CN217620030U - Polishing abrasive disc for concrete floor - Google Patents
Polishing abrasive disc for concrete floor Download PDFInfo
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- CN217620030U CN217620030U CN202123357143.2U CN202123357143U CN217620030U CN 217620030 U CN217620030 U CN 217620030U CN 202123357143 U CN202123357143 U CN 202123357143U CN 217620030 U CN217620030 U CN 217620030U
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Abstract
The utility model relates to a concrete ground polishing abrasive disc in the technical field of abrasive discs, which comprises a grinding layer and a back base layer; the grinding device comprises a back base layer, a grinding layer, a chip removal groove, a rough layer and a plurality of grinding blocks, wherein a bonding surface is fixed on one surface of the back base layer, the other surface of the back base layer is fixedly connected with the grinding layer, the center of the grinding layer is provided with the mounting groove, the chip removal groove is uniformly distributed on the grinding layer, the grinding layer is divided into a plurality of grinding blocks with different shapes by the chip removal groove, the grinding blocks are fixedly provided with the rough layer, and the rough layer is bulges uniformly distributed on the upper surfaces of the grinding blocks; the grinding layer comprises diamond particles, high-temperature-resistant composite materials and solidified particles. The utility model discloses rational in infrastructure, convenient operation, the production of being convenient for, and be adapted to the burnishing and polishing on concrete ground, through the setting on coarse layer improved the abrasive disc and gone out sword efficiency, improved and polished, polishing efficiency, through the mutually supporting of grinding layer diamond granule, high temperature resistant combined material and curing granule, improved the burnishing and polishing effect, improved the smooth finish on concrete ground.
Description
Technical Field
The utility model relates to an abrasive disc technical field specifically, relates to concrete ground polishing abrasive disc.
Background
When laying concrete floor, need use the abrasive disc to polish concrete floor, adopt the diamond abrasive disc to polish mostly among the prior art, the diamond abrasive disc is when using, and it is slower to go out the sword, and not only waste time and burnishing and polishing effect are not ideal, and whole flow of polishing is taken a lot of work and is taken time. Therefore, there is a high necessity for a concrete floor polishing abrasive disc to solve the above problems.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a concrete ground polishing abrasive disc, which comprises a grinding layer and a back base layer; the grinding device comprises a back base layer, a grinding layer, a chip removal groove, a rough layer and a plurality of grinding blocks, wherein a bonding surface is fixed on one surface of the back base layer, the other surface of the back base layer is fixedly connected with the grinding layer, the center of the grinding layer is provided with the mounting groove, the chip removal groove is uniformly distributed on the grinding layer, the grinding layer is divided into a plurality of grinding blocks with different shapes by the chip removal groove, the grinding blocks are fixedly provided with the rough layer, and the rough layer is bulges uniformly distributed on the upper surfaces of the grinding blocks;
the grinding layer is a high-temperature-resistant composite layer, diamond particles and curing particles are uniformly distributed in the high-temperature-resistant composite layer, and the grinding layer is formed by mixing and hot-pressing diamond particles (powder), a high-temperature-resistant composite material (resin) and the curing particles.
Preferably, the chip removal recess includes regular polygon recess, many lead to groove one and many lead to groove two, the center of regular polygon recess is located same point with mounting groove's center, many it is perpendicular with each limit of regular polygon recess respectively to lead to groove one, lead to the one end and the mounting groove intercommunication of groove one, lead to the border that extends to the grinding layer behind the other end of groove one link up the limit that regular polygon recess corresponds, many it sets up respectively in each summit department of regular polygon recess to lead to groove two, lead to the summit intercommunication that the one end of groove two corresponds with regular polygon recess, lead to the other end of groove two and extend to the border of grinding layer. The arrangement of the chip removal groove improves the chip removal efficiency, and is beneficial to improving the grinding effect and the polishing efficiency when the concrete ground is subjected to dry grinding.
Preferably, the bulges are hemispherical, the arrangement of the bulges improves the wear efficiency of the bulges, and the sharpening efficiency of the grinding block is further improved.
Preferably, the protrusions and the grinding layer are integrally formed, and the protrusions are formed by mixing and hot-pressing diamond particles, high-temperature-resistant composite materials (resin) and solidified particles.
Preferably, the curing particles are fluorine-based material particles or silicon-based material particles, and the fluorine-based material particles or the silicon-based material particles have good hydrophobicity, so that the concrete ground can be better cured, and the polishing effect of the concrete ground is improved and the smoothness of the concrete ground is improved by matching with the grinding of the grinding discs.
Preferably, the bonding surface is a magic tape, and the magic tape is fixed with the back base layer through a bonding agent.
The utility model discloses still including enabling the other subassemblies of concrete floor polishing abrasive disc normal use, be the conventional technical means in this field. In addition, the device or the component which is not limited in the utility model adopts the conventional technical means in the field, such as back base layer, resin material, adhesive, magic tape, fluorine-based material and silicon-based material, etc. are the conventional equipment in the field.
The working principle of the utility model is that when the abrasive disc is produced, the abrasive disc can realize accurate positioning when hot-press molding through the central mounting groove, thereby improving the molding efficiency and the molding quality of the abrasive disc; the abrasive disc is when using, magic subsides through the back of the body base layer are fixed the abrasive disc on the mill, the mill drives the abrasive disc and rotates and carry out the dry grinding to concrete ground, the in-process of polishing, the setting of mat surface, the efficiency of going out is improved, make the quick efficient of diamond in the wearing course expose, carry out the efficient to concrete ground and polish, along with going on of polishing, the continuous promotion of the temperature of abrasive disc and concrete ground contact department, during the solidification granule migration infiltration concrete ground in the abrasive brick, not only play the solidification to concrete ground, and improved polishing effect, the smooth finish on concrete ground has been improved.
The beneficial effects of the utility model, it is rational in infrastructure, convenient operation, the production of being convenient for, and be adapted to the burnishing and polishing on concrete ground, through setting up of coarse layer improved the abrasive disc and gone out sword efficiency, improved and polished, polishing efficiency, through mutually supporting of diamond particles, high temperature resistant combined material and the solidification granule of grinding layer, improved the burnishing and polishing effect, improved the smooth finish on concrete ground.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic structural view of a concrete floor polishing abrasive disc of the present invention;
fig. 2 is a left side view of fig. 1.
In the figure: 1. the grinding layer, 2, the protrusions, 3, the square grooves, 4, the first through grooves, 5, the second through grooves, 6, the mounting grooves, 7, the bonding surface and 8, the back base layer.
Detailed Description
The present invention will be described more clearly with reference to the accompanying drawings and specific embodiments in the embodiments of the present invention, and the description herein is only for explaining the present invention, but not for limiting the present invention. Based on the embodiments of the present invention, any modifications, equivalent replacements, improvements, etc. made by other embodiments obtained by those skilled in the art without creative efforts should be included in the protection scope of the present invention.
Examples
As shown in FIGS. 1-2, the utility model provides a concrete ground polishing abrasive disc, which comprises an abrasive layer 1 and a back base layer 8; a bonding surface 7 is fixed on one surface of the back base layer 8, the other surface of the back base layer 8 is fixedly connected with the grinding layer 1, an installation groove 6 is arranged at the center of the grinding layer 1, chip removal grooves are uniformly distributed on the grinding layer 1, the chip removal grooves divide the grinding layer 1 into a plurality of grinding blocks with different shapes, a rough layer is fixed on the grinding blocks, and the rough layer is bulges uniformly distributed on the upper surfaces of the grinding blocks;
the grinding layer 1 is a high-temperature-resistant composite layer, diamond particles and solidified particles are uniformly distributed in the high-temperature-resistant composite layer, and the grinding layer is formed by mixing and hot-pressing diamond particles (powder), the high-temperature-resistant composite layer and the solidified particles.
The chip removal recess includes square groove 3, four lead to groove one 4 and four lead to groove two 5, the center of square groove 3 is located same point with the center of mounting groove 6, four it is perpendicular with each limit of square groove 3 respectively to lead to groove one 4, the one end and the 6 intercommunications of mounting groove that lead to groove one 4 extend to the border of polishing layer 1 behind the other end that leads to groove one 4 link up the limit that square groove 3 corresponds, four it sets up respectively in each summit department of square groove 3 to lead to groove two 5, the summit intercommunication that the one end that leads to groove two 5 and square groove 3 correspond leads to the other end that leads to groove two 5 and extends to polishing layer 1's border. The arrangement of the chip removal groove improves the chip removal efficiency, and is beneficial to improving the grinding effect and the polishing efficiency when the concrete ground is subjected to dry grinding.
Protruding 2 is the hemisphere, and this department sets up the wear efficiency who has improved protruding 2, has further improved the efficiency of going out the sword of abrasive brick.
The bulges 2 and the grinding layer 1 are integrally formed, and the bulges 2 are formed by mixing and hot-pressing diamond particles, a high-temperature-resistant composite layer and solidified particles.
The grinding layer 1 is formed by mixing and hot-pressing diamond particles, high-temperature-resistant composite materials and solidified particles.
The curing particles are made of fluorine-based materials or silicon-based materials (such as hexafluorocalcium silicate), the fluorine-based materials or the silicon-based materials have good hydrophobicity, the concrete ground can be better cured, and the polishing effect of the concrete ground is improved and the smoothness of the concrete ground is improved by matching with the grinding of the grinding plates.
The bonding surface 7 is a magic tape, and the magic tape is fixed with the back base layer 8 through a bonding agent.
The foregoing description of the embodiments of the invention has been presented for purposes of illustration and not limitation, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the illustrated embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The concrete ground polishing abrasive disc comprises a grinding layer and a back base layer; one side of back of the body basic unit is fixed with the face that bonds, back of the body basic unit's another side and abrasive layer fixed connection, its characterized in that: the grinding layer is divided into a plurality of grinding blocks with different shapes by the chip removal grooves, a rough layer is fixed on each grinding block, and the rough layer is bulges uniformly distributed on the upper surface of each grinding block;
the grinding layer is a high-temperature-resistant composite layer, and diamond particles and solidified particles are uniformly distributed in the high-temperature-resistant composite layer.
2. The concrete floor polishing grinding plate of claim 1, wherein: the chip removal recess includes regular polygon recess, many logical groove one and many logical groove two, the center of regular polygon recess is located same point with mounting groove's center, many it is perpendicular with each limit of regular polygon recess respectively to lead to groove one, lead to the one end and the mounting groove intercommunication of groove one, lead to the border that extends to the grinding layer behind the other end of groove one link up the limit that regular polygon recess corresponds, many it sets up respectively in each summit department of regular polygon recess to lead to groove two, lead to the summit intercommunication that the one end of groove two corresponds with regular polygon recess, lead to the other end of groove two and extend to the border of grinding layer.
3. The concrete floor polishing grinding plate of claim 1, wherein: the protrusions are hemispherical.
4. A concrete floor-polishing abrasive disc according to claim 3, wherein: the protrusions are integrally formed with the polishing layer.
5. The concrete floor polishing abrasive disc of claim 1, wherein: the solidified particles are particles made of fluorine-based materials or silicon-based materials.
6. The concrete floor polishing grinding plate of claim 1, wherein: the adhesive surface is a magic tape, and the magic tape is fixed with the back base layer through an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123357143.2U CN217620030U (en) | 2021-12-29 | 2021-12-29 | Polishing abrasive disc for concrete floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123357143.2U CN217620030U (en) | 2021-12-29 | 2021-12-29 | Polishing abrasive disc for concrete floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217620030U true CN217620030U (en) | 2022-10-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123357143.2U Active CN217620030U (en) | 2021-12-29 | 2021-12-29 | Polishing abrasive disc for concrete floor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217620030U (en) |
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2021
- 2021-12-29 CN CN202123357143.2U patent/CN217620030U/en active Active
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