CN217606774U - Wafer jump sheet detection mechanism - Google Patents

Abstract

The application relates to a wafer jump piece detection mechanism, include: the bracing piece, fixing base and two sets of correlation sensors, two sets of correlation sensors set up respectively on the sensor fixed plate, and the light that the transmitting terminal in the correlation sensor sent can pass the receiving terminal that the via hole reaches the opposite side. The through hole that sets up on the sensor fixed plate can make the light that the correlation sensor transmitting terminal sent be the same shape with the through hole, prevents the insensitivity problem of response that the too wide light that the correlation sensor transmitting terminal sent and cause.

Description

Wafer jump sheet detection mechanism

Technical Field

The application belongs to the technical field of wafer production equipment, and particularly relates to a wafer jump detection mechanism.

Background

In the wafer production equipment, no matter the wafer box bears the weight of the wafer or does not have the fixed mode of wafer box direct support, all need monitor the state of wafer, for example use photoelectric sensor to respond to the edge of wafer, when the wafer is accurately placed, photoelectric sensor's light is wiped the wafer edge, when the wafer is placed the position inaccurate (partial wafer is higher), then can block photoelectric sensor, however current photoelectric sensor no matter be transmitting terminal or receiving terminal, the light width degree of sending is broad, easily lead to the erroneous judgement, the position is accurate also easily reports the mistake promptly.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: in order to solve the defects in the prior art, the wafer jump detecting mechanism with sensitive detection is provided.

The utility model provides a technical scheme that its technical problem adopted is:

a wafer jump detecting mechanism includes:

4 support rods are arranged at four corners of the wafer;

the number of the fixed seats is 4, the fixed seats are respectively arranged on the supporting rods and comprise first fixed plates directly connected with the supporting rods, second fixed plates perpendicular to the first fixed plates and sensor fixed plates arranged on the second fixed plates, and through holes are formed in the sensor fixed plates;

and the two groups of correlation sensors are respectively arranged on the sensor fixing plate, and light rays emitted by the emitting ends in the correlation sensors can pass through the through holes to reach the receiving end on the other side.

Preferably, the utility model discloses a wafer jump piece detection mechanism, the diameter of installing the via hole of the sensor fixed plate on the correlation sensor of transmitting terminal is 1-2mm.

Preferably, the utility model discloses a wafer jump piece detection mechanism, the diameter of the via hole of the sensor fixed plate on the correlation sensor of installing the receiving terminal is greater than the via hole of the sensor fixed plate on the correlation sensor of installing the transmitting terminal.

Preferably, the utility model discloses a wafer jump piece detection mechanism, horizontal installation hole has on the first fixed plate.

Preferably, the utility model discloses a wafer jump piece detection mechanism has vertical mounting hole on the second fixed plate.

Preferably, the utility model discloses a wafer jump piece detection mechanism, the bracing piece has the horizontal plate, and is provided with rectangular hole on the horizontal plate.

Preferably, the utility model discloses a wafer jump piece detection mechanism, be provided with the unequal via hole of a plurality of diameters along vertical direction on the sensor fixed plate to select the via hole of suitable size according to actual conditions.

The utility model has the advantages that:

the utility model discloses a wafer jump piece detection mechanism, the via hole that sets up on the sensor fixed plate can make the light that the correlation sensor transmitting terminal sent be the shape the same with the via hole, prevents the too wide light that the correlation sensor transmitting terminal sent and the insensitive problem of response that causes.

Drawings

The technical solution of the present application is further explained below with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of a wafer skipping detection mechanism according to an embodiment of the present application; (the line connecting the two correlation sensors in the figure is a light ray)

FIG. 2 is a schematic single-side view of a wafer skipping detection mechanism according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a support frame according to an embodiment of the present application;

the reference numbers in the figures are:

1. a support bar;

2. a fixed seat;

4. a correlation sensor;

8. a wafer carrying device;

9. a wafer;

21. a second fixing plate;

22. a first fixing plate;

23. a sensor fixing plate;

231. and (6) a via hole.

Detailed Description

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify the description, but are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus are not to be construed as limiting the scope of the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific cases.

The technical solutions of the present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Examples

The present embodiment provides a wafer skipping detection mechanism, as shown in fig. 1 and 3, including:

4 support rods are arranged at the four corners of the wafer;

the number of the fixed seats 2 is 4, the fixed seats are respectively arranged on the support rod 1, and each fixed seat comprises a first fixed plate 22 directly connected with the support rod 1, a second fixed plate 21 perpendicular to the first fixed plate 22, and a sensor fixed plate 23 arranged on the second fixed plate 21, and a through hole 231 is formed in the sensor fixed plate 23;

two sets of correlation sensors 4 (be photoelectric sensor) set up respectively on sensor fixed plate 23, and the light that the transmitting terminal in the correlation sensor 4 sent can pass through via hole 231 and reach the receiving terminal.

In the wafer skipping detection mechanism of the embodiment, the via hole 231 formed in the sensor fixing plate 23 enables the light emitted from the emitting end of the correlation sensor 4 to have the same shape as the via hole 231, thereby preventing the problem of insensitivity of sensing caused by the excessively wide light emitted from the emitting end of the correlation sensor 4.

Further, in the wafer jump detecting mechanism of the embodiment, the diameter of the via hole 231 of the sensor fixing plate 23 on the opposite-emitting sensor 4 with the emitting end mounted thereon is 1-2mm, such as 1mm, 1.5mm, 2mm, and so on.

Further, in the wafer skipping detection mechanism of the embodiment, the diameter of the via hole 231 of the sensor fixing plate 23 on the correlation sensor 4 mounted with the receiving end is larger than that of the via hole 231 of the sensor fixing plate 23 on the correlation sensor 4 mounted with the emitting end. So that the receiving end can more easily receive the light emitted from the emitting end.

Further, in the wafer skipping detection mechanism of the embodiment, the first fixing plate 22 has a horizontal mounting hole, so that the mounting position of the fixing base 2 can be adjusted in the horizontal direction.

Further, in the wafer skipping detection mechanism of the embodiment, the second fixing plate 21 has a vertical mounting hole, so that the mounting position of the correlation sensor 4 can be adjusted in the vertical direction.

Further, in the wafer skipping detection mechanism of the embodiment, the support rod 1 has a horizontal plate, and the horizontal plate is provided with a strip hole.

Further, in the wafer jump detecting mechanism of this embodiment, the sensor fixing plate 23 is provided with a plurality of through holes 231 with different diameters along the vertical direction, so that the through holes 231 with appropriate sizes are selected according to actual conditions.

As shown in fig. 2, a wafer 9 is loaded on the wafer loading device 8 (the wafer loading device 8 does not belong to the content required to be protected by the present application), the two sets of correlation sensors 4 respectively correspond to two sides above the wafer, when the position of the wafer 9 is accurate, the light of the correlation sensors 4 passes along the edge of the wafer 9, and when the position of any wafer 9 is not accurate, the light is shielded, so that the sensor at the receiving end cannot receive the light.

In light of the foregoing description of the preferred embodiments according to the present application, it is to be understood that various changes and modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims. The technical scope of the present application is not limited to the contents of the specification, and must be determined according to the scope of the claims.

Claims (7)

1. A wafer jump detecting mechanism, comprising:

4 support rods (1) are arranged at the four corners of the wafer;

the number of the fixing seats (2) is 4, the fixing seats are respectively arranged on the supporting rods (1), and each fixing seat comprises a first fixing plate (22) directly connected with the corresponding supporting rod (1), a second fixing plate (21) perpendicular to the corresponding first fixing plate (22), and a sensor fixing plate (23) arranged on the corresponding second fixing plate (21), and each sensor fixing plate (23) is provided with a through hole (231);

two sets of correlation sensors (4) are respectively arranged on the sensor fixing plate (23), and light rays emitted by the emitting ends in the correlation sensors (4) can pass through the through holes (231) to reach the receiving end on the other side.

2. The wafer jump detection mechanism according to claim 1, wherein the diameter of the via hole (231) of the sensor fixing plate (23) on the correlation sensor (4) with the transmitting end is 1-2mm.

3. The wafer jump detection mechanism according to claim 1, wherein the diameter of the via hole (231) of the sensor fixing plate (23) on the correlation sensor (4) provided with the receiving end is larger than the diameter of the via hole (231) of the sensor fixing plate (23) on the correlation sensor (4) provided with the emitting end.

4. The wafer skipping detection mechanism of claim 1, wherein the first fixing plate (22) has a horizontal mounting hole.

5. The wafer skipping detection mechanism according to claim 1, wherein the second fixing plate (21) has a vertical mounting hole.

6. The wafer jump detecting mechanism according to claim 1, wherein the supporting rod (1) has a horizontal plate, and the horizontal plate is provided with a long hole.

7. The wafer jump detecting mechanism according to claim 5, wherein a plurality of through holes (231) with different diameters are vertically arranged on the sensor fixing plate (23), so that the through holes (231) with proper sizes can be selected according to actual conditions.

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