CN217635145U

CN217635145U - High-power semiconductor laser lighting device

Info

Publication number: CN217635145U
Application number: CN202221085834.3U
Authority: CN
Inventors: 詹雪; 邵洁; 李云; 朱佳映; 李智; 李雪锋; 胡文涛; 陈晓东; 王付勤
Original assignee: Yangzhou Huaheng Electric Co ltd
Current assignee: Yangzhou Huaheng Electric Co ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2022-10-21
Anticipated expiration: 2032-05-07

Abstract

The utility model discloses a high power semiconductor laser lighting device, including semiconductor lighting module and LED illumination lamp plate, it has the slot of C type structure to open on the inner wall of semiconductor lighting module lower part, and it has the jack to open on the lower extreme of semiconductor lighting module right side, has passed LED illumination lamp plate in the jack, and in LED illumination lamp plate inserted the slot, the jack top was equipped with the recess, and the rigid coupling has the dead lever in the recess, has cup jointed the torsional spring on the dead lever, and has the cardboard through the torsional spring kink, and the cardboard supports LED illumination lamp plate. Consequently this practicality is through dialling open the cardboard, then draws out the LED illumination lamp plate and maintains, and it is more convenient to dismantle the LED illumination lamp plate like this, has improved the dismantlement efficiency of LED illumination lamp plate, and then has improved semiconductor lighting module's maintenance efficiency.

Description

High-power semiconductor laser lighting device

Technical Field

The utility model relates to a semiconductor lighting module technical field specifically is a high power semiconductor laser lighting device.

Background

The semiconductor lighting module is a lighting device manufactured by using an LED as a light source, and has the remarkable characteristics of high efficiency, high power, energy conservation, environmental protection, easy maintenance and the like, so that the semiconductor lighting module is an effective way for realizing energy conservation and emission reduction.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high power semiconductor laser lighting device to solve the problem that the semiconductor lighting module maintenance efficiency that proposes among the above-mentioned background art is low.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a high power semiconductor laser lighting device, includes semiconductor lighting module and LED illumination lamp plate, it has the slot of C type structure to open on the semiconductor lighting module lower part inner wall, it has the jack to open on the semiconductor lighting module right side lower extreme, it has passed in the jack LED illumination lamp plate, just LED illumination lamp plate inserts in the slot, the jack top is equipped with the recess, the rigid coupling has the dead lever in the recess, the torsional spring has been cup jointed on the dead lever, and passes through the torsional spring has been turned round and has been connect the cardboard, the cardboard supports LED illumination lamp plate.

Further, the slot is flush with the jack.

Furthermore, a power supply module is installed on the top in the semiconductor lighting module.

Furthermore, a transparent plate is arranged on the bottom surface of the semiconductor lighting module.

Furthermore, one end of the torsion spring is fixedly connected to the fixing rod, and the other end of the torsion spring is fixedly connected to the clamping plate.

Compared with the prior art, the utility model discloses the beneficial effect who reaches is:

the utility model discloses a dial out the cardboard, then draw out the LED illumination lamp plate and maintain, it is more convenient to dismantle the LED illumination lamp plate like this, has improved the dismantlement efficiency of LED illumination lamp plate, and then has improved the maintenance efficiency of semiconductor lighting module.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the principles of the invention. In the drawings:

fig. 1 is a front sectional view of the present invention;

fig. 2 is an enlarged schematic view of a in fig. 1.

In the figure: 1. a semiconductor lighting module; 2. an LED illuminating lamp panel; 3. a slot; 4. a jack; 5. a groove; 6. a fixing rod; 7. a torsion spring; 8. clamping a plate; 9. a power module; 10. a transparent plate.

Detailed Description

To further illustrate the various embodiments, the present invention provides the accompanying drawings, which are part of the disclosure and which are primarily intended to illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and, by reference to these drawings, those of ordinary skill in the art will understand the principles of the invention and its advantages, with reference to the drawings and figures, in which elements are not drawn to scale and like elements are generally designated by like reference numerals.

According to the utility model discloses an embodiment provides a high power semiconductor laser lighting device.

The first embodiment is as follows:

as shown in fig. 1-2, a high-power semiconductor laser lighting device comprises a semiconductor lighting module 1 and an LED lighting lamp panel 2, wherein a C-shaped slot 3 is formed in the inner wall of the lower portion of the semiconductor lighting module 1, a jack 4 is formed in the lower end of the right side of the semiconductor lighting module 1, the LED lighting lamp panel 2 penetrates through the jack 4, the LED lighting lamp panel 2 is inserted into the slot 3, a groove 5 is formed above the jack 4, a fixing rod 6 is fixedly connected into the groove 5, a torsion spring 7 is sleeved on the fixing rod 6, a clamping plate 8 is connected through the torsion spring 7 in a twisting manner, and the clamping plate 8 is abutted against the LED lighting lamp panel 2;

example two:

the slot 3 is flush with the jack 4, so that the slot 3 and the jack 4 are in the same horizontal position;

the power module 9 is arranged on the top in the semiconductor lighting module 1;

a transparent plate 10 is arranged on the bottom surface of the semiconductor lighting module 1;

one end of the torsion spring 7 is fixedly connected on the fixed rod 6, and the other end is fixedly connected on the clamping plate 8;

the utility model discloses a theory of operation:

when the LED illuminating lamp panel 2 needs to be detached for maintenance, the clamping plate 8 is lifted, then the LED illuminating lamp panel 2 is drawn out from the slot 3 and the jack 4 for replacement, then a new LED illuminating lamp panel 2 is inserted into the slot 3 and the jack 4, then the clamping plate 8 is loosened, and the clamping plate 8 props against the new LED illuminating lamp panel 2 under the action of the torsion spring 7;

consequently this practicality is through dialling out cardboard 8, then draws out LED illumination lamp plate 2 and maintains, and it is more convenient like this to dismantle LED illumination lamp plate 2, has improved LED illumination lamp plate 2's dismantlement efficiency, and then has improved semiconductor lighting module's maintenance efficiency.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a high power semiconductor laser lighting device, includes semiconductor lighting module (1) and LED illumination lamp plate (2), its characterized in that: open slot (3) that have C type structure on semiconductor lighting module (1) lower part inner wall, it has jack (4) to open on semiconductor lighting module (1) right side lower extreme, it has passed in jack (4) LED illumination lamp plate (2), just LED illumination lamp plate (2) insert in slot (3), jack (4) top is equipped with recess (5), the rigid coupling has dead lever (6) in recess (5), torsional spring (7) have been cup jointed on dead lever (6), and pass through torsional spring (7) cross-under has cardboard (8), cardboard (8) support LED illumination lamp plate (2).

2. The high power semiconductor laser lighting device according to claim 1, wherein: the slot (3) is flush with the jack (4).

3. The high power semiconductor laser lighting device according to claim 1, wherein: and a power supply module (9) is arranged on the top in the semiconductor lighting module (1).

4. The high power semiconductor laser lighting device according to claim 1, wherein: the bottom surface of the semiconductor lighting module (1) is provided with a transparent plate (10).

5. The high power semiconductor laser lighting device according to claim 1, wherein: one end of the torsion spring (7) is fixedly connected to the fixing rod (6), and the other end of the torsion spring is fixedly connected to the clamping plate (8).