CN217584930U - Outer protective machine case of semiconductor cooler heat dissipation - Google Patents
Outer protective machine case of semiconductor cooler heat dissipation Download PDFInfo
- Publication number
- CN217584930U CN217584930U CN202220433722.6U CN202220433722U CN217584930U CN 217584930 U CN217584930 U CN 217584930U CN 202220433722 U CN202220433722 U CN 202220433722U CN 217584930 U CN217584930 U CN 217584930U
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- Prior art keywords
- heat dissipation
- air
- body frame
- semiconductor
- semiconductor cooler
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 77
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 230000001681 protective effect Effects 0.000 title claims description 20
- 238000009434 installation Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
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Abstract
The utility model discloses a semiconductor refrigerator heat dissipation outer protection case, which relates to the technical field of semiconductor refrigerator cases and comprises a semiconductor refrigerator, wherein an outer protection case main body frame is wrapped outside the semiconductor refrigerator, auxiliary heat dissipation plates are arranged on two sides of the outer protection case main body frame, an air diversion guide box is arranged on the top of the outer protection case main body frame, and an air inlet assembly is arranged on the inner side of the top of the air diversion guide box; lead the box and the subassembly that admits air with the leading-in outer case body frame of outside air inboard through the air reposition of redundant personnel, when the heat that gives out semiconductor cooler blows off, can also cool down for semiconductor cooler, discharge the heat that semiconductor cooler was blown off from outer case body frame inboard fast through supplementary heating panel again simultaneously, improved radiating effect and efficiency greatly.
Description
Technical Field
The utility model relates to a semiconductor cooler machine case technical field specifically says a semiconductor cooler heat dissipation outer protective machine case.
Background
The semiconductor refrigerator is a device for preparing cold energy by utilizing the thermoelectric effect of a semiconductor, and is also called as a thermoelectric refrigerator, because the semiconductor refrigerator can keep stable operation only by fast heat dissipation when in use, most of structures of the semiconductor refrigerator are exposed outside in most occasions, so that the semiconductor refrigerator is convenient to dissipate heat, but after most of structures of the semiconductor refrigerator are exposed outside, the semiconductor refrigerator is easy to be damaged by external impact, the service life is shortened, and in order to avoid the situation, the use cost is reduced, and a case which is favorable for heat dissipation is arranged outside the semiconductor refrigerator;
however, it is found through analysis that most of the existing semiconductor refrigerator cases are provided with a large number of heat dissipation holes for passive heat dissipation, which results in low heat dissipation efficiency and effect efficiency.
SUMMERY OF THE UTILITY MODEL
Therefore, in order to solve the above-mentioned not enough, the utility model provides a semiconductor cooler heat dissipation outer protective case here, it is inboard with the leading-in outer protective case body frame of outside air through air diversion guide box and air inlet assembly, when the heat that gives out the semiconductor cooler blows off, can also cool down for the semiconductor cooler, and the heat that is blown off through the auxiliary heating panel with the semiconductor cooler is discharged from outer protective case body frame inboard fast again simultaneously, has improved radiating effect and efficiency greatly.
The utility model discloses a realize like this, construct a semiconductor cooler heat dissipation outer protective case, including the semiconductor cooler, the parcel has outer protective case main body frame in the semiconductor cooler outside, and outer protective case main body frame both sides are equipped with supplementary heating panel, and outer protective case main body frame installs at the top that the box is led in the air reposition of redundant personnel, and box top inboard is led in the air reposition of redundant personnel is equipped with the subassembly that admits air.
Further, supplementary heating panel is including the square through groove, the cross exhaust roller, the gear, brake motor, braking chamber and conveying cingulum, the square through groove top is located to the braking chamber, cross exhaust roller bottom is connected in the square through groove bottom through the bearing, the cross exhaust roller top passes the square through groove top through the bearing, it passes the part and gets into braking intracavity side, and the gear nestification gets into the part in braking chamber in cross exhaust roller top, the conveying cingulum twines in the gear outside, brake motor installs in braking chamber top, and brake motor bottom gets into braking intracavity side, brake motor's output shaft and a set of cross exhaust roller top are through shaft joint fixed connection.
Furthermore, the cross exhaust roller comprises a main shaft and a fan blade plate, and the fan blade plate is arranged on the outer side of the main shaft.
Further, the air shunting guide box comprises an arc-shaped cavity and an air guide pipe, and the air guide pipe is arranged at the bottom of the arc-shaped cavity.
Furthermore, the semiconductor refrigerator comprises a connecting plate, a semiconductor refrigeration piece, a radiating fin and a radiating fan, wherein one end of the semiconductor refrigeration piece is embedded into the inner side of the connecting plate, the radiating fin is arranged at the other end of the semiconductor refrigeration piece, and the radiating fan is arranged at one end of the radiating fin.
Furthermore, air inlet fans are arranged at two ends of the air inlet assembly, and a breathable net layer is arranged at one end of the outer protective box main body frame.
Compared with the prior art, the beneficial effects of the utility model embody: after the semiconductor refrigerator runs, the heat of the heat release end of the semiconductor refrigeration sheet is led out to the inner side of the outer protection box main body frame through the heat dissipation fins in the semiconductor refrigerator, then an air inlet fan external power supply in the air inlet assembly is switched on, air blown out after the air inlet fan runs enters an air guide pipe through the arc-shaped cavity bottom of the air diversion guide box, then the air is led out to the inner side of the outer protection box main body frame through the air guide pipe, and is blown to the top of the semiconductor refrigerator to cool the semiconductor refrigerator, the heat of the semiconductor refrigerator is blown out to the inner side of the main body frame, then the heat of the air blown out by the air inlet fan is discharged through the air guide pipe, the heat led out by the heat dissipation fins and the heat inside of the outer protection box main body frame are discharged through the air permeable net layer, meanwhile, the brake motor external power supply in the auxiliary heat dissipation plate is switched on, the brake motor drives the cross exhaust roller connected with the brake motor to rotate, after the cross exhaust roller connected with the brake motor rotates, the cross exhaust roller is pulled through gear meshing to drive the conveying toothed belt to rotate, the heat inside of the outer protection box main body frame through the fan blade plate, and the heat of the semiconductor refrigerator is discharged through the square through the auxiliary heat dissipation box, and the heat dissipation box main body frame, thereby greatly improving the heat dissipation efficiency of the semiconductor refrigerator.
Drawings
Fig. 1 is a schematic structural view of a heat dissipation outer protection case of a semiconductor refrigerator according to the present invention;
FIG. 2 is a schematic view of the semiconductor refrigerator of the present invention;
FIG. 3 is a schematic view of the structure of the auxiliary heat dissipation plate of the present invention;
FIG. 4 is an enlarged view of a portion of the gear of FIG. 3 according to the present invention;
FIG. 5 is a schematic structural view of the cross-shaped air exhausting roller of the present invention;
fig. 6 is a cross-sectional view of the air diversion box of the present invention.
In the figure: the air-cooling device comprises a semiconductor refrigerator 1, an outer protective box main body frame 2, an auxiliary heat dissipation plate 3, an air diversion guide box 4, an air inlet assembly 5, a connecting plate 11, a semiconductor refrigeration sheet 12, a heat dissipation fin 13, a heat dissipation fan 14, an air permeable net layer 21, a square through groove 31, a cross exhaust roller 32, a gear 33, a brake motor 34, a brake cavity 35, a conveying toothed belt 36, a main shaft 321, a fan blade plate 322, an arc-shaped cavity 41, an air guide pipe 42 and an air inlet fan 51.
Detailed Description
The present invention will be described in detail below with reference to the attached drawings, wherein the technical solutions in the embodiments of the present invention are clearly and completely described, and obviously, the described embodiments are only a part of the embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention; furthermore, the terms "first," "second," "third," "upper, lower, left, right," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Also, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. To those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific cases, and unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which the present invention belongs.
It is right to combine the specification attached drawing and concrete embodiment below the utility model discloses technical scheme does further elaboration, and the case is protected outward in semiconductor cooler heat dissipation that this application embodiment provided, including semiconductor cooler 1, case main body frame 2 is protected outward to semiconductor cooler 1 outside parcel, and 2 both sides of outer case main body frame are equipped with supplementary heating panel 3, and 2 tops of outer case main body frame are installed air distribution and are led box 4, and 4 top inboards of air distribution and lead box are equipped with air intake component 5.
Referring to fig. 3-4, the auxiliary heat dissipating plate 3 includes a square through groove 31, a cross air discharging roller 32, a gear 33, a brake motor 34, a brake chamber 35 and a transmission toothed belt 36, the brake chamber 35 is disposed on the top of the square through groove 31, the bottom of the cross air discharging roller 32 is connected to the bottom of the square through groove 31 through a bearing, the top of the cross air discharging roller 32 passes through the top of the square through groove 31 through a bearing, the part of the exhaust wheel penetrates into the inner side of a brake cavity 35, a gear 33 is nested on the part of the top of the cross exhaust roller 32 entering the brake cavity 35, a conveying toothed belt 36 is wound on the outer side of the gear 33, a brake motor 34 is installed at the top of the brake cavity 35, the bottom of the brake motor 34 enters the inner side of the brake cavity 35, and an output shaft of the brake motor 34 is fixedly connected with the tops of a group of cross exhaust rollers 32 through a coupling;
as an example, it should be noted that there are two sets of auxiliary heat dissipation plates 3, the brake motors 34 of the two sets of auxiliary heat dissipation plates 3 are connected in series, the brake motors 34 are connected with an external power supply, there are multiple sets of cross exhaust rollers 32, a gear 33 is fixed in a nesting manner on the portion of the top of each set of cross exhaust rollers 32 entering the inside of the brake cavity 35, a meshing rack is arranged on the side where the transmission toothed belt 36 contacts with the gear 33, and is meshed with the gear 33, and the square through groove 31 is communicated with the outer casing main body frame 2.
Referring to fig. 5, the cross-shaped exhaust roller 32 includes a main shaft 321 and a blade plate 322, the blade plate 322 is disposed outside the main shaft 321;
as an example, it should be noted that, when the external power supply of the brake motor 34 is turned on, the brake motor 34 drives the cross exhaust roller 32 connected thereto to rotate, after the cross exhaust roller 32 connected to the brake motor 34 rotates, the gear 33 is engaged to pull the conveying toothed belt 36 to drive the other cross exhaust rollers 32 to rotate, and after the cross exhaust roller 32 rotates, the fan blade plate 322 exhausts the heat inside the outer box main body frame 2.
Referring to fig. 6, the air diversion box 4 includes an arc-shaped cavity 41 and an air duct 42, the air duct 42 is disposed at the bottom of the arc-shaped cavity 41;
as an example, it should be noted that the top of the air duct 42 is communicated with the arc-shaped chamber 41, and the air duct 42 passes through the top plate of the outer box main body frame 2 and enters the inner side of the outer box main body frame 2.
Referring to fig. 2, the semiconductor refrigerator 1 includes a connecting plate 11, a semiconductor chilling plate 12, a heat dissipating fin 13 and a heat dissipating fan 14, wherein one end of the semiconductor chilling plate 12 is embedded inside the connecting plate 11, the heat dissipating fin 13 is installed at the other end of the semiconductor chilling plate 12, and the heat dissipating fan 14 is installed at one end of the heat dissipating fin 13;
as an example, it should be noted that, the heat absorbing end of the semiconductor refrigeration sheet 12 is embedded inside the connecting plate 11, the heat dissipating fins 13 are installed at the side portion of the heat dissipating end of the semiconductor refrigeration sheet 12, so as to facilitate the heat dissipation of the heat dissipating end of the semiconductor refrigeration sheet 12, the fin plates inside the heat dissipating fins 13 are vertically distributed, so that the gaps between every two adjacent fin plates are vertically distributed, so as to facilitate the air flow guided out by the air guiding pipe 42 to enter, the heat dissipating fan 14 is close to the end of the air permeable mesh layer 21 of the outer casing main body frame 2, and after the external power supply of the heat dissipating fan 14 is connected, the heat guided out by the heat dissipating fins 13 is discharged through the air permeable mesh layer 21.
Referring to fig. 1, the air inlet assembly 5 has air inlet fans 51 at two ends thereof, and the outer casing main frame 2 has a permeable mesh 21 at one end thereof;
as an example, it should be noted that the air outlet ends of the air inlet fans 51 at the two ends of the air inlet assembly 5 are embedded in the bottom of the arc-shaped cavity 41, the air inlet fans 51 are connected to an external power supply, air blown out by the air inlet fans 51 after operation enters the air duct 42 through the bottom of the arc-shaped cavity 41, then blows out air through the air duct 42 into the inner side of the outer protective casing main body frame 2, and blows out air at the top of the semiconductor refrigerator 1 to cool the semiconductor refrigerator 1, and the other end of the outer protective casing main body frame 2 is sealed by the connecting plate 11 of the semiconductor refrigerator 1.
The utility model discloses a theory of operation: after the semiconductor refrigerator 1 runs, heat at the heat release end of the semiconductor refrigeration sheet 12 is conducted out of the inner side of the outer protection box main body frame 2 through the heat dissipation fins 13, then an external power supply of the air inlet fan 51 is connected, air blown out after the air inlet fan 51 runs enters the air guide pipe 42 through the bottom of the arc-shaped cavity 41, then the air is conducted out of the inner side of the outer protection box main body frame 2 through the air guide pipe 42 and is blown to the top of the semiconductor refrigerator 1 to cool the semiconductor refrigerator 1, the heat of the semiconductor refrigerator 1 is blown out of the inner side of the main body frame 2, then the power supply of the heat dissipation fan 14 is connected, the heat conducted out by the heat dissipation fins 13 and the heat inside the outer protection box main body frame 2 are exhausted through the air permeable net layer 21, meanwhile, the external power supply of the brake motor 34 is connected, the cross exhaust roller 32 connected with the brake motor 34 is driven to rotate after the cross exhaust roller 32 connected with the brake motor 34 rotates, the transmission toothed belt 36 is pulled through meshing of the gear 33 to drive other cross exhaust rollers 32 to rotate, after the cross exhaust roller 32 rotates, the heat inside the outer protection box main body frame 2 is exhausted through the fan blade plate 322 through the square through the through groove 31 to assist in heat dissipation.
In conclusion; semiconductor cooler heat dissipation outer protective casing is inboard with the leading-in outer protective casing main body frame of outside air through air distribution guide box and the subassembly of admitting air, when the heat that gives out semiconductor cooler blows off, can also cool down for semiconductor cooler, discharges the heat that the semiconductor cooler was blown off from outer protective casing main body frame inboard fast through supplementary heating panel again simultaneously, has improved radiating effect and efficiency greatly.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein, and it is to be understood that various changes and modifications may be made by one of ordinary skill in the art without departing from the spirit and scope of the present application. Therefore, the protection scope of the present patent application shall be subject to the appended claims.
Claims (6)
1. The utility model provides a quick-witted case is protected in semiconductor cooler heat dissipation, includes semiconductor cooler (1), its characterized in that: semiconductor cooler (1) outside parcel has outer protecting case body frame (2), outer protecting case body frame (2) both sides are equipped with auxiliary heat dissipation board (3), and outer protecting case body frame (2) top installation air distribution leads box (4), air distribution leads box (4) top inboard and is equipped with air intake assembly (5).
2. The external protective case of semiconductor cooler heat dissipation of claim 1, characterized in that: auxiliary heat dissipation plate (3) are including square through groove (31), cross exhaust roller (32), gear (33), brake motor (34), braking chamber (35) and conveying cingulum (36), braking chamber (35) are located square through groove (31) top, cross exhaust roller (32) bottom is connected in square through groove (31) bottom through the bearing, and cross exhaust roller (32) top passes square through groove (31) top through the bearing, and it passes the part and gets into braking chamber (35) are inboard, just gear (33) nestification gets into the part in braking chamber (35) in cross exhaust roller (32) top, conveying cingulum (36) twine in gear (33) outside, brake motor (34) are installed in braking chamber (35) top, and brake motor (34) bottom gets into braking chamber (35) inboard, and the output shaft and a set of brake motor (34) cross exhaust roller (32) top pass through shaft connector fixed connection.
3. The outer machine case of outer protection of semiconductor cooler heat dissipation of claim 2, characterized in that: the cross exhaust roller (32) comprises a main shaft (321) and a fan blade plate (322), wherein the fan blade plate (322) is arranged on the outer side of the main shaft (321).
4. The external protective case of semiconductor cooler heat dissipation of claim 1, characterized in that: the air diversion guide box (4) comprises an arc-shaped cavity (41) and an air guide pipe (42), and the air guide pipe (42) is arranged at the bottom of the arc-shaped cavity (41).
5. The outer quick-witted case of semiconductor cooler heat dissipation of claim 1, characterized in that: the semiconductor refrigerator (1) comprises a connecting plate (11), semiconductor refrigerating pieces (12), radiating fins (13) and radiating fans (14), wherein one ends of the semiconductor refrigerating pieces (12) are embedded into the inner side of the connecting plate (11), the radiating fins (13) are installed at the other ends of the semiconductor refrigerating pieces (12), and the radiating fans (14) are installed at one ends of the radiating fins (13).
6. The external protective case of semiconductor cooler heat dissipation of claim 1, characterized in that: air inlet fans (51) are arranged at two ends of the air inlet assembly (5), and a breathable net layer (21) is arranged at one end of the outer protective box main body frame (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220433722.6U CN217584930U (en) | 2022-03-02 | 2022-03-02 | Outer protective machine case of semiconductor cooler heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220433722.6U CN217584930U (en) | 2022-03-02 | 2022-03-02 | Outer protective machine case of semiconductor cooler heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217584930U true CN217584930U (en) | 2022-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220433722.6U Expired - Fee Related CN217584930U (en) | 2022-03-02 | 2022-03-02 | Outer protective machine case of semiconductor cooler heat dissipation |
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| Country | Link |
|---|---|
| CN (1) | CN217584930U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115782558A (en) * | 2022-12-16 | 2023-03-14 | 广东天太机器人有限公司 | Walking unit |
-
2022
- 2022-03-02 CN CN202220433722.6U patent/CN217584930U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115782558A (en) * | 2022-12-16 | 2023-03-14 | 广东天太机器人有限公司 | Walking unit |
| CN115782558B (en) * | 2022-12-16 | 2024-03-12 | 广东天太机器人有限公司 | Walking unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221014 |
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| CF01 | Termination of patent right due to non-payment of annual fee |