CN217597505U - Portable monocrystalline silicon head cutting device - Google Patents

Abstract

The utility model provides a portable monocrystalline silicon head cutting device, include: a movable device body; the cutting assembly is arranged on the device main body and can move relative to the device main body to cut the monocrystalline silicon head; a cooling medium circulating assembly arranged on the device main body and used for spraying cooling medium to the cutting assembly; the collecting component is communicated with the cooling medium circulating component and is used for collecting the cut single crystal head and the cooling medium; and the fixing component is connected with the collecting component and used for clamping and fixing the silicon single crystal rod. The beneficial effects of the utility model are that adopt the diamond wire to cut the head of single crystal silicon rod to overall structure is integrated in the device main part, and the device main part can freely remove, can freely remove according to the position of single crystal silicon rod, realizes the portable cutting, can test quality parameters such as single crystal head resistivity, life-span, defect, oxygen carbon content in advance at the in-process of pulling, carries out to make guiding measure next step of production.

Description

Portable monocrystalline silicon head cutting device

Technical Field

The utility model belongs to the technical field of silicon single crystal preparation, especially, relate to a portable monocrystalline silicon head cutting device.

Background

The resistivity of the single crystal is measured and identified in advance in the current workshop through a head knocking process, and the doping amount, the length of the taken section, the raw material re-feeding and the furnace shutdown time after the material is taken and fed are correspondingly adjusted, so that the output of high-quality products is ensured. However, the cross section is uneven when the molybdenum hammer is knocked, so that the measuring result is influenced, and potential safety hazards exist when the molybdenum hammer is knocked.

Disclosure of Invention

In view of the above, the present invention provides a portable monocrystalline silicon head cutting device to solve the above or other former problems existing in the prior art.

In order to solve the technical problem, the utility model discloses a technical scheme is: a portable single crystal silicon head cutting device, comprising:

a movable device body;

the cutting assembly is arranged on the device main body and can move relative to the device main body to cut the monocrystalline silicon head;

a cooling medium circulating assembly arranged on the device main body and used for spraying cooling medium to the cutting assembly;

the collecting component is communicated with the cooling medium circulating component and is used for collecting the cut single crystal head and the cooling medium;

and the fixing component is connected with the collecting component and used for clamping and fixing the silicon single crystal rod.

Furthermore, the cutting assembly comprises a supporting piece, a guide assembly connected with the supporting piece and a cutting piece sleeved on the guide assembly, and the supporting piece is movably arranged on the device main body and used for adjusting the position of the cutting piece;

the guide assembly comprises a driving guide part and at least one driven guide part, the driving guide part is connected with the driven guide part through a cutting part, and the driving guide part drives the cutting part to rotate so as to cut.

Further, the initiative guiding part includes the regulating part of being connected with support piece, the direction driving piece and the action wheel of being connected with the regulating part, and the action wheel is connected with the direction driving piece, and the direction driving piece carries out position control under the effect of regulating part, and direction driving piece drive action wheel rotates, drives the rotation of cutting piece.

Furthermore, the supporting piece comprises a supporting frame, a transverse moving piece and a longitudinal moving piece, the supporting frame is connected with the transverse moving piece, and the transverse moving piece is connected with the longitudinal moving piece, so that the supporting frame can move transversely and longitudinally under the action of the longitudinal moving piece and the transverse moving piece.

Furthermore, the cutting assembly also comprises a push rod, and the push rod is connected with the support piece and pushes the cut single crystal head.

Furthermore, the cooling medium circulation assembly comprises a storage part, a storage power part connected with the storage part and a spraying part connected with the storage power part, the position of the spraying part corresponds to the position of the cutting part, and the storage power part acts to enable the cooling medium in the storage part to be sprayed out by the spraying part.

Furthermore, the collection subassembly including connect the hopper and with connect the sealed material piece that connects of hopper intercommunication, the slope of sealed material piece that connects sets up, leads, collects coolant.

Furthermore, the sealed material receiving part comprises a first receiving part and a second receiving part which are oppositely arranged, the first receiving part is connected and communicated with the material receiving hopper, the second receiving part is movably arranged on the device main body, and the second receiving part can be relatively close to or far away from the first receiving part;

openings are arranged at corresponding positions of the first bearing piece and the second bearing piece, so that a hole structure is constructed when the first bearing piece is contacted with the second bearing piece, and the silicon single crystal rod is placed in the hole structure when being cut.

Further, the inner space of the receiving hopper is provided with a collecting chamber and a circulating chamber which are communicated with each other, a filter screen is arranged at the joint of the collecting chamber and the circulating chamber, and the cooling medium entering the receiving hopper is filtered.

Furthermore, the fixing assembly comprises a first fixing piece and a second fixing piece which are oppositely arranged, the first fixing piece is connected with the collecting assembly, the second fixing piece is movably arranged on the device main body, and the second fixing piece can be relatively close to or far away from the first fixing piece;

the first fixing component and the second fixing component are respectively provided with a fixing opening at the corresponding position, a through hole structure is constructed when the first fixing component is contacted with the second fixing component, and the single crystal silicon rod is placed in the through hole structure to be fixedly clamped when being cut.

Due to the adoption of the technical scheme, the portable monocrystalline silicon head cutting device adopts the diamond wire to cut the head of the monocrystalline silicon rod, the integral structure is integrated on the device main body, the device main body can move freely and can move freely according to the position of the monocrystalline silicon rod, and convenient cutting is realized;

the head part of the monocrystalline silicon rod is cut off by the monocrystalline silicon head part cutting device, so that quality parameters such as resistivity, service life, defects, oxygen and carbon content of the head part of the monocrystalline silicon can be tested in advance in the crystal pulling process, and guiding measures are taken for the next production execution;

by adopting diamond wire cutting, after the head of the single crystal silicon rod is cut, the cutting section is flat, the measured resistivity and the service life data are more accurate, the generation of invalid products is reduced, the output of high-quality products is ensured, the waste of raw materials, labor, time and other costs is reduced, the product competitiveness is improved, and the benefit is improved;

the cutting device has compact structure, light weight and high convenience, can flexibly adjust and cut according to the position of the single crystal silicon rod, the size of the head of the single crystal silicon rod and the use position, and ensures the safety of the cutting process;

the positions of the driving wheel and the driven wheel are adjusted, so that the positions of the diamond wires are adjusted, the heads of the single crystal silicon rods at different positions are cut, the cooling medium circulating assembly is arranged, the diamond wires are sprayed with the cooling medium in the cutting process of the diamond wires, the diamond wires are cooled and lubricated, and the single crystal silicon rods are prevented from being broken in the cutting process; the single crystal silicon rod cutting device is provided with a collecting component and a push rod, pressure is applied through the push rod, so that the head of a single crystal can enter the collecting component, the head of the cut single crystal silicon rod is collected, the safety is high, the head of the single crystal is convenient to perform centralized processing, a sealing material part is obliquely arranged, a cooling medium is collected, the cooling medium enters the collecting component and is filtered, the cooling medium can be recycled, and the utilization rate of the cooling medium is improved; the fixing assembly is arranged, the single crystal can be clamped and fixed, the head of the single crystal is prevented from shaking in the cutting process, and the cutting section is guaranteed to be smooth.

Drawings

Fig. 1 is a schematic structural diagram of a portable monocrystalline silicon head cutting device according to an embodiment of the present invention;

fig. 2 is a schematic top view of a portable monocrystalline silicon head cutting device according to an embodiment of the present invention (the cutting assembly is not shown);

fig. 3 is a schematic top view of a cutting assembly according to an embodiment of the present invention.

In the figure:

1. supporting seat 2, supporting frame 3 and adjusting part

4. Guide driving piece 5, driving wheel 6 and push rod

7. Connecting rod 8, driven wheel 9 and receiving hopper

10. Filter screen 11, storage part 12, storage power part

13. Walking member 14, fixed subassembly 15, sealed material receiving part

16. Power unit 17, spraying member 18, longitudinal moving member

19. A transverse moving member 15-1, a first receiving member 15-2, a second receiving member

20. Cutting member

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments.

Fig. 1 shows the structure schematic diagram of an embodiment of the utility model, this embodiment relates to a portable monocrystalline silicon head cutting device for head to monocrystalline silicon cuts, adopts the diamond wire to cut the head of monocrystalline silicon rod, and the cutting cross-section is leveled, and measurement resistivity and life-span data are more accurate, and the cutting process is automatic to be accomplished, and collect the monocrystalline head after cutting, and the security is high, reduces the production of invalid product, guarantees the output of high-quality product, reduces the waste on the cost such as raw materials, manual work, time.

A portable single crystal silicon head cutting device, as shown in fig. 1, comprising:

the movable device main body can adjust the position of the monocrystalline silicon head cutting device according to the position of the drawn monocrystalline silicon rod, and can cut the head of the monocrystalline silicon rod at different positions of different furnace platforms;

the cutting assembly is arranged on the device main body, can move relative to the device main body, and can feed to cut the head of the monocrystalline silicon;

the cooling medium circulating assembly is arranged on the device main body, sprays cooling medium in the cutting process of the cutting assembly and cools and lubricates the cutting assembly in the cutting process;

the collecting component is communicated with the cooling medium circulating component, collects the head part of the cut single crystal silicon rod and the cooling medium, and filters the cooling medium so that the cooling medium can be recycled;

and the fixing component 14 is connected with the collecting component and is used for fixing the silicon single crystal rod, so that the silicon single crystal rod is prevented from shaking in the cutting process to influence cutting and damage the cutting component.

After a single crystal silicon rod is pulled, the single crystal silicon rod is vertically placed in a single crystal cylinder, the portable single crystal silicon head cutting device is moved to move to one side of the single crystal silicon rod, and after the device main body is positioned, the fixing component 14 acts to fix the single crystal silicon rod; the cutting assembly moves, the position of the cutting assembly is adjusted according to the position of the head of the monocrystalline silicon rod, so that the cutting assembly corresponds to the position, needing to be cut, of the head of the monocrystalline silicon rod when cutting is carried out, the cooling medium circulating assembly acts during the cutting process of the cutting assembly, the cooling medium is sprayed to the cutting assembly for cooling and lubricating, the cutting process of the cutting assembly is guaranteed to be carried out smoothly, and collapse is avoided; after the monocrystalline silicon cutting is completed, the head of the monocrystalline silicon rod drops into the collecting assembly to collect the head of the monocrystalline silicon rod, and meanwhile, in the cutting process, the cooling medium flows into the collecting assembly to collect the cooling medium to complete the cutting of the head of the monocrystalline silicon rod.

Specifically, as shown in fig. 1 and 2, the device main body includes a supporting seat 1 and a walking part 13, the walking part 13 is rotatably connected with the supporting seat 1, so that the device main body can move, the supporting seat 1 is arranged to play a role of a supporting framework, the cutting assembly, the cooling medium circulating assembly, the collecting assembly and the fixing assembly 14 are convenient to install, the walking part 13 is connected with the supporting seat 1 through a rotating shaft, and the walking of the device main body is realized through the rotation of the walking part 13, in this embodiment, the walking part 13 is preferably a walking wheel.

The device main body further comprises a power device 16, the power device 16 is connected with the walking part 13 and drives the walking part 13 to move, so that the device main body moves, in the embodiment, the power device 16 is a motor, an output shaft of the motor is connected with a driving gear, a rotating shaft of the walking part 13 is connected with a driven gear, and the walking part 13 is driven to rotate to walk through meshing transmission of the driving gear and the driven gear; or the motor is directly connected with the walking part 13 to drive the walking part 13 to rotate for walking, or other connection modes of the motor and the walking part 13 are selected according to actual requirements, and no specific requirement is made here.

The number of the walking members 13 is plural, and the walking members are arranged at different positions on the supporting seat 1 according to actual requirements, and no specific requirement is made here.

The supporting seat 1 is of a flat plate structure, and the shape and the size of the supporting seat are selected according to actual requirements, and no specific requirements are made here. One side of the supporting seat 1 facing the single crystal silicon rod is provided with an opening which is formed by sinking towards the opposite side, so that when the device main body moves to one side of the single crystal silicon rod, the position of the opening corresponds to the position of the single crystal silicon rod, the device main body continues to move towards the direction of the single crystal silicon rod, and the single crystal silicon rod enters the opening, so that the cutting component can conveniently cut the head part of the single crystal silicon rod. In this embodiment, the opening is preferably U-shaped.

As shown in fig. 1 and 3, the cutting assembly includes a supporting member, a guiding assembly connected to the supporting member, and a cutting member 20 sleeved on the guiding assembly, the supporting member is movably disposed on the device body, so that the cutting member 20 mounted on the supporting member can move, and the position of the cutting member 20 can be adjusted, and the cutting member 20 can rotate under the guiding action of the guiding assembly, so that the cutting member 20 can accurately cut the head of the monocrystalline silicon rod.

This guide assembly passes through cutting member 20 with driven guide and is connected including initiative guide and at least one driven guide, initiative guide, and the action of initiative guide, drive cutting member 20 rotates, cuts, and the action of initiative guide drives driven guide and moves, and then makes the suit cut 20 rotation on initiative guide and driven guide, cuts. In this embodiment, the number of the driven guides is two, two driven guides are disposed on two sides of the driving guide, and the two driven guides and the driving guide are arranged in a triangular shape, so that the part of the cutting part 20 located between the driving guide and any one of the driven guides cuts the head of the monocrystalline silicon rod.

Foretell initiative guiding part includes the regulating part 3 of being connected with support piece, guide driving piece 4 and action wheel 5 of being connected with regulating part 3, guide driving piece 4 carries out position control under the effect of regulating part 3, guide driving piece 4 drive action wheel 5 rotates, it rotates to drive cutting member 20, this regulating part 3 is the lead screw, guide driving piece 4 is servo motor, action wheel 5 is the guide pulley, the lead screw rotates, make guide driving piece 4 reciprocate, adjust the position of action wheel 5, action wheel 5 is rotated by the servo motor drive. Of course, the rotation of the lead screw can be manually adjusted, or the lead screw can also be connected to a motor, and the lead screw is driven to rotate by the motor.

Foretell driven guide includes connecting rod 7 and rotates from driving wheel 8 of being connected with connecting rod 7, removes through connecting rod 7, adjusts the position from driving wheel 8, is the leading wheel from driving wheel 8, sets up the screw thread on the connecting rod 7, and the screw thread has certain length, and connecting rod 7 passes through threaded connection with support piece, and then adjusts the position from driving wheel 8 through rotating connecting rod 7.

The cutting part 20 is a diamond wire, the diamond wire is sleeved on the driving wheel 5 and the two driven wheels 8, the driving wheel 5 rotates to drive the driven wheels 8 and the diamond wire to rotate, and the diamond wire cuts the head of the single crystal silicon rod.

This initiative guide and driven guide are located the top of single crystal silicon rod, and are corresponding with the position of single crystal silicon rod, so that cutting member 20 can cut the head of single crystal silicon rod, initiative guide and the vertical setting of driven guide, so that the buddha's warrior attendant line rotates in the plane, and then make action wheel 5 and arbitrary buddha's warrior attendant line from between the driving wheel 8 be sharp setting, cut the head of single crystal silicon rod, make the head cutting cross-section of single crystal silicon rod level and smooth.

The support member comprises a support frame 2, a transverse moving member 19 and a longitudinal moving member 18, the support frame 2 is connected with the transverse moving member 19, the transverse moving member 19 is connected with the longitudinal moving member 18, so that the support frame 2 transversely and longitudinally moves under the action of the longitudinal moving member 18 and the transverse moving member 19, the support frame 2 is of a frame body structure, and the installation of a driving guide member and a driven guide member is facilitated, the longitudinal moving member 18 is fixedly installed on the support base 1, the transverse moving member 19 is slidably installed on the longitudinal moving member 18, so that the transverse moving member 19 longitudinally moves under the action of the longitudinal moving member 18, the support frame 2 is connected with the transverse moving member 19, the transverse moving member 2 transversely moves under the action of the transverse moving member 19, the transverse moving and longitudinal moving of the support frame 2 are realized, the transverse moving and longitudinal moving of the cutting member 20 are further realized, and the feeding and cutting of the cutting member 20 are realized. This horizontal moving member 19 is horizontal parallel arrangement's screw drive structure or electronic guide rail, and vertical moving member 18 is vertical parallel arrangement's screw drive structure or electronic guide rail, for the product sold in the market, selects according to actual demand, does not do the specific requirements here.

In order to enable the head of the cut single crystal silicon rod to fall into the collecting component, the cutting component further comprises a push rod 6, the push rod 6 is connected with the support and pushes the head of the cut single crystal silicon rod, the position of the push rod 6 corresponds to the position of the head of the single crystal silicon rod, the shape of the push rod 6 is L-shaped, the push rod 6 moves towards the head of the single crystal silicon rod to push the head of the single crystal silicon rod, and the head of the single crystal silicon rod falls into the collecting component.

When the head of the single crystal silicon rod is cut, the diamond wire rotates, meanwhile, the support frame 2 moves in the longitudinal direction, the diamond wire is fed in the longitudinal direction, the head of the single crystal silicon rod is cut, after the cutting is finished, the support frame 2 moves in the transverse direction, the push rod 6 moves in the transverse direction, contacts with the head of the single crystal silicon rod, thrust is applied to the head of the single crystal silicon rod, and the head of the single crystal silicon rod falls off from a single crystal and falls into the collecting component.

As shown in fig. 1 and 2, the cooling medium circulation assembly includes a storage member 11, a storage power member 12 connected to the storage member 11, and a spray member 17 connected to the storage power member 12, wherein the spray member 17 corresponds to the cutting member 20, and the storage power member 12 operates to spray the cooling medium in the storage member 11 from the spray member 17. The storage part 11 is used for storing cooling media and fixedly mounted on the supporting seat 1, the storage power part 12 is communicated with the storage part 11 through a connecting pipeline, the storage power part 12 is communicated with the spraying part 17 through a connecting pipeline, the cooling media flow out of the storage part 11 under the action of the storage power part 12, flow along the connecting pipeline and are sprayed out of the spraying part 17, the spraying part 17 corresponds to the cutting position of the head of the single crystal silicon rod, and the cooling media are sprayed on the cut diamond wire. In this embodiment, the storage power member 12 is preferably a water pump and the spray member 17 is preferably a nozzle. The connecting pipe connected with the nozzle is hung on the guide driving member 4, and the spraying direction of the nozzle corresponds to the cutting position of the head of the single crystal silicon rod.

The cooling medium is cooling water.

The collecting assembly comprises a receiving hopper 9 and a sealed receiving part 15 communicated with the receiving hopper 9, the receiving hopper 9 is used for collecting the head of the cut single crystal silicon rod, and the sealed receiving part 15 is used for collecting a cooling medium sprayed onto the diamond wire and enabling the cooling medium to flow into the receiving hopper 9 for collection.

The sealed material receiving part 15 comprises a first receiving part 15-1 and a second receiving part 15-2 which are oppositely arranged, the first receiving part 15-1 is connected and communicated with the material receiving hopper 9, the first receiving part 15-1 is fixedly arranged on one side surface of the material receiving hopper 9 facing to the single crystal silicon rod, the second receiving part 15-2 is movably arranged on the device main body, the second receiving part 15-2 can relatively approach or depart from the first receiving part 15-1, openings are respectively arranged at corresponding positions of the first receiving part 15-1 and the second receiving part 15-2, so that a hole structure is constructed when the first receiving part 15-1 and the second receiving part 15-2 approach to each other, the single crystal silicon rod is arranged in the hole structure when being cut, the second receiving part 15-2 is movably arranged on the supporting seat 1, a driving part is arranged on the supporting seat 1, the driving part is connected with the second receiving part 15-2, the second receiving part 15-2 is driven to move relatively approach or depart from the first receiving part 15-1, and the driving part is an air cylinder or an electric cylinder.

The first bearing piece 15-1 is a plate-shaped structure, and a rubber sealing strip is arranged on one side edge which is in contact with the single crystal silicon rod, so that the first bearing piece 15-1 is in contact with the surface of the single crystal silicon rod and is in soft contact with the surface of the single crystal silicon rod, the surface of the single crystal silicon rod cannot be damaged, and meanwhile, the first bearing piece 15-1 is in close contact with the surface of the single crystal silicon rod; the first receiving member 15-1 is obliquely arranged to guide the flow of the cooling medium, and the side of the first receiving member 15-1 facing the single crystal silicon rod has an opening with a shape adapted to the shape of the single crystal silicon rod so that the single crystal silicon rod is located in the opening, which in this embodiment is a semi-elliptical shape due to the oblique arrangement of the first receiving member 15-1.

The shape and structure of the second receiving part 15-2 are consistent with those of the first receiving part 15-1, the first receiving part 15-1 and the second receiving part 15-2 are respectively positioned at two sides of the single crystal silicon rod, when the first receiving part 15-1 and the second receiving part 15-2 are close to and buckled, an oval hole structure is formed, the single crystal silicon rod is positioned in the hole structure, when the head part of the single crystal silicon rod is cut, a cooling medium sprayed on a diamond wire falls on the first receiving part 15-1 and/or the second receiving part 15-2, or the cooling medium flowing along the surface of the single crystal silicon rod also falls on the first receiving part 15-1 and/or the second receiving part 15-2, and the cooling medium flows along the surfaces of the first receiving part 15-1 and the second receiving part 15-2 and enters the receiving hopper 9. The second bearing piece 15-2 is connected with the material receiving driving piece through at least two supporting rods so as to ensure that the position of the second bearing piece 15-2 corresponds to the position of the first bearing piece 15-1.

The receiving hopper 9 is provided with a through hole, the lower end of the first receiving piece 15-1 is bent to form a channel structure, and the corresponding position of the second receiving piece 15-2 is also arranged in a channel structure, and the channel is communicated with the through hole of the receiving hopper 9, so that a cooling medium can flow into the receiving hopper 9.

Foretell connect hopper 9 to be the box structure, connect hopper 9 inner space to be set up to the collection room and the circulation room of intercommunication each other, collect the room and circulate the room junction and be equipped with filter screen 10, filter the coolant that gets into and connect hopper 9, the head of the single crystal silicon rod after the cutting is located and collects the room, is blockked by filter screen 10, in coolant got into the circulation room after filtering, circulation room and storage component 11 intercommunication, in coolant got into storage component 11, recycle.

The fixing assembly 14 comprises a first fixing member and a second fixing member which are oppositely arranged, the first fixing member is connected with the collecting assembly, the second fixing member is movably arranged on the device main body, the second fixing member can be relatively close to or far away from the first fixing member, fixing openings are respectively arranged at corresponding positions of the first fixing member and the second fixing member, a through hole structure is formed when the first fixing member is in contact with the second fixing member, and the single crystal silicon rod is placed in the through hole structure to be fixedly clamped when being cut. In this embodiment, the shape of the fixing opening is semicircular, so that when the first fixing member and the second fixing member are in close contact and buckling, the fixing opening on the first fixing member and the fixing opening on the second fixing member construct a circular through hole structure, and the single crystal silicon rod is located in the circular through hole structure to clamp and fix the single crystal silicon rod.

The second fixing piece is fixedly connected with the supporting rod, the second bearing piece 15-2 and the second fixing piece are sequentially arranged from top to bottom along the vertical direction, and the material receiving driving piece drives the second fixing piece to move so as to enable the second fixing piece to be relatively close to or far away from the first fixing piece.

Of course, the first fixing member and the first receiving member 15-1 may be fixedly connected to form an integral structure, and the second fixing member and the second receiving member 15-2 may be fixedly connected to form an integral structure, so as to clamp and fix the monocrystalline silicon rod and guide the cooling medium, so that the cooling medium flows into the receiving hopper 9.

When the portable monocrystalline silicon head cutting device is used, the manual pushing or power device 16 acts, the device body moves to one side of the monocrystalline silicon rod, the first fixing piece and the first bearing piece 15-1 are both contacted with the surface of the monocrystalline silicon rod, the material receiving driving piece acts, the second fixing piece and the second bearing piece 15-2 move towards the direction of the monocrystalline silicon rod, the second fixing piece is contacted with the first fixing piece to clamp and fix the monocrystalline silicon rod to avoid shaking, and the second bearing piece 15-2 is contacted with the first bearing piece 15-1, is both contacted with the monocrystalline silicon rod and is tightly contacted with the surface of the monocrystalline silicon rod; adjusting the positions of the driving wheel 5 and the driven wheel 8 to enable the diamond wire to correspond to the cutting position of the head of the single crystal silicon rod, guiding the driving piece 4 to act, enabling the driving wheel 5 to rotate, driving the driven wheel 8 to rotate through the diamond wire, achieving the rotation of the diamond wire, enabling the longitudinal moving piece 18 to act, enabling the diamond wire to feed, and cutting the head of the single crystal silicon rod; meanwhile, the water pump acts, the cooling medium is sprayed out from the nozzle and sprayed onto the diamond wire at the cutting position to cool the diamond wire and lubricate the diamond wire so as to facilitate better cutting of the diamond wire; in the process of cutting the diamond wire, the cutting speed of the diamond wire is 1-5m/min, the feeding speed is 1-5mm/min, the temperature of a cooling medium is less than 60 ℃, and the water flow speed is 0.5-3L/min, so that the diamond wire is prevented from being broken during cutting; after cutting, the transverse moving member 19 acts, the push rod 6 moves towards the head of the single crystal silicon rod, contacts with the head of the single crystal silicon rod, and applies thrust to the head of the single crystal silicon rod along with the movement of the push rod 6, the head of the single crystal silicon rod is pushed down and falls into the receiving hopper 9, and a cooling medium in the cutting process falls on the first receiving member 15-1 and the second receiving member 15-2, flows along the first receiving member 15-1 and the second receiving member 15-2, enters the receiving hopper 9, is filtered by the filter screen 10, enters the storage member 11 and is recycled.

Due to the adoption of the technical scheme, the portable monocrystalline silicon head cutting device adopts the diamond wire to cut the head of the monocrystalline silicon rod, the integral structure is integrated on the device main body, the device main body can move freely and can move freely according to the position of the monocrystalline silicon rod, and convenient cutting is realized;

the head part of the monocrystalline silicon rod is cut off by the monocrystalline silicon head part cutting device, so that quality parameters such as resistivity, service life, defects, oxygen and carbon content of the head part of the monocrystalline silicon can be tested in advance in the crystal pulling process, and guiding measures are taken for the next production execution;

by adopting diamond wire cutting, after the head of the single crystal silicon rod is cut, the cutting section is flat, the measured resistivity and the service life data are more accurate, the generation of invalid products is reduced, the output of high-quality products is ensured, the waste of raw materials, labor, time and other costs is reduced, the product competitiveness is improved, and the benefit is improved;

the cutting device has the advantages of compact structure, light weight and high convenience, can be flexibly adjusted and cut according to the position of the single crystal silicon rod, the size of the head of the single crystal silicon rod and the use position, and ensures the safety of the cutting process;

the positions of the driving wheel and the driven wheel are adjusted, so that the positions of the diamond wires are adjusted, the heads of the single crystal silicon rods at different positions are cut, the cooling medium circulating assembly is arranged, the diamond wires are sprayed with the cooling medium in the cutting process of the diamond wires, the diamond wires are cooled and lubricated, and the single crystal silicon rods are prevented from being broken in the cutting process; the silicon single crystal silicon rod cutting device is provided with a collecting assembly and a push rod, pressure is applied through the push rod, so that the head of a single crystal can enter the collecting assembly, the head of the cut silicon single crystal rod is collected, the safety is high, the head of the single crystal is conveniently and intensively treated, a sealing material piece is obliquely arranged, a cooling medium is collected, the cooling medium enters the collecting assembly and is filtered, the cooling medium can be recycled, and the utilization rate of the cooling medium is improved; the fixing assembly is arranged, the single crystal can be clamped and fixed, the head of the single crystal is prevented from shaking in the cutting process, and the cutting section is guaranteed to be smooth.

The embodiments of the present invention have been described in detail, but the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. The equivalent changes and improvements made according to the application scope of the present invention should be still included in the patent coverage of the present invention.

Claims (10)

1. A portable monocrystalline silicon head cutting device which is characterized in that: the method comprises the following steps:

a movable device body;

the cutting assembly is arranged on the device main body and can move relative to the device main body to cut the monocrystalline silicon head;

the cooling medium circulating assembly is arranged on the device main body and sprays cooling media to the cutting assembly;

the collecting assembly is communicated with the cooling medium circulating assembly and is used for collecting the cut single crystal head and the cooling medium;

and the fixing component is connected with the collecting component and used for clamping and fixing the silicon single crystal rod.

2. The portable monocrystalline silicon head cutting device of claim 1, wherein: the cutting assembly comprises a supporting piece, a guide assembly connected with the supporting piece and a cutting piece sleeved on the guide assembly, and the supporting piece is movably arranged on the device main body and used for adjusting the position of the cutting piece;

the guide assembly comprises a driving guide part and at least one driven guide part, the driving guide part is connected with the driven guide part through the cutting part, and the driving guide part drives the cutting part to rotate for cutting.

3. The portable monocrystalline silicon head cutting device of claim 2, wherein: the initiative guiding part include with regulating part that support piece is connected, direction driving piece and the action wheel of being connected with the regulating part, the action wheel with the direction driving piece is connected, the direction driving piece is in carry out position control under the effect of regulating part, the drive of direction driving piece the action wheel rotates, drives the cutting member rotates.

4. The portable monocrystalline silicon head cutting device of claim 2 or 3, characterized in that: the supporting piece comprises a supporting frame, a transverse moving piece and a longitudinal moving piece, wherein the supporting frame is connected with the transverse moving piece, and the transverse moving piece is connected with the longitudinal moving piece, so that the supporting frame can transversely and longitudinally move under the action of the longitudinal moving piece and the transverse moving piece.

5. The portable monocrystalline silicon head cutting device of claim 4, wherein: the cutting assembly further comprises a push rod, and the push rod is connected with the supporting piece and pushes the cut single crystal head.

6. The portable monocrystalline silicon head cutting device of claim 2 or 3 or 5, characterized in that: the cooling medium circulation assembly comprises a storage part, a storage power part connected with the storage part and a spraying part connected with the storage power part, the position of the spraying part corresponds to the position of the cutting part, and the storage power part acts to enable the cooling medium in the storage part to be sprayed out by the spraying part.

7. The portable monocrystalline silicon head cutting device of claim 6, wherein: the collecting assembly comprises a material receiving hopper and a sealing material receiving piece communicated with the material receiving hopper, wherein the sealing material receiving piece is obliquely arranged to guide and collect cooling media.

8. The portable monocrystalline silicon head cutting device of claim 7, wherein: the sealed material receiving part comprises a first receiving part and a second receiving part which are oppositely arranged, the first receiving part is connected and communicated with the material receiving hopper, the second receiving part is movably arranged on the device main body, and the second receiving part can be relatively close to or far away from the first receiving part;

openings are formed in the corresponding positions of the first bearing piece and the second bearing piece, so that a hole structure is formed when the first bearing piece is in contact with the second bearing piece, and the silicon single crystal rod is placed in the hole structure when being cut.

9. The portable monocrystalline silicon head cutting device of claim 7 or 8, characterized in that: the inner space of the receiving hopper is provided with a collecting chamber and a circulating chamber which are communicated with each other, a filter screen is arranged at the joint of the collecting chamber and the circulating chamber, and the cooling medium entering the receiving hopper is filtered.

10. The portable monocrystalline silicon head cutting device of any one of claims 1-3, 5 and 7-8, wherein: the fixing assembly comprises a first fixing piece and a second fixing piece which are oppositely arranged, the first fixing piece is connected with the collecting assembly, the second fixing piece is movably arranged on the device main body, and the second fixing piece can be relatively close to or far away from the first fixing piece;

the first fixing component and the second fixing component are respectively provided with a fixing opening at the corresponding position, a through hole structure is constructed when the first fixing component is contacted with the second fixing component, and the single crystal silicon rod is placed in the through hole structure to be fixedly clamped when being cut.

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