CN217563774U

CN217563774U - Shock-absorbing structure and electronic equipment

Info

Publication number: CN217563774U
Application number: CN202221579833.4U
Authority: CN
Inventors: 何可辉; 高飞
Original assignee: Insta360 Innovation Technology Co Ltd
Current assignee: Insta360 Innovation Technology Co Ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-10-11
Anticipated expiration: 2032-06-22

Abstract

The embodiment of the utility model provides a relate to electronic equipment technical field, especially disclose a shock-absorbing structure and electronic equipment, shock-absorbing structure includes: the buffer piece comprises a buffer surface and a buffer bulge, the buffer bulge is arranged on the buffer surface, the buffer piece is provided with a through hole, and the through hole penetrates through the buffer surface; the fastener is arranged in the buffer part in a penetrating way and is connected with the shell. The buffering bulge is arranged on the buffering surface, so that the contact area between the end surface of the buffering part and the shell and the contact area between the end surface of the buffering part and the fastening part can be reduced. When the buffer piece is subjected to external force, the buffer piece can be fully deformed so as to realize the damping effect. The fastener is arranged in the buffer piece in a penetrating mode and connected with the shell, and therefore the loudspeaker can be fixedly installed. The shock absorption and buffering of the shock absorption structure can solve the frequency response caused by high-frequency vibration of the loudspeaker, so that the problems of signal extraction and whole machine shaking are avoided.

Description

Shock-absorbing structure and electronic equipment

Technical Field

The embodiment of the utility model provides a relate to electronic equipment technical field, especially relate to a shock-absorbing structure and electronic equipment.

Background

The horn is also called a loudspeaker, is a commonly used electroacoustic transducer, is used for amplifying sound, and is widely applied to various fields such as conference sets, televisions, flat panels, notebooks, automobiles and the like. In the process of implementing the embodiment of the present invention, the inventor finds: the loudspeaker can produce the frequency response when high frequency shakes, and signal back production and complete machine rock problem can appear in the frequency response.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a main technical problem who solves provides a shock-absorbing structure and electronic equipment to solve the problem that the speaker can produce the frequency response when high frequency vibrations.

In order to solve the technical problem, the utility model discloses a technical scheme be: there is provided a vibration-damping structure for reducing vibration caused by a speaker and connecting the speaker to an electronic device case, the speaker including a connecting portion provided with an opening, the vibration-damping structure comprising:

the buffer piece is clamped in the opening and comprises a buffer surface and a buffer bulge, the buffer bulge is arranged on the buffer surface, and the buffer piece is provided with a through hole which penetrates through the buffer surface;

the fastener is arranged in the buffer part in a penetrating mode and connected with the shell.

Optionally, the buffer member is provided with a buffer convex strip, and the buffer convex strip is arranged on the inner circumferential surface of the through hole.

Optionally, the buffering face includes first buffering face and the second buffering face that sets up mutually back to back, the bellied quantity of buffering is a plurality of, and is a plurality of the buffering is protruding set up in first buffering face with on the second buffering face.

Optionally, the buffering protrusion is annular, and the buffering protrusion surrounds the through hole.

Optionally, the buffer member is made of silica gel.

According to an aspect of the embodiments of the present invention, there is provided an electronic apparatus, including: the loudspeaker comprises a body and a connecting part, wherein the connecting part is arranged in a protruding mode on the body and is provided with an opening; the speaker is connected to the housing through the shock-absorbing structure.

Optionally, the housing is provided with an accommodating cavity, the speaker and the damping structure are arranged in the accommodating cavity, the electronic device further comprises a counterweight damping member, and the counterweight damping member is arranged in the accommodating cavity and connected to the housing.

Optionally, the buffer is in interference fit with the opening.

Optionally, the damping structure includes a plurality of dampers and a plurality of fasteners for firmly connecting the speaker to the housing.

Optionally, the electronic device further includes a shock absorbing member, and the shock absorbing member is disposed between the housing and the speaker.

The embodiment of the utility model provides a beneficial effect is: the first buffering face and the second buffering face of shock-absorbing structure's bolster all are provided with buffering arch, can reduce the area of contact of the terminal surface of bolster and shell, fastener, consequently, receive external force when the bolster, and the abundant deformation that takes place to realize the cushioning effect. The fastener is arranged on the buffer piece in a penetrating mode and connected with the shell, and therefore the loudspeaker can be fixedly installed. The shock absorption and buffering of the shock absorption structure can solve the frequency response caused by high-frequency vibration of the loudspeaker, so that the problems of signal extraction and whole machine shaking are avoided.

An opening is arranged on the connecting part of the loudspeaker of the electronic equipment, and the buffer piece is arranged in the opening. The fastener is arranged in the opening in a penetrating mode and is connected with the shell, and therefore the loudspeaker is fixedly installed. Because the loudspeaker of the electronic equipment is arranged on the shell through the damping structure, the electronic equipment with the damping structure can solve the frequency response caused by high-frequency vibration of the loudspeaker so as to avoid the problems of signal back-extraction and whole machine shaking.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Fig. 1 is a perspective view of a buffer according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of an electronic device according to an embodiment of the present invention;

FIG. 3 is an enlarged schematic view of portion A of FIG. 2;

fig. 4 is another cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 5 is an enlarged schematic view of a portion B in fig. 4.

The reference numbers in the detailed description are as follows:

100. a shock-absorbing structure; 11. a buffer member; 110. a buffer surface; 111. a first buffer surface; 112. a second buffer surface; 113. a buffer protrusion; 114. a through hole; 115. buffering the convex strips; 12. a fastener;

200. an electronic device; 21. a speaker; 211. a body; 212. a connecting portion; 22. a housing; 23. a counterweight shock absorber; 24. a shock absorbing member.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, an embodiment of the present invention provides a shock absorbing structure 100, wherein the shock absorbing structure 100 is used for reducing the shock caused by the speaker 21 and simultaneously connecting the speaker 21 to the housing 22 of the electronic device 200. The speaker 21 includes a body 211 for emitting sound and a connection portion 212 protruding from the body 211, and the connection portion 212 is provided with an opening (not shown).

Referring to fig. 1 and 3, the shock-absorbing structure 100 includes: a cushioning member 11 and a fastener 12. The cushioning material 11 is substantially block-shaped, and is engaged with the opening of the connecting portion 212, and since the cushioning material 11 absorbs shock by being deformed, the cushioning material 11 is deformed to be fitted into the opening of the connecting portion 212. The buffer member 11 includes a buffer surface 110, and the buffer surface 110 includes a first buffer surface 111 and a second buffer surface 112 opposite to each other, that is, the first buffer surface 111 and the second buffer surface 112 are opposite to each other. The buffer member 11 further includes a buffer protrusion 113 disposed on the buffer surface 110, that is, the buffer protrusion 113 is disposed on each of the first buffer surface 111 and the second buffer surface 112. Since the buffering protrusion 113 protrudes from the first buffering surface 111 or the second buffering surface 112, the contact area between the end surface of the buffering member 11 and the housing and the fastening member 12 can be reduced, and thus, when the buffering member 11 receives an external force, the buffering member can be deformed sufficiently to achieve a shock absorbing effect. The buffer member 11 is further provided with a through hole 114 for mounting the fastener 12, and both axial ends of the through hole 114 respectively penetrate through the first buffer surface 111 and the second buffer surface 112. The fastening member 12 is inserted into the through hole 114 of the buffer member 11 and connected to the housing 22 to fix the speaker 21.

In the present embodiment, the fastener 12 is a screw. In other embodiments, the fasteners 12 may also be bolts or rivets.

Referring to fig. 1, in some embodiments, the buffer member 11 is provided with a buffer rib 115, and the buffer rib 115 is disposed on an inner circumferential surface of the through hole 114 of the buffer member 11 and extends along an axis of the through hole 114. The buffering convex strip 115 is arranged on the inner circumferential surface of the through hole 114, so that the radial section of the buffering member 11 can be in a quincunx shape, the contact area between the buffering member 11 and the fastening member 12 can be reduced, and therefore, the buffering member 11 can be fully deformed after being acted by external force to realize the damping effect.

The shock-absorbing structure 100 may include a plurality of buffers 11 and fasteners 12 to further fix the speaker 21. In this embodiment, the damping structure 100 includes four buffering members 11 and fasteners 12 adapted to the buffering members 11, and the four buffering members 11 are respectively disposed at four corners of the speaker 21. In other embodiments, the number of the shock absorbing structure 100 including the shock absorbing members 11 and the fastening members 12 can be flexibly set according to actual situations, so as to achieve the function of stably fixing the speaker 21 to the housing 22, and the specific number is not limited.

Referring to fig. 1 and 3, in some embodiments, a plurality of buffering protrusions 113 are provided, and the plurality of buffering protrusions 113 are provided on the first buffering surface 111 and the second buffering surface 112, that is, the plurality of buffering protrusions 113 are provided on both the first buffering surface 111 and the second buffering surface 112, so as to further reduce the contact area between the buffering member 11 and the housing, and the fastening member 12.

In an embodiment, the plurality of buffering protrusions 113 on the first buffering surface 111 and/or the second buffering surface 112 are uniformly arranged, and the uniform arrangement may be parallel arrangement or cross arrangement at a fixed angle with each other. The buffer protrusions 113 are uniformly arranged, so that the contact surface between the first buffer surface 111 or the second buffer surface 112 and the shell is relatively flat, and the buffer member 11 can be prevented from shaking due to the uneven contact surface.

In some embodiments, the buffering protrusion 113 is annular, that is, the buffering protrusion 113 is disposed around the through hole 114, when the fastening member 12 presses the buffering member 11, the force applied to the buffering member 11 is uniform, so that the buffering member 11 is not easily deformed and displaced due to local force application, and the buffering and damping effects of the buffering member 11 are not affected.

Referring to fig. 1, in some embodiments, the buffer 11 is made of a silicon rubber, and since the silicon rubber is soft, the buffer 11 of the buffer 11 made of a silicon rubber has a strong elasticity and can be deformed sufficiently after being stressed, so as to perform the shock absorption and buffering functions. In some embodiments, the material of the buffer member 11 is not limited to silicone, and for example, the material of the buffer member 11 may also be rubber, resin, or other material with certain elasticity.

To sum up, the utility model provides a shock-absorbing structure 100, all be provided with buffering arch 113 on the first buffering face 111 and the second buffering face 112 of shock-absorbing structure 100's bolster 11, can reduce the area of contact of the terminal surface of bolster 11 and shell, fastener 12, consequently, after bolster 11 received external force, can fully take place deformation to realize the cushioning effect. The fastener 12 is inserted through the buffer 11 and connected with the housing 22 to realize the fixed installation of the speaker 21. The shock absorption and buffering of the shock absorbing structure 100 can solve the frequency response caused by the high frequency vibration of the loudspeaker 21, so as to avoid the problems of signal extraction and overall machine shaking.

Referring to fig. 1 to fig. 5, an embodiment of the present invention further provides an electronic device 200, in this embodiment, the electronic device 200 may be a video conference machine with a speaker function, and the electronic device 200 includes: speaker 21, the above-mentioned shock absorbing structure 100 and housing 22. Specifically, the speaker 21 includes a body 211 for emitting sound and a connection portion 212 protruding from the body 211, the connection portion 212 being provided with an opening. The housing 22 is used to provide a space for the speaker 21 and the shock absorbing structure 100. The speaker 21 is connected to the housing 22 through the shock absorbing structure 100, specifically, the buffer member 11 of the shock absorbing structure 100 is installed at the opening of the connecting portion 212 of the speaker 21, and the fastening member 12 of the shock absorbing structure 100 is inserted into the buffer member 11 and connected to the housing 22, so that the speaker 21 can be installed to the housing 22 through the shock absorbing structure 100. Since the damper mechanism has a shock-absorbing and cushioning function, and the speaker 21 is mounted to the housing 22 through the damper structure 100, the damper mechanism can absorb a part of the shock generated by the speaker 21. The electronic device 200 can solve the frequency response caused by the high-frequency vibration of the loudspeaker 21, so as to avoid the problems of signal extraction and whole machine shaking.

Referring to fig. 2 and 3, in some embodiments, the housing 22 is provided with a receiving cavity, which provides an installation space for the speaker 21 and the shock-absorbing structure 100, and the speaker 21 and the shock-absorbing structure 100 are disposed in the receiving cavity.

Referring to fig. 2 and 3, the electronic device 200 further includes a weight damping member 23 disposed in the accommodating cavity, and the weight damping member 23 may be made of a metal material, has a certain weight, and is connected to the housing 22 to increase the weight of the whole device, so as to prevent the speaker 21 from resonating with other components.

Referring to fig. 3 and 5, in some embodiments, the buffer member 11 is in interference fit with the opening of the connecting portion 212 of the speaker 21, specifically, the size of the buffer member 11 is slightly larger than the size of the opening, and since the buffer member 11 has certain elasticity, when the buffer member 11 is installed, the buffer member 11 can be installed in the opening by pressing the buffer member 11, and the buffer member 11 cannot fall off by itself when the buffer member 11 is installed in the opening.

Referring to fig. 5, in some embodiments, the electronic device 200 further includes a shock absorbing member 24, the shock absorbing member 24 may be a shock absorbing foam, and the shock absorbing member 24 is disposed between the housing 22 and the speaker 21. As the shock absorption foam is loose and porous, the shock absorption foam also has the shock absorption and buffering functions. The shock absorption foam can play a role in fixing the loudspeaker 21 and reducing the vibration of the loudspeaker 21, and can also play a role in sound insulation and prevent the sound emitted by the loudspeaker 21 from being transmitted inside the electronic equipment 200.

To sum up, the utility model provides an electronic equipment 200 is equipped with the opening on the connecting portion 212 of electronic equipment 200's speaker 21, and bolster 11 sets up in the opening. The fastening member 12 is inserted through the buffer member 11 and connected to the housing 22 to achieve the fixed installation of the speaker 21. Since the speaker 21 of the electronic device 200 is mounted on the housing 22 through the shock absorbing structure 100, the electronic device 200 with the shock absorbing structure 100 can solve the frequency response caused by the high-frequency vibration of the speaker 21, so as to avoid the problems of signal extraction and overall shaking.

It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims

1. A shock-absorbing structure for reducing vibrations caused by a speaker and connecting the speaker to an electronic device case, the speaker including a connecting portion provided with an opening, comprising:

the buffer piece is clamped in the opening and comprises a buffer surface and a buffer bulge, the buffer bulge is arranged on the buffer surface, the buffer piece is provided with a through hole, and the through hole penetrates through the buffer surface;

2. The structure according to claim 1, wherein the buffer member is provided with a buffer rib provided on an inner peripheral surface of the through hole.

3. The shock-absorbing structure according to claim 1, wherein the buffering surface comprises a first buffering surface and a second buffering surface which are opposite to each other, the number of the buffering protrusions is plural, and the plural buffering protrusions are uniformly arranged on the first buffering surface and the second buffering surface.

4. The shock-absorbing structure according to claim 1, wherein said buffer protrusion is ring-shaped, and said buffer protrusion is provided around said through hole.

5. The shock-absorbing structure of claim 1, wherein the buffer member is made of silicone.

6. An electronic device, comprising:

the loudspeaker comprises a body and a connecting part, wherein the connecting part is arranged to protrude out of the body and is provided with an opening;

the shock-absorbing structure as set forth in any one of claims 1 to 5;

a housing, the speaker being connected to the housing through the shock-absorbing structure.

7. The electronic device of claim 6, wherein the housing has a receiving cavity, the speaker and the damping structure are disposed in the receiving cavity, and the electronic device further comprises a weight damping member disposed in the receiving cavity and connected to the housing.

8. The electronic device of claim 6, wherein the buffer has an interference fit with the opening.

9. The electronic device of claim 6, wherein the shock absorbing structure comprises a plurality of shock absorbers and a plurality of fasteners for securely connecting the speaker to the housing.

10. The electronic device of claim 6, further comprising a shock absorber disposed between the housing and the speaker.