CN217587386U - Test circuit for oscillation frequency of inductive proximity sensor - Google Patents

Test circuit for oscillation frequency of inductive proximity sensor Download PDF

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CN217587386U
CN217587386U CN202220253296.8U CN202220253296U CN217587386U CN 217587386 U CN217587386 U CN 217587386U CN 202220253296 U CN202220253296 U CN 202220253296U CN 217587386 U CN217587386 U CN 217587386U
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resistor
electrically connected
pin
capacitor
chip
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唐可信
叶立平
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Shenzhen Akusense Technology Co Ltd
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Shenzhen Akusense Technology Co Ltd
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Abstract

The utility model discloses a test circuit that inductance type proximity sensor oscillation frequency used, including inductance coils, power supply circuit and treater, the treater includes digital analog converter and MPU processing circuit, inductance coils's output electric connection has signal amplification processing circuit, signal amplification processing circuit's output and digital analog converter's input electric connection, power supply circuit's output and signal amplification processing circuit's input and MPU processing circuit's input electric connection, and power supply circuit's output electric connection has frequency display unit, frequency display unit's output and MPU processing circuit's input electric connection. The utility model relates to a rationally, be convenient for carry out the test of oscillation frequency to the sensor that is in the semi-manufactured goods stage to accurate test inductance type proximity sensor's oscillation frequency, thereby effectively improve efficiency of software testing, the personnel of being convenient for use satisfies the user demand.

Description

Test circuit for oscillation frequency of inductive proximity sensor
Technical Field
The utility model relates to a sensor oscillation frequency tests technical field, especially relates to a test circuit that inductance type proximity sensor oscillation frequency used.
Background
The inductive proximity sensor is also called a contactless proximity switch, is an optimal switching value sensor for detecting metal in place, has accurate positioning and long service life, can adapt to severe detection environments such as water, oil and the like, and is widely used in modern industry;
the inductive proximity sensor is precise, so that the requirements on an inductive coil and circuit components are extremely high, in addition, the inside of a shell adopts a glue pouring process, defective products cannot be maintained, once the products are defective, the products can only be scrapped, the defective rate of the products is increased, and the cost of the products is increased, so in the semi-finished product stage of the products, the relevant function test of the products is qualified, and the products can be encapsulated.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a test circuit for the oscillation frequency of an inductive proximity sensor.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a test circuit that inductance type proximity sensor oscillation frequency used, includes inductance coils, power supply circuit and treater, the treater includes digital-to-analog converter and MPU processing circuit, inductance coils's output electric connection has signal amplification processing circuit, signal amplification processing circuit's output and digital-to-analog converter's input electric connection, power supply circuit's output and signal amplification processing circuit's input and MPU processing circuit's input electric connection, power supply circuit's output electric connection has the frequency display unit, the output of frequency display unit and MPU processing circuit's input electric connection, MPU processing circuit's output and frequency display unit's input electric connection, digital-to-analog converter's output and MPU processing circuit's input electric connection.
Preferably, the signal amplification processing circuit includes a signal amplification chip, an interface J3 and an interface J5, the interface J3 is electrically connected to one end of the inductor coil, the other end of the inductor coil is electrically connected to the interface J5, the interface J5 is electrically connected to one end of a resistor R73, the other end of the resistor R73 is grounded, the interface J3 is electrically connected to one end of a capacitor C11, the other end of the capacitor C11 is electrically connected to one end of a resistor R17, the other end of the resistor R17 is electrically connected to one end of the capacitor C17, one end of a resistor R20, one end of a resistor R15, one end of a capacitor C16 and the pin 3 of the signal amplification chip, the other end of the capacitor C17 and the other end of the resistor R20 are both grounded, the pin 2 of the signal amplification chip is electrically connected to one end of a resistor R24 and one end of a resistor R22, the other end of the resistor R22 is electrically connected to one end of a capacitor C14, the other end of the capacitor C14 and the other end of the signal amplification chip are both grounded, the other end of the pin 1 of the signal amplification chip is electrically connected to the pin 8 of the signal amplification chip, and the other end of the capacitor C9 is grounded.
Preferably, the digital-to-analog converter includes a digital-to-analog conversion chip, a pin 5 of the digital-to-analog conversion chip is electrically connected to a pin 7 of the digital-to-analog conversion chip, a pin 6 of the digital-to-analog conversion chip is electrically connected to one end of a resistor R19, and the other end of the resistor R19 is electrically connected to one end of a capacitor C16.
Preferably, the MPU processing circuit includes an STM32F030K6T6 type MPU processing chip, pin 14 of the MPU processing chip is electrically connected with resistor R16, the other end of resistor R16 is electrically connected with pin 7 of the digital-to-analog conversion chip, pin 31 of the MPU processing chip is electrically connected with one end of resistor R8 and one end of resistor R10, the other end of resistor R10 is grounded, the MPU processing chip is also electrically connected with a crystal oscillator circuit, pin 4 of the MPU processing chip is electrically connected with one end of capacitor C2 and one end of resistor R3, and the other end of capacitor C2 is grounded.
Preferably, power supply circuit includes the stabiliser, pin 1 ground connection of stabiliser, pin 3 electric connection of stabiliser has diode D2's negative pole, resistance R21's one end and high level VCC, resistance R21's other end electric connection has emitting diode D4's positive pole, emitting diode D4's negative pole ground connection, diode D2's positive pole electric connection has pin 2 of stabiliser, electric capacity C12's one end, electric capacity C13's one end, resistance R3's the other end, resistance R8's the other end, resistance R15's the other end and signal amplification chip's pin 8.
Preferably, the frequency display unit includes a connection row CON4 of the liquid crystal display, pin 1 of the connection row CON4 of the liquid crystal display is grounded, pin 2 of the connection row CON4 of the liquid crystal display is electrically connected with one end of a capacitor C1, one end of a resistor R2 and pin 2 of the voltage stabilizer, the other end of the capacitor C1 is grounded, the other end of the resistor R1 is electrically connected with one end of a resistor R6 and pin 29 of the MPU processing chip, the other end of the resistor R6 is electrically connected with pin 3 of the connection row CON4 of the liquid crystal display, the other end of the resistor R2 is electrically connected with one end of the resistor R4 and pin 30 of the MPU processing chip, and the other end of the resistor R4 is electrically connected with pin 4 of the connection row CON4 of the liquid crystal display.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model relates to a rationally, be convenient for carry out the test of oscillation frequency to the sensor that is in the semi-manufactured goods stage to accurate test inductance type proximity sensor's oscillation frequency, thereby effectively improve efficiency of software testing, the personnel of being convenient for use satisfies the user demand.
Drawings
Fig. 1 is a system block diagram of a test circuit for the oscillation frequency of an inductive proximity sensor according to the present invention;
fig. 2 is a circuit diagram of a frequency display unit in a test circuit for the oscillation frequency of the inductive proximity sensor according to the present invention;
fig. 3 is a circuit diagram of a power circuit in a test circuit for oscillation frequency of an inductive proximity sensor according to the present invention;
fig. 4 is a circuit diagram of an MPU processing circuit in the testing circuit for the oscillation frequency of the inductive proximity sensor according to the present invention;
fig. 5 is a circuit diagram of a digital-to-analog converter in a test circuit for the oscillation frequency of an inductive proximity sensor according to the present invention;
fig. 6 is a circuit diagram of a signal amplification processing circuit in a test circuit for the oscillation frequency of the inductive proximity sensor according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-6, a test circuit for an oscillation frequency of an inductive proximity sensor includes an inductor, a power supply circuit and a processor, the processor includes a digital-to-analog converter and an MPU processing circuit, an output terminal of the inductor is electrically connected with a signal amplification processing circuit, an output terminal of the signal amplification processing circuit is electrically connected with an input terminal of the digital-to-analog converter, an output terminal of the power supply circuit is electrically connected with an input terminal of the signal amplification processing circuit and an input terminal of the MPU processing circuit, an output terminal of the power supply circuit is electrically connected with a frequency display unit, an output terminal of the frequency display unit is electrically connected with an input terminal of the MPU processing circuit, an output terminal of the MPU processing circuit is electrically connected with an input terminal of the frequency display unit, and an output terminal of the digital-to-analog converter is electrically connected with an input terminal of the MPU processing circuit;
the signal amplification processing circuit comprises a signal amplification chip, an interface J3 and an interface J5, wherein the interface J3 is electrically connected with one end of an inductance coil, the other end of the inductance coil is electrically connected with the interface J5, the interface J5 is electrically connected with one end of a resistor R73, the other end of the resistor R73 is grounded, the interface J3 is electrically connected with one end of a capacitor C11, the other end of the capacitor C11 is electrically connected with one end of a resistor R17, the other end of the resistor R17 is electrically connected with one end of the capacitor C17, one end of a resistor R20, one end of a resistor R15, one end of a capacitor C16 and a pin 3 of the signal amplification chip, the other end of the capacitor C17 and the other end of the resistor R20 are both grounded, a pin 2 of the signal amplification chip is electrically connected with one end of a resistor R24 and one end of a resistor R22, the other end of the resistor R22 is electrically connected with one end of a capacitor C14, the other end of the capacitor C14 and a ground terminal of the signal amplification chip are both grounded, the other end of the resistor R24 is electrically connected with a pin 1 of the signal amplification chip and the other end of the capacitor C16, a pin 8 of the signal amplification chip is electrically connected with one end of the pin 8 of the capacitor C9;
the digital-to-analog converter comprises a digital-to-analog conversion chip, a pin 5 of the digital-to-analog conversion chip is electrically connected with a pin 7 of the digital-to-analog conversion chip, a pin 6 of the digital-to-analog conversion chip is electrically connected with one end of a resistor R19, and the other end of the resistor R19 is electrically connected with one end of a capacitor C16;
the MPU processing circuit comprises an STM32F030K6T6 type MPU processing chip, a pin 14 of the MPU processing chip is electrically connected with a resistor R16, the other end of the resistor R16 is electrically connected with a pin 7 of a digital-to-analog conversion chip, a pin 31 of the MPU processing chip is electrically connected with one end of a resistor R8 and one end of a resistor R10, the other end of the resistor R10 is grounded, the MPU processing chip is also electrically connected with a crystal oscillator circuit, a pin 4 of the MPU processing chip is electrically connected with one end of a capacitor C2 and one end of a resistor R3, and the other end of the capacitor C2 is grounded;
the power supply circuit comprises a voltage stabilizer, wherein a pin 1 of the voltage stabilizer is grounded, a pin 3 of the voltage stabilizer is electrically connected with a cathode of a diode D2, one end of a resistor R21 and a high level VCC, the other end of the resistor R21 is electrically connected with an anode of a light-emitting diode D4, the cathode of the light-emitting diode D4 is grounded, the anode of the diode D2 is electrically connected with a pin 2 of the voltage stabilizer, one end of a capacitor C12, one end of a capacitor C13, the other end of a resistor R3, the other end of a resistor R8, the other end of a resistor R15 and a pin 8 of a signal amplification chip;
the frequency display unit includes liquid crystal display's wiring row CON4, liquid crystal display's wiring row CON 4's pin 1 ground connection, liquid crystal display's wiring row CON 4's pin 2 electric connection has electric capacity C1's one end, resistance R2's one end and stabiliser pin 2, electric capacity C1's other end ground connection, resistance R1's other end electric connection has resistance R6's one end and MPU to handle the pin 29 of chip, resistance R6's the other end and liquid crystal display's wiring row CON 4's pin 3 electric connection, resistance R2's other end electric connection has resistance R4's one end and MPU to handle the pin 30 of chip, resistance R4's the other end and liquid crystal display's wiring row CON 4's pin 4 electric connection, the utility model relates to a rationally, be convenient for carry out the test of oscillation frequency to the sensor that is in the semi-manufactured goods stage, thereby accurate test inductance type proximity sensor's oscillation frequency, thereby effectively improve test efficiency, the personnel of being convenient for use satisfies the user demand.
The working principle is as follows: when the frequency measurement device is used, the power supply circuit supplies power to the signal amplification processing circuit, the MPU processing circuit and the frequency display unit, when the sensor approaches to the inductance coil, the inductance coil generates current due to electromagnetic induction, the current flows into one end of the resistor R17 through one end of the capacitor C11, the current flows into the pin 3 of the signal amplification chip through the other end of the resistor R17, the current flowing into the signal amplification chip is processed through the signal amplification chip to obtain a signal waveform with the same frequency as that of the proximity switch, the signal waveform flows into one end of the capacitor C16 through the pin 1 of the signal amplification chip, the signal waveform flows into one end of the resistor R19 through the other end of the capacitor C16, the signal waveform flows into the digital-to-analog converter through the other end of the resistor R19, the digital-to-analog converter performs frequency conversion on the received signal waveform, the converted frequency is guided into the pin 14 of the MPU processing chip through the resistor R16, the frequency value after the MPU processing chip is guided into the frequency display unit through the pin 29 and the pin 30, and the oscillation frequency display unit displays the obtained frequency value of the sensor, so that the oscillation frequency measurement device can accurately obtain the oscillation frequency of the inductance approach to the sensor, and improve the efficiency of the inductance measurement.
In the description of the present application, it should be further noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may include, for example, a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, a connection through an intermediate medium, and a connection between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to specific situations.
The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.

Claims (6)

1. The utility model provides a test circuit that inductance type proximity sensor oscillation frequency was used, includes inductance coils, power supply circuit and treater, its characterized in that, the treater includes digital analog converter and MPU processing circuit, inductance coils's output electric connection has signal amplification processing circuit, signal amplification processing circuit's output and digital analog converter's input electric connection, power supply circuit's output and signal amplification processing circuit's input and MPU processing circuit's input electric connection, power supply circuit's output electric connection has the frequency display unit, the output of frequency display unit and MPU processing circuit's input electric connection, MPU processing circuit's output and frequency display unit's input electric connection, digital analog converter's output and MPU processing circuit's input electric connection.
2. The test circuit for the oscillation frequency of the inductive proximity sensor according to claim 1, wherein the signal amplification processing circuit comprises a signal amplification chip, an interface J3 and an interface J5, the interface J3 is electrically connected to one end of the inductor coil, the other end of the inductor coil is electrically connected to the interface J5, the interface J5 is electrically connected to one end of a resistor R73, the other end of the resistor R73 is grounded, the interface J3 is electrically connected to one end of a capacitor C11, the other end of the capacitor C11 is electrically connected to one end of a resistor R17, the other end of the resistor R17 is electrically connected to one end of a capacitor C17, one end of a resistor R20, one end of a resistor R15, one end of a capacitor C16 and the pin 3 of the signal amplification chip, the other end of the capacitor C17 and the other end of the resistor R20 are grounded, the pin 2 of the signal amplification chip is electrically connected to one end of a resistor R24 and one end of a resistor R22, the other end of the resistor R22 is electrically connected to one end of a capacitor C14, the other end of the capacitor C14 and the ground of the signal amplification chip are grounded, the other end of the resistor R24 and the pin 1 of the signal amplification chip are electrically connected to one end of the pin 1 of the pin 8 of the signal amplification chip, and the signal amplification chip is electrically connected to the pin 9, and the ground.
3. The test circuit for the oscillating frequency of the inductive proximity sensor according to claim 1, wherein the digital-to-analog converter comprises a digital-to-analog conversion chip, the pin 5 of the digital-to-analog conversion chip is electrically connected to the pin 7 of the digital-to-analog conversion chip, the pin 6 of the digital-to-analog conversion chip is electrically connected to one end of a resistor R19, and the other end of the resistor R19 is electrically connected to one end of a capacitor C16.
4. The test circuit for the oscillation frequency of the inductive proximity sensor according to claim 1, wherein the MPU processing circuit comprises an STM32F030K6T6 type MPU processing chip, a resistor R16 is electrically connected to a pin 14 of the MPU processing chip, the other end of the resistor R16 is electrically connected to a pin 7 of the digital-to-analog conversion chip, one end of a resistor R8 and one end of a resistor R10 are electrically connected to a pin 31 of the MPU processing chip, the other end of the resistor R10 is grounded, the MPU processing chip is further electrically connected to a crystal oscillator circuit, one end of a capacitor C2 and one end of a resistor R3 are electrically connected to a pin 4 of the MPU processing chip, and the other end of the capacitor C2 is grounded.
5. The test circuit for the oscillating frequency of the inductive proximity sensor according to claim 1, wherein the power circuit comprises a voltage stabilizer, pin 1 of the voltage stabilizer is grounded, pin 3 of the voltage stabilizer is electrically connected with a cathode of a diode D2, one end of a resistor R21 and a high level VCC, the other end of the resistor R21 is electrically connected with an anode of a light emitting diode D4, a cathode of the light emitting diode D4 is grounded, and an anode of the diode D2 is electrically connected with pin 2 of the voltage stabilizer, one end of a capacitor C12, one end of a capacitor C13, the other end of the resistor R3, the other end of a resistor R8, the other end of a resistor R15 and a pin 8 of the signal amplification chip.
6. The test circuit for the oscillating frequency of the inductive proximity sensor according to claim 1, wherein the frequency display unit comprises a connection line CON4 of the liquid crystal display, a pin 1 of the connection line CON4 of the liquid crystal display is grounded, a pin 2 of the connection line CON4 of the liquid crystal display is electrically connected to one end of a capacitor C1, one end of a resistor R2 and a pin 2 of a voltage regulator, the other end of the capacitor C1 is grounded, the other end of the resistor R1 is electrically connected to one end of a resistor R6 and a pin 29 of the MPU processing chip, the other end of the resistor R6 is electrically connected to a pin 3 of the connection line CON4 of the liquid crystal display, the other end of the resistor R2 is electrically connected to one end of a resistor R4 and a pin 30 of the MPU processing chip, and the other end of the resistor R4 is electrically connected to a pin 4 of the connection line CON4 of the liquid crystal display.
CN202220253296.8U 2022-02-08 2022-02-08 Test circuit for oscillation frequency of inductive proximity sensor Active CN217587386U (en)

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CN202220253296.8U CN217587386U (en) 2022-02-08 2022-02-08 Test circuit for oscillation frequency of inductive proximity sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220253296.8U CN217587386U (en) 2022-02-08 2022-02-08 Test circuit for oscillation frequency of inductive proximity sensor

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CN217587386U true CN217587386U (en) 2022-10-14

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