafluoroethylene washes the cover high temperature resistant, corrosion-resistant, can cover the descaling bath through the weight of self, collects the nitrogen oxide that produces and seals water in absorption cover 101, and after nitrogen oxide constantly produced, pressure rises gradually, discharges through drum hole 103, realizes that nitrogen oxide absorbs.
As a technical optimization scheme of the utility model, the distance between two rows of bubbling holes 103 and the lower end of the absorbing cover 101 is 20-30mm, and the aperture of the bubbling hole 103 is smaller than 8mm.
In this embodiment: the inner diameter of the bubble hole 103 can be 6mm, the bubble hole 103 is convenient for discharging nitrogen oxide in the absorption cover 101, and the aperture of the bubble hole 103 is smaller than 8mm, so that the silicon wafer is prevented from splashing in water due to heat or nitrogen oxide in the reaction of the silicon wafer and acid.
The utility model discloses a theory of operation and use flow: firstly, a sample wafer is placed into a pickling basket and placed into a pickling tank, water is injected into an absorption tank 102, the pickling tank in which the sample wafer is placed into the absorption tank 102, nitrogen oxide generated by reaction of an absorption cover 101 is covered, part of the nitrogen oxide is absorbed along a drum hole 103, the nitrogen oxide which is not absorbed is sucked out of a spray tower by a fan for secondary spraying, and finally the nitrogen oxide is completely absorbed.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (4)
1. The utility model provides an absorbing device for silicon chip pickling waste gas, includes device body (1), its characterized in that: the device body (1) comprises an absorption cover (101) and an absorption groove (102), the absorption cover (101) is located above the absorption groove (102), the lower end of the absorption cover (101) is tightly attached to the bottom end inside the absorption groove (102), two rows of drum holes (103) are formed in the lower portion of the outer side wall of the absorption cover (101) in a penetrating mode, lifting lugs (104) are fixedly connected to the left side and the right side of the upper end face of the absorption cover (101), and baffle sleeves (105) are fixedly connected to the lower portion of the outer side wall of the absorption cover (101).
2. The absorption device for silicon wafer pickling exhaust gas according to claim 1, characterized in that: the device body (1) is made of polytetrafluoroethylene materials.
3. The absorption device for silicon wafer pickling exhaust gas according to claim 1, characterized in that: the thickness of the absorption cover (101) is more than 10mm.
4. The absorption device for silicon wafer pickling exhaust gas as set forth in claim 1, wherein: the distance between the two rows of the bubble blowing holes (103) and the lower end of the absorption cover (101) is 20-30mm, and the pore diameter of the bubble blowing holes (103) is less than 8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221394659.6U CN217646131U (en) | 2022-06-07 | 2022-06-07 | A absorbing device for silicon chip pickling waste gas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221394659.6U CN217646131U (en) | 2022-06-07 | 2022-06-07 | A absorbing device for silicon chip pickling waste gas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217646131U true CN217646131U (en) | 2022-10-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221394659.6U Active CN217646131U (en) | 2022-06-07 | 2022-06-07 | A absorbing device for silicon chip pickling waste gas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217646131U (en) |
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2022
- 2022-06-07 CN CN202221394659.6U patent/CN217646131U/en active Active
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