CN217596758U - Surface treatment polishing equipment for circuit board production and processing - Google Patents
Surface treatment polishing equipment for circuit board production and processing Download PDFInfo
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- CN217596758U CN217596758U CN202221272327.0U CN202221272327U CN217596758U CN 217596758 U CN217596758 U CN 217596758U CN 202221272327 U CN202221272327 U CN 202221272327U CN 217596758 U CN217596758 U CN 217596758U
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Abstract
The utility model discloses a surface treatment polishing equipment is used in circuit board production and processing relates to circuit board production technical field, the on-line screen storage device comprises a base, the bottom both sides welding of base has the backup pad, and the top surface central authorities of base seted up flutedly, the internally mounted of recess has the filter screen, the outside embedding of recess has the silica gel strip, and the drilling of the bottom surface central authorities of recess has the through-flow groove, the bottom in through-flow groove is connected with the pipe, and the end-to-end connection of pipe has the cylinder, the inside swing joint of cylinder has the piston. The utility model discloses in, through pressing down the circuit board body, make circuit board body and silica gel strip laminating be in the same place, silica gel strip and circuit board body cooperation are plugged up the recess shutoff, move right through second electric putter drive piston, can extract the air of recess and through-flow inslot portion to can form the negative pressure in the inside of recess, hold the bottom of circuit board body, make the circuit board body in polishing process, be difficult for taking place to remove, polishing effect is better.
Description
Technical Field
The utility model relates to a circuit board production technical field especially relates to a surface treatment polishing equipment is used in circuit board production and processing.
Background
With the rapid development of the electronic industry, the manufacturing technology of circuit boards is more and more important, the requirements for manufacturing circuits and holes are more and more refined, the circuit boards are manufactured by a copper-clad substrate through a series of processes of cutting, drilling, etching, exposure, highlighting and the like, and are divided into single-sided boards, double-sided boards and multilayer boards, in the manufacturing process of the circuit boards, the communication of circuits among layers of the circuit boards is usually realized by drilling holes in the copper-clad substrate and plating copper on the inner walls of the via holes, and the circuit boards need to be polished in the production process, so that a surface treatment polishing device for producing and processing the circuit boards is provided.
The surface treatment polishing equipment for the production and processing of the existing circuit board has poor fixing effect on the circuit board in the polishing process of the circuit board, so that the circuit board is easy to move and has poor polishing effect in the polishing process.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving current for circuit board production and processing surface treatment polishing equipment in carrying out the polishing process to the circuit board, relatively poor to the fixed effect of circuit board for in the polishing process, the circuit board takes place to remove easily, the relatively poor shortcoming of polishing effect, and the surface treatment polishing equipment for circuit board production and processing who proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a surface treatment polishing device for circuit board production and processing comprises:
the base, the bottom both sides welding of base has the backup pad, and the top surface central authorities of base have seted up the recess, the internally mounted of recess has the filter screen, the outside embedding of recess has the silica gel strip, and the drilling of the bottom surface central authorities of recess has the through-flow groove, the bottom in through-flow groove is connected with the pipe, and the end-to-end connection of pipe has the cylinder, the inside swing joint of cylinder has the piston, and the right side central authorities of piston install second electric putter.
Preferably, the circuit board body has been placed to the top of base, and the top both sides of base install first electric putter, first electric putter's top is connected with the guide rail, and the bottom of guide rail installs linear electric motor, linear electric motor's bottom welding has the U-shaped frame, and the inboard swing joint of U-shaped frame has the burnishing roll, the center department of burnishing roll is connected with the pivot, and the motor is installed to the rear end of pivot.
Preferably, be fixed connection between second electric putter and the backup pad, constitute the removal structure through second electric putter between piston and the backup pad, and the outer wall of piston is laminated with the inner wall of cylinder mutually.
Preferably, the groove and the cylinder are communicated through the through-flow groove and the guide pipe, and the total depth of the groove and the through-flow groove is consistent with the thickness of the base.
Preferably, a lifting structure is formed between the guide rail and the base through a first electric push rod, and the guide rail and the base are parallel to each other.
Preferably, a rotating structure is formed between the polishing roller and the U-shaped frame through a rotating shaft and a motor, and the U-shaped frame and the guide rail are connected in a sliding mode through a linear motor.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
1. the utility model discloses in, through pressing down the circuit board body, make circuit board body and silica gel strip laminating be in the same place, silica gel strip and circuit board body cooperation are plugged up the recess shutoff, move right through second electric putter drive piston, can extract the air of recess and through-flow inslot portion to can form the negative pressure in the inside of recess, hold the bottom of circuit board body, make the circuit board body in polishing process, be difficult for taking place to remove, polishing effect is better.
2. The utility model discloses in, control through linear electric motor drive U-shaped frame and remove, can drive pivoted polishing roller and remove, remove the polishing to the circuit board body, can drive the guide rail through first electric putter and reciprocate, can drive linear electric motor, U-shaped frame and polishing roller and reciprocate, can polish the circuit board body of different thickness, the practicality is higher.
Drawings
FIG. 1 is a schematic view of the overall internal structure of the apparatus of the present invention;
FIG. 2 is a schematic view of a partial structure of the top surface of the base of the present invention;
fig. 3 is a schematic view of the connection structure of the U-shaped frame and the polishing roll of the present invention.
Illustration of the drawings:
1. a linear motor; 2. a guide rail; 3. a first electric push rod; 4. a base; 5. a support plate; 6. a second electric push rod; 7. a cylinder; 8. a piston; 9. a conduit; 10. a flow through groove; 11. filtering with a screen; 12. a groove; 13. a circuit board body; 14. a polishing roll; 15. a U-shaped frame; 16. a silica gel strip; 17. an electric motor; 18. a rotating shaft.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-3, a surface treatment polishing device for circuit board production and processing comprises a base 4, wherein supporting plates 5 are welded on two sides of the bottom of the base 4, a groove 12 is formed in the center of the top surface of the base 4, the groove 12 and a cylinder 7 are communicated through a through flow groove 10 and a guide pipe 9, the total depth of the groove 12 and the through flow groove 10 is consistent with the thickness of the base 4, when a piston 8 moves rightwards, air in the groove 12 and the through flow groove 10 can be extracted, so that negative pressure can be formed in the groove 12 to suck the bottom of a circuit board body 13, the circuit board body 13 is not easy to move and has good polishing effect, a filter screen 11 is arranged in the groove 12, and a silica gel strip 16 is embedded in the outer side of the groove 12, a flow through groove 10 is drilled in the center of the bottom surface of the groove 12, a guide pipe 9 is connected to the bottom end of the flow through groove 10, a cylinder 7 is connected to the tail end of the guide pipe 9, a piston 8 is movably connected to the inside of the cylinder 7, a second electric push rod 6 is installed in the center of the right side of the piston 8, the second electric push rod 6 is fixedly connected with the support plate 5, a moving structure is formed between the piston 8 and the support plate 5 through the second electric push rod 6, the outer wall of the piston 8 is attached to the inner wall of the cylinder 7, the second electric push rod 6 and the support plate 5 are fixed together, when the second electric push rod 6 extends or retracts, the piston 8 can be driven to move left and right, the outer wall of the piston 8 is attached to the inner wall of the cylinder 7, and the air tightness of the contact position of the piston 8 and the cylinder 7 is ensured to be good;
The working principle is as follows: place circuit board body 13 in the top of base 4, and press circuit board body 13 downwards, make circuit board body 13 and the laminating of the silica gel strip 16 of closure form be in the same place, silica gel strip 16 can block up recess 12 with circuit board body 13 cooperation this moment, start second electric putter 6, second electric putter 6 drives piston 8 and moves to the right, can extract the inside air in recess 12 and circulation groove 10, thereby can form the negative pressure in the inside of recess 12, hold circuit board body 13's bottom, make circuit board body 13 in the polishing process, difficult emergence is removed, polishing effect is better, starter motor 17, motor 17 can drive pivot 18 and polishing roll 14 and rotate, and then can polish circuit board body 13's surface, linear electric motor 1 can drive the U-shaped frame 15 and remove, and then can drive pivoted polishing roll 14 and remove, move polishing roll 13 and polish circuit board body 13, can drive guide rail 2 through first electric putter 3 and reciprocate, and then can drive linear electric motor 1, U-shaped frame 15 and polishing roll 14 reciprocate, can polish circuit board body 13 of different thickness, the practicality is higher.
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a circuit board production and processing is with surface treatment polishing equipment which characterized in that includes:
base (4), the bottom both sides welding of base (4) has backup pad (5), and the top surface central authorities of base (4) set up fluted (12), the internally mounted of recess (12) has filter screen (11), the outside embedding of recess (12) has silica gel strip (16), and the drilling of the bottom surface central authorities of recess (12) has through-flow groove (10), the bottom of through-flow groove (10) is connected with pipe (9), and the end-to-end connection of pipe (9) has cylinder (7), the inside swing joint of cylinder (7) has piston (8), and the right side central authorities of piston (8) install second electric putter (6).
2. The surface treatment polishing apparatus for production processing of a circuit board according to claim 1, wherein: circuit board body (13) have been placed to the top of base (4), and first electric putter (3) are installed to the top both sides of base (4), the top of first electric putter (3) is connected with guide rail (2), and linear electric motor (1) are installed to the bottom of guide rail (2), the bottom welding of linear electric motor (1) has U-shaped frame (15), and the inboard swing joint of U-shaped frame (15) has polishing roller (14), the center department of polishing roller (14) is connected with pivot (18), and motor (17) are installed to the rear end of pivot (18).
3. The surface treatment polishing apparatus for production processing of a circuit board according to claim 1, wherein: be fixed connection between second electric putter (6) and backup pad (5), constitute through second electric putter (6) between piston (8) and backup pad (5) and remove the structure, and the outer wall of piston (8) is laminated with the inner wall of cylinder (7) mutually.
4. The surface treatment polishing apparatus for production and processing of a circuit board according to claim 1, wherein: the groove (12) and the cylinder (7) are communicated through the flow through groove (10) and the guide pipe (9), and the total depth of the groove (12) and the flow through groove (10) is consistent with the thickness of the base (4).
5. The surface treatment polishing apparatus for production and processing of a circuit board according to claim 2, characterized in that: the lifting structure is formed between the guide rail (2) and the base (4) through the first electric push rod (3), and the guide rail (2) and the base (4) are parallel to each other.
6. The surface treatment polishing apparatus for production and processing of a circuit board according to claim 2, characterized in that: the polishing roller (14) and the U-shaped frame (15) form a rotating structure through a rotating shaft (18) and a motor (17), and the U-shaped frame (15) and the guide rail (2) form sliding connection through a linear motor (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202221272327.0U CN217596758U (en) | 2022-05-25 | 2022-05-25 | Surface treatment polishing equipment for circuit board production and processing |
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CN202221272327.0U CN217596758U (en) | 2022-05-25 | 2022-05-25 | Surface treatment polishing equipment for circuit board production and processing |
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CN217596758U true CN217596758U (en) | 2022-10-18 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115673907A (en) * | 2022-11-29 | 2023-02-03 | 扬州韩思半导体科技有限公司 | Grinding device for semiconductor wafer production |
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2022
- 2022-05-25 CN CN202221272327.0U patent/CN217596758U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115673907A (en) * | 2022-11-29 | 2023-02-03 | 扬州韩思半导体科技有限公司 | Grinding device for semiconductor wafer production |
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