CN217605155U - Dual-modality tactile sensor assembly and signal acquisition system - Google Patents
Dual-modality tactile sensor assembly and signal acquisition system Download PDFInfo
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- CN217605155U CN217605155U CN202220014518.0U CN202220014518U CN217605155U CN 217605155 U CN217605155 U CN 217605155U CN 202220014518 U CN202220014518 U CN 202220014518U CN 217605155 U CN217605155 U CN 217605155U
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Abstract
The application provides a bimodal tactile sensor assembly and a signal acquisition system. The dual-modality tactile sensor assembly includes: at least one visual pressure sensor for converting pressure applied to the at least one visual pressure sensor into an optical signal; a temperature sensor coupled to the at least one visual pressure sensor for collecting an electrical signal of a resistance in the temperature sensor responsive to temperature; wherein the optical signal and the electrical signal are output independently and synchronously with each other. The pressure-temperature bimodal tactile sensor component provided by the application has no signal crosstalk, and simultaneous sensing and independent sensing of pressure and temperature are realized.
Description
Technical Field
The present application relates to the field of sensor technology, and in particular, to a bimodal tactile sensor assembly and a signal acquisition system.
Background
The intelligent robot has the characteristics of learning, reasoning, autonomous interaction and the like, and has important and wide application in the fields of civil life, military, aerospace, industry and the like. The artificial bionic touch sensing is an important way for the intelligent robot to sense the outside and acquire information, and is a prerequisite for learning, reasoning and evolution of the intelligent robot. The existing touch sensor assembly is mostly focused on single physical quantity sensing or single-mechanism multi-physical quantity sensing, so that the problems of single sensing signal or signal crosstalk and the like exist, and the intelligent requirement of a future robot cannot be met.
SUMMERY OF THE UTILITY MODEL
The purpose of the embodiments of the present application is to couple multiple sensing mechanisms, provide a bimodal tactile sensor assembly and a signal acquisition system, and implement crosstalk-free sensing of pressure and temperature. PSS, respectively converts pressure and temperature stimuli into light and electric signals, and realizes simultaneous and independent output of stimulus sensing signals.
To achieve the above object, an embodiment of the present application provides a dual-mode tactile sensor assembly, including: at least one visual pressure sensor for converting pressure applied to the at least one visual pressure sensor into an optical signal; a temperature sensor coupled to the at least one visual pressure sensor for collecting an electrical signal of a resistance in the temperature sensor responsive to temperature; wherein the optical signal and the electrical signal are output independently and synchronously with each other.
Further, the at least one visual pressure sensor comprises a layer of carrier material and a mechanoluminescence material; the force-luminescent material is dispersed in the layer of carrier material and emits light in response to a force applied to the at least one visual pressure sensor, wherein the intensity of the emitted light increases with increasing force.
Further, the structure of the dual-modality tactile sensor assembly includes any of: sandwich structures, laminated structures or cantilever structures.
Further, the at least one visual pressure sensor has a thickness value in the range of 0.1mm to 2mm.
Further, the layer of carrier material comprises: a transparent or translucent polymer matrix.
Further, the mechanoluminescence material includes a ZnS or CaZnOS material doped with transition metal ions or rare earth ions.
Further, the temperature sensor includes: the temperature sensing device comprises a temperature sensing layer and interdigital electrodes, wherein the variable resistance of the temperature sensing layer is reduced along with the increase of the temperature.
Further, the material of the temperature sensing layer comprises poly (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid) PEDOT: PSS, the thickness range of the temperature sensing layer is 3-10um; the thickness range of the interdigital electrode is 30nm-100nm.
Further, the material of the temperature sensing layer includes an organic, inorganic, or organic-inorganic hybrid material having a temperature response.
Further, the organic, inorganic or organic-inorganic hybrid material having a temperature response includes: a metal thin film, carbon nanotubes, or metal nanowires.
By the technical scheme, the dual-mode touch sensor assembly is coupled with optical and electrical mechanisms, so that the dual-mode touch sensor assembly can independently sense pressure and temperature without signal crosstalk.
In another aspect, the present application provides a signal acquisition system based on a dual-modality tactile sensor assembly, comprising: the bimodal tactile sensor assembly is used for simultaneously acquiring an electric signal generated by a variable resistor on the temperature sensor and an optical signal generated on the visual pressure sensor; the tester is electrically connected with the dual-mode touch sensor assembly and is used for converting the electric signal generated by the variable resistor into a temperature signal; a spectrometer electrically connected to the bimodal tactile sensor assembly for converting the optical signal to a pressure signal; the database is connected with the LCR tester and the spectrometer in a wired or wireless way and is used for simultaneously storing the temperature signal and the pressure signal; and the terminal device reads the temperature signal and the pressure signal stored in the database in a wired or remote mode and displays the signals visually.
Through the technical scheme, the wireless sensing feedback of pressure and temperature can be realized through the non-crosstalk and independent light-emitting characteristics between signals of the dual-mode touch sensor assembly.
In another aspect, the application provides a use of a signal acquisition system based on a bimodal tactile sensor assembly in a wireless health monitoring system.
By the technical scheme, the bimodal tactile sensor component is coupled with optical and electrical mechanisms, so that the bimodal tactile sensor component can independently sense pressure and temperature without signal crosstalk; the manufacturing process of the dual-mode touch sensor assembly is simple and easy to copy; the crosstalk-free and independent light emitting characteristics between signals of the dual-mode touch sensor assembly not only ensure the visual interaction between a user and the robot, but also realize the wireless sensing feedback of pressure and temperature.
Additional features and advantages of embodiments of the present application will be described in detail in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the embodiments of the disclosure, but are not intended to limit the embodiments of the disclosure. In the drawings:
FIG. 1 is a schematic diagram of a dual-modality tactile sensor assembly configuration according to an embodiment of the present application;
FIG. 2 is an ML spectrum of the response of the dual-modality tactile sensor assembly of the embodiment of the present application to different forces;
FIG. 3 is a graph of the stability performance of the dual-modality tactile sensor assembly of the embodiment of the present application with respect to pressure response;
FIG. 4 is a graph of the resistance change of a dual-modality tactile sensor assembly of an embodiment of the present application, along with a fitted graph;
FIG. 5 is a graph illustrating temperature cycling stability testing of a dual-modality tactile sensor assembly according to an embodiment of the present application;
FIG. 6 is a graph of temperature for a dual-modality tactile sensor assembly with different forces applied and different temperatures according to an embodiment of the present application;
FIG. 7 is a flow chart of data transmission of a dual-modality tactile sensor assembly based signal acquisition system according to an embodiment of the present application.
Detailed Description
The following detailed description of embodiments of the present application will be made with reference to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the embodiments of the application, are given by way of illustration and explanation only, not limitation.
Mechanoluminescence (ML) refers to the phenomenon of luminescence of a material produced by external mechanical forces such as compression, stretching, scratching, tearing, or grinding.
Apparatus embodiment
FIG. 1 is a schematic diagram of a dual-modality tactile sensor assembly structure according to an embodiment of the present application.
Embodiments of the present application provide a dual-modality tactile sensor assembly. The sensor assembly includes: at least one visual pressure sensor for converting pressure applied to the at least one visual pressure sensor into an optical signal; the temperature sensor is coupled with the at least one visual pressure sensor and is used for acquiring an electric signal of a resistor in the temperature sensor responding to the temperature; wherein the optical signal and the electrical signal are output independently and synchronously with each other. The device is not limited to a sandwich structure, and the structure of the bimodal tactile sensor component, such as a laminated structure, a cantilever structure and the like, can be changed according to the requirement; the sensor component can also be designed in a patterning mode according to the corresponding application scene, such as an arrayed sensor component and a special-shape (cylindrical shape, prismatic shape and the like) touch sensor component. As shown in FIG. 1, the dual-modality tactile sensor assembly preferably employs a sandwich structure, wherein the dual-modality tactile sensor assembly 100 includes:
a first visual pressure sensor 101 for converting a pressure applied to the first visual pressure sensor into a first light signal.
A second visual pressure sensor 103 for converting pressure applied to the second visual pressure sensor into a second light signal.
And the temperature sensor is positioned between the first visual pressure sensor 101 and the second visual pressure sensor 103 and is used for acquiring the electric signal of the variable resistor. The first optical signal, the second optical signal and the electric signal of the variable resistor are mutually independent and synchronously output; the dual-modality tactile sensor assembly is insensitive to temperature during pressure sensing and insensitive to pressure during temperature sensing.
The first and second visual pressure sensors 101, 103 are of the same construction and comprise a layer of carrier material 107 and a layer of mechanoluminescence material; the mechanoluminescence material is dispersed on the layer of carrier material 107, emitting light in response to a force applied to the first and second visual pressure sensors 101, 103, wherein the intensity of the emitted light increases with increasing force.
According to an embodiment, the thickness values of the first and second visual pressure sensors range from 0.1mm to 2mm, with a preferred value of 0.5mm.
According to an embodiment, the electroluminescent material comprises, but is not limited to, transition metal ions and rare earth ions (Mn 2+, pb2+, pr3+, ho3+, tb3+, dy3+, eu3+, sm3+, yb3+, tm3 +) doped ZnS or CaZnOS material, the layer of carrier material 107 comprising: transparent or translucent polymer matrices, such as epoxy, AB glue. Applying a force to the first visual pressure sensor 101 and the second visual pressure sensor 103 induces luminescence of the force-luminescent material, wherein the luminescence intensity increases with increasing force and the luminescence phenomenon may reciprocate with the applied force cycle, for example, the luminescence phenomenon increases-decreases-increases with increasing-decreasing-increasing cycle of the applied force. The light is clearly visible in the dark or natural light environment.
According to an embodiment, the temperature sensor (not shown in fig. 1) comprises: a temperature sensing layer 102 and interdigital electrodes 104, wherein the variable resistance of the temperature sensing layer 102 decreases with increasing temperature. The material of the temperature sensing layer 102 includes poly (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid) PEDOT: PSS, the thickness range of the temperature sensing layer is 3-10um; the thickness range of the interdigital electrode is 30nm-100nm. The temperature sensing layer 102 further includes an organic, inorganic, organic-inorganic hybrid material with temperature response, such as a metal thin film, carbon nanotubes, or metal nanowires, and the temperature sensing layer 102 is mounted on the interdigital electrode 104, which is preferably a copper electrode.
According to an embodiment, the resistance of the temperature sensor decreases with increasing temperature. The relationship between the resistance (Y) of the temperature sensor 105 and the temperature (X) will be described in detail in fig. 4. The temperature sensor remains consistent throughout multiple heating or cooling cycles as will be described in detail in fig. 5, indicating a persistent operation of the temperature sensor.
According to an embodiment, a process for preparing a dual-modality tactile sensor assembly comprises the steps of:
(1) Uniformly mixing a mechanoluminescence material (such as ZnS doped with Mn element or CaZnOS) and an organic matrix (such as epoxy resin) according to a certain mass ratio (such as 7:3), and injecting into a silica gel mold;
(2) Drying the die in an oven at 60 ℃ for 4 hours to obtain a first visual pressure sensor 101;
(3) Depositing copper interdigital electrodes 104 for a temperature sensor on the visual pressure sensor by sputtering method in combination with a patterned mask;
(4) The reaction of (poly (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid)) PEDOT: PSS is coated on the Cu interdigital electrode in a spinning mode, rotates at the rotating speed of 300rpm for 30 seconds, and then is solidified in an oven at the temperature of 50 ℃ for 1 hour to obtain a temperature sensing layer 102;
(5) And (3) putting the sample obtained in the step into a silica gel mold again, enabling the temperature sensing layer 102 to face upwards, repeating the steps (1) and (2) to obtain a second visual layer pressure sensing layer 103, and thus, the temperature sensor is sandwiched by the two visual pressure sensing layers to form a sandwich structure, and the preparation of the bimodal touch sensor assembly is completed.
FIG. 2 is an ML spectrum of the response of a dual-modality tactile sensor assembly of an embodiment of the present application to different forces.
Example 1
Referring to fig. 2, the measured first optical signal and/or the second optical signal is processed by the ocean spectrometer to convert the measured wavelength range and resolution into readable wavelength values (nm) and mechanical luminescence intensity (a.u). The peak of the emission of the mechanoluminescence after the excitation of the mechanical stimulus is about 596nm, and the light intensity is increased along with the increase of the applied force. Where a force is applied to the dual-modality tactile sensor assembly 100 (sample) by a linear motor and a force gauge is used to simultaneously quantify the dual-modality tactile sensor assembly 100. In the embodiment, the applied force is increased step by step from 2N to 13N, and the light emission peak of the ML spectrum is correspondingly increased along with the increase of the force. This example demonstrates that the luminous intensity of a dual-modality tactile sensor assembly increases with increasing applied force.
FIG. 3 is a graph of the stability performance of a dual-modality tactile sensor assembly of an embodiment of the present application with respect to pressure response.
Example 2
Referring to fig. 3, the dual-modality tactile sensor assembly exhibits a change in the peak of the ML spectrum with the application of multiple cycles of mechanical stimulus excitation. In the embodiment, a linear motor is periodically controlled by a program, 6N force is periodically and circularly applied to the dual-mode tactile sensor assembly, and ML luminescence peak intensity collected and recorded by a spectrometer at 596nm is obtained after 2300 cycles. This example demonstrates the stability of the dual-modality tactile sensor assembly to pressure response, and also understands that the dual-modality tactile sensor assembly does not exhibit instability in luminous intensity with pressure variations due to repeated mechanical stimulus exposure.
FIG. 4 is a graph of resistance change, along with a fitted graph, for a dual-modality tactile sensor assembly according to an embodiment of the present application.
Example 3
PSS of the temperature sensing layer 102 decreases with increasing temperature and shows a fitted curve of a cubic polynomial fit to the curve.
The thermistor is a sensitive element, the resistance value of the thermistor can change along with the change of temperature, and the thermistor is different from a common fixed resistor, belongs to a variable resistor and is widely applied to various electronic components. Unlike resistance thermometers that use pure metals, the materials used in thermistors are typically ceramics or polymers. The positive temperature coefficient thermistor has a resistance value which is larger as the temperature is higher, and the negative temperature coefficient thermistor has a resistance value which is lower as the temperature is higher, and they are both semiconductor devices. The thermistor has the main characteristics of high sensitivity, more than ten times of resistance temperature coefficient than metal, small volume and convenient use.
According to an embodiment, a peltier assembly is used to control the temperature of the dual-mode tactile sensor assembly, the resistance-temperature relation curve collected and recorded by the LCR is obtained when the temperature is raised from 20 ℃ to 60 ℃, and discrete points distributed according to experimental data can be obtained. PSS resistance (Ω) versus temperature (deg.C) of the temperature sensing layer 102 is shown and can be expressed as a cubic equation: y =1177.37675-25.97355+0.44683X 2 -0.0028X 3 Wherein Y represents a resistance value and X represents a temperature. From the fitted curves of FIG. 4, it is demonstrated that the dual-modality tactile sensor assembly 100 is a negative temperature coefficient thermistor, with lower resistance values at higher temperatures.
FIG. 5 is a graph illustrating temperature cycling stability testing of a dual-modality tactile sensor assembly according to an embodiment of the present application.
Example 4
Referring to fig. 5, a test curve of the cycle stability of the temperature sensor was obtained by repeating heating and cooling between 25 ℃ and 50 ℃. In the case of 8000 experiments, all normalized resistances were approximately stable at the upper and lower boundary values of 25 ℃ and 50 ℃. Specifically, for a system with a sample temperature of 25 ℃, the corresponding resistance values are normalized to 1, the normalized resistance for the resistance value corresponding to 50 ℃ is approximately 0.86, and the normalized frequency range is between [0.85,1 ]. Wherein the deviation in the temperature sensor resistance change is less than 0.01%, indicates that the dual-mode tactile sensor assembly of the present application has good stability and repeatability, and it is also understood that the dual-mode tactile sensor assembly does not have its thermistor unstable due to repeated heating.
FIG. 6 is a graph of temperature for a dual-modality tactile sensor assembly with different forces applied and different temperatures according to an embodiment of the present application.
Example 5
Referring to fig. 6, 0N and 5N forces were applied to the dual-modality tactile sensor assembly at temperatures of 30-50 c, respectively, and the temperature profiles at 0N and 5N were compared.
According to the embodiment, firstly, under the condition of applying 0N to the bimodal tactile sensor assembly, selecting and removing a heating source after respectively heating to 30 ℃, 35 ℃, 40 ℃, 45 ℃ and 50 ℃ from 25 ℃ for example under the condition that the heating range is within the range of 30 ℃ to 50 ℃, and obtaining five groups of normalized resistance-temperature relation curves (a: 0N-30 ℃, b:0N-35 ℃, c:0N-40 ℃, d:0N-45 ℃ and e:0N-50 ℃) recorded in 0N through LCR acquisition; under the conditions of 5N applied to the modal tactile sensor assembly, other conditions remained the same as above, and five additional sets of normalized resistance-temperature relationship curves at 5N recorded by LCR acquisition (a: 5N-30 deg.C, b: 5N-35 deg.C, c: 5N-40 deg.C, d: 5N-45 deg.C, e: 5N-50 deg.C) were obtained. Fig. 6 shows that the temperature dependence curves at the same temperature approximately overlap with the application of 0N and 5N (lower graph in fig. 6).
Fig. 6 further shows the luminescence intensity of mechanical luminescence of different sets of applied forces at different temperatures of the pressure sensor according to an embodiment, the luminescence peak not varying with temperature (dashed upper part in fig. 6). The pressure sensor is stimulated to mechanoluminesce with a force of 6N and then integrated over the ML curve over a wavelength range of 400nm to 800nm at different temperatures (30 ℃ to 50 ℃). The ML integrated intensity values at 30-50 ℃ are shown to trend toward horizontal lines (the control group is without force, the rest conditions are the same), indicating that the error between the force without application and the force with 6N application is small and within a reasonable range.
As shown in FIG. 6, the effect of temperature on the pressure response of a dual-modality tactile sensor is known according to the above embodiments, wherein the ML integrated intensities under steady forces can approximately overlap under temperature variations over the operating range of the dual-modality tactile sensor assembly, which indicates that the dual-modality tactile sensor assembly is not temperature sensitive during pressure sensing. The thermal response curves of the dual-mode tactile sensor assembly appear consistent over varying forces, indicating that the dual-mode tactile sensor assembly is not sensitive to pressure during temperature sensing. The optical and electrical sensing signals remain consistent under stimuli of varying pressure and temperature, demonstrating the non-interfering sensing capabilities of the dual-modality tactile sensor assembly.
FIG. 7 is a flow chart illustrating data transmission in a signal acquisition system based on a dual-modality tactile sensor assembly according to an embodiment of the present application.
The user interaction interface with the sensory feedback function has important significance for the humanoid robot to sense external stimulation and exchange information with the human. As shown in fig. 7, according to an embodiment, there is provided a dual-modality tactile sensor assembly-based signal acquisition system 700, comprising: the dual-modality tactile sensor assembly 100, the tester 701, the spectrometer 703, the database 705, and the terminal device 707 described above in this application.
A dual-modality tactile sensor assembly 100 for simultaneously acquiring an electrical signal generated by a variable resistance on a temperature sensor and visualizing an optical signal generated on a pressure sensor.
A database 705, wired or wirelessly connected to the LCR tester 701 and the spectrometer 703, for storing both temperature and pressure signals. According to an embodiment, the database is preferably a cloud database.
The terminal device 707 reads the temperature signal and the pressure signal stored in the database by wire or remotely and displays them visually.
According to an embodiment, the wireless transmission of sensory data from the user interaction device to the smartphone may be demonstrated using a custom developed application. The temperature and pressure signals are first collected and uploaded as sensory information into the "cloud" (database 705), then extracted by developed applications (e.g., MATLAB program and android development program) and displayed by the terminal device 707 (e.g., smartphone). Force transmission information and temperature and pressure sensing signals can be remotely and simultaneously read, and convenient interaction between a wearer and a supervisor is realized.
According to an embodiment, a signal acquisition system based on a dual-modality tactile sensor assembly is applied to a wireless health monitoring system. Because the bimodal touch sensor component can sense pressure and temperature without crosstalk, the intelligent robot can effectively sense the outside and acquire information, the artificial bionic touch sensing accuracy is improved more effectively, and the intelligent robot can learn, reason and evolve more accurately.
In summary, the present application provides a temperature and pressure dual-modality tactile sensor assembly without signal coupling that can be used for tactile sensing and human-computer interaction applications. The combined sensing mechanism of piezoelectric/friction photon effect and thermal resistance effect can convert mechanical and thermal stimulation into optical and electrical signals with temperature sensitivity of-0.6 deg.C -1 The force detection is limited to 2N. The dual-mode touch sensor component can accurately capture the perception of external multiple stimuli, and arouses the contribution of a multi-mode sensor composed of multiple heterogeneous mechanisms to expand sensing and application.
The beneficial effect of this application does:
(1) The pressure and temperature sensing is realized by detecting different sensing variables, namely a first optical signal, a second optical signal and an electric signal of the variable resistor (read as a light intensity value and a resistance value);
(2) The dual-modality tactile sensor assembly couples optical and electrical mechanisms such that it is capable of sensing pressure and temperature independently without signal cross-talk;
(3) The pressure is visually identified through the piezoelectric or friction photon effect of ZnS or CaZnOS mechanoluminescence mixture, the temperature sensing is realized through the thermal resistance effect of PEDOT and PSS, and the manufacturing process of the bimodal touch sensor assembly is simple and easy to copy;
(4) The dual-modality tactile sensor assembly of the present application, exhibits-0.6% ° c over the range of 20 ℃ -60 ℃ -1 And the applied force can be visually sensed at a detection limit of 2N;
(5) The crosstalk-free and independent light-emitting characteristics between signals of the dual-mode touch sensor assembly can realize wireless sensing feedback of pressure and temperature along with development of mobile phone application programs.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art to which the present application pertains. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (7)
1. A dual-modality tactile sensor assembly, the sensor assembly comprising:
at least one visual pressure sensor for converting pressure applied to the at least one visual pressure sensor into an optical signal;
a temperature sensor coupled to the at least one visual pressure sensor for collecting an electrical signal of a resistance in the temperature sensor responsive to temperature; wherein
The optical signal and the electrical signal are output independently and synchronously.
2. The dual-modality tactile sensor assembly of claim 1, wherein the at least one visual pressure sensor emits light in response to a force applied to the at least one visual pressure sensor, wherein the intensity of the emitted light increases as the force increases.
3. The dual-modality tactile sensor assembly of claim 1 or 2, wherein the structure of the dual-modality tactile sensor assembly includes any one of: sandwich structures, laminated structures or cantilever structures.
4. The dual-modality tactile sensor assembly of claim 1 or 2, wherein the at least one visual pressure sensor has a thickness value in a range of 0.1mm to 2mm.
5. The dual-modality tactile sensor assembly of claim 1, wherein the temperature sensor comprises: the temperature sensing device comprises a temperature sensing layer and interdigital electrodes, wherein the resistance of the temperature sensing layer decreases along with the temperature response, and the resistance decreases along with the temperature.
6. The dual-modality tactile sensor assembly of claim 5, wherein the material of the temperature sensing layer comprises poly (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid) PEDOT: PSS, the thickness of the temperature sensing layer ranges from 3 um to 10um;
the thickness range of the interdigital electrode is 30nm-100nm.
7. A signal acquisition system, comprising:
the dual-modality tactile sensor assembly of any one of claims 1 to 6, being configured to simultaneously acquire an electrical signal generated by a variable resistance on the temperature sensor and visualize an optical signal generated on the pressure sensor;
the tester is electrically connected with the dual-mode tactile sensor assembly and is used for converting the electric signal generated by the variable resistor into a temperature signal;
a spectrometer electrically connected to the dual-modality tactile sensor assembly for converting the optical signal to a pressure signal;
a database, connected with the tester and the spectrometer in a wired or wireless way, for storing the temperature signal and the pressure signal at the same time;
and the terminal device reads the temperature signal and the pressure signal stored in the database in a wired or remote mode and displays the signals visually.
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Cited By (3)
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| CN116295656A (en) * | 2023-05-09 | 2023-06-23 | 之江实验室 | Photoelectric fusion-based integrated multi-parameter sensor and preparation method thereof |
| CN117091653A (en) * | 2023-08-24 | 2023-11-21 | 哈尔滨理工大学 | Double-parameter thin film sensor for safety monitoring of energy storage system and preparation method and application thereof |
| CN118209228A (en) * | 2024-01-23 | 2024-06-18 | 武汉纺织大学 | Electrothermal response flexible touch sensor based on carbon nanomaterial and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116295656A (en) * | 2023-05-09 | 2023-06-23 | 之江实验室 | Photoelectric fusion-based integrated multi-parameter sensor and preparation method thereof |
| CN116295656B (en) * | 2023-05-09 | 2023-10-31 | 之江实验室 | Photoelectric fusion-based integrated multi-parameter sensor and preparation method thereof |
| CN117091653A (en) * | 2023-08-24 | 2023-11-21 | 哈尔滨理工大学 | Double-parameter thin film sensor for safety monitoring of energy storage system and preparation method and application thereof |
| CN117091653B (en) * | 2023-08-24 | 2024-04-12 | 哈尔滨理工大学 | Double-parameter thin film sensor for safety monitoring of energy storage system and preparation method and application thereof |
| CN118209228A (en) * | 2024-01-23 | 2024-06-18 | 武汉纺织大学 | Electrothermal response flexible touch sensor based on carbon nanomaterial and preparation method thereof |
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