CN217641235U - Fixing tool for packaging semiconductor - Google Patents

Abstract

The utility model discloses a fixed frock of encapsulation semiconductor, the fixed frock of encapsulation semiconductor includes: the semiconductor packaging device comprises a loading plate and a press-mounting piece, wherein the loading plate is provided with a containing groove used for containing a packaged semiconductor; the press-fitting member is movably disposed on a peripheral side of the loading plate and adapted to press against a package frame of the packaged semiconductor after the packaged semiconductor is fitted into the accommodating groove. Therefore, by arranging the loading plate and the pressing piece, the packaged semiconductor can be borne and compressed, the packaged semiconductor is accurately positioned, the packaging frame which is warped can be flattened or the warping of the packaging frame is avoided, the subsequent processing of the packaged semiconductor is facilitated, the pressing piece is movably arranged on the peripheral side of the loading plate, the end part of the packaged semiconductor is compressed by the pressing piece, the operation difficulty of mounting the packaged semiconductor on a fixed tool is reduced, the packaged semiconductor is convenient to mount and dismount, and the production efficiency can be improved.

Description

Fixing tool for packaging semiconductor

Technical Field

The utility model belongs to the technical field of the semiconductor package technique and specifically relates to a fixed frock of encapsulation semiconductor is related to.

Background

In a semiconductor packaging process, a PDFN (Power Dual Flat No-lead Chinese name) appearance product is subjected to laser printing on the surface of a packaged semiconductor after packaging is finished, and the requirement of the printing process on the shape of the packaged semiconductor is strict.

The thickness of PDFN product frame is thin, and it warp in the production process takes place easily, and it warp the back and print and easily appear seal content phenomenon such as unstable, can destroy the aesthetic property of product, takes place for avoiding this phenomenon, adopts fixed frock to fix the encapsulation semiconductor usually, and nevertheless current fixed frock can't realize effective location, and the pressfitting is bad with fixed frock appearance easily, and fixed frock debugging is comparatively complicated.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the utility model is to provide a fixed frock of encapsulation semiconductor, the fixed frock of encapsulation semiconductor can accurate location encapsulation semiconductor, reduces the probability of its deformation.

According to the utility model discloses encapsulation semiconductor's fixed frock, include: the semiconductor packaging device comprises a loading plate and a press-fitting piece, wherein the loading plate is provided with a containing groove used for containing a packaged semiconductor; the press-fitting member is movably disposed on a circumferential side of the loading plate and adapted to press against a package frame of the packaged semiconductor after the packaged semiconductor is fitted into the receiving groove.

According to the utility model discloses fixed frock of encapsulation semiconductor, through setting up loading plate and pressure equipment piece, can bear and compress tightly the encapsulation semiconductor, realize accurate location to the encapsulation semiconductor, can flatten or avoid the encapsulation frame that takes place the warpage to appear the warpage, the subsequent processing of the encapsulation semiconductor of being convenient for, and through setting up pressure equipment piece in the week side of loading the plate movablely, the tip of the pressure equipment piece of being convenient for compress tightly the encapsulation semiconductor has reduced the operation degree of difficulty of encapsulation semiconductor installation on fixed frock, be convenient for install and dismantle the encapsulation semiconductor, can improve production efficiency.

In some embodiments, both ends of the accommodating groove in the length direction are open, and the press-fitting member is disposed at an end of the loading plate and adapted to press against the package frame at both ends of the package frame.

Specifically, the press-fitting member includes: the connecting piece is arranged on the end face of the loading plate; the rotating shaft block is connected with the connecting piece; the pressing plate and the driving piece are arranged on two sides of the rotating shaft block and are suitable for pushing the driving piece to drive the pressing plate to rotate relative to the connecting piece, so that the pressing plate is switched between an opening position far away from the accommodating groove and a pressing position above the accommodating groove.

Further, the connector includes: the connecting plate is connected with the loading plate, and the matching plate is in pivot connection with the rotating shaft block.

In some embodiments, the platen comprises: the fixing plate is connected with the rotating shaft block, and the pressing parts are used for pressing the packaging frame.

Specifically, the driving member includes: the rotary shaft device comprises a base plate and a T-shaped block arranged above the base plate, wherein the T-shaped block is connected with the rotary shaft block.

Further, the press fitting further comprises: the bottom plate is provided with an elastic piece fixing groove, the elastic piece is arranged in the elastic piece fixing groove, and the other end of the elastic piece is pushed against the connecting piece.

In some embodiments, the base plate is provided with a driving arm, and the driving arm is suitable for being linked with a power source to push the rotating shaft block, the pressure plate and the driving piece to synchronously rotate relative to the connecting piece.

Specifically, the loading plate includes: the plate body and the vertical plates are located on two sides of the plate body, the accommodating groove is defined by the plate body and the vertical plates, a step plate is further arranged on one side, facing the accommodating groove, of each vertical plate, and the press fitting piece is pressed against the step plate.

Furthermore, a taking groove is formed in the vertical plate, and a sensor avoiding hole is formed in the plate body.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a fixing tool for packaging a semiconductor according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a platen according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a rotating shaft block according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a driving member according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a connector according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a loading plate according to an embodiment of the present invention;

fig. 7 is a schematic illustration of a disassembly of a press fitting according to an embodiment of the invention;

fig. 8 is an angled side view of a press fitting according to an embodiment of the invention;

fig. 9 is a side view from another angle of the press fitting according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a power source thrust pressing assembly according to an embodiment of the present invention.

Reference numerals:

a fixing tool 100 for packaging a semiconductor, a power source 200,

the plate (10) is loaded on the plate,

the plate body 11, the sensor avoiding hole 111,

the vertical plate 12, the step plate 121, the first step surface 1211, the second step surface 1212, the taking groove 12121,

the positioning groove 13, the positioning column 14,

the press-fit part 20 is provided with a press-fit part,

the coupling member 21, the coupling plate 211, the fitting plate 212, the circular shaft hole 2121, the circular groove 213,

the rotation shaft block 22, the connection block 221, the rotation shaft 222,

the pressing plate 23, the fixing plate 231, the recess 2311, the pressing part 232,

a driving member 24, a base plate 241, an elastic member fixing groove 2411, a T-shaped block 242, a driving arm 243,

and an elastic member 25.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

A fixing tool 100 for encapsulating a semiconductor according to an embodiment of the present invention is described below with reference to fig. 1 to 10.

As shown in fig. 1, a fixing tool 100 for packaging a semiconductor according to an embodiment of the present invention includes: loading plate 10, press fitting 20.

Wherein, the loading plate 10 has a receiving slot 13, and the receiving slot 13 is used for receiving the packaged semiconductor; the press-fitting member 20 is movably disposed on the circumferential side of the loading plate 10 and adapted to press against a package frame of the packaged semiconductor after the packaged semiconductor is fitted to the receiving container 13.

Specifically, the loading plate 10 is disposed in a first direction, which is the a direction shown in fig. 1, and the press-fitting members 20 are disposed in a second direction, which is the B direction shown in fig. 1. The upper surface of the loading plate 10 is recessed downward to form an accommodating groove 13, the accommodating groove 13 extends along a first direction, the length of the accommodating groove 13 is the same as that of the loading plate 10 (i.e. the accommodating groove 13 penetrates through the loading plate 10), the semiconductor package is placed in the accommodating groove 13, and the press-fitting member 20 is disposed on the peripheral side of the loading plate 10 (which may be located at the end or on the side of the loading plate 10).

It should be noted that the loading plate 10 is fixedly disposed, the press-fitting member 20 can move relative to the loading plate 10, and the two may be configured in a flip-fit manner, a sliding fit manner, or other fitting manners. Illustratively, in a form that the two are arranged to be matched in an overturning manner, the loading plate 10 is fixed, the press-fitting member 20 can be overturned relative to the loading plate 10, can be overturned to be away from the loading plate 10, and can also be overturned to press against the loading plate 10, the press-fitting member 20 can rotate towards a direction away from the loading plate 10, and after the press-fitting member 20 rotates away from a range opposite to the loading plate 10, the packaged semiconductor can be placed in the accommodating groove 13; after the packaged semiconductor is placed in the accommodating groove 13, the press-fitting member 20 can rotate toward the direction close to the loading plate 10 until the press-fitting member 20 presses against the packaged semiconductor, so as to fix the packaged semiconductor.

In addition, the packaged semiconductor comprises a package frame and a PDFN (Power Dual Flat No-lead, chinese name) product, wherein the thickness of the package frame is thin, the package frame is easy to deform in the production process, the package frame is arranged in the accommodating groove 13, the press fitting part 20 is used for pressing the package frame, accurate positioning can be realized, and the package frame can be prevented from deforming and warping.

According to the utility model discloses fixed frock 100 of encapsulation semiconductor, through setting up loading plate 10 and pressure equipment piece 20, can bear and compress tightly the encapsulation semiconductor, realize accurate location to the encapsulation semiconductor, can flatten or avoid the encapsulation frame that warping takes place to appear the warpage, be convenient for encapsulate the follow-up processing of semiconductor, and through setting up pressure equipment piece 20 in the week side of loading plate 10 movablely, the tip of the encapsulation semiconductor is compressed tightly to the pressure equipment piece 20 of being convenient for, the operation degree of difficulty of encapsulation semiconductor installation on fixed frock 100 has been reduced, be convenient for install and dismantle the encapsulation semiconductor, can improve production efficiency.

As shown in fig. 1, in some embodiments, both ends of the receiving groove 13 in the length direction are open, and the press-fitting members 20 are disposed at the ends of the loading plate 10 and adapted to press the package frame at both ends thereof.

It should be noted that, two ends of the loading plate 10 located in the first direction are respectively provided with one press-fitting part 20, two ends of the accommodating groove 13 in the length direction are open, the first direction is the length direction, the press-fitting parts 20 can extend into the accommodating groove 13 from two ends of the accommodating groove 13 in the length direction, the package frame is arranged in the accommodating groove 13, two ends of the package frame are located at two ends of the accommodating groove 13 in the length direction, and the two press-fitting parts 20 extend into the accommodating groove 13 and press against two ends of the package frame. Set up like this, can compress tightly the tip of encapsulation frame, make it closely laminate with storage tank 13, improve positioning accuracy, avoid encapsulation frame to take place skew, warpage, reduce the probability of its deformation, can make the upper surface of encapsulation semiconductor more level and more smooth, subsequent handling such as the laser printing of being convenient for, and can improve subsequent handling's machining precision and result of processing, for example: the beauty of the packaged semiconductor after laser printing is improved.

As shown in fig. 1 and 7, specifically, the press-fitting member 20 includes: the loading device comprises a connecting piece 21, a rotating shaft block 22, a pressure plate 23 and a driving piece 24, wherein the connecting piece 21 is arranged on the end face of the loading plate 10; the rotating shaft block 22 is connected with the connecting piece 21; the pressing plate 23 and the driving member 24 are disposed on two sides of the rotating shaft block 22, and are adapted to push the driving member 24 to drive the pressing plate 23 to rotate relative to the connecting member 21, so that the pressing plate 23 is switched between an open position away from the accommodating groove 13 and a pressing position pressed against the upper side of the accommodating groove 13.

Specifically, the pressing plate 23 is arranged above the connecting piece 21 and the rotating shaft block 22 and connected with the rotating shaft block 22, the driving piece 24 is arranged below the connecting piece 21 and the rotating shaft block 22 and connected with the rotating shaft block 22, the connecting piece 21 is arranged between the rotating shaft block 22 and the loading plate 10, one side of the connecting piece 21 is connected with the end part of the loading plate 10, the other side of the connecting piece 21 is connected with the rotating shaft block 22, one side of the connecting piece 21 connected with the rotating shaft block 22 can rotate, and the rotation of the connecting piece 21 and the rotating shaft block 22 can push the driving piece 24 to drive the pressing plate 23 to turn over.

It should be noted that the pressing plate 23 rotates towards the direction away from the containing groove 13, and when the pressing plate 23 rotates away from the range over the containing groove 13, that is, the upper side of the containing groove 13 is open, the pressing plate 23 is in the open position, and at this time, the packaged semiconductor can be placed in the containing groove 13; when the packaged semiconductor is placed in the receiving cavity 13, the pressing plate 23 can rotate in a direction close to the receiving cavity 13, and when the pressed packaged semiconductor is pressed against the top of the packaged semiconductor, the pressing plate 23 is in a pressed-down position. The pressing plate 23 is switchable between an open position and a depressed position to mount or dismount the packaged semiconductor and to press the packaged semiconductor.

By the arrangement, the arrangement form and principle of the press fitting part 20 are simple, the packaged semiconductor is convenient to mount or dismount through the overturning of the pressing plate 23, the mounting or dismounting difficulty is reduced, the connection mode of the press fitting part 20 and the loading plate 10 is simple, and the press fitting part 20 is arranged at the end part of the loading plate 10 and is convenient to compress and package the semiconductor.

As shown in fig. 5, in some embodiments, the connection member 21 includes: the connecting plate 211 is connected to the loading plate 10, and the fitting plate 212 is pivotally connected to the rotary shaft block 22.

Specifically, the connecting member 21 may be configured as a "not" structure, wherein the transverse extension portion is a connecting plate 211, the longitudinal extension portion is a matching plate 212, the transverse extension portion is located in the second direction, the longitudinal extension portion is located in the first direction, one side of the connecting plate 211 is provided with two matching plates 212, the two matching plates 212 are spaced and arranged in parallel, the matching plate 212 is perpendicular to the connecting plate 211, each of the two matching plates 212 is provided with a circular shaft hole 2121, and both ends of the connecting plate 211 are provided with two through holes.

In addition, as shown in fig. 3, the rotation shaft block 22 includes a connection block 221 and rotation shafts 222 located at both sides of the connection block 221, the connection block 221 is configured in a rectangular structure, and the rotation shafts 222 are cylindrical shafts. As shown in fig. 6, two positioning pillars 14 are respectively disposed at two ends of the loading plate 10, the two positioning pillars 14 at each end are disposed at intervals and located at two sides of the accommodating groove 13, and a threaded hole is further disposed at an end of the loading plate 10 adjacent to the positioning pillars 14.

It should be noted that, two positioning columns 14 at each end of the loading plate 10 are matched with the corresponding through holes on the connecting plate 211, and screws or other fasteners pass through the through holes at the end of the connecting plate 211 and extend into the threaded holes at the end of the loading plate 10, so as to fix the other side of the connecting plate 211 with the loading plate 10. The shaft 222 of the shaft block 22 is fitted in the circular shaft hole 2121, and the two are pivotally connected.

With such an arrangement, positioning and connection between the connecting member 21 and the loading plate 10 are facilitated, connection stability between the connecting member and the loading plate is improved, the pressing member 20 can be prevented from shifting, and the rotating shaft block 22 and the connecting member 21 can be pivotally connected, so that the pressure plate 23 can be ensured to be deflected.

As shown in fig. 2 to 3 and 8 to 9, specifically, the platen 23 includes: the fixing plate 231 and the pressing portions 232 located at two ends of the fixing plate 231, the fixing plate 231 is connected with the rotating shaft block 22, and the pressing portions 232 are used for pressing the packaging frame.

It should be noted that the pressing plate 23 is configured as a U-shaped structure, the transverse extension portion of the pressing plate is a fixing plate 231, the longitudinal extension portion of the pressing plate is a pressing portion 232, the bottom surface of the fixing plate 231 is connected with the top surface of the connecting block 221, the portion of the bottom surface of the fixing plate 231 facing the connecting block 221 is recessed upwards to form a recess 2311, the top surface of the connecting block 221 is fitted in the recess 2311, at least two circular holes are arranged at intervals on one side of the recess 2311 facing the top surface of the connecting block 221, at least two circular holes are also arranged at intervals on the top surface of the connecting block 221, the number of the circular holes on the top surface of the connecting block 221 is consistent and corresponding to the number of the circular holes on the fixing plate 231, and the circular holes on the fixing plate 231 are combined with the circular holes on the top surface of the connecting block 221 through screws or other fasteners. When the packaged semiconductor is located in the receiving cavity 13, the pressing portion 232 is located above the packaging frame and presses against the end portion of the packaging frame.

Set up like this, clamp plate 23 can be with the top of connecting block 221 agree with more inseparable, can improve the stability that the two are connected, press the tip that supports 232 and support the encapsulation frame and can make encapsulation frame inseparabler with the laminating of storage tank 13, can improve the roughness on encapsulation frame surface.

As shown in fig. 4, further, the driving member 24 includes: the bottom plate 241 and the T-block 242 disposed above the bottom plate 241, the T-block 242 is connected with the rotation shaft block 22.

Specifically, the bottom plate 241 is of a rectangular structure, the T-shaped blocks 242 are arranged above the bottom plate 241 and are formed by the upward protrusion of the top surface of the bottom plate 241, at least two round holes are formed in one side of each T-shaped block 242 corresponding to the connecting block 221 at intervals, at least two round holes are formed in the bottom surface of the connecting block 221 at intervals, the number of the round holes in the bottom surface of the connecting block 221 is consistent with that of the round holes in the T-shaped blocks 242 and corresponds to that of the round holes in the bottom surface of the connecting block 221 one by one, and the round holes in the T-shaped blocks 242 are combined with the round holes in the bottom surface of the connecting block 221 through screws or other fasteners. By such an arrangement, the driving member 24 can be engaged with the bottom of the connecting block 221 more tightly, and the stability of the connection between the driving member and the connecting block can be improved.

As shown in fig. 4-5 and 7, in some embodiments, press-fitting member 20 further includes: the elastic member 25 is provided with an elastic member fixing groove 2411 on the bottom plate 241, the elastic member 25 is arranged in the elastic member fixing groove 2411, and the other end of the elastic member is pushed against the connecting member 21.

Specifically, the press-fitting member 20 includes at least two elastic members 25, and in order to ensure that the urging forces of the at least two elastic members 25 on the pressing plate 23 are balanced, a plurality of elastic members 25 are provided in the press-fitting member 20. At least two elastic piece fixing grooves 2411 are formed in the bottom plate 241 at intervals, the at least two elastic piece fixing grooves 2411 are respectively located on two sides of the T-shaped block 242, and the number of each side is equal. At least two circular grooves 213 are spaced on the side of the connecting member 21 corresponding to the bottom plate 241, the circular grooves 213 on the connecting member 21 are opposite to the elastic member fixing grooves 2411 on the bottom plate 241, the upper end of the elastic member 25 is pushed against the circular grooves 213, and the lower end is pushed against the elastic member fixing grooves 2411. This arrangement facilitates the placement and positioning of the resilient member 25, and the resilient member 25 can provide a resilient force to urge the platen 23 to rotate.

As shown in fig. 4 and 10, in particular, the base plate 241 is provided with a driving arm 243, and the driving arm 243 is adapted to be coupled with the power source 200 to push the rotating shaft block 22, the pressing plate 23 and the driving member 24 to rotate synchronously relative to the connecting member 21.

The driving member 24 is integrally formed in an "L" shape, and the driving arm 243 is connected to an end of the base plate 241 on a side where the elastic member fixing groove 2411 is provided, and the driving arm 243 is located on the same side as at least two elastic member fixing grooves 2411. The power source 200 is disposed below the driving arm 243, the power source 200 may be a cylinder, a motor, or the like, the driving arm 243 is linked with the power source 200, the two may be in power connection by gear-rack transmission, gear-gear transmission, or the like, or the power source 200 such as the cylinder directly pushes the driving arm 243. After the driving arm 243 is pushed, the elastic member 25 is compressed, the elastic member 25 pushes the rotating shaft block 22 to rotate, the rotating shaft block 22 drives the pressing plate 23 to rotate synchronously so as to be away from the accommodating groove 13, and when the power source 200 stops driving or is away from the driving arm 243, the driving pressing plate 23 can be correspondingly reset to the position pressed in the accommodating groove 13 under the action of the elastic member 25.

With this arrangement, the power source 200 can provide an urging force for the driving arm 243, so as to rotate the rotating shaft block 22, and further drive the pressing plate 23 to rotate, so that the pressing plate 23 moves from the pressing position to the opening position.

As shown in fig. 6, further, the loading plate 10 includes: the plate comprises a plate body 11 and vertical plates 12 located on two sides of the plate body 11, a containing groove 13 is defined by the plate body 11 and the vertical plates 12, a step plate 121 is further arranged on one side, facing the containing groove 13, of the vertical plates 12, and the press fitting part 20 is pressed against the step plate 121.

It should be noted that, the board body 11 is horizontally disposed, the vertical board 12 is vertically disposed on two sides of the board body 11 in the second direction, a step board 121 is disposed on one side of the vertical board 12 facing the containing slot 13, in the vertical direction, the step board 121 defines a first step surface 1211 and a second step surface 1212, the first step surface 1211 and the second step surface 1212 are in a step shape, the first step surface 1211 is lower than the second step surface 1212, the pdfn product is placed in the containing slot 13, and the package frame is attached to the first step surface 1211. The pressing members 20 are disposed at two ends of the loading plate 10 in the first direction, and when the pressing plate 23 rotates to the pressing position, it presses against the first step surface 1211, so as to flatten the package frame with deformation, and prevent the package frame without deformation from being deformed during the subsequent process of matching with the fixing tool 100.

By the arrangement, the position of the packaging frame can be better fixed, the positioning precision of the packaging frame is improved, the position of the press fitting part 20 can be limited, and the press fitting part 20 is more tightly pressed against the packaging frame.

As shown in fig. 1 and 6, in some embodiments, the vertical plate 12 has a taking groove 12121, and the plate body 11 has a sensor avoiding hole 111.

It should be noted that, a plurality of taking grooves 12121 are provided on the second step surface 1212 of the vertical plate 12, the taking grooves 12121 are arranged at intervals, the number of the taking grooves 12121 on the vertical plates 12 on two sides is the same, and the positions of the taking grooves 12121 are in one-to-one correspondence, the taking grooves 12121 are semicircular grooves which are recessed downward from the upper surface of the second step surface 1212 to be flush with the first step surface 1211, and the size of the opening of the taking groove 12121 gradually decreases from one side close to the accommodating groove 13 to one side far away from the accommodating groove 13. The encapsulation semiconductor is snatched by the grabber, and the grabber can be taken off the encapsulation semiconductor by material fence department and place in storage tank 13, also can take out the encapsulation semiconductor in by storage tank 13, sets up the groove 12121 of taking and can hold the grabber, makes things convenient for the grabber to get and puts the encapsulation semiconductor.

In addition, be provided with oval-shaped sensor on the board body 11 and dodge hole 111, sensor dodge hole 111 is the through-hole, is provided with light sensor under it, sets up sensor and dodges hole 111 and can avoid board body 11 to shelter from, makes things convenient for the light sensor sensitization, also can improve the machining precision.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A fixed frock of encapsulation semiconductor which characterized in that includes:

a loading plate having a receiving groove for receiving a packaged semiconductor;

and the press-fitting part is movably arranged on the peripheral side of the loading plate and is suitable for pressing against the packaging frame of the packaged semiconductor after the packaged semiconductor is assembled to the accommodating groove.

2. The fixture for fixing a packaged semiconductor according to claim 1, wherein two ends of the accommodating slot in the length direction are open, and the pressing member is disposed at an end of the loading plate and adapted to press against the package frame at two ends of the package frame.

3. The fixture for fixing a packaged semiconductor according to claim 1 or 2, wherein the press-fitting member comprises:

a connector provided on an end surface of the loading plate;

the rotating shaft block is connected with the connecting piece;

the pressing plate and the driving piece are arranged on two sides of the rotating shaft block and are suitable for pushing the driving piece to drive the pressing plate to rotate relative to the connecting piece, so that the pressing plate is far away from the opening position of the accommodating groove and is pressed against the pressing position above the accommodating groove to switch between the pressing positions.

4. The fixture for fixing a packaged semiconductor according to claim 3, wherein the connector comprises: the connecting plate is connected with the loading plate, and the matching plate is in pivot connection with the rotating shaft block.

5. The fixture for fixing a packaged semiconductor according to claim 3, wherein the pressing plate comprises: the fixed plate is connected with the rotating shaft block, and the pressing parts are used for pressing the packaging frame.

6. The fixture for fixing a packaged semiconductor according to claim 3, wherein the driving member comprises: the rotating shaft device comprises a base plate and a T-shaped block arranged above the base plate, wherein the T-shaped block is connected with the rotating shaft block.

7. The fixture for fixing a packaged semiconductor according to claim 6, wherein the press-fit member further comprises: the elastic piece, be provided with the elastic piece fixed slot on the bottom plate, the elastic piece sets up in the elastic piece fixed slot and the other end push up to be in on the connecting piece.

8. The fixture for fixing the packaged semiconductor according to claim 6, wherein the base plate is provided with a driving arm, and the driving arm is adapted to be linked with a power source to push the rotating shaft block, the pressing plate and the driving member to rotate synchronously relative to the connecting member.

9. The fixture for fixing a packaged semiconductor according to claim 1, wherein the loading plate comprises: the plate body and the vertical plates are located on two sides of the plate body, the accommodating groove is defined by the plate body and the vertical plates, a step plate is further arranged on one side, facing the accommodating groove, of each vertical plate, and the press fitting piece is pressed against the step plate.

10. The fixing tool for packaging semiconductors according to claim 9, wherein the vertical plate has a taking groove, and the plate body has a sensor avoiding hole.

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