CN217597748U - Cooling water channel mechanism of injection mold - Google Patents
Cooling water channel mechanism of injection mold Download PDFInfo
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- CN217597748U CN217597748U CN202221505741.1U CN202221505741U CN217597748U CN 217597748 U CN217597748 U CN 217597748U CN 202221505741 U CN202221505741 U CN 202221505741U CN 217597748 U CN217597748 U CN 217597748U
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- water box
- injection mold
- copper water
- cooling
- spacer
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Abstract
The utility model discloses an injection mold's cooling water route mechanism, including copper water box, semiconductor refrigeration piece and installing frame, still include spacer, lower spacer and filter sleeve, the semiconductor refrigeration piece is located the installing frame bottom, the top is inserted and is equipped with copper water box in the installing frame, copper water box both sides bottom and the equal welded connection in installing frame both sides top have the installation ear that corresponds, copper water box top both ends are equipped with water inlet and outlet respectively, water inlet top thread bush is equipped with the filter sleeve, the welded connection has connected the metal filter screen piece in the filter sleeve. The cooling waterway mechanism of the whole injection mold is stable and efficient to use, the waterway mechanism for cooling is provided for the injection mold, the semiconductor refrigerating mechanism is used for assisting in refrigerating, the cooling waterway mechanism replaces the traditional room-temperature water source, the forming efficiency of the injection molding part inside the injection mold is greatly increased, and the injection molding mechanism has higher practicability.
Description
Technical Field
The utility model relates to an injection mold technical field, in particular to injection mold's cooling water route mechanism.
Background
During the use period of the injection mold, the mold and the like need to be cooled, so that the molding speed of an injection molding piece is shortened, and the injection molding processing efficiency is improved.
Patent No. CN202120304550.8 discloses a cooling water circuit mechanism of an injection mold, which includes: the lower end of the injection molding nozzle is fixedly connected with an injection molding disc, the lower end of the injection molding disc is fixedly connected with an injection molding seat, the lower end of the injection molding seat is fixedly connected with an upper die, the lower end of the upper die is movably connected with a base, and the upper end of the base is fixedly connected with a lower die; the device of this application has following drawback: the water source of its cooling is close with indoor normal atmospheric temperature, and after the water source walked the injection mold highway section, its back end temperature had been unable to realize efficient cryogenic cooling effect, lacked the waterway mechanism that can utilize the temperature of the cold water of semiconductor. Therefore, a cooling water path mechanism of the injection mold is provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides an injection mold's cooling water route mechanism can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the technical proposal that:
the utility model provides an injection mold's cooling waterway mechanism, includes copper water box, semiconductor refrigeration piece and installing frame, still includes spacer, lower spacer and crosses the filter sleeve, the semiconductor refrigeration piece is located the installing frame bottom, the top is inserted and is equipped with copper water box in the installing frame, copper water box both sides bottom and the equal welded connection in installing frame both sides top have the installation ear that corresponds, copper water box top both ends are equipped with water inlet and outlet respectively, water inlet top thread bush is equipped with the filter sleeve, the welded connection has crossed the metal filter screen piece in the filter sleeve.
Further, crisscross laying of bottom and interior top in the copper water box has last spacer and lower spacer, it is located between water inlet and the outlet to go up spacer and lower spacer, go up spacer and copper water box interior top welded connection, spacer and copper water box interior bottom welded connection down.
Furthermore, the copper water box is connected with the mounting lug of the mounting frame through a bolt in a mounting mode.
Further, copper water box bottom surface and semiconductor refrigeration piece top refrigeration end laminating contact.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. through copper water box, semiconductor refrigeration piece, installing frame, go up the subassembly that spacer, lower spacer and filter sleeve constitute, the water route structure of cooling section is provided for injection mold to it is better to help the cooling effect during injection mold uses.
2. The cooling waterway mechanism of the whole injection mold is stable and efficient to use, the waterway mechanism for cooling is provided for the injection mold, the cooling waterway mechanism replaces the cooling waterway of the traditional room temperature water source through the auxiliary refrigeration of the semiconductor refrigerating mechanism, the forming efficiency of the injection molding part in the injection mold is greatly increased, and the practicability is higher.
Drawings
Fig. 1 is the utility model relates to an injection mold's cooling water route mechanism's overall structure schematic diagram.
Fig. 2 is the utility model relates to an injection mold's cooling waterway mechanism's installing frame structure sketch.
Fig. 3 is the utility model relates to an injection mold's cooling water route mechanism's copper water box structure sketch map.
Fig. 4 is the schematic view of the filter sleeve of the cooling water path mechanism of the injection mold according to the present invention.
Fig. 5 is the utility model relates to a cooling water route mechanism's copper water box looks sideways at cross-sectional structure sketch map of injection mold.
In the figure: 1. a semiconductor refrigeration sheet; 2. installing a frame; 3. a copper water box; 4. a water inlet; 5. a water discharge port; 6. a filter sleeve; 7. filtering a metal filter screen sheet; 8. an upper spacer; 9. a lower spacer; 10. and (7) installing ears.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-5, a cooling water path mechanism of an injection mold comprises a copper water box 3, a semiconductor refrigeration piece 1, an installation frame 2, an upper spacer 8, a lower spacer 9 and a filter sleeve 6, wherein the semiconductor refrigeration piece 1 is located at the bottom in the installation frame 2, the copper water box 3 is inserted at the top in the installation frame 2, the bottoms at two sides of the copper water box 3 and the tops at two sides of the installation frame 2 are respectively welded with a corresponding installation lug 10, two ends of the top of the copper water box 3 are respectively provided with a water inlet 4 and a water outlet 5, the top of the water inlet 4 is provided with the filter sleeve 6 in a threaded manner, and a metal filter screen 7 is welded in the filter sleeve 6.
The copper water box comprises a copper water box body 3, a water inlet 4, a water outlet 5, an upper spacer 8, a lower spacer 9, a water inlet pipe, a water outlet pipe, a water inlet pipe, a water outlet pipe and a water outlet pipe, wherein the inner bottom and the inner top of the copper water box body 3 are alternately provided with the upper spacer 8 and the lower spacer 9, the upper spacer 8 and the lower spacer 9 are positioned between the water inlet 4 and the water outlet pipe, the upper spacer 8 is welded with the inner top of the copper water box body 3, and the lower spacer 9 is welded with the inner bottom of the copper water box body 3; as shown in fig. 5, the arrangement of the upper and lower spacers 8 and 9 can help the water source stay longer in the copper water box 3.
Wherein, the copper water box 3 is connected with the mounting lug 10 of the mounting frame 2 through a bolt; as shown in fig. 1-3, the mounting lug 10 facilitates flexible bolt mounting and dismounting between the copper water box 3 and the mounting frame 2.
The bottom surface of the copper water box 3 is in fit contact with the refrigerating end at the top of the semiconductor refrigerating sheet 1; as shown in fig. 1, the cooling process is performed by a copper water box 3 at the cooling end of a semiconductor cooling plate 1.
What need explain, the utility model relates to an injection mold's cooling waterway mechanism, in operation, the personnel will use the water supply pipe in place to be connected with filter sleeve 6 on the water inlet 4, and be connected outlet 5 and the cooling tube that injection mold used, supply mechanism through using the place is peripheral for semiconductor refrigeration piece 1 provides the electric fish, in use, carry out cooling treatment for copper water box 3 by the refrigeration end of semiconductor refrigeration piece 1, make through the inside water source of copper water box 3 can realize the cooling, thereby can realize providing water-cooling treatment for injection mold by outlet 5 discharged water source, it is better to help the inside module shaping efficiency of back mould of moulding plastics, through last spacer 8 and lower spacer 9's setting, can help the dwell time of water source in copper water box 3 longer, greatly increased is long when water source and the contact of copper water box 3, make the cooling effect better.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. The utility model provides an injection mold's cooling water route mechanism, includes copper water box (3), semiconductor refrigeration piece (1) and installing frame (2), its characterized in that still includes spacer (8), lower spacer (9) and crosses filter sleeve (6), semiconductor refrigeration piece (1) is located installing frame (2) bottom, the top is inserted at installing frame (2) interior top and is equipped with copper water box (3), equal welded connection in copper water box (3) both sides bottom and installing frame (2) both sides top has installation ear (10) that correspond, copper water box (3) top both ends are equipped with water inlet (4) and outlet (5) respectively, water inlet (4) top thread bush is equipped with filter sleeve (6), it has metal filter screen piece (7) to cross the welded connection in filter sleeve (6).
2. The cooling waterway mechanism of the injection mold according to claim 1, wherein: spacer (8) and lower spacer (9) have been laid in the crisscross of bottom and interior top in copper water box (3), it is located between water inlet (4) and outlet (5) with lower spacer (9) to go up spacer (8), go up top welded connection in spacer (8) and copper water box (3), bottom welded connection in lower spacer (9) and copper water box (3).
3. The cooling waterway mechanism of the injection mold according to claim 1, wherein: the copper water box (3) is connected with the mounting lug (10) of the mounting frame (2) through bolts.
4. The cooling water path mechanism of the injection mold according to claim 1, characterized in that: the bottom surface of the copper water box (3) is in contact with the refrigerating end at the top of the semiconductor refrigerating sheet (1) in a fitting manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221505741.1U CN217597748U (en) | 2022-06-15 | 2022-06-15 | Cooling water channel mechanism of injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221505741.1U CN217597748U (en) | 2022-06-15 | 2022-06-15 | Cooling water channel mechanism of injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217597748U true CN217597748U (en) | 2022-10-18 |
Family
ID=83590407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221505741.1U Active CN217597748U (en) | 2022-06-15 | 2022-06-15 | Cooling water channel mechanism of injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217597748U (en) |
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2022
- 2022-06-15 CN CN202221505741.1U patent/CN217597748U/en active Active
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