CN217588011U - Heat dissipation device and expansion card assembly - Google Patents
Heat dissipation device and expansion card assembly Download PDFInfo
- Publication number
- CN217588011U CN217588011U CN202221551724.1U CN202221551724U CN217588011U CN 217588011 U CN217588011 U CN 217588011U CN 202221551724 U CN202221551724 U CN 202221551724U CN 217588011 U CN217588011 U CN 217588011U
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- Prior art keywords
- locking
- expansion card
- heat sink
- locking member
- locking piece
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Surface Heating Bodies (AREA)
- Die Bonding (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The utility model provides a heat abstractor and expansion card subassembly. The heat sink is fixed on a positioning column and thermally contacts with an expansion card. The heat dissipation device comprises a heat dissipation plate and a locking member. The heat sink is used to thermally contact the expansion card. The locking piece is movably arranged on the radiating fin and can move between a locking position and an unlocking position. When the locking piece is located at the locking position, the locking piece is used for being fixed on the positioning column. The locking member is configured to be disengaged from the positioning post when the locking member is in the unlocked position.
Description
Technical Field
The utility model relates to a heat abstractor and extension card subassembly especially relate to a heat abstractor that can exempt from instrument installation and contain its extension card subassembly.
Background
Electronic devices such as notebook computers, desktop computers, and servers have been developed to be expandable according to the needs of users. Further, the user can selectively mount additional expansion cards on the electronic device to increase the performance of the electronic device.
Some types of expansion cards are provided with additional heat sinks for dissipating heat from the expansion card. However, most of the heat sinks are fixed on the expansion cards through screws, so that tools (such as screwdrivers) are required to pass through during the process of assembling and disassembling the expansion cards, thereby causing the problems of inconvenient and inefficient assembly and disassembly of the heat sinks. Accordingly, researchers in this field are working on solving such problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor and expansion card subassembly can be in order to avoid the mode dismouting of instrument to expand the card.
An embodiment of the present invention discloses a heat dissipation device for being fixed to a positioning post and thermally contacting an expansion card. The heat dissipation device comprises a heat dissipation plate and a locking member. The heat sink is used for thermally contacting the expansion card. The locking piece is movably arranged on the radiating fin and can move between a locking position and an unlocking position. When the locking piece is located at the locking position, the locking piece is used for being fixed on the positioning column. The locking member is configured to be disengaged from the positioning post when the locking member is in the unlocked position.
According to one embodiment of the present invention, the locking member is slidably disposed on the heat sink.
According to one embodiment of the present invention, the locking member has a locking hole; when the locking piece is positioned at the locking position, one end edge of the clamping hole is clamped and fixed on the positioning column; when the locking piece is located at the unlocking position, one end edge of the clamping hole is separated from the positioning column.
According to one embodiment of the present invention, the locking hole has a guiding inclined plane, and the guiding inclined plane of the locking hole is used for abutting against a guiding surface of the positioning column, so that the locking member slides relative to the heat sink.
According to one embodiment of the present invention, the locking device further comprises an elastic member, the elastic member is a spring, one end of the elastic member abuts against the heat sink, the other end of the elastic member abuts against the locking member, and the elastic member is used for applying an acting force of the locking member moving from the unlocking position to the locking position.
According to one embodiment of the present invention, the locking device further comprises an elastic member, the elastic member is a spring piece, one end of the elastic member abuts against the heat sink, the other end of the elastic member is connected to the locking member, and the elastic member is used for applying an acting force of the locking member moving from the unlocking position to the locking position.
According to one embodiment of the present invention, the heat sink further comprises at least one positioning member, the locking member has at least one long through hole, a long axis of the at least one long through hole is parallel to a slidable direction of the locking member, and the at least one positioning member passes through the at least one long through hole of the locking member and is fixed to the heat sink.
According to one embodiment of the present invention, the heat sink has an end surface and a guiding sliding groove, the guiding sliding groove is formed by recessing the end surface, and the locking member is partially disposed inside and outside the guiding sliding groove.
Another embodiment of the present invention discloses an expansion card assembly for being assembled to an electrical connector. The expansion card seat comprises an expansion card seat, an expansion card and a heat dissipation device. The expansion card seat is provided with a positioning column. The expansion card is arranged on the expansion card seat and is used for being inserted into the electric connector. The heat dissipation device comprises a heat dissipation plate and a locking member. The heat sink is in thermal contact with the expansion card. The locking piece is movably arranged on the radiating fin and can move between a locking position and an unlocking position. When the locking piece is located the latched position, the locking piece is fixed in the reference column. The locking member is disengageable from the positioning post when the locking member is in the unlocked position.
According to one embodiment of the present invention, the locking member is slidably disposed on the heat sink.
According to the heat dissipation device and the expansion card assembly disclosed by the embodiment, the locking piece is movably arranged on the heat dissipation piece, so that the heat dissipation device can be fixed on the positioning column when in a locking position, and can be separated from the positioning column when in an unlocking position, and the heat dissipation device can be detached from the expansion card in a tool-free mode. Similarly, the heat sink can be mounted on the expansion card in a tool-free manner. Therefore, the heat dissipation device can be assembled and disassembled on the expansion card in a simple and efficient manner.
The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention.
Drawings
Fig. 1 is a perspective view of an expansion card assembly according to a first embodiment of the present invention.
Fig. 2 is an exploded view of fig. 1.
Fig. 3 is a partially exploded view of the heat dissipation device of fig. 2.
Fig. 4 to 5 are schematic cross-sectional views illustrating a process of mounting the heat dissipation device on the expansion card.
Fig. 6 is a cross-sectional schematic view of the lock of fig. 5 in an unlocked position.
Fig. 7 is a partially exploded view of a heat dissipation device according to a second embodiment of the present invention.
Fig. 8 to 9 are schematic cross-sectional views illustrating a process of mounting the heat dissipation device on the expansion card.
Fig. 10 is a cross-sectional schematic view of the lock of fig. 9 in an unlocked position.
The reference numbers are as follows:
1: expansion card assembly
2: main board
3: electric connector
10 expansion card seat
11 positioning column
111 body part
112 head part
1121 guide surface
20 expansion card
30,30a heat sink
31,31a heat sink
311 end face
312 guide chute
313 inserting hole
314,314a storage tank
32,32a locking element
321,321a Assembly part
322,322a operating part
3211 perforation with long length
3212 protruding structure
3212a through groove
3213,3213a fastening hole
3214,3214a the guide slope
3215,3215a end edge
33,33a positioning member
34,34a elastic member
W1, W2: width
L is the long axis
D, D1: direction
Detailed Description
Please refer to fig. 1 to 3. Fig. 1 is a perspective view of an expansion card assembly according to a first embodiment of the present invention. Fig. 2 is an exploded view of fig. 1. Fig. 3 is a partially exploded view of the heat dissipation device of fig. 2.
In the present embodiment, the expansion card assembly 1 includes an expansion card socket 10, an expansion card 20 and a heat dissipation device 30.
The expansion card socket 10 is configured to be mounted on a motherboard 2, for example. The expansion card socket 10 has a positioning post 11, and the positioning post 11 and an electrical connector 3 on the motherboard 2 are opposite to each other. The positioning post 11 has a body 111 and a head 112 connected to each other, and a width W2 of the head 112 of the positioning post 11 is greater than a width W1 of the body 111. The head 112 has a guiding surface 1121, and the guiding surface 1121 is, for example, a curved surface. The expansion card 20 is, for example, an m.2-compliant SSD memory. The expansion card 20 is installed on the expansion card socket 10 and is used for being inserted into the electrical connector 3 on the motherboard 2.
The heat dissipation device 30 includes a heat sink 31 and a locking member 32. In addition, the heat dissipation device 30 may further include a plurality of positioning members 33 and an elastic member 34.
The heat sink 31 is in thermal contact with the expansion card 20 for dissipating heat from the expansion card 20. The heat sink 31 has an end surface 311, a guiding sliding groove 312, an insertion hole 313 and a receiving groove 314, wherein the end surface 311 is located on the long axis L of the heat sink 31, and the guiding sliding groove 312 is formed by recessing from the end surface 311. The insertion holes 313 are separated from the receiving grooves 314 and are all communicated with the guiding sliding grooves 312. The insertion hole 313 is used for inserting the head 112 of the positioning column 11, and the accommodating groove 314 accommodates the elastic element 34.
The locking member 32 is slidably disposed in the guiding slot 312 of the heat sink 31 and can move between a locking position (refer to fig. 4) and an unlocking position (refer to fig. 6). In detail, the locking member 32 includes an assembling portion 321 and an operating portion 322 connected to each other. The assembling portion 321 is slidably assembled to the guiding sliding slot 312 of the heat sink 31, and the operating portion 322 is located outside the guiding sliding slot 312. The slidable direction D of the assembling portion 321 of the locking member 32 is parallel to the long axis L of the heat sink 31. The assembling portion 321 has a plurality of elongated through holes 3211. Each of the elongated through holes 3211 has a length greater than a width, and a long axis of the elongated through hole 3211 is parallel to the slidable direction D of the assembling portion 321 of the locking element 32. These positioning elements 33 are for example screws. The positioning members 33 pass through the elongated through holes 3211 and are locked to the heat sink 31 to position the locking member 32 on the heat sink 31.
It should be noted that the heat sink 31 is not limited to having the guide chute 312. In other embodiments, the heat sink may not have a guiding sliding groove, and the assembling portion of the locking member may slide directly on the outer surface of the heat sink.
It should be noted that the number of the elongated through holes 3211 of the assembling portion 321 of the locking member 32 and the number of the positioning members 33 are not intended to limit the present invention. In other embodiments, the number of the elongated through holes of the assembling portion of the locking element and the number of the positioning elements may be one.
In the present embodiment, the assembling portion 321 of the locking member 32 further has a protruding structure 3212. The protruding structure 3212 is inserted into the receiving groove 314 of the heat sink 31. The elastic member 34 is, for example, a compression spring. The elastic element 34 is located in the receiving groove 314 of the heat sink 31, and two opposite ends thereof respectively abut against an inner wall surface of the receiving groove 314 and the protruding structure 3212. The elastic member 34 is used to apply a force to move the locking member 32 from the unlocking position to the locking position. The elastic member 34 normally keeps the locking member 32 in the locking position in a state where the user does not apply force to the locking member 32.
It should be noted that the elastic element 34 is not limited to the protrusion structure 3212 located in the receiving groove 314 and abutting against the inner wall surface of the receiving groove 314 and the assembling portion 321 of the locking element 32. The structure of the assembling portion of the heat sink and the locking member for the elastic member to abut against can be any suitable type of structure as long as the opposite ends of the elastic member can abut against the assembling portion of the heat sink and the locking member.
In the present embodiment, the assembling portion 321 of the locking member 32 further has a fastening hole 3213. The fastening hole 3213 is used for the positioning column 11 to pass through, and the size of the fastening hole 3213 is larger than the size of the head 112 of the positioning column 11. The locking hole 3213 has a guiding inclined surface 3214, and the guiding inclined surface 3214 of the locking hole 3213 is configured to press against the guiding surface 1121 of the head 112 of the positioning post 11 during the installation of the heat dissipation device 30 on the expansion card 20, so that the locking member 32 slides relative to the heat sink 31.
The process of mounting the heat sink 30 on the expansion card 20 will be described in detail below. Referring to fig. 4 and 5, fig. 4 to 5 are schematic cross-sectional views illustrating a process of mounting the heat dissipation device on the expansion card.
First, the heat dissipation device 30 is placed on the expansion card 20. At this time, the guiding inclined surface 3214 of the locking hole 3213 of the locking member 32 abuts against the guiding surface 1121 of the head 112 of the positioning column 11, so that the heat dissipation device 30 is inclined on the expansion card 20. Then, the heat dissipation device 30 is pressed downward (in the direction D1), and the head 112 of the positioning column 11 pushes the locking member 32 from the locking position to the unlocking position due to the engagement of the guiding surface 1121 with the guiding inclined surface 3214 of the locking hole 3213, so that the elastic member 34 is compressed by the locking member 32 and the heat sink 31. Once the locking member 32 is moved to the unlocking position, the head 112 of the positioning column 11 can pass through the locking hole 3213, so that the heat sink 31 lies down on the expansion card 20. Then, under the resilient force of the elastic member 34, the locking member 32 slides from the unlocking position to the locking position, so that the locking member 32 impacts the body 111 of the positioning pillar 11, and the head 112 of the positioning pillar 11 is clamped at one end edge 3215 of the clamping hole 3213. Thus, the sound of the locking member 32 hitting the body 111 of the positioning post 11 can determine that the heat dissipation device 30 is properly mounted on the expansion card 20.
Next, the process of detaching the heat sink 30 from the expansion card 20 will be described below. Referring to fig. 6, fig. 6 is a schematic cross-sectional view of the locking member of fig. 5 in an unlocked position.
First, the operating portion 322 of the locking member 32 is pushed, so that the locking member 32 moves from the locking position to the unlocking position. At this time, the head 112 of the positioning post 11 is separated from the end edge 3215 of the fastening hole 3213 and completely aligned with the fastening hole 3213. Then, the heat sink 30 is lifted up, so that the assembly portion 321 of the locking member 32 is separated from the positioning post 11, and the heat sink 30 is separated from the expansion card 20.
In the present embodiment, the locking member 32 is movably disposed on the heat sink 31, and can be fixed to the positioning post 11 when in the locking position, and can be detached from the positioning post 11 when in the unlocking position, so that the heat dissipation device 30 can be detached from the expansion card 20 in a tool-free manner. Similarly, the heat sink 30 can be mounted on the expansion card 20 in a tool-free manner. Therefore, the heat sink 30 can be easily and efficiently attached to and detached from the expansion card 20.
It should be noted that the slidable direction D of the locking member 32 is not limited to being parallel to the long axis L of the heat sink 31. In other embodiments, the slidable direction of the locking element may be parallel to the minor axis of the heat sink.
In the present embodiment, the positioning post 11 combined with the locking piece 32 of the heat sink 30 is not limited to be opposite to the electrical connector 3. In other embodiments, the positioning post may be disposed on the electrical connector instead, and the position of the locking member disposed on the heat sink may be adjusted correspondingly.
It should also be noted that the locking member 32 is not limited to a design that is slidable with respect to the heat sink 31. In other embodiments, the locking member may be configured to rotate relative to the heat sink, and the locking member may be secured to the positioning post or disengaged from the positioning post by rotating the locking member.
Next, referring to fig. 7, fig. 7 is a partially exploded view of a heat dissipation device according to a second embodiment of the present invention.
The heat dissipation device 30a of the present embodiment is similar to the heat dissipation device 30 described above with reference to fig. 1 to 6, and also includes a heat dissipation fin 31a, a locking member 32a, a plurality of positioning members 33a, and an elastic member 34a. The main difference between the heat dissipation device 30a of the present embodiment and the heat dissipation device 30 described above with reference to fig. 1 to 6 is that the types of the elastic elements are different, and the following description mainly describes the elastic element 34a of the present embodiment and the related structures thereof in detail, and please refer to the description with reference to fig. 1 to 6 for the structures of other elements of the present embodiment and the connection relationship between them, and no further description is given.
In the present embodiment, the assembling portion 321a of the locking member 32a has a through groove 3212a, and the through groove 3212a is communicated with the receiving groove 314a of the heat sink 31 a. The elastic element 34a is a spring piece, and the elastic element 34a passes through the through groove 3212a of the assembling portion 321a. One end of the elastic element 34a extends into the receiving groove 314a of the heat sink 31a and abuts against the inner wall surface of the receiving groove 314a, and the other end of the elastic element 34a is connected to the assembling portion 321a of the locking element 32 a. The elastic member 34a has a curved shape and is elastically deformable.
The process of mounting the heat sink 30a on the expansion card 20 will be described in detail below. Referring to fig. 8 and 9, fig. 8 to 9 are schematic cross-sectional views illustrating a process of mounting the heat dissipation device on the expansion card.
First, the heat dissipation device 30a is placed on the expansion card 20. At this time, the guiding inclined surface 3214a of the locking hole 3213a of the locking piece 32a abuts against the guiding surface 1121 of the head 112 of the positioning post 11, so that the heat sink 30a is inclined on the expansion card 20. Then, the heat sink 30a is pressed downward (in the direction D1), and the head 112 of the positioning post 11 pushes the locking piece 32a from the locking position to the unlocking position due to the cooperation of the guiding surface 1121 and the guiding inclined surface 3214a of the fastening hole 3213a, so that the elastic piece 34a is pressed by the heat sink 31a and deformed. Once the locking member 32a moves to the unlocking position, the head 112 of the positioning column 11 passes through the fastening hole 3213a, so that the heat sink 31a lies down on the expansion card 20. Then, under the resilient force of the elastic member 34a, the locking member 32a slides from the unlocking position to the locking position, so that the locking member 32a impacts the body 111 of the positioning pillar 11, and the head 112 of the positioning pillar 11 is clamped at one end edge 3215a of the clamping hole 3213a. Thus, the sound of the locking member 32a hitting the body 111 of the positioning post 11 can determine that the heat sink 30a is properly mounted on the expansion card 20.
Next, a process of attaching and detaching the heat sink 30a from the expansion card 20 will be described below. Referring to fig. 10, fig. 10 is a schematic cross-sectional view of the locking member of fig. 9 in an unlocked position.
First, the operating portion 322a of the locking member 32a is pushed, so that the locking member 32a moves from the locking position to the unlocking position. At this time, the head 112 of the positioning post 11 is separated from the end edge 3215a of the fastening hole 3213a and completely aligned with the fastening hole 3213a. Then, the heat sink 30a is lifted up, so that the assembly portion 321a of the locking piece 32a is separated from the positioning post 11, and the heat sink 30a is separated from the expansion card 20.
According to the heat dissipation device and the expansion card assembly disclosed by the embodiment, the locking piece is movably arranged on the heat dissipation piece, so that the heat dissipation device can be fixed on the positioning column when in a locking position, and can be separated from the positioning column when in an unlocking position, and the heat dissipation device can be detached from the expansion card in a tool-free mode. Similarly, the heat sink can be mounted on the expansion card in a tool-free manner. Therefore, the heat dissipation device can be assembled and disassembled on the expansion card in a simple and efficient manner.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make modifications and variations without departing from the spirit and scope of the present invention.
Claims (10)
1. A heat dissipating device is used for being fixed on a positioning column and thermally contacting with an expansion card, and is characterized by comprising:
a heat sink for thermally contacting the expansion card; and
the locking piece is movably arranged on the radiating fin and can move between a locking position and an unlocking position;
when the locking piece is positioned at the locking position, the locking piece is used for being fixed on the positioning column; when the locking piece is positioned at the unlocking position, the locking piece can be separated from the positioning column.
2. The heat dissipating device of claim 1, wherein the locking member is slidably disposed on the heat sink.
3. The heat dissipating device of claim 2, wherein the locking member has a locking hole; when the locking piece is positioned at the locking position, one end edge of the clamping hole is clamped and fixed on the positioning column; when the locking piece is located at the unlocking position, one end edge of the clamping hole is separated from the positioning column.
4. The heat dissipating device of claim 3, wherein the locking hole has a guiding slope, and the guiding slope of the locking hole is configured to abut against a guiding surface of the positioning post, so that the locking member slides relative to the heat sink.
5. The heat dissipating device as claimed in claim 2, further comprising a resilient member, wherein the resilient member is a spring, one end of the resilient member abuts against the heat sink, the other end of the resilient member abuts against the locking member, and the resilient member is used to apply a force to the locking member to move from the unlocking position to the locking position.
6. The heat dissipating device of claim 2, further comprising an elastic member, wherein the elastic member is a spring, one end of the elastic member abuts against the heat sink, the other end of the elastic member is connected to the locking member, and the elastic member is configured to apply a force to the locking member moving from the unlocked position to the locked position.
7. The heat dissipating device of claim 2, further comprising at least one positioning member, wherein the locking member has at least one elongated through hole, the long axis of the at least one elongated through hole is parallel to the slidable direction of the locking member, and the at least one positioning member passes through the at least one elongated through hole of the locking member and is fixed to the heat sink.
8. The heat dissipating device of claim 2, wherein the heat sink has an end face and a guiding groove recessed from the end face, and the locking member is partially disposed in and out of the guiding groove.
9. An expansion card assembly for assembly with an electrical connector, comprising:
an expansion card seat with a positioning column;
an expansion card, which is arranged on the expansion card seat and is used for being inserted into the electric connector; and
a heat dissipation device, comprising:
a heat sink thermally contacting the expansion card; and
the locking piece is movably arranged on the radiating fin and can move between a locking position and an unlocking position;
when the locking piece is positioned at the locking position, the locking piece is fixed on the positioning column; when the locking piece is located at the unlocking position, the locking piece can be separated from the positioning column.
10. The expansion card assembly of claim 9, wherein the locking member is slidably disposed on the heat sink.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111204935U TWM630521U (en) | 2022-05-13 | 2022-05-13 | Heatsinks and Expansion Card Assemblies |
| TW111204935 | 2022-05-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217588011U true CN217588011U (en) | 2022-10-14 |
Family
ID=82898668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221551724.1U Active CN217588011U (en) | 2022-05-13 | 2022-06-20 | Heat dissipation device and expansion card assembly |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP3239187U (en) |
| CN (1) | CN217588011U (en) |
| DE (1) | DE202022103913U1 (en) |
| TW (1) | TWM630521U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI858908B (en) * | 2023-09-07 | 2024-10-11 | 英業達股份有限公司 | Laptop computer and solid state drive fixing structure thereof |
-
2022
- 2022-05-13 TW TW111204935U patent/TWM630521U/en unknown
- 2022-06-20 CN CN202221551724.1U patent/CN217588011U/en active Active
- 2022-07-12 DE DE202022103913.5U patent/DE202022103913U1/en active Active
- 2022-07-25 JP JP2022002429U patent/JP3239187U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP3239187U (en) | 2022-09-26 |
| DE202022103913U1 (en) | 2022-07-28 |
| TWM630521U (en) | 2022-08-01 |
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