CN217591200U - High-speed signal mainboard and electronic equipment - Google Patents
High-speed signal mainboard and electronic equipment Download PDFInfo
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- CN217591200U CN217591200U CN202221575803.6U CN202221575803U CN217591200U CN 217591200 U CN217591200 U CN 217591200U CN 202221575803 U CN202221575803 U CN 202221575803U CN 217591200 U CN217591200 U CN 217591200U
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Abstract
The application relates to the technical field of high-speed communication, in particular to a high-speed signal mainboard and electronic equipment. Wherein, high-speed signal mainboard includes: the communication terminal comprises a main board body and a plurality of embedded printed circuit boards, wherein at least part of the embedded printed circuit boards are connected and fixed to a communication terminal area of the main board body; the embedded printed circuit board includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate. According to the technical scheme, the circuit board with the whole main board body set as the high-speed board substrate is avoided while the high-speed signal loss is reduced, and therefore the cost is reduced.
Description
Technical Field
The application relates to the technical field of high-speed communication, in particular to a high-speed signal mainboard and electronic equipment.
Background
With the coming of the digital era, the market and users have higher and higher demands for data transmission, which has promoted the rapid development of the signal rate of electronic products, and computers were mainstream with Universal Serial BUS (USB) 3.0 and 5Gbps for many years ago, but thunder and lightning (thunderbolt) is now on the market TM TBT) 4.0 and 40Gbps, or Universal Serial BUS (USB) 4.0 and 40 Gbps.
The development challenge of increasing the transmission rate of high-speed signals is how to reduce the loss of the high-speed signals during transmission, thereby ensuring the integrity of the high-speed signals. The traditional method for reducing the loss of the high-speed signals is to use a high-speed plate for the whole circuit board, so that the loss of the high-speed signals in the transmission process is reduced, but the high-speed plate is expensive, and the high-speed plate is used for the whole circuit board, so that the problem of high cost is caused.
SUMMERY OF THE UTILITY MODEL
Based on this, to above-mentioned technical problem, the application provides a high-speed signal mainboard and electronic equipment, when realizing reducing high-speed signal loss, has avoided setting up whole mainboard main part into the circuit board of high-speed panel substrate to be favorable to reduce cost.
In a first aspect, an embodiment of the present application provides a high-speed signal motherboard, including:
the communication terminal comprises a main board body and a plurality of embedded printed circuit boards, wherein at least part of the embedded printed circuit boards are connected and fixed to a communication terminal area of the main board body;
the embedded printed circuit board includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate.
In one embodiment, at least a portion of the embedded printed circuit board is connectively secured to a first region of the motherboard body; the first area is a middle preset area of the main board body.
In one embodiment, a central processing unit is fixedly connected to the main board body, and the central processing unit is electrically connected to a preset first embedded printed circuit board through a wire in the main board body;
the middle preset area is an area with the loss of the routing larger than the preset loss; the first embedded printed circuit board is arranged corresponding to the communication terminal area.
In one embodiment, at least a portion of the electronic devices are stacked in a direction perpendicular to the embedded printed circuit board.
In one embodiment, the electronic devices arranged in a stack are electrically connected to each other through-silicon vias.
In one embodiment, the embedded printed circuit board is arranged corresponding to the communication terminal area, the interface electronic device is arranged in a single layer, and at least part of the non-interface electronic device is arranged in a stacked mode.
In one embodiment, the electronic device comprises a preset electronic device, and the embedded printed circuit board is a universal embedded printed circuit board.
In one embodiment, the embedded printed circuit board is electrically connected to the main board body through pads, pins, or gold wires.
In one embodiment, the embedded printed circuit board is soldered to the main board body by a surface mounting technique.
In a second aspect, an embodiment of the present application further provides an electronic device, including any one of the high-speed signal motherboards provided in the first aspect.
The high-speed signal mainboard provided by the embodiment of the application comprises a mainboard main body and a plurality of embedded printed circuit boards, wherein at least part of the embedded printed circuit boards are connected and fixed to a communication terminal area of the mainboard main body; the embedded printed circuit board includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate. Therefore, the embedded printed circuit board of the high-speed board substrate is arranged at the communication terminal area of the main board body, and meanwhile, the electronic device for receiving the high-speed signal is arranged on the high-speed board substrate, namely, a plurality of electronic devices are arranged on the same embedded printed circuit board. In addition, the circuit board with the whole main board body set as the high-speed board substrate is avoided while the high-speed signal loss is reduced, so that the cost is reduced.
Drawings
Fig. 1 is a schematic top view of a high-speed signal motherboard according to an embodiment of the present disclosure;
fig. 2 is a schematic top view of another high-speed signal motherboard according to an embodiment of the present disclosure;
fig. 3 is a schematic view of a three-dimensional placement structure of an electronic device according to an embodiment of the present disclosure;
fig. 4 is a schematic view of a three-dimensional placement structure of another electronic device provided in an embodiment of the present application;
fig. 5 is a schematic perspective view illustrating a placement structure of another electronic device according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.
Fig. 1 is a schematic top view of a high-speed signal motherboard according to an embodiment of the present disclosure. As shown in fig. 1, the high-speed signal motherboard includes a motherboard body 10 and a plurality of embedded printed circuit boards 11, at least a part of the embedded printed circuit boards 11 are connected and fixed to a communication terminal area of the motherboard body 10; the embedded printed circuit board 11 includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate.
Specifically, the main board body 10 may be configured as a low-speed board substrate, that is, the main board body 10 is configured as a normal board, the embedded printed circuit board 11 is disposed on a partial area of the main board body 10, for example, a communication end area, and the area where the embedded printed circuit board 11 is located is the communication end area shown in fig. 1. The embedded printed circuit board 11 is provided as a high-speed board substrate, and a plurality of electronic devices, which are electronic devices required for communication, such as electronic devices that receive high-speed signals, are provided on the high-speed board substrate.
Among them, the high-speed board has characteristics of low Dielectric constant (Dk), low Dielectric loss factor (Df), and low Roughness (Roughness). The dielectric constant, also called dielectric constant or dielectric coefficient, is a coefficient used to characterize the insulation of a material and is designated by the letter epsilon. In engineering applications, the dielectric constant is often expressed in terms of relative dielectric constant, rather than absolute value, and is often used in calculating impedance and time delay. The dielectric loss factor, also called damping factor, internal loss (internal dissipation) or loss tangent (loss tangent), is the tangent of the phase difference angle between strain and stress cycle of a material under the action of an alternating force field, and is also equal to the ratio of the loss modulus to the storage modulus of the material (i.e. the ratio of the energy lost in the insulating board in a signal line to the energy still existing in the line). In the transmission process of high-speed signals, the loss of the high-speed signals is closely related to the dielectric constant, the dielectric loss factor and the roughness of materials. For example, the lower the dielectric constant, dielectric dissipation factor, and roughness of a material, the less the loss of a high speed signal. Therefore, the embedded printed circuit board 11 is set as a high-speed board substrate, which is beneficial to reducing the loss of high-speed signals.
Among them, electronic devices receiving high-speed signals are generally disposed in the communication end region, and such electronic devices belong to a three-dimensional structure, and inserting such electronic devices of a three-dimensional structure into the main board body 10 disposed as a low-speed board substrate is one of the main causes of the high-speed signal loss becoming large. Therefore, in the embodiment of the present application, such electronic devices are disposed in the embedded pcb 11 of the high-speed board substrate, and the embedded pcb 11 is disposed at the communication terminal area, that is, a part of the embedded pcb 11 is connected and fixed to the communication terminal area of the motherboard main body 10, so that when the electronic device receives a high-speed signal, the high-speed board substrate of the embedded pcb 11 is utilized to avoid a large high-speed signal loss caused by the fact that the electronic device is directly inserted into the motherboard main body 10 of the low-speed board substrate, thereby being beneficial to reducing the loss of the high-speed signal.
Thus, providing the embedded printed circuit board 11 including a high-speed board substrate at the communication end region avoids providing the main board main body 10 as a circuit board including a high-speed board substrate while achieving reduction in high-speed signal loss, thereby contributing to cost reduction.
Exemplarily, at a frequency of 10GHz, printed circuit boards of different board substrates are disposed and embedded in the communication terminal area of the main board body 10, respectively, and a simulation test is performed on loss of a high-speed signal, and table 1 shows a result of the simulation test. As shown in table 1, N represents different types of board substrates, eight different types of board substrates are shown in table 1, DK represents the dielectric constant of the board, DF represents the dielectric loss factor of the board, roughnesss represents the Roughness of the board in microns, and insertional loss represents the loss of the high speed signal in decibels. As can be seen from table 1, the lower the dielectric constant, dielectric dissipation factor and roughness of the printed circuit board material embedded in the main board body 10, the lower the loss of the high-speed signal. From the simulation test results shown in table 1, it can be obtained that the eighth material has the lowest loss for high-speed signals, and thus the eighth material can be used as the board substrate of the embedded printed circuit board 11 in the embodiment of the present application, that is, the embedded printed circuit board 11 is set as the high-speed board substrate.
As shown in table 1, eight kinds of printed circuit boards with different board substrates were respectively embedded in the communication terminal area of the main board body 10 at a frequency of 10GHz, and a simulation test was performed on loss of a high-speed signal. It can be obtained through simulation test results that when the eighth material is used as the board substrate of the printed circuit board, the loss of the high-speed signal is 2.4688dB, and when the first material is used as the board substrate of the printed circuit board, the loss of the high-speed signal is 3.6995dB, so that it can be obtained through comparison results that when the high-speed board substrate, that is, the eighth material is embedded in the printed circuit board of the board substrate, the total loss of the high-speed signal can be reduced by 1.8dB.
It should be noted that, at a frequency of 10GHz, the simulation test results shown in table 1 only exemplarily show that a signal transmission line of 2inch is provided in the embedded printed circuit board 11. For high-speed signal transmission lines generally as long as 10-40 inch, when the eighth material is used as a plate substrate, namely, a high-speed plate substrate is used for simulation test, the high-speed signal transmission line has more remarkable effect of reducing the loss of high-speed signals.
TABLE 1
Illustratively, the printed circuit boards of eight different board substrates in table 1 are respectively embedded in the communication terminal area in the main board body 10 at a frequency of 20GHz, and the loss of the high-speed signal is subjected to a simulation test, and table 2 is a result of the simulation test.
TABLE 2
| N | DK | DF | Roughness(um) | Insertion loss(dB) |
| 1 | 4.5 | 0.02 | 8 | 6.3904 |
| 2 | 4.2 | 0.018 | 8 | 5.7928 |
| 3 | 3.9 | 0.015 | 6 | 5.0308 |
| 4 | 3.5 | 0.011 | 5 | 4.0695 |
| 5 | 3.3 | 0.011 | 3 | 4.0389 |
| 6 | 3.2 | 0.009 | 1 | 3.6442 |
| 7 | 3 | 0.008 | 1 | 3.3673 |
| 8 | 2.8 | 0.005 | 1 | 2.7858 |
As shown in table 2, eight kinds of printed circuit boards with different board substrates were respectively embedded in the communication terminal area in the main board body 10 at a frequency of 20GHz, and a simulation test was performed on loss of a high-speed signal. It can be obtained through simulation test results that when the eighth material is used as the board substrate of the printed circuit board, the loss of the high-speed signal is 2.7858dB, and when the first material is used as the board substrate of the printed circuit board, the loss of the high-speed signal is 6.3904dB, so that it can be obtained through comparison results that the total loss of the high-speed signal can be reduced by 3.6dB by using the high-speed board substrate, that is, the eighth material, as the board substrate.
It should be noted that, at a frequency of 20GHz, the simulation test results shown in table 2 only exemplarily show that a signal transmission line of 2 inches is provided in the embedded printed circuit board 11. For high-speed signal transmission lines generally as long as 10-40 inch, when the eighth material is used as a plate substrate, namely, a high-speed plate substrate is used for simulation test, the high-speed signal transmission line has more remarkable effect of reducing the loss of high-speed signals.
Thus, it can be obtained from the simulation test results of tables 1 and 2 that when the embedded printed circuit board 11 of the high-speed board substrate is disposed at the communication terminal area of the main board body 10, it is advantageous to reduce the loss of high-speed signals; in particular, as the frequency is higher, the effect on reducing the high-speed signal loss is more remarkable. Illustratively, the High-speed signal may include a Double Data Rate (DDR) signal, a High Definition Multimedia Interface (HDMI) signal, a Thunderbolt Interface (TBT) signal, a High speed Serial computer extended Bus (PCIE) signal, a Universal Serial Bus (USB) signal, a display Interface (DP) signal, and a Mobile Industry Processor Interface (MIPI) signal.
The high-speed signal main board provided by the embodiment of the application comprises a main board main body and a plurality of embedded printed circuit boards, wherein at least part of the embedded printed circuit boards are connected and fixed to a communication terminal area of the main board main body; the embedded printed circuit board includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate. Therefore, the embedded printed circuit board of the high-speed board substrate is arranged at the communication terminal area of the main board body, and meanwhile, the electronic device for receiving the high-speed signal is arranged on the high-speed board substrate, namely, a plurality of electronic devices are arranged on the same embedded printed circuit board. In addition, the circuit board with the whole main board body set as the high-speed board substrate is avoided while the high-speed signal loss is reduced, so that the cost is reduced.
In an embodiment, fig. 2 is a schematic top view of another high-speed signal motherboard according to an embodiment of the present application. Referring to fig. 2, at least a portion of the embedded printed circuit board 11 is fixedly connected to the first region of the main board body 10; the first area is a middle preset area of the main board body.
Specifically, a simulation test is performed on the non-communication terminal area of the main board body 10, and the specific position of the first area on the main board body 10 can be determined according to the simulation test result. Exemplarily, a preset loss threshold is set, and according to a simulation test result, when it is determined that the loss of a certain region on the main board body 10 for a high-speed signal is greater than the preset loss threshold, it may be determined that the loss of the middle region of the main board body 10 for the high-speed signal is greater, and then the region is used as a first region, that is, the middle preset region, and further, the embedded printed circuit board 11 is disposed in the first region, which is beneficial to reducing the loss of the high-speed signal, thereby ensuring the integrity of the high-speed signal.
In one embodiment, with reference to fig. 2, a central processing unit 12 is fixedly connected to the main board body 10, and the central processing unit 12 is electrically connected to a predetermined first embedded pcb through traces 13 in the main board body 10; the middle preset area is an area with the loss on the wiring larger than the preset loss; the first embedded pcb is an embedded pcb 11 disposed corresponding to the communication end region.
Specifically, a first embedded printed circuit board is disposed on the main board body 10 corresponding to the communication terminal area, and the first embedded printed circuit board is electrically connected to the central processing unit 12 disposed on the main board body 10, so that the central processing unit 12 controls the transmission of high-speed signals in the first embedded printed circuit board. When a high-speed signal is transmitted from the first embedded pcb to the cpu 12 along the high-speed transmission line, i.e. the trace 13, if a certain area on the main board 10 has a large loss to the high-speed signal, for example, the loss is greater than a predetermined loss, the current area can be used as a middle predetermined area, and the embedded pcb 11 is disposed in the middle predetermined area, so that the high-speed board substrate of the embedded pcb 11 is used to reduce the loss of the high-speed signal, thereby achieving the integrity of the high-speed signal.
In an embodiment, fig. 3 is a schematic view of a three-dimensional placement structure of an electronic device provided in an embodiment of the present application, and fig. 4 is a schematic view of a three-dimensional placement structure of another electronic device provided in an embodiment of the present application. On the basis of fig. 1 or fig. 2, in conjunction with fig. 3 and fig. 4, at least part of the electronic devices 14 are arranged stacked in a direction perpendicular to the embedded printed circuit board 11. It should be noted that fig. 3 and 4 show an electronic device 14 on an embedded printed circuit board 11.
Specifically, a plurality of electronic devices 14 are all provided on the same embedded printed circuit board 11. Wherein, in the direction perpendicular to the embedded printed circuit board 11, part of the electronic devices 14 may be stacked in the direction perpendicular to the embedded printed circuit board 11, as shown in fig. 3; it is also possible to stack all the electronic devices 14 in a direction perpendicular to the embedded printed circuit board 11, as shown in fig. 4. The preferred implementation of the embodiment of the present application is to stack all the electronic devices 14 in a direction perpendicular to the embedded printed circuit board 11, which is beneficial to shorten the signal transmission line for connecting the electronic devices 14.
In one embodiment, with continued reference to fig. 3 or 4, the stacked electronic devices 13 are electrically interconnected by through-silicon vias.
Among other things, the stacking technique may also be called a 3D stacking technique, and the stacking technique is used to realize three-dimensional integration of a plurality of electronic devices 14 in the Z-axis direction through interconnection or other micromachining techniques. In addition, the three-dimensional electronic device allows multi-layer stacking, and improves the integration of the electronic device 14 by implementing communication of a plurality of electronic devices 13 in a vertical direction through the through-silicon vias.
Specifically, silicon is a dielectric layer in the electronic device 14, the dielectric layer in the electronic device 14 is perforated, and the upper and lower electronic devices 14 can be electrically connected through vertical traces in the silicon through holes, that is, the stacked electronic devices 14 are electrically connected through the silicon through holes. Therefore, the electronic devices 14 can be stacked to be in close contact with each other in the vertical direction, and compared with the case where the electronic devices 14 are laid on the embedded printed circuit board 11, the signal transmission line for connecting the electronic devices can be shortened.
In one embodiment, fig. 5 is a schematic perspective view illustrating a placement of another electronic device provided in an embodiment of the present application. On the basis of fig. 1 or fig. 2, in conjunction with fig. 5, in the embedded printed circuit board 11 disposed corresponding to the communication end region, the interface electronic device 15 is disposed in a single layer, and at least a part of the non-interface electronic devices 14 is disposed in a stacked manner.
Specifically, the electronic device may include an interface electronic device 15 and a non-interface electronic device 14, the embedded printed circuit board 11 disposed at the communication terminal area accesses the high-speed signal through the interface electronic device 15, further, transmits the high-speed signal to the non-interface electronic device such as 14 through the interface electronic device 15, and the accessed high-speed signal is amplified and signal-converted by the non-interface electronic device 14.
Where a portion of non-interface electronics 14 are stacked as shown in fig. 3, or all of non-interface electronics 14 may be stacked as shown in fig. 4, with a single layer of interface electronics 15 disposed at the edge of non-interface electronics 14.
In one embodiment, the electronic device comprises a predetermined electronic device, and the embedded printed circuit board is a general embedded printed circuit board.
Specifically, the electronic device includes a preset electronic device, and the preset electronic device is a general electronic device, such as a high-speed interface electronic device, an ac coupling capacitor, a common mode inductor, an anti-interference resistor, and other key electronic devices. The preset electronic devices are different electronic devices for receiving high-speed signals, the different electronic devices for receiving the high-speed signals are arranged on the substrate of the high-speed plate, namely, a plurality of electronic devices are connected through PCB wiring and are arranged on the same embedded printed circuit board, such as a TBT4 embedded board, an HDMI embedded pass board and a USB embedded board, the embedded printed circuit board is favorable for being used on various electronic products as a universal printed circuit board while the loss of the high-speed signals is reduced, the problem that the circuit main board needs to be repeatedly designed for many times due to the fact that different electronic devices for receiving the high-speed signals need to be arranged in different circuit main boards can be avoided, and further the design cost is reduced. Therefore, the preset electronic device is integrated in the embedded printed circuit board, and the embedded printed circuit board can be used as a universal circuit board due to the universality and cross-industrial property of signals, so that the embedded printed circuit board can be used on various electronic products, and the problem of repeatedly designing the circuit board for many times can be avoided. Thus, the embedded printed circuit board is designed as a general-purpose circuit board, which has a great commercial value or causes an industrial revolution.
The high-speed signal mainboard provided by the embodiment of the application is formed by simply stacking main electronic devices together by using a 3D stacking technology, so that a signal transmission line between the electronic devices is shortened, the loss of the insertion of the electronic devices to high-speed signals is reduced, the residual space of an embedded printed circuit board is saved, and the improvement of the space utilization rate of the embedded printed circuit board is facilitated.
Illustratively, table 3 shows simulation test results of trace length between electronic devices versus high speed signal loss at a frequency of 20 GHz. As shown in table 3, N represents traces of different lengths, four different lengths are shown in table 3, DK represents the dielectric constant of the board, DF represents the dielectric loss factor of the board, roughnesss represents the Roughness of the board in microns, and insertional loss represents the loss of high speed signals in decibels. The simulation test result can be used to obtain that the board substrate of the printed circuit board is fixed, the shorter the wiring between the electronic devices is, the lower the loss of the high-speed signal is, and the loss of the high-speed signal can be reduced by 1.8dB every time the wiring is shortened by 1 inch. Therefore, at least part of the electronic devices are stacked together through the 3D stacking technology, wiring between the connected electronic devices is shortened, and loss of high-speed signals is reduced.
TABLE 3
In one embodiment, the embedded printed circuit board 11 is soldered to the main board body 10 by a surface mounting technique.
Specifically, the embedded printed circuit board 11 is mounted on the main board body 10 by Surface Mount Technology (SMT). The surface mounting technology welds the embedded printed circuit board 11 and the main board body 10 by reflow soldering, dip soldering, or the like, thereby embedding the embedded printed circuit board 11 into the main board body 10.
In one embodiment, the embedded printed circuit board 11 is electrically connected to the main board body 10 through pads, pins, or gold wires.
Specifically, the embedded printed circuit board 11 may be electrically connected to the main board body 10 through one of pad, pin, and gold wire, so as to enable the embedded printed circuit board 11 to communicate with the main board body 10.
Therefore, the high-speed signal main board provided by the embodiment of the application is embedded into the printed circuit board of the high-speed plate substrate through the communication end interface area, and is also embedded into the printed circuit board of the high-speed plate substrate in the area with larger loss in the middle of the routing, so that the loss of the high-speed signal is favorably reduced, the integrity of the high-speed signal is improved, and further, the signal protocol test through verifying the integrity of the signal is favorably realized. The 3D stacking technology is used for integrally arranging various electronic devices on the same high-speed board substrate, the signal loss is reduced to ensure the quality of high-speed signals, and meanwhile, the high-speed board substrate provided with the various electronic devices, namely the embedded printed circuit board, can be used as a universal module, so that the problem that the embedded printed circuit board comprising different electronic devices needs to be repeatedly designed for many times in different circuits is solved, and the development period of the circuit board is further shortened. Therefore, the printed circuit board with the high-speed plate substrate is embedded in the interface area of the communication end, and the printed circuit board with the high-speed plate substrate is also embedded in the area with large loss in the middle of routing.
On the basis of the foregoing embodiments, an electronic device is further provided in an embodiment of the present application, including any one of the high-speed signal motherboards provided in the foregoing embodiments, and has the same or similar beneficial effects, which is not described in detail herein. The electronic device may be various mobile phones, computers, and the like, and this is not particularly limited in this embodiment of the application.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A high-speed signal motherboard, comprising:
the communication terminal comprises a main board body and a plurality of embedded printed circuit boards, wherein at least part of the embedded printed circuit boards are fixedly connected to a communication terminal area of the main board body;
the embedded printed circuit board includes a high-speed board substrate and a plurality of electronic devices disposed on the high-speed board substrate.
2. The high-speed signal motherboard of claim 1 wherein at least a portion of the embedded printed circuit board is connectively secured to the first region of the motherboard body; the first area is a middle preset area of the main board body.
3. The high-speed signal main board according to claim 2, wherein a central processing unit is fixedly connected to the main board body, and the central processing unit is electrically connected to a preset first embedded printed circuit board through a trace in the main board body;
the middle preset area is an area with the loss of the routing larger than the preset loss; the first embedded printed circuit board is arranged corresponding to the communication terminal area.
4. A high-speed signal motherboard according to any of claims 1 to 3, wherein at least some of said electronic components are stacked in a direction perpendicular to said embedded printed circuit board.
5. The high-speed signal motherboard of claim 4 wherein said electronic devices in a stacked arrangement are electrically interconnected by through-silicon vias.
6. The high-speed signal motherboard according to claim 4, wherein in the embedded printed circuit board disposed corresponding to the communication termination region, the interface electronics are disposed in a single layer, and at least a portion of the non-interface electronics are disposed in a stacked arrangement.
7. The high-speed signal motherboard of any of claims 1-3 wherein said electronics comprise pre-set electronics and said embedded printed circuit board is a general purpose embedded printed circuit board.
8. A high-speed signal motherboard according to any of claims 1 to 3, wherein the embedded printed circuit board is electrically connected to the motherboard body by pads, pins or gold wires.
9. The high-speed signal motherboard of claim 8 wherein the embedded printed circuit board is soldered to the motherboard body by surface mount technology.
10. An electronic device comprising a high-speed signal motherboard according to any of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221575803.6U CN217591200U (en) | 2022-06-22 | 2022-06-22 | High-speed signal mainboard and electronic equipment |
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| CN202221575803.6U CN217591200U (en) | 2022-06-22 | 2022-06-22 | High-speed signal mainboard and electronic equipment |
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| CN217591200U true CN217591200U (en) | 2022-10-14 |
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| CN202221575803.6U Active CN217591200U (en) | 2022-06-22 | 2022-06-22 | High-speed signal mainboard and electronic equipment |
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