CN217641275U - Device for transferring electronic components - Google Patents

Abstract

The utility model provides a device for shifting electronic component, including first load-bearing platform, second load-bearing platform, laser production device and optical adjustment module. The first bearing platform is used for bearing a first carrier, and an electronic component is arranged on the surface of the first carrier; for the second load-bearing platformCarrying a second carrier, and enabling the second carrier to be arranged opposite to the first carrier; the laser generating device may project a laser beam having a first irradiation range; the optical adjusting module is arranged between the first bearing platform and the laser generating device, and the laser beam is shot to the first bearing platform through the optical adjusting module; wherein the first irradiation range of the laser beam is adjusted by the optical adjustment module to become a second irradiation range, the second irradiation range is larger than the first irradiation range, and the second irradiation range is 1-10000 mm ² . Utilize the utility model discloses a scheme is favorable to shifting the electronic component on the first carrier to the second carrier.

Description

Device for transferring electronic components

Technical Field

The present invention relates to an apparatus for transferring electronic components, and more particularly, to an apparatus for transferring electronic components including an optical adjustment module.

Background

Currently, light-Emitting diodes (LEDs) are widely used because of their characteristics such as good Light quality and high Light-Emitting efficiency. Generally, in order to make a display device using leds as light emitting elements have better color rendering capability, the prior art uses led chips with three colors of red, green and blue to be matched with each other to form a full color led display device, which can emit light with three colors of red, green and blue through the led chips with three colors of red, green and blue, respectively, and then form full color light through light mixing to display related information. However, in the prior art, the substrate carrying the led chip needs to be removed in the process of fixing the led chip on the circuit substrate.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the problem that will solve lies in: the shortcomings of the prior art are addressed by providing an apparatus for transferring electronic components.

In order to solve the above technical problem, one of the technical solutions of the present invention is to provide a device for transferring an electronic component, which includes a first carrying platform, a second carrying platform, a laser generating device and an optical adjusting module. The first bearing platform is used for bearing a first carrier, and an electronic assembly is arranged on the surface of the first carrier; the second bearing platform is used for bearing a second carrier and enabling the second carrier to be arranged opposite to the first carrier; the laser generating device may project a laser beam having a first irradiation range; the optical adjusting module is arranged between the first bearing platform and the laser generating device, and the laser beam is emitted to the first bearing platform through the optical adjusting module; wherein the first irradiation range of the laser beam is adjusted by the optical adjustment module to become a second irradiation range, and the second irradiation range is larger than the first irradiation rangeA first irradiation range and a second irradiation range of 1-10000 mm ² 。

Preferably, the optical adjustment module is a lens.

Drawings

For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the invention.

Fig. 1 is a first operation diagram of a laser heating device applied to fixedly connecting LEDs according to a first embodiment of the device for transferring electronic components of the present invention.

Fig. 2 is a second operation schematic diagram of the laser heating device for fixedly connecting the LED according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 3 is a third schematic diagram of the laser heating device for fixedly connecting the LEDs according to the first embodiment of the present invention.

Fig. 4 is a fourth schematic operation diagram of the laser heating device for fixedly connecting LEDs according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 5 is a fifth schematic operation diagram of the laser heating device for fixedly connecting the LEDs according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 6 is an enlarged view of section VI in fig. 5.

Fig. 7 is a schematic view of the second irradiation range of the laser source of the first embodiment of the apparatus for transferring electronic components according to the present invention.

Fig. 8 is a sixth schematic operation diagram of the laser heating device for fixedly connecting the LEDs according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 9 is a seventh schematic operation diagram of the laser heating device for fixedly connecting the LEDs according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 10 is an eighth schematic operation diagram of the laser heating device for fixedly connecting the LEDs according to the first embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 11 is a first operation diagram of a laser heating device for fixedly connecting an LED according to a second embodiment of the apparatus for transferring an electronic component of the present invention.

Fig. 12 is a second operation diagram of the laser heating device for fixedly connecting the LED according to the second embodiment of the device for transferring electronic components of the present invention.

Fig. 13 is a schematic structural diagram of a part of modules of a third embodiment of the device for transferring electronic components, which is applied to a laser heating device for fixedly connecting LEDs.

Fig. 14 is a functional block diagram of a laser heating device for fixedly connecting an LED according to a third embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 15 is a first operation diagram of a laser heating device for fixedly connecting LEDs according to a fourth embodiment of the apparatus for transferring electronic components of the present invention.

Fig. 16 is a second operation diagram of the laser heating device for fixedly connecting the LED according to the fourth embodiment of the device for transferring electronic components of the present invention.

Fig. 17 is a schematic view of a fifth embodiment of the apparatus for transferring electronic components according to the present invention.

Reference numerals

10 a circuit substrate; 100 conductive pads; 101 an electrical conductor; 102 a light emitting diode chip; 1020 a base layer; 50 means for transferring electronic components; 51 a first load-bearing platform; 511 a first vector; 512 an electronic component; 52 a second load-bearing platform; 521 a second vector; 53 laser generating means; 54 an optical adjustment module; f, contacting an interface; an L laser source; an M light emitting layer; m1 bearing a substrate; an M2 optical module; an M3 laser generation module; m4 chip taking and placing module; m5, a temperature control module; an M6 control module; 5363 a conductive layer of the type N n; 5363 a conductive layer of the type P p; r1 a first irradiation range; r2 a second irradiation range; z laser heating device.

Detailed Description

The following is a description of the embodiments of the present invention relating to a "device for transferring electronic components" with specific embodiments, and those skilled in the art can understand the advantages and effects of the present invention from the disclosure of the present specification. The present invention can be implemented or applied through other different embodiments, and various details in the present specification can be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. The drawings of the present invention are merely schematic illustrations, and are not drawn to scale, but are described in advance. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are primarily used to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.

[ first embodiment ]

Referring to fig. 1 to 10 together with fig. 14, a first embodiment of the present invention provides a laser heating apparatus Z for fixedly connecting an LED, including: a carrier substrate M1, an optical module M2, and a laser generating module M3.

First, referring to fig. 1 and 2, the circuit substrate 10 is carried on the carrier substrate M1, and the carrier substrate M1 may be a stage device having a displacement function, but not limited thereto. The circuit substrate 10 includes a plurality of conductive pads 100, a plurality of conductors 101 and a plurality of led chips 102, wherein the conductors 101 are disposed on the conductive pads 100, respectively; for example, at least one conductor 101 may be disposed on each conductive pad 100, and the conductor 101 may be a solder ball or other conductive material, but not limited thereto. The led chips 102 are disposed on the circuit substrate 10, and each led chip 102 is disposed on at least two conductors 101.

Further say, cooperate that fig. 3 is shown, the utility model provides a be applied to rigid coupling LED's laser heating device Z still further includes: a chip pick-and-place module M4 adjacent to the carrier substrate M1 for placing each led chip 102 on at least two corresponding electrical conductors 101. For example, the present invention can further place a plurality of led chips 102 on the circuit substrate 10 through the chip pick-and-place module M4, and each led chip 102 corresponds to at least two electrical conductors 101. The chip pick-and-place module M4 may be a vacuum nozzle or any kind of pick-and-place machine (pick and place machine). However, the present invention is not limited to the above examples.

The optical module M2 is disposed above the carrier substrate M1 and located between the laser generating module M3 and the circuit substrate 10, and the optical module M2 may be a lens structure or a light guide plate structure, but not limited thereto. The laser generating module M3 may provide a laser source L having a first irradiation range R1 and project toward the optical module M2. The first irradiation range R1 of the laser source L forms a second irradiation range R2 through optical adjustment of the optical module M2; in the embodiment, the first irradiation range R1 is taken as an example that the first irradiation range R1 is smaller than the second irradiation range R2, but not limited thereto. The first irradiation range R1 and the second irradiation range R2 may have the same or different shapes.

Further, as shown in fig. 4 to 7, when the laser light source L of the second irradiation range R2 is projected to each of the led chips 102, the laser light source L passes through the N-type conductive layer N, the light emitting layer M and the P-type conductive layer P of the led chip 102 and is further projected on the at least two conductors 101 of the circuit substrate 10; the laser source L generated by the laser generating module M3 passes through the led chip 102 to be projected to the conductor 101 and the circuit board 10. Further, as shown in fig. 6, each of the LED chips 102 may be a Micro semiconductor light emitting device (Micro LED), which includes an N-type conductive layer N, a light emitting layer M and a P-type conductive layer P, wherein the N-type conductive layer N is a N-type gan material layer or an N-type gaas material layer, the light emitting layer M is a multi-quantum well structure layer, and the P-type conductive layer P is a P-type gan material layer or a P-type gaas material layer, but not limited thereto. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

Furthermore, as shown in fig. 7, the second irradiation range R2 of the laser source L may cover a plurality of led chips 102, for example, the second irradiation range R2 may cover 4 × 4 led chips 102, but not limited thereto. Furthermore, the present invention can also adjust the intensity of the laser source L of the laser generating module M3, so that the laser source L generated by the laser generating module M3 only passes through the led chip 102, and does not pass through the circuit board 10. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

Finally, as shown in fig. 6 and 8, the conductor 101 provided between the light emitting diode chip 102 and the circuit board 10 is cured by irradiation with the laser light source L, so that the light emitting diode chip 102 is fixed to the circuit board 10. For example, when the conductor 101 disposed between the led chip 102 and the circuit board 10 is irradiated by the laser light source L, the conductor is softened and connected to the led chip 102. Then, after the conductor 101 is cured, the led chip 102 is fixed to the circuit board 10 and electrically connected to the circuit board 10 through the conductor 101. However, the present invention is not limited to the above examples.

In addition, as shown in fig. 9 to 10, the laser heating device Z for fixedly connecting LEDs provided by the present invention can further project the laser source L generated by the laser generating module M3 to the contact interface F between the LED chip 102 and the conductor 101, so as to reduce the connection strength between the LED chip 102 and the conductor 101, so that the LED chip 102 can be easily detached from the conductor 101 and taken down from the circuit substrate 10. For example, the present invention can also project the laser source L generated by the laser generating module M3 to the contact interface F between the led chip 102 and the solidified conductor 101, so as to soften the portion of the conductor 101 close to the contact interface F, thereby reducing the connection strength and the bonding force between the led chip 102 and the conductor 101, and further making the led chip 102 easily separate from the conductor 101 and be taken down from the circuit substrate 10. Then, at least two old conductors 101 separated from the led chip 102 can be removed from the circuit substrate 10 by a special tool (e.g., a scraper or a grinder) so that new conductors 101 can be replaced later. However, the present invention is not limited to the above examples.

Furthermore, as shown in fig. 1 to 10, the present invention can also provide a laser heating device Z for fixedly connecting LEDs, which includes: a circuit substrate 10, an optical module M2, and a laser generating module M3. The circuit substrate 10 is used for carrying a plurality of conductors 101 and a plurality of led chips 102. The optical module M2 is disposed above the circuit substrate 10. The laser generating module M3 is adjacent to the optical module M2 to provide the laser light source L with the first irradiation range R1. The conductor 101 is irradiated by the laser source L to fix the led chip 102, the first irradiation range R1 of the laser source L is optically adjusted by the optical module M2 to form a second irradiation range R2, and the first irradiation range R1 is greater than, less than or equal to the second irradiation range R2.

It is to be noted that, in the above embodiment, the wavelengths of the laser light source L for bonding the conductive body 101 and the led chip 102 and the laser light source L for reducing the bonding force of the conductive body 11 may be different from or the same as each other.

[ second embodiment ]

Referring to fig. 11 and 12, and referring to fig. 1 to 10, a laser heating device Z for fixedly connecting an LED according to a second embodiment of the present invention is similar to the laser heating device Z for fixedly connecting an LED according to the first embodiment, and therefore, the similar operation manner is not repeated. Further, referring to fig. 6, and comparing fig. 11 and 12 with fig. 5 and 8, the difference between the second embodiment and the first embodiment of the present invention is that each LED chip 102 of the present invention can be a submillimeter LED (Mini LED), which includes a base layer 1020, an N-type conductive layer N, a light emitting layer M penetrated by a laser source L, and a P-type conductive layer P, the base layer 1020 is a sapphire (sapphire) layer, the N-type conductive layer N can be an N-type gallium nitride layer or an N-type gallium arsenide layer, the light emitting layer M is a multiple quantum well structure layer, and the P-type conductive layer P can be a P-type gallium nitride layer or a P-type gallium arsenide layer, but not limited thereto. The base layer 1020 may also be a quartz base layer, a glass base layer, a silicon base layer, or a base layer of any material. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

For example, when the laser light source L of the second irradiation range R2 is directed to each led chip 102, it passes through the base layer 1020, the N-type conductive layer N, the light emitting layer M and the P-type conductive layer P, and then is projected onto at least two conductors 101 of the circuit substrate 10. Next, the conductor 101 provided between the light emitting diode chip 102 and the circuit board 10 is cured by irradiation of the laser light source L, so that the light emitting diode chip 102 is fixed to the circuit board 10. However, the above-mentioned example is only one of the possible embodiments and is not intended to limit the present invention.

[ third embodiment ]

Referring to fig. 13 and 14 together with fig. 1 to 12, a laser heating device Z for fixedly connecting LEDs according to a third embodiment of the present invention is similar to the laser heating device Z for fixedly connecting LEDs according to the first embodiment, and therefore, the similar operation is not repeated. Further, the third embodiment of the present invention is different from the first embodiment in that the laser heating device Z further includes: a temperature control module M5 and a control module M6. The temperature control module M5 is adjacent to the carrier substrate M1, and is used for detecting the temperature of the electrical conductor 101 to obtain the temperature information of the electrical conductor. The control module M6 is electrically connected between the temperature control module M5 and the laser generating module M3. The control module M6 adjusts the power output by the laser generating module M3 according to the temperature information of the conductive object.

For example, the temperature control module M5 may be a temperature sensor or a temperature controller, but not limited thereto. The sensing terminal of the temperature control module M5 can be disposed in the carrier substrate M1 and adjacent to the circuit substrate 10, or the sensing terminal of the temperature control module M5 can be disposed outside the carrier substrate M1 and adjacent to one or a part of the conductive body 101 on the circuit substrate 10. In addition, the control module M6 is electrically connected to the carrier substrate M1, the laser generating module M3, the chip pick-and-place module M4, and the temperature control module M5. Therefore, at the same time as or after the laser source L is projected onto the conductor 101 on the circuit substrate 10, the temperature of the conductor 101 can be detected by the temperature control module M5, and the conductor temperature information can be obtained. Then, the control module M6 can determine whether the power output by the laser generating module M3 is sufficient, too low, or too high (for example, the conductor temperature information is compared with the default temperature information, but not limited thereto) according to the conductor temperature information, so as to appropriately adjust the power output by the laser generating module M3. However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.

It is worth mentioning, cooperation fig. 1 to fig. 14 are shown, the utility model discloses still provide a laser heating device Z who is applied to rigid coupling LED, it includes: the laser module comprises a circuit substrate 10, an optical module M2, a laser generating module M3, a temperature control module M5 and a control module M6. The circuit board 10 is used for carrying a plurality of conductors 101; the optical module M2 is disposed above the circuit substrate 10; the laser generation module M3 is adjacent to the optical module M2 to provide the laser source L with the first irradiation range R1; the temperature control module M5 is adjacent to the circuit substrate 10 and is used for detecting the temperature of the conductor 101 to obtain the temperature information of the conductor; the control module M6 is electrically connected between the temperature control module M5 and the laser generating module M3; the first irradiation range R1 of the laser source L forms the second irradiation range R2 by optical adjustment of the optical module M2, the first irradiation range R1 is greater than, less than or equal to the second irradiation range R2, and the first irradiation range R1 and the second irradiation range R2 have the same or different shapes. The control module M6 adjusts the power output by the laser generating module M3 according to the temperature information of the conductive object.

[ fourth embodiment ]

Referring to fig. 15 and 16, and referring to fig. 1 to 14, a laser heating device Z for fixedly connecting an LED according to a fourth embodiment of the present invention is similar to the laser heating device Z for fixedly connecting an LED according to the first embodiment, and therefore, the similar operation manner is not repeated. Further, as shown by comparing fig. 15 with fig. 2 and fig. 3, the fourth embodiment of the present invention is different from the first embodiment in that the laser heating device Z may further include at least two electrical conductors 101 disposed on each led chip 102.

For example, in the present invention, at least two conductors 101 may be disposed on each led chip 102, and the conductors 101 may be solder balls or other conductive materials, but not limited thereto. Next, as shown in fig. 15, a plurality of led chips 102 are placed on the circuit substrate 10 by the chip pick-and-place module M4, and at least two conductors 101 of each led chip 102 are corresponding to the conductive pads 100 of the circuit substrate 10. Then, the laser light is emitted to the led chip 102 by the laser light source L generated by the laser light generation module M3. Next, the conductor 101 disposed between the light emitting diode chip 102 and the circuit board 10 is softened by the irradiation of the laser light source L, and is connected to the circuit board 10. Finally, after the conductor 101 is cured, the led chip 102 is fixed to the circuit board 10 and electrically connected to the circuit board 10 through the conductor 101. However, the present invention is not limited to the above examples.

[ fifth embodiment ]

Referring to fig. 17, a fifth embodiment of the present invention provides an apparatus 50 for transferring electronic components, comprising: a first carrying platform 51, a second carrying platform 52, a laser generating device 53 and an optical adjusting module 54. The first carrying platform 51 is used for carrying the first carrier 511, and an electronic component 512 is disposed on a surface of the first carrier 511; the second carrying platform 52 is used for carrying the second carrier 521, and the second carrier 521 is arranged opposite to the first carrier 511; the laser generating device 53 may project a laser beam having a first irradiation range R1; the optical adjustment module 54 is disposed on the first supporting platform 51 and the laserBetween the light generating devices 53, and the laser beam is emitted to the first carrying platform 51 through the optical adjustment module 54; wherein the first irradiation range R1 of the laser beam is adjusted by the optical adjustment module 54 to become a second irradiation range R2, the second irradiation range R2 is larger than the first irradiation range R1, and the second irradiation range R2 is 1-10000 mm ² . Wherein the electronic component 512 is detached from the first carrier 511 by the irradiation of the laser beam having the second irradiation range R2 and falls to the second carrier 521 located below the first carrier 511 to complete the transfer of the electronic component 512.

In a preferred embodiment, the optical adjustment module is a lens, but the invention is not limited thereto.

[ advantageous effects of the embodiments ]

The beneficial effects of the utility model reside in that, the utility model provides a be applied to rigid coupling LED's laser heating device Z, it can include through "be applied to rigid coupling LED's laser heating device Z: a carrying substrate M1, an optical module M2, a laser generating module M3, the optical module M2 being disposed above the carrying substrate M1, the laser generating module M3 being adjacent to the optical module M2 to provide a laser source L having a first irradiation range R1 and a conductive body 101 to be irradiated by the laser source L to fixedly connect the led chip 102, the first irradiation range R1 of the laser source L being optically adjusted by the optical module M2 to form a second irradiation range R2, the first irradiation range R1 being larger than, smaller than or equal to the second irradiation range R2", so that the led chip is fixedly connected to the circuit substrate 10.

Furthermore, the laser heating device Z for fixedly connecting the LED provided by the present invention can utilize the optical module M2 to optically adjust to convert the first irradiation range R1 of the laser source L into the second irradiation range R2, so as to perform the die bonding process of the LED chip 102.

Furthermore, the utility model provides a device for shifting electronic component can adjust the first irradiation range of laser beam for great second irradiation range to do benefit to and shift the electronic component on the first carrier to the second carrier.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the scope of the claims of the present invention, so that all the modifications of the equivalent technology made by the disclosure of the present invention and the attached drawings are included in the scope of the claims of the present invention.

Claims (2)

1. An apparatus for transferring electronic components on a first carrier to a second carrier, comprising:

the first bearing platform is used for bearing the first carrier, and the surface of the first carrier is provided with the electronic component;

the second bearing platform is used for bearing the second carrier and enabling the second carrier to be arranged opposite to the first carrier;

a laser generating device capable of projecting a laser beam having a first irradiation range; and

the optical adjusting module is arranged between the first bearing platform and the laser generating device, and the laser beam is shot to the first bearing platform through the optical adjusting module to form a second irradiation range;

wherein the second irradiation range is larger than the first irradiation range, and the second irradiation range is 1-10000 mm ² 。

2. The apparatus for transferring electronic components of claim 1, wherein the optical adjustment module is a lens.

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