CN217570768U - Medical instrument part forming die - Google Patents
Medical instrument part forming die Download PDFInfo
- Publication number
- CN217570768U CN217570768U CN202220076355.9U CN202220076355U CN217570768U CN 217570768 U CN217570768 U CN 217570768U CN 202220076355 U CN202220076355 U CN 202220076355U CN 217570768 U CN217570768 U CN 217570768U
- Authority
- CN
- China
- Prior art keywords
- mould
- heat
- liquid storage
- heat conduction
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000007788 liquid Substances 0.000 claims abstract description 84
- 239000002826 coolant Substances 0.000 claims abstract description 25
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims 1
- 238000002309 gasification Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000004064 recycling Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Abstract
The utility model relates to a medical instrument part forming die, which comprises a die, the bottom fixedly connected with reservoir of mould, the reservoir intussuseption is filled with the coolant liquid, be equipped with heat conduction assembly in the mould, heat conduction assembly will heat in the mould is leading-in the coolant liquid. The utility model relates to a technical field of mould. The utility model discloses heat-conducting component heats the coolant liquid in the coolant liquid with the leading-in reservoir of each partial heat in the mould even when using the mould, coolant liquid temperature rise gasification is cooled down the mould through heat-conducting component, the gasified coolant liquid gets into and liquefies into liquid flow back to and is recycled in the reservoir again among the backward flow subassembly, the temperature can not be too high when making the mould use, the part size that the mould can not be heated the inflation and lead to the mould to produce produces the deviation, can not increase the processing degree of difficulty in part later stage, staff's intensity of labour has been reduced.
Description
Technical Field
The utility model belongs to the technical field of the technique of mould and specifically relates to a medical instrument part forming die is related to.
Background
The mould is used for making the tool of the shaping article, this kind of tool is formed by various parts, different moulds are formed by different parts, it mainly realizes the processing of the article appearance through the change of the physical state of the shaping material, it is the name of the mother in industry.
When the mould used, because the mould is made for metal material, thereby the mould high temperature can be heated the thermal expansion and lead to the recess in the mould to produce the dimensional deviation, finally lead to the part size of producing to produce the deviation, increased the processing degree of difficulty in part later stage, increased staff's intensity of labour.
SUMMERY OF THE UTILITY MODEL
According to the deficiencies in the prior art, the utility model aims at providing a medical instrument part forming die has the effect that reduces staff intensity of labour.
The above technical purpose of the present invention can be achieved by the following technical solutions:
the utility model provides a medical instrument part forming die, includes the mould, the bottom fixedly connected with reservoir of mould, the reservoir intussuseption is filled with the coolant liquid, be equipped with heat conduction assembly in the mould, heat conduction assembly will heat in the mould is leading-in the coolant liquid, the top of reservoir is equipped with the backward flow subassembly, the backward flow subassembly will gasify the coolant liquid is turned back to liquid again.
Through adopting above-mentioned technical scheme, heat conduction component heats the coolant liquid in the coolant liquid with the leading-in reservoir of each part heat in the mould when using the mould, coolant liquid temperature rising gasification is cooled down the mould through heat conduction component, the gasified coolant liquid gets into and liquefies into liquid flow back to the reservoir in the backward flow subassembly again and recycles, make the mould temperature can not be too high when using, the mould can not be heated the part size that the inflation leads to the mould to produce and produce the deviation, can not increase the processing degree of difficulty in part later stage, staff's intensity of labour has been reduced.
The present invention in a preferred embodiment can be further configured to: the heat conduction assembly comprises a heat conduction plate and a plurality of heat conduction rods, the heat conduction plate is located in the mold, the top end of each heat conduction rod is fixedly connected with the bottom end of the heat conduction plate, the other end of each heat conduction rod extends to the outside of the mold and is inserted into the liquid storage tank, and each heat conduction rod is fixedly connected with the mold and the liquid storage tank.
Through adopting above-mentioned technical scheme, when the mould used, the heat-conducting plate absorbed the heat in the mould to in a plurality of coolant liquids by the leading-in reservoir of heat-conducting rod, the heat-conducting plate had increased heat-conducting rod in to the mould thermal absorption rate, had made things convenient for the mould to conduct the heat into the coolant liquid.
The present invention in a preferred embodiment can be further configured to: the backflow assembly comprises a liquid storage ring, the inner wall of the liquid storage ring is fixedly connected with the outer peripheral wall of the mold, a ring pipe is arranged in the liquid storage ring, two guide pipes penetrate through the bottom end of the ring pipe relatively, the bottom end of each guide pipe penetrates through the ring wall of the liquid storage ring and extends into the liquid storage ring, each guide pipe is fixedly connected with the liquid storage ring, the liquid storage ring and the ring pipe, joints penetrate through the two opposite ends of the outer peripheral wall of the liquid storage ring, and each joint is fixedly connected with the liquid storage ring.
By adopting the technical scheme, the gasified cooling liquid enters the annular pipe through the guide pipe, the gasified cooling liquid is in contact with the pipe wall of the annular pipe to increase the heat of the annular pipe, meanwhile, the heat of the annular pipe is taken away by the water flow flowing through the two joints in the liquid storage ring, the gasified cooling liquid is condensed into water drops of the cooling liquid on the inner wall of the annular pipe and flows back to the liquid storage tank through the guide pipe for recycling, and the loss of the gasified cooling liquid is avoided.
The present invention may be further configured in a preferred embodiment as: the heat-conducting plates are arranged in a net shape and are distributed around the die groove.
By adopting the technical scheme, the heat conducting plate arranged in a net shape can increase the contact area between the heat conducting plate and the die, and the absorption rate of the heat conducting plate to the heat of the die is increased.
The present invention may be further configured in a preferred embodiment as: a plurality of heating panels are fixedly connected to the peripheral wall of the heat conducting rod, and each heating panel is located in the liquid storage tank.
Through adopting above-mentioned technical scheme, increase the area of contact of heat conduction pole and coolant liquid through the heating panel, made things convenient for the heat on the heat conduction pole to give off in the coolant liquid.
To sum up, the utility model discloses a following at least one useful technological effect:
1. when the mold is used, the heat conduction assembly uniformly guides heat of all parts in the mold into the cooling liquid in the liquid storage tank to heat the cooling liquid, the temperature of the cooling liquid is increased and gasified, the cooling liquid is cooled by the heat conduction assembly, the gasified cooling liquid enters the backflow assembly to be liquefied again into liquid, and the liquid flows back to the liquid storage tank for recycling, so that the temperature of the mold is not too high when the mold is used, the size of a part produced by the mold cannot be deviated due to thermal expansion of the mold, the processing difficulty of the part in the later period is not increased, and the labor intensity of workers is reduced;
2. the gasified cooling liquid enters the annular pipe through the guide pipe and contacts with the pipe wall of the annular pipe to increase the heat of the annular pipe, and meanwhile, the heat of the annular pipe is taken away by water flow flowing through the two joints in the liquid storage ring, so that the gasified cooling liquid is condensed into water drops of the cooling liquid on the inner wall of the annular pipe and flows back to the liquid storage tank through the guide pipe for recycling, and the loss of the gasified cooling liquid is avoided.
Drawings
FIG. 1 is a schematic view of the overall structure of the present embodiment;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
fig. 3 is a schematic view of the mounting structure of the heat dissipating plate in fig. 1 according to the present embodiment.
In the figure, 1, a mold; 2. a liquid storage tank; 3. cooling liquid; 4. a heat conducting component; 41. a heat conducting plate; 42. a heat conducting rod; 43. a heat dissipation plate; 5. a cooling assembly; 51. a liquid storage ring; 52. a ring pipe; 53. a conduit; 54. and (4) a joint.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example (b):
referring to fig. 1-3, the utility model discloses a medical instrument part forming die, including mould 1, the bottom fixedly connected with reservoir 2 of mould 1, the intussuseption of reservoir 2 is filled with coolant liquid 3, and coolant liquid 3 is not full of reservoir 2, is equipped with heat-conducting component 4 in the mould 1, and heat-conducting component 4 is with in the leading-in coolant liquid 3 of heat in the mould 1. The heat conducting component 4 comprises a heat conducting plate 41 and a plurality of heat conducting rods 42, the heat conducting plate 41 is located in the mold 1, and the top end of each heat conducting rod 42 is fixedly connected with the bottom end of the heat conducting plate 41. The heat conducting plates 41 are arranged in a net shape, and the heat conducting plates 41 are distributed around the groove of the mold 1. The heat conductive plate 41 disposed in a mesh shape can increase the contact area of the heat conductive plate 41 with the mold 1.
The other end of each heat conduction rod 42 extends out of the mold 1 and is inserted into the liquid storage tank 2, each heat conduction rod 42 is fixedly connected with the mold 1 and the liquid storage tank 2, and the bottom end of each heat conduction rod 42 is inserted into the cooling liquid 3. A plurality of heat dissipation plates 43 are fixedly connected to the outer peripheral wall of the heat conduction rod 42, each heat dissipation plate 43 is located in the liquid storage tank 2, and the plurality of heat dissipation plates 43 are uniformly distributed on the outer peripheral wall of the heat conduction rod 42. The contact area of the heat conduction rod 42 with the coolant 3 is increased by the heat radiation plate 43, and the rate at which the heat conduction rod 42 radiates heat into the coolant 3 is increased.
When the mold 1 is used, the heat conducting plate 41 absorbs heat in the mold 1, and a plurality of cooling liquids 3 are guided into the liquid storage tank 2 by the heat conducting rod 42, and the heat conducting plate 41 increases the absorption rate of the heat conducting rod 42 to the heat in the mold 1.
The top end of the reservoir 2 is provided with a return assembly which re-converts the vaporized cooling liquid 3 back into liquid. The backflow assembly comprises a liquid storage ring 51, the inner wall of the liquid storage ring 51 is fixedly connected with the outer peripheral wall of the mold 1, a ring pipe 52 is arranged in the liquid storage ring 51, two guide pipes 53 penetrate through the bottom end of the ring pipe 52 relatively, the bottom end of each guide pipe 53 penetrates through the ring wall of the liquid storage ring 51 and extends into the liquid storage tank 2, each guide pipe 53 is fixedly connected with the liquid storage tank 2, the liquid storage ring 51 and the ring pipe 52, joints 54 are arranged at two opposite ends of the outer peripheral wall of the liquid storage ring 51 respectively in a penetrating mode, and each joint 54 is fixedly connected with the liquid storage ring 51. The gasified cooling liquid 3 enters the loop pipe 52 through a conduit 53, contacts with the pipe wall of the loop pipe 52 to increase the heat of the loop pipe 52, and meanwhile, the water flowing in the liquid storage ring 51 through two connectors 54 carries away the heat of the loop pipe 52, so that the gasified cooling liquid 3 is condensed into water drops of the cooling liquid 3 on the inner wall of the loop pipe 52 and flows back to the liquid storage tank 2 through the conduit 53 for recycling.
When the mold 1 is used, the heat conducting component 4 uniformly heats the cooling liquid 3 in the liquid storage tank 2, which guides heat of each part in the mold 1 into the cooling liquid 3, the temperature of the cooling liquid 3 is increased and gasified, the mold 1 is cooled through the heat conducting component 4, the gasified cooling liquid 3 enters the backflow component and is liquefied again into liquid to flow back to the liquid storage tank 2 for recycling, the temperature of the mold 1 is not too high when the mold 1 is used, and the mold 1 cannot be heated and expanded to cause the size deviation of parts produced by the mold 1.
The implementation principle of the above embodiment is as follows: when the device is used, the mould 1 is arranged at a proper position and then the water inlet pipe and the water outlet pipe are connected to each joint 54, when the mould 1 is used, the temperature of the mould 1 rises along with the injection of the metal solution into the groove of the mould 1, the heat conducting plate 41 absorbs the heat in the mould 1 and conducts the heat into the heat conducting rod 42, then the heat is conducted into the cooling liquid 3 through the heat radiating plate 43, the cooling liquid 3 is heated, partially cooled and gasified, the gasified cooling liquid 3 rises and enters the loop pipe 52 through the conduit 53, the gasified cooling liquid contacts with the pipe wall of the loop pipe 52 to increase the heat of the loop pipe 52, meanwhile, the water flowing through the two joints 54 in the liquid storage ring 51 takes away the heat of the loop pipe 52, the gasified cooling liquid 3 is condensed into the liquid cooling liquid 3 on the inner wall of the loop pipe 52 and flows back to the liquid storage tank 2 through the conduit 53 for circulation, and finally the heat in the mould 1 is taken away through the evaporation of the cooling liquid 3, so that the temperature of the mould 1 is kept in a certain range.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (5)
1. The utility model provides a medical instrument part forming die, includes mould (1), its characterized in that: the bottom fixedly connected with reservoir (2) of mould (1), the intussuseption of reservoir (2) is filled with coolant liquid (3), be equipped with heat conduction subassembly (4) in mould (1), heat conduction subassembly (4) will heat in the mould (1) is leading-in coolant liquid (3), the top of reservoir (2) is equipped with backward flow subassembly (5), backward flow subassembly (5) will gasify coolant liquid (3) become liquid again.
2. The medical device part forming die as claimed in claim 1, wherein: the heat conduction assembly (4) comprises a heat conduction plate (41) and a plurality of heat conduction rods (42), the heat conduction plate (41) is located in the mold (1), the top end of each heat conduction rod (42) is fixedly connected with the bottom end of the heat conduction plate (41), the other end of each heat conduction rod (42) extends out of the mold (1) and is inserted into the liquid storage tank (2), and each heat conduction rod (42) is fixedly connected with the mold (1) and the liquid storage tank (2).
3. The medical device part forming die as claimed in claim 1, wherein: the backflow component (5) comprises a liquid storage ring (51), the inner wall of the liquid storage ring (51) is fixedly connected with the outer peripheral wall of the mold (1), a circular pipe (52) is arranged in the liquid storage ring (51), two guide pipes (53) penetrate through the bottom end of the circular pipe (52) relatively, the bottom end of each guide pipe (53) penetrates through the circular wall of the liquid storage ring (51) and extends into the liquid storage tank (2), each guide pipe (53) is fixedly connected with the liquid storage tank (2), the liquid storage ring (51) and the circular pipe (52), connectors (54) penetrate through the two opposite ends of the outer peripheral wall of the liquid storage ring (51), and each connector (54) is fixedly connected with the liquid storage ring (51).
4. The medical device part forming die as claimed in claim 2, wherein: the heat conducting plates (41) are arranged in a net shape, and the heat conducting plates (41) are distributed around the grooves of the die (1).
5. The medical device part molding die according to claim 2, wherein: a plurality of heating panels (43) are fixedly connected to the peripheral wall of the heat conducting rod (42), and each heating panel (43) is located in the liquid storage tank (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220076355.9U CN217570768U (en) | 2022-01-13 | 2022-01-13 | Medical instrument part forming die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220076355.9U CN217570768U (en) | 2022-01-13 | 2022-01-13 | Medical instrument part forming die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217570768U true CN217570768U (en) | 2022-10-14 |
Family
ID=83536585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220076355.9U Expired - Fee Related CN217570768U (en) | 2022-01-13 | 2022-01-13 | Medical instrument part forming die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217570768U (en) |
-
2022
- 2022-01-13 CN CN202220076355.9U patent/CN217570768U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221014 |