CN217641395U

CN217641395U - Novel Mini LED backlight device

Info

Publication number: CN217641395U
Application number: CN202221565424.9U
Authority: CN
Inventors: 胡俊
Original assignee: Xiamen Honghan Optoelectronics Technology Co ltd
Current assignee: Xiamen Honghan Optoelectronics Technology Co ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-10-21
Anticipated expiration: 2032-06-22

Abstract

The utility model discloses a novel Mini LED device in a poor light, concretely relates to Mini LED field of being shaded, including Mini LED chip, the fixed electrode slice that is equipped with in both sides of Mini LED chip lower extreme, the upside of Mini LED chip is equipped with flexible waterproof insulation layer, flexible waterproof insulation layer's middle part is equipped with the adaptation card hole, the downside of Mini LED chip is equipped with flexible insulating substrate. The utility model discloses when in-service use, through the flexible stretch-proofing layer that sets up, flexible insulating substrate, the intensity that can conveniently increase Mini LED backlight device overall structure under the corresponding setting state of flexible waterproof insulating layer and insulating waterproof bottom plate, avoid Mini LED backlight device to receive outside tensile force and produce the fracture when too big, and under the condition of self thickness, increase the suitability of Mini LED backlight device, simultaneously through the MiniLED chip that sets up, the correspondence of electrode slice and conducting layer sets up the state and can avoid whole Mini LED backlight device can't work when Mini LED backlight device produces local fracture.

Description

Novel Mini LED backlight device

Technical Field

The utility model relates to an electron cigarette holder field, more specifically says, the utility model relates to a novel Mini LED device in a poor light.

Background

With the development of liquid crystal display technology, the application field of liquid crystal displays, especially color liquid crystal displays, is also widening. The market of the liquid crystal display is pulling, and the backlight industry presents a splendid scene. The backlight liquid crystal display is a screen in which light emitted from a backlight source is used as a light source and then transmitted or reflected by a liquid crystal molecular layer to form an image. The notebook computer and the liquid crystal display which are usually used by people are mostly backlight liquid crystal screens, when the backlight element of the liquid crystal display on the market works, the whole color saturation of the display is poor easily due to the fact that the backlight element is in a side-edge lighting state and the arrangement sequence of the backlight element is easy to cause, the whole display is in a gray state in a screen-rest state, the use and watching comfort degree of people is influenced, and the advantage of the LCD and the OLED are combined to be taken as reference, so that a Mini LED backlight device is derived, and the Mini LED is an LED device with the chip size of 50-200 mu m. The unit consists of a Mini LED pixel array and a driving circuit, the pixel center distance is 0.3-1.5mm, and the Mini LED chip has the advantages of high color saturation, local dimming, high brightness, energy conservation and the like, can be applied to the fields of backlight, displays, vehicles and the like, and has become a recent research hotspot. Because the MiniLED chip has a very small size and is similar to a point light source, when the MiniLED chip is used to manufacture the backlight module, the Mini LED chip needs to be arranged very densely to uniformly mix light, which makes the manufacturing cost of the backlight module very high. In order to reduce the usage amount of the Mini LED chip in the backlight module, the exiting light of the Mini LED device is scattered by the micron-sized lens arranged on the exiting surface of the Mini LED chip, so that the Mini LED device forms a surface light source. However, when the existing Mini LED backlight device is used, the intensity of the device itself is low, and the device is easily broken and damaged by external force.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a novel Mini LED device in a poor light, the utility model aims to solve the technical problem that: how to increase the intensity of the Mini LED backlight device mounting is adjusted.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel Mini LED device in a poor light, includes Mini LED chip, the fixed electrode slice that is equipped with in both sides of Mini LED chip lower extreme, the upside of Mini LED chip is equipped with flexible waterproof insulation layer, flexible waterproof insulation layer's middle part is equipped with the adaptation card hole, mini LED chip's downside is equipped with flexible insulating substrate, the fixed spacing groove that is equipped with in upper end of flexible insulating substrate, the inside of spacing groove is equipped with the conducting layer, flexible insulating substrate's lower extreme is fixed and is equipped with flexible stretch-proofing layer, the fixed insulating waterproof bottom plate that is equipped with of lower extreme on flexible stretch-proofing layer, the fixed flexible optical colloid that is equipped with in upper end of flexible waterproof insulation layer.

In a preferred embodiment, the number of the electrode plates is two, and the electrode plates are correspondingly arranged on two sides of a vertical central axis of a top view direction of the Mini LED chip, and the outer end surface of the Mini LED chip is matched with the inner end surface of the adapter card hole.

In a preferred embodiment, the number of the conducting layers and the limiting grooves is two, the conducting layers and the limiting grooves are correspondingly arranged on two sides of the vertical central axis in the overlooking direction of the flexible insulating substrate, the outer single surface of each conducting layer is matched with the inner end surface of each limiting groove, and the thickness of each conducting layer in the overlooking direction is 10-50 μm.

In a preferred embodiment, the flexible waterproof insulating layer has a thickness of 10 to 30 μm in a front view direction, and the flexible insulating substrate is configured of an anti-bending material and has a thickness of 30 to 120 μm.

In a preferred embodiment, the flexible optical gel is disposed in a fully-covered state at an outer end surface of the Mini LED chip in a top view direction, and the flexible optical gel is made of a highly transparent gel material.

In a preferred embodiment, the thickness of the insulating and waterproof substrate in the front view direction is 10 to 30 μm.

The utility model discloses a technological effect and advantage:

this use is novel when in-service use, through the flexible stretch-proofing layer that sets up, flexible insulating substrate, the intensity that can conveniently increase Mini LED backlight device overall structure under the corresponding setting state of flexible waterproof insulating layer and insulating waterproof bottom plate, avoid Mini LED backlight device to receive outside tensile force and produce the fracture when too big, and under the condition of self thickness, increase the suitability of Mini LED backlight device, simultaneously through the Mini LED chip that sets up, can avoid whole Mini LED backlight device unable work when Mini LED backlight device produces local fracture under the corresponding setting state of electrode slice and conducting layer.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

FIG. 2 is a schematic view of the overall overlooking structure of the present invention

Fig. 3 is a schematic view of the overall main-view section structure of the present invention.

Fig. 4 is a schematic view of the overall section connection structure of the present invention.

The reference signs are: the LED chip comprises a Mini LED chip 1, a flexible stretch-resistant layer 2, a flexible insulating substrate 3, a flexible waterproof insulating layer 4, a flexible optical colloid 5, an insulating waterproof bottom plate 6, an electrode plate 7, an adaptive card hole 8, a conductive layer 9 and a limiting groove 10.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repetitive description will be omitted.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided to give a thorough understanding of example embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the embodiments of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, steps, etc. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure

The utility model provides a as shown in fig. 1-4 novel Mini LED device in a poor light, including Mini LED chip 1, the fixed electrode slice 7 that is equipped with in both sides of Mini LED chip 1 lower extreme, mini LED chip 1's upside is equipped with flexible waterproof insulation layer 4, flexible waterproof insulation layer 4's middle part is equipped with adapter card hole 8, mini LED chip 1's downside is equipped with flexible insulating substrate 3, the fixed spacing groove 10 that is equipped with in upper end of flexible insulating substrate 3, the inside of spacing groove 10 is equipped with conducting layer 9, the fixed flexible stretch-proofing layer 2 that is equipped with of lower extreme of flexible insulating substrate 3, the fixed insulating waterproof bottom plate 6 that is equipped with of lower extreme on flexible stretch-proofing layer 2, the fixed flexible optical colloid 5 that is equipped with in upper end of flexible waterproof insulation layer 4.

Further, in the above scheme, the number of the electrode plates 7 is two, and the electrode plates are correspondingly arranged on two sides of the vertical central axis of the Mini LED chip 1 in the overlooking direction, and the outer end surface of the Mini LED chip 1 is matched with the inner end surface of the adapter hole 8.

Further, in the above scheme, two conducting layers 9 and two limiting grooves 10 are provided and are correspondingly arranged on two sides of the vertical central axis of the flexible insulating substrate 3 in the overlooking direction, so that the Mini LED chip 1 can be conveniently welded and fixed, the outer single surface of each conducting layer 9 is matched with the inner end surface of each limiting groove 10, the thickness of each conducting layer 9 in the main viewing direction is 10-50 μm, so that the thickness can be reduced, the thickness of the flexible waterproof insulating layer 4 in the main viewing direction is 10-30 μm, the flexible insulating substrate 3 is made of an anti-bending material and has a thickness of 30-120 μm, so that the strength of the overall structure of the Mini LED backlight device can be increased, the possibility that the Mini LED device is broken when the flexible waterproof insulating layer 4 is pulled can be reduced, the waterproof performance of the Mini LED chip 1 can be increased, and the thickness of the overall structure of the Mini LED backlight device can be reduced through the arrangement of the thickness.

Further, in the above scheme, the flexible optical colloid 5 is disposed in a fully-coated state at the outer end surface of the Mini LED chip 1 in the overlooking direction, thereby increasing the upwind of the Mini LED chip 1 in the overall structure, the flexible optical colloid 5 is made of a highly transparent colloid material, thereby increasing the light transmittance of the flexible optical colloid 5, and the thickness of the insulating waterproof bottom plate 6 in the main viewing direction is 10 to 30 μm, thereby reducing the overall thickness of the Mini LED backlight device and increasing the applicability of the device.

The utility model discloses theory of operation:

the utility model discloses when installing fixedly, with flexible insulating substrate 3, flexible stretch-proofing layer 2 and insulating waterproof bottom plate 6 are pasted together in proper order, set up conducting layer 9 in the inside of spacing groove 10 afterwards, be in the same place Mini LED chip 1 and conducting layer 9 welding afterwards, paste flexible waterproof insulation layer 4 in flexible insulating substrate 3's upper end afterwards, paste fixed back with it and drip flexible optical colloid 5 in Mini LED chip 1's upper end, wait for its self solidification can, when it receives outside power, the flexible stretch-proofing layer 2 of setting, flexible insulating substrate 3 and insulating waterproof bottom plate 6 can increase Mini LED backlight unit overall structure's intensity under the interact condition, reduce its cracked probability.

The points to be finally explained are: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to common designs, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel Mini LED backlight device comprises a Mini LED chip (1), and is characterized in that: the fixed electrode slice (7) that is equipped with in both sides of Mini LED chip (1) lower extreme, the upside of Mini LED chip (1) is equipped with flexible waterproof insulation layer (4), the middle part of flexible waterproof insulation layer (4) is equipped with adapter card hole (8), the downside of Mini LED chip (1) is equipped with flexible insulating substrate (3), the fixed spacing groove (10) that is equipped with in upper end of flexible insulating substrate (3), the inside of spacing groove (10) is equipped with conducting layer (9), the fixed flexible stretch-proofing layer (2) that is equipped with of lower extreme of flexible insulating substrate (3), the fixed insulating waterproof bottom plate (6) that is equipped with of lower extreme on flexible stretch-proofing layer (2), the fixed flexible optical colloid (5) that is equipped with in upper end of flexible waterproof insulation layer (4).

2. The novel Mini LED backlight device as claimed in claim 1, wherein: the number of the electrode plates (7) is two, the electrode plates are correspondingly arranged on two sides of a vertical central axis of the overlooking direction of the Mini LED chip (1), and the outer end face of the Mini LED chip (1) is matched with the inner end face of the adaptive clamping hole (8).

3. The novel Mini LED backlight device as claimed in claim 1, wherein: the number of the conducting layers (9) and the limiting grooves (10) is two, the conducting layers and the limiting grooves are correspondingly arranged on two sides of a vertical central axis of the flexible insulating substrate (3) in the overlooking direction, the outer single surface of each conducting layer (9) is matched with the inner end surface of each limiting groove (10), and the thickness of each conducting layer (9) in the front view direction is 10-50 microns.

4. The novel Mini LED backlight device as claimed in claim 1, wherein: the thickness of the flexible waterproof insulating layer (4) in the main view direction is 10-30 mu m, and the flexible insulating substrate (3) is made of an anti-bending material and has a thickness of 30-120 mu m.

5. The novel Mini LED backlight device as claimed in claim 1, wherein: the flexible optical colloid (5) is arranged in a fully-coated state at the outer end surface of the Mini LED chip (1) in the overlooking direction, and the flexible optical colloid (5) is made of a highly-transparent colloid material.

6. The novel Mini LED backlight device as claimed in claim 1, wherein: the thickness of the insulating waterproof bottom plate (6) in the main view direction is 10-30 mu m.