CN217636196U - Heat pump device capable of generating high-temperature air - Google Patents
Heat pump device capable of generating high-temperature air Download PDFInfo
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- CN217636196U CN217636196U CN202221623386.8U CN202221623386U CN217636196U CN 217636196 U CN217636196 U CN 217636196U CN 202221623386 U CN202221623386 U CN 202221623386U CN 217636196 U CN217636196 U CN 217636196U
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Abstract
The utility model provides a can produce heat pump device of high temperature air. The technical scheme simultaneously constructs two sets of high-temperature and low-temperature refrigeration systems, wherein the hot end is connected with the refrigerant of the low-temperature refrigeration system, and the cold end is connected with the refrigerant of the high-temperature refrigeration system. The high temperature refrigeration system refrigerant gets heat from the low temperature refrigeration system refrigerant to evaporate, while the low temperature refrigeration system lowers the temperature by transferring heat to the high temperature refrigeration system. The utility model discloses use the heat of auxiliary heat radiator output to produce high temperature air as the heat source, the highest temperature can reach 170 ℃, and the heating efficiency of high temperature heat pump can reach more than 2.5. The utility model discloses the high temperature air that produces can be applied to various absorption runner regeneration (contain dehumidification runner, VOCs runner, carbon dioxide absorption runner etc.) and coating machine air heating. Compared with the pure electric heating air, the utility model can save energy by more than 50%; and the temperature of the hot air can reach 170 ℃ at most, which is far higher than that of the prior conventional technology, thereby greatly expanding the application range.
Description
Technical Field
The utility model relates to a refrigeration air conditioner technical field, concretely relates to can produce heat pump device of high temperature air.
Background
The adsorption rotating wheel dehumidification is widely applied in the industrial production field, for example, pharmaceutical workshops and lithium battery production workshops need to be carried out at lower relative humidity, the energy consumed by the regeneration of the adsorption rotating wheel is the main energy consumption of a rotating wheel dehumidification device, and the regeneration temperature of the rotating wheel is usually 70-140 ℃.
In addition, coating is also a common process, the production of the positive and negative electrode plates of the lithium battery, the production of the optical film and the like all adopt coating processes, and hot air at about 100 ℃ is basically required for coating. The utilization of heat pumps is a recognized high-efficiency energy-saving device, but the traditional heat pump is difficult to generate high-temperature air with the temperature of more than 100 ℃.
A conventional compression refrigeration system is composed of a refrigeration evaporator, a refrigeration condenser, an expansion valve, and a compressor. A typical configuration is shown in fig. 1. The refrigeration condenser is used for cooling gas discharged from the compressor into a liquid state, taking a refrigeration system using R22 as a refrigerant as an example, the refrigeration temperature discharged from the compressor is about 110-130 ℃, the refrigerant is cooled to the saturation temperature by using a medium such as water or air, and the heat released by cooling the gaseous refrigerant discharged from the compressor to the saturation refrigerant state accounts for about 13% of the total heat released by the condenser. Then the refrigerant is condensed at a constant temperature at a saturation temperature to release heat, and the refrigerant is further cooled to a supercooled state by using a medium such as water or air after being condensed into a liquid state. The supercooling of refrigerant can increase the cooling capacity or heating capacity of the system, which is a necessary process.
In order to obtain relatively high temperature hot air using a heat pump, a flow scheme as shown in fig. 2 is proposed in the related art. The technical route has the advantages that the air needing to be heated is utilized to enable the refrigerant to be fully subcooled through the second subcooling condenser 5, the system can exert the maximum refrigerating capacity and heating capacity, in addition, the high-temperature gas enters the second high-temperature refrigerant cooler 107 through the compressor, the highest temperature can reach 130 ℃, and after the air needing to be heated passes through the second high-temperature refrigerant cooler 107, the air temperature can be heated to about 70 ℃. In addition, the second auxiliary radiator 106 discharges the excess heat of the system to the atmosphere. Although the mode can generate certain hot air, the temperature of the hot air does not reach a higher level, so that the applicable working condition environment is relatively limited; moreover, the overall heating efficiency of this model also needs to be improved.
Disclosure of Invention
The utility model discloses aim at to prior art's technical defect, provide a can produce the heat pump device of high temperature air to solve the produced hot air temperature of conventional heat pump device lower technical problem relatively.
The utility model discloses another technical problem that will solve is, how to further improve heat pump device's heating efficiency.
In order to realize the technical purpose, the utility model adopts the following technical scheme:
a heat pump device capable of generating high-temperature air comprises a refrigeration compressor of a low-temperature heat pump, an evaporator, a subcooler of a condenser, a heat exchanger, a refrigerant cooler discharged by the compressor, a heat pump condenser and a heat pump compressor, wherein the subcooler of the condenser, the refrigerant cooler discharged by the compressor and the heat pump condenser are sequentially arranged on a flow path of air to be heated; meanwhile, a subcooler of the condenser, an evaporator, a refrigeration compressor of the low-temperature heat pump and a refrigerant cooler discharged by the compressor sequentially form a first loop; meanwhile, a refrigerant cooler discharged by the compressor, the high-temperature side of the heat exchanger and a subcooler of the condenser sequentially form a second loop; meanwhile, the heat pump condenser, the low-temperature side of the heat exchanger and the heat pump compressor sequentially form a third loop.
Preferably, the evaporator is provided with an evaporator fan.
Preferably, the high temperature side of the heat exchanger is an auxiliary radiator.
Preferably, a refrigeration compressor, an evaporator, a subcooler of a condenser, a high-temperature side of a heat exchanger and a refrigerant cooler discharged by the compressor of the low-temperature heat pump jointly form a low-temperature heat pump system; the refrigeration working medium of the low-temperature heat pump system is selected from one or more of the following components: r22, R134a, R142B, R401A.
Preferably, the low-temperature sides of the heat pump condenser, the heat pump compressor and the heat exchanger jointly form a high-temperature heat pump system; the refrigerant of the high-temperature heat pump system is selected from one or more of the following components: r245fa, R1233zd (E), R1336mzz (Z), R134a, R11.
The utility model provides a can produce heat pump device of high temperature air. The technical scheme simultaneously constructs two sets of high-temperature and low-temperature refrigeration systems, wherein the hot end is connected with the refrigerant of the low-temperature refrigeration system, and the cold end is connected with the refrigerant of the high-temperature refrigeration system. The high temperature refrigeration system refrigerant gets heat from the low temperature refrigeration system refrigerant to evaporate, while the low temperature refrigeration system lowers the temperature by transferring heat to the high temperature refrigeration system.
The utility model discloses use the heat of auxiliary radiator output to produce high temperature air as the heat source, the highest temperature can reach 170 ℃, and the heating efficiency of high temperature heat pump can reach more than 2.5. The utility model discloses the high temperature air that produces can be applied to various absorption runner regeneration (contain dehumidification runner, VOCs runner, carbon dioxide absorption runner etc.) and coating machine air heating. Compared with the pure electric heating air, the utility model can save energy by more than 50%; and the temperature of the hot air can reach 170 ℃ at most, which is far higher than that of the prior conventional technology, thereby greatly expanding the application range.
Drawings
Fig. 1 is an operational schematic diagram of a conventional compression refrigeration system.
Fig. 2 is a system diagram of an apparatus for generating high-temperature hot air proposed in the prior art.
Fig. 3 is a system diagram of the apparatus of the present invention.
In the above fig. 2 and 3, a is the inlet of the air to be heated and b is the outlet of the heated air.
In the above fig. 1 to 3:
1. refrigeration compressor 2, evaporator fan 3 and evaporator of low-temperature heat pump
4. Expansion valve 5, subcooler 6 of condenser, heat exchanger
7. Compressor-discharged refrigerant cooler 8, heat pump condenser 9, and heat pump compressor
10. Heat pump expansion valve
11. A first refrigeration compressor 12, a first refrigeration condenser 13, a first expansion valve
14. First refrigeration evaporator
101. A second compressor 102, a second fan 103, a second evaporator
104. A second expansion valve 105, a second supercooling condenser 106, and a second auxiliary radiator
107. A second high temperature refrigerant cooler 108, and a cooling fan of a second auxiliary radiator.
In the present invention, the terms "first" and "second" are used only for distinguishing the respective apparatuses in the description, and do not constitute a limitation on the technical features of the respective apparatuses themselves, and thus are described herein.
Detailed Description
Hereinafter, specific embodiments of the present invention will be described in detail. Well-known structures or functions may not be described in detail in the following embodiments in order to avoid unnecessarily obscuring the details. Approximating language, as used herein in the following examples, may be applied to identify quantitative representations that could permissibly vary in number without resulting in a change in the basic function. Unless defined otherwise, technical and scientific terms used in the following examples have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
Example 1
A heat pump device capable of generating high-temperature air is shown in figure 3, and comprises a refrigeration compressor 1 of a low-temperature heat pump, an evaporator 3, a subcooler 5 of a condenser, a heat exchanger 6, a refrigerant cooler 7 discharged by the compressor, a heat pump condenser 8 and a heat pump compressor 9, wherein the subcooler 5 of the condenser, the refrigerant cooler 7 discharged by the compressor and the heat pump condenser 8 are sequentially arranged on a flow path of air to be heated; meanwhile, a subcooler 5 of the condenser, an evaporator 3, a refrigeration compressor 1 of the low-temperature heat pump and a refrigerant cooler 7 discharged by the compressor sequentially form a first loop; meanwhile, a refrigerant cooler 7 discharged from the compressor, the high-temperature side of the heat exchanger 6 and the subcooler 5 of the condenser sequentially form a second loop; meanwhile, the heat pump condenser 8, the low-temperature side of the heat exchanger 6, and the heat pump compressor 9 sequentially constitute a third circuit.
Example 2
A heat pump device capable of generating high-temperature air comprises a refrigeration compressor 1 of a low-temperature heat pump, an evaporator 3, a subcooler 5 of a condenser, a heat exchanger 6, a refrigerant cooler 7 discharged by the compressor, a heat pump condenser 8 and a heat pump compressor 9, wherein the subcooler 5 of the condenser, the refrigerant cooler 7 discharged by the compressor and the heat pump condenser 8 are arranged on a flow path of air to be heated in sequence; meanwhile, a subcooler 5 of the condenser, an evaporator 3, a refrigeration compressor 1 of the low-temperature heat pump and a refrigerant cooler 7 discharged by the compressor sequentially form a first loop; meanwhile, a refrigerant cooler 7 discharged from the compressor, the high-temperature side of the heat exchanger 6 and the subcooler 5 of the condenser sequentially form a second loop; meanwhile, the heat pump condenser 8, the low-temperature side of the heat exchanger 6, and the heat pump compressor 9 sequentially constitute a third circuit.
The evaporator 3 is provided with an evaporator fan 2. An expansion valve 4 is provided in the first circuit. A heat pump expansion valve 10 is provided in the third circuit. The high temperature side of the heat exchanger 6 is an auxiliary radiator.
A refrigeration compressor 1, an evaporator 3, a subcooler 5 of a condenser, the high-temperature side of a heat exchanger 6 and a refrigerant cooler 7 discharged by the compressor of the low-temperature heat pump jointly form a low-temperature heat pump system; the refrigeration working medium of the low-temperature heat pump system is selected from one or more of the following components: r22, R134a, R142B, R401A.
The heat pump condenser 8, the heat pump compressor 9 and the low-temperature side of the heat exchanger 6 jointly form a high-temperature heat pump system; the refrigerant of the high-temperature heat pump system is selected from one or more of the following components: r245fa, R1233zd (E), R1336mzz (Z), R134a, R11.
The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention, and is not intended to limit the present invention. Any modification, equivalent replacement, and improvement made within the scope of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A heat pump device capable of generating high-temperature air is characterized by comprising a refrigeration compressor (1) of a low-temperature heat pump, an evaporator (3), a subcooler (5) of a condenser, a heat exchanger (6), a refrigerant cooler (7) discharged by the compressor, a heat pump condenser (8) and a heat pump compressor (9), wherein the subcooler (5) of the condenser, the refrigerant cooler (7) discharged by the compressor and the heat pump condenser (8) are sequentially arranged on a flow path of air to be heated; meanwhile, a subcooler (5) of the condenser, an evaporator (3), a refrigeration compressor (1) of the low-temperature heat pump and a refrigerant cooler (7) discharged by the compressor sequentially form a first loop; meanwhile, a refrigerant cooler (7) discharged by the compressor, the high-temperature side of the heat exchanger (6) and a subcooler (5) of the condenser sequentially form a second loop; meanwhile, a third loop is formed by the heat pump condenser (8), the low-temperature side of the heat exchanger (6) and the heat pump compressor (9) in sequence.
2. A heat pump apparatus capable of generating high-temperature air according to claim 1, wherein the evaporator fan (2) is provided on the evaporator (3).
3. A heat pump apparatus capable of generating high temperature air according to claim 1, wherein the high temperature side of the heat exchanger (6) is an auxiliary radiator.
4. A heat pump apparatus capable of generating high temperature air according to claim 1, wherein the refrigerant compressor (1), the evaporator (3), the subcooler (5) of the condenser, the high temperature side of the heat exchanger (6), and the refrigerant cooler (7) discharged from the compressor constitute a low temperature heat pump system.
5. A heat pump device capable of generating high-temperature air according to claim 1, wherein the low-temperature side of the heat pump condenser (8), the heat pump compressor (9) and the heat exchanger (6) together form a high-temperature heat pump system.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122706077 | 2021-11-05 | ||
| CN2021227060779 | 2021-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217636196U true CN217636196U (en) | 2022-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221623386.8U Active CN217636196U (en) | 2021-11-05 | 2022-06-24 | Heat pump device capable of generating high-temperature air |
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|---|---|
| CN (1) | CN217636196U (en) |
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2022
- 2022-06-24 CN CN202221623386.8U patent/CN217636196U/en active Active
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