CN217611352U - Appearance moults with semiconductor refrigeration piece - Google Patents

Abstract

The utility model relates to an appearance that moults with semiconductor refrigeration piece, including the main part and be fixed in the epilation head in the main part, the epilation head is equipped with transparent crystal, be equipped with semiconductor refrigeration piece, heat abstractor and circuit board in the main part, the main part is equipped with the switch outward, the semiconductor refrigeration piece is equipped with cold tip, cold tip with transparent crystal connects, transparent crystal still with heat abstractor connects, heat abstractor, switch and semiconductor refrigeration piece all with the circuit board is connected, be equipped with heat dissipation channel in the heat abstractor, heat dissipation channel is one at least. The utility model provides an appearance that moults with semiconductor refrigeration piece, the radiating effect is better, life is longer.

Description

Appearance moults with semiconductor refrigeration piece

Technical Field

The utility model relates to a semiconductor refrigeration piece technical field, concretely relates to appearance that moults with semiconductor refrigeration piece.

Background

In principle, a semiconductor chilling plate is a means of heat transfer. When a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the pair, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that will generate heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred in a reverse direction through the air and the semiconductor material itself. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts are equal, a balance point is reached, the positive heat transfer and the reverse heat transfer are mutually counteracted, and the temperature of the cold end and the hot end cannot be continuously changed.

Most existing depilating instruments are of a traditional structure, the overall efficiency is not high, and due to the fact that the semiconductor refrigerating piece is low in cost and good in matching performance, improvement needs to be made on the basis of the prior art, and the semiconductor refrigerating piece is applied to depilating instrument equipment.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a appearance that moults with semiconductor refrigeration piece, the radiating effect is better, life is longer.

In order to realize the utility model discloses a purpose, the utility model provides an appearance that moults with semiconductor refrigeration piece, including the main part and be fixed in the epilation head in the main part, be equipped with transparent crystal in the epilation head, be equipped with semiconductor refrigeration piece, heat abstractor and circuit board in the main part, the main part is equipped with the switch outward, the semiconductor refrigeration piece is equipped with cold tip, cold tip with transparent crystal connects, transparent crystal still with heat abstractor connects, heat abstractor, switch and semiconductor refrigeration piece all with the circuit board is connected, be equipped with heat dissipation channel in the heat abstractor, heat dissipation channel is one at least.

Preferably, the heat dissipation device is further provided with a heat radiator, a fan support and an exhaust fan located in the fan support, the fan support is fixed on the circuit board, the heat radiator is respectively connected with the transparent crystal and the fan support, the heat dissipation channel is located in the heat radiator, and the heat dissipation channel is communicated with an air outlet in the fan support.

Preferably, the radiator includes first heat dissipation support, second heat dissipation support, first connecting plate and second connecting plate, first connecting plate with second connecting plate both ends all with first heat dissipation support and second heat dissipation leg joint, be equipped with the recess on the first connecting plate, the recess can with transparent crystal cooperation is connected, the second connecting plate with fan leg joint, be equipped with a plurality of vents on the second connecting plate, first heat dissipation support is located fan leg's top, second heat dissipation support is located fan leg's below.

Preferably, be equipped with first ventilation cavity and step face on the first heat dissipation support, the step face respectively with first heat dissipation support and first connecting plate are connected, first ventilation cavity with the air exit passes through the step face is connected, just first ventilation cavity with the step face is connected and is formed first heat dissipation channel, the step face is the tilting structure.

Preferably, first heat dissipation support, second heat dissipation support, first connecting plate and second connecting plate connect gradually and form second ventilation cavity, second ventilation cavity is located between first heat dissipation support and the second heat dissipation support, or, second ventilation cavity is located between first connecting plate and the second connecting plate, second ventilation cavity with a plurality of vents are connected and are formed second heat dissipation channel.

Preferably, a third ventilation cavity and a concave hole are formed in the second heat dissipation support, the second heat dissipation channel and the third ventilation cavity are connected through the concave hole, and the third ventilation cavity and the concave hole are connected to form a third heat dissipation channel.

Preferably, the heat dissipation channel comprises a first heat dissipation channel, a second heat dissipation channel and a third heat dissipation channel, and the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are all communicated with the air outlet.

Preferably, the shell of the main body is further provided with a first air outlet and a second air outlet, the first air outlet is connected with the second heat dissipation channel, and the second air outlet can be connected with the first heat dissipation channel and the second heat dissipation channel.

Preferably, the semiconductor refrigeration piece further comprises a conductive group, a conductive wire and a hot end portion, two ends of the conductive group are respectively connected with the cold end portion and the hot end portion, the conductive group is connected with the circuit board through the conductive wire, and when the transparent crystal is connected with the heat dissipation device, a space is arranged between the hot end portion of the semiconductor and the first connecting plate of the heat dissipation device.

Preferably, a charging groove, a display screen and a control button are further arranged on the shell of the main body, and the charging groove, the display screen and the control button are all connected with the circuit board.

The utility model has the advantages that: the utility model provides an appearance that moults with semiconductor refrigeration piece, the radiating effect is better, life is longer.

Drawings

The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.

Fig. 1 is a schematic diagram of an overall structure of an epilating apparatus with a semiconductor cooling plate at a first viewing angle according to an embodiment of the present invention;

fig. 2 is a schematic diagram of an overall structure of an epilating apparatus with a semiconductor cooling plate at a second viewing angle according to an embodiment of the present invention;

fig. 3 is a schematic diagram illustrating an internal structure of a depilation instrument with semiconductor refrigeration sheets according to an embodiment of the present invention;

fig. 4 is a schematic view of a specific structure of a heat sink provided in an embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of an epilating apparatus having a semiconductor cooling plate according to an embodiment of the present invention;

in the figure: 1-main part, 11-display screen, 12-control button, 13-charging groove, 14-second air outlet, 15-first air outlet, 16-switch, 2-epilation head, 3-first heat dissipation bracket, 31-first connecting plate, 32-second heat dissipation bracket, 33-second connecting plate, 34-first ventilation cavity, 35-second ventilation cavity, 36-third ventilation cavity, 361-laser component, 37-step surface, 38-ventilation opening, 4-semiconductor refrigeration piece, 5-transparent crystal, 6-fan bracket, 61-exhaust fan and 7-circuit board.

Detailed Description

To facilitate an understanding of the present invention, reference will now be made to the more complete description of the invention, as illustrated in the accompanying drawings.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "mounted," "one end," "the other end," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this document belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-5, an embodiment of the present invention provides a depilating apparatus with semiconductor refrigeration sheet 4, including main body 1 and depilating head 2 fixed on main body 1, transparent crystal 5 is provided in depilating head 2, semiconductor refrigeration sheet 4 is provided in main body 1, heat dissipation device and circuit board 7, switch 16 is provided outside main body 1, semiconductor refrigeration sheet 4 is provided with a cold end, the cold end is connected with transparent crystal 5, transparent crystal 5 is further connected with heat dissipation device, switch 16 and semiconductor refrigeration sheet 4 are all connected with circuit board 7, heat dissipation device is provided with a heat dissipation channel, the heat dissipation channel is at least one.

Please refer to fig. 1-5, the utility model provides a depilating device with semiconductor refrigeration piece 4, in the use, switch 16 button pressing the side starts the depilating device, the whole function of the depilating device has been started this moment, circuit board 7 gives the fan, semiconductor refrigeration piece 4 and laser subassembly 361 provide the electric energy and impel the fan, semiconductor refrigeration piece 4 and laser subassembly 361 operate, semiconductor refrigeration piece 4 carries out the production of heat and cold volume through the Peltier effect of semiconductor material this moment, laser subassembly 361 produces laser, the fan begins to operate, only need align transparent crystal 5 to the place that needs to moult this moment, when transparent crystal 5 is right, laser subassembly 361 and semiconductor refrigeration piece 4 match the use, just can pass the root that the skin top layer reachd the hair follicle through laser wavelength energy, then the wide interior heat energy that can be absorbed and turn into and destroy the tissue of hair follicle in the hair follicle, thereby let the hair that is in the growth phase be burnt out, thereby play the efficiency of mouling, the utility model provides a wireless depilating device is wireless depilating device, when the device electric quantity is not enough, only need to carry out the charging device that charges in the hair follicle to carry out through the charger 13.

The utility model has the advantages that: the semiconductor refrigerating sheet 4 is matched with the depilating instrument, depilating efficiency is improved to a certain degree, and the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are additionally arranged, so that the depilating instrument is longer in service life and better in heat dissipation performance.

Referring to fig. 3, in a preferred embodiment, the heat dissipation device further includes a heat sink, a fan bracket 6 and a fan 61 located in the fan bracket 6, the fan bracket 6 is fixed on the circuit board 7, the heat sink is connected to the transparent crystal 5 and the fan bracket 6, respectively, the heat dissipation channel is located in the heat sink, and the heat dissipation channel is communicated with the air outlet on the fan bracket 6. The radiator adopts high temperature resistant material, and mainly matches the fan and carries out the conversion with the gas in the appearance equipment that moults to the whole life that the appearance that moults is prolonged.

Referring to fig. 4, in a preferred embodiment, the heat sink includes a first heat dissipation bracket 3, a second heat dissipation bracket 32, a first connection plate 31 and a second connection plate 33, two ends of the first connection plate 31 and the second connection plate 33 are connected to the first heat dissipation bracket 3 and the second heat dissipation bracket 32, a groove is disposed on the first connection plate 31, the groove can be connected to the transparent crystal 5 in a matching manner, the second connection plate 33 is connected to the fan bracket 6, a plurality of ventilation openings 38 are disposed on the second connection plate 33, the first heat dissipation bracket 3 is disposed above the fan bracket 6, and the second heat dissipation bracket 32 is disposed below the fan bracket 6. The groove is mainly connected with the transparent crystal 5, the groove is mainly arranged to completely radiate the light source emitted by the laser component 361 through the transparent crystal 5, so that a certain unhairing effect is ensured, and the fan converts wind coming from an air inlet of the unhairing instrument device, and then the wind passes through the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel and is discharged out of the unhairing instrument through the first air outlet 15 and the second air outlet 14.

Referring to fig. 3-4, in a further preferred embodiment, the first heat dissipating bracket 3 is provided with a first ventilation cavity 34 and a step surface 37, the step surface 37 is respectively connected to the first heat dissipating bracket 3 and the first connecting plate 31, the first ventilation cavity 34 is connected to the air outlet through the step surface 37, the first ventilation cavity 34 is connected to the step surface 37 to form a first heat dissipating passage, and the step surface 37 is an inclined structure. The step surface 37 mainly passes the air from the air outlet through the first ventilation cavity 34 and then out of the epilating apparatus through the second air outlet 14.

Referring to fig. 3-5, in a further preferred embodiment, the first heat dissipation bracket 3, the second heat dissipation bracket 32, the first connection plate 31 and the second connection plate 33 are sequentially connected to form a second ventilation cavity 35, the second ventilation cavity 35 is located between the first heat dissipation bracket 3 and the second heat dissipation bracket 32, or the second ventilation cavity 35 is located between the first connection plate 31 and the second connection plate 33, and the second ventilation cavity 35 is connected to the plurality of ventilation openings 38 to form a second heat dissipation channel. The second heat dissipation channel is mainly discharged the heat that laser subassembly 361 and semiconductor refrigeration piece 4 gived off through first air outlet 15, has ensured semiconductor refrigeration piece 4 and laser subassembly 361's temperature balance to a certain extent, prevents to moult the appearance use in, because high temperature scalds the skin, other equipment such as quartz lamp tube are generally adopted to laser subassembly 361.

Referring to fig. 3-5, in a preferred embodiment, the second heat dissipation bracket is provided with a third ventilation cavity 36 and a concave hole, the second heat dissipation channel is connected to the third ventilation cavity 36 through the concave hole, and the third ventilation cavity 36 is connected to the concave hole to form a third heat dissipation channel. The concave hole can discharge redundant hot air in the second heat dissipation channel into the third ventilation cavity 36, and then the redundant hot air is discharged out of the body through the third ventilation cavity 36 and the second air outlet 14.

Referring to fig. 4, in a further preferred embodiment, the heat dissipation channels include a first heat dissipation channel, a second heat dissipation channel and a third heat dissipation channel, and the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are all communicated with the air outlet. The first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are communicated with each other, and the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are mainly arranged to provide heat dissipation performance, so that the service life is guaranteed.

Referring to fig. 1-2, in a preferred embodiment, a first air outlet 15 and a second air outlet 14 are further disposed on the housing of the main body 1, the first air outlet 15 is connected to the second heat dissipation channel, and the second air outlet 14 is connected to the first heat dissipation channel and the second heat dissipation channel. The two ends of the second heat dissipation channel are of a closed structure, the gas in the second heat dissipation channel is mainly exhausted out of the body through the first air outlet 15, the gas in the first heat dissipation channel and the gas in the third heat dissipation channel are mainly exhausted through the second air outlet 14, and the second air outlet 14 can also exhaust the gas in other positions in the depilating instrument.

Referring to fig. 1-2, in a preferred embodiment, the semiconductor cooling plate 4 further includes a conductive set, a conductive wire, and a hot end, two ends of the conductive set are respectively connected to the cold end and the hot end, the conductive set is connected to the circuit board 7 through the conductive wire, and when the transparent crystal 5 is connected to the heat sink, a space is provided between the hot end of the semiconductor and the first connecting plate 31 of the heat sink. Cold tip and hot junction portion all adopt the ceramic substrate, and the conducting group mainly is the combination of P type semiconductor and N type semiconductor, the utility model provides an appearance that moults mainly adopts the use that the electric energy of utilizing of semiconductor refrigeration piece 4 produced the temperature difference and carries out the appearance function that moults.

Referring to fig. 1-2, in the preferred embodiment, a charging slot 13, a display 11 and a control button 12 are further disposed on the housing of the main body 1, and the charging slot 13, the display 11 and the control button 12 are all connected to the circuit board 7. The appearance that moults is rechargeable structure, compares in other appearance that moults, can cut off the power supply and use, provides convenience to a certain extent, and display screen 11 and control button 12's setting can provide more function selection for the user, when needs carry out the function regulation, only need press corresponding control button 12, then adjust the function that suits according to hobby, provide more selections for the user.

The utility model has the advantages that: the utility model provides an appearance that moults with semiconductor refrigeration piece, the radiating effect is better, life is longer.

In this specification, unless explicitly stated or limited otherwise, a first feature may be "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, reference to the description of the terms "preferred embodiment," "yet another embodiment," "other embodiments," or "specific examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1. The utility model provides an appearance that moults with semiconductor refrigeration piece, its characterized in that includes the main part and is fixed in the epilation head in the main part, be equipped with transparent crystal in the epilation head, be equipped with semiconductor refrigeration piece, heat abstractor and circuit board in the main part, the main part is equipped with the switch outward, the semiconductor refrigeration piece is equipped with cold tip, transparent crystal with cold end connection, transparent crystal still with heat abstractor connects, heat abstractor, switch and semiconductor refrigeration piece all with the circuit board is connected, be equipped with heat dissipation channel in the heat abstractor, heat dissipation channel is one at least.

2. The hair removal device with the semiconductor chilling plate as claimed in claim 1, wherein the heat dissipation device further comprises a heat sink, a fan bracket and an exhaust fan located in the fan bracket, the fan bracket is fixed on the circuit board, the heat sink is respectively connected with the transparent crystal and the fan bracket, the heat dissipation channel is located in the heat sink, and the heat dissipation channel is communicated with an air outlet on the fan bracket.

3. The hair removal device with the semiconductor chilling plate according to claim 2, wherein the heat sink includes a first heat dissipation bracket, a second heat dissipation bracket, a first connection plate and a second connection plate, both ends of the first connection plate and the second connection plate are connected to the first heat dissipation bracket and the second heat dissipation bracket, the first connection plate is provided with a groove, the groove can be connected to the transparent crystal in a matching manner, the second connection plate is connected to the fan bracket, the second connection plate is provided with a plurality of ventilation openings, the first heat dissipation bracket is located above the fan bracket, and the second heat dissipation bracket is located below the fan bracket.

4. The hair removal device with the semiconductor chilling plate as claimed in claim 3, wherein a first ventilation cavity and a step surface are provided on the first heat dissipation bracket, the step surface is connected to the first heat dissipation bracket and the first connection plate, the first ventilation cavity is connected to the air outlet through the step surface, the first ventilation cavity is connected to the step surface to form a first heat dissipation channel, and the step surface is an inclined structure.

5. The hair removal device with the semiconductor chilling plate as claimed in claim 3, wherein the first heat dissipation bracket, the second heat dissipation bracket, the first connecting plate and the second connecting plate are sequentially connected to form a second ventilation cavity, the second ventilation cavity is located between the first heat dissipation bracket and the second heat dissipation bracket, or the second ventilation cavity is located between the first connecting plate and the second connecting plate, and the second ventilation cavity and the plurality of ventilation openings are connected to form a second heat dissipation channel.

6. The hair removal device with a semiconductor cooling plate of claim 3, wherein a third ventilation cavity and a concave hole are formed on the second heat dissipation bracket, the second heat dissipation channel and the third ventilation cavity are connected through the concave hole, and the third ventilation cavity and the concave hole are connected to form a third heat dissipation channel.

7. The hair removal device with the semiconductor chilling plate as claimed in claim 2, wherein the heat dissipation channel comprises a first heat dissipation channel, a second heat dissipation channel and a third heat dissipation channel, and the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel are all communicated with the air outlet.

8. The hair removal device with the semiconductor chilling plate as claimed in claim 7, wherein a first air outlet and a second air outlet are further provided on the housing of the main body, the first air outlet is connected with the second heat dissipation channel, and the second air outlet is connected with the first heat dissipation channel and the second heat dissipation channel.

9. The hair removal device with the semiconductor chilling plate according to claim 1, wherein the semiconductor chilling plate further comprises a conductive set, a conductive wire and a hot end portion, two ends of the conductive set are respectively connected with the cold end portion and the hot end portion, the conductive set and the circuit board are connected through the conductive wire, and when the transparent crystal is connected with the heat dissipation device, a space is arranged between the hot end portion of the semiconductor and the first connecting plate of the heat dissipation device.

10. The hair removal device with a semiconductor chilling plate as claimed in claim 1, wherein a charging slot, a display screen and a control button are further provided on the housing of the main body, and the charging slot, the display screen and the control button are all connected with the circuit board.

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