CN217546618U - Heat dissipation device, electronic equipment and protection device of electronic equipment - Google Patents

Abstract

The application discloses heat abstractor, electronic equipment and electronic equipment's protection device, heat abstractor includes: a phase change heat storage plate; the loop heat pipe is arranged on one surface of the phase change heat storage plate; the thermoelectric generator membrane is arranged on one surface of the phase change heat storage plate, which is far away from the loop heat pipe, and a plurality of P/N junctions of the thermoelectric generator membrane are arranged along the arrangement direction of the hot end and the cold end. This application is through combining the loop heat pipe, phase change heat storage plate and thermoelectric generator membrane, utilize the loop heat pipe to circulate the heat transfer, utilize phase change heat storage plate to maintain stable intensification and heat dissipation, in order to guarantee the invariable difference in temperature in thermoelectric generator membrane both ends, make thermoelectric generator membrane can be in the duration of electric energy in order to be used for electronic equipment with the heat transformation under the effect of stabilizing the difference in temperature, when promoting electronic equipment radiating effect, can also promote electronic equipment's duration, and accord with frivolous user demand.

Description

Heat dissipation device, electronic equipment and protection device of electronic equipment

Technical Field

The application belongs to the technical field of electronics, and in particular relates to a heat dissipation device, electronic equipment and a protection device of the electronic equipment.

Background

With the gradual development of the 5G era, the power consumption of the heat dissipation device is increased by times, which causes severe heating problem. In the related technology, the heat dissipation method of the heat dissipation device mainly adopts a combination mode of a common heat pipe, a vapor chamber, a multilayer graphite PGS and heat-conducting gel to realize the vapor chamber effect; or the heat dissipation is enhanced by using external devices such as a heat dissipation protective sleeve, a heat dissipation back clip and the like; in addition, in order to improve the endurance of the heat dissipation device to meet the power consumption requirement, the endurance is mainly improved by increasing the battery capacity in the related art. The applicant has found that at least the following problems exist in the prior art: the existing heat dissipation effect is not good and cannot be further improved; and the heat dissipation device is limited by the design requirement of lightness and thinness of the terminal, and the endurance of the heat dissipation device is not good.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present invention provides a heat dissipation apparatus, an electronic device, and a protection apparatus for the electronic device, which at least solve one of the problems of poor heat dissipation effect and poor endurance of the electronic device.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a heat dissipation device, including:

a phase change heat storage plate;

the loop heat pipe is arranged on one surface of the phase change heat storage plate, the hot end of the loop heat pipe is arranged at one end, close to the heat source, of the heat dissipation device, and the cold end of the loop heat pipe is arranged at one end, far away from the heat source, of the heat dissipation device;

the thermoelectric generator membrane is arranged on one surface of the phase change heat storage plate, which is far away from the loop heat pipe, and a plurality of P/N junctions of the thermoelectric generator membrane are arranged along the arrangement directions of the hot end and the cold end.

In a second aspect, an embodiment of the present application provides an electronic device, including:

the heat dissipating device of the first aspect;

the display screen is arranged on one surface of the heat dissipation device close to the thermoelectric generator film;

the outer frame is arranged around the periphery of the display screen in a surrounding manner;

the circuit board is arranged on one surface of the heat dissipation device close to the loop heat pipe;

the first shell is arranged on one surface, deviating from the display screen, of the circuit board.

In a third aspect, an embodiment of the present application provides a protection device for an electronic device, including:

a gasket;

a second housing;

the heat sink of the first aspect, the heat sink being disposed between the gasket and the second housing.

In the embodiment of this application, through combining the loop heat pipe, phase change heat storage plate and thermoelectric generator membrane, utilize the loop heat pipe to circulate the heat transfer, utilize phase change heat storage plate to maintain stable intensification and heat dissipation, in order to guarantee the invariable difference in temperature in thermoelectric generator membrane both ends, make thermoelectric generator membrane can be in the duration of electric energy in order to be used for electronic equipment with the heat transformation under the effect of stabilizing the difference in temperature, when promoting electronic equipment radiating effect, can also promote electronic equipment's duration, and accord with frivolous user demand.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;

fig. 2 is a second schematic structural diagram of a heat dissipation device according to an embodiment of the present application;

fig. 3 is a third schematic structural diagram of a heat dissipation device according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a heat dissipation device according to an embodiment of the present disclosure;

fig. 5 is a fourth schematic structural view of a heat dissipation device according to an embodiment of the present application;

fig. 6 is a fifth schematic structural view of a heat dissipation device according to an embodiment of the present application;

fig. 7 is a sixth schematic structural view of a heat dissipation device according to an embodiment of the present application;

FIG. 8 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

fig. 9 is a second schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 10 is a third schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 11 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 12 is a fifth schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of a protection device for electronic equipment according to an embodiment of the present application.

Reference numerals:

110: a loop heat pipe; 120: a phase change heat storage plate; 130: a thermoelectric generator film;

111: a hot end; 112: a cold end; 113: a gas phase line; 114: a liquid phase pipeline;

131: a P-N junction region; 132: a current collection module; 133: a heat source region;

134: a P junction; 135: n knot;

210: a display screen; 220: an outer frame; 230: a circuit board; 240: a first housing; 221: a through hole;

250: a screen-side graphite film; 260: a back side graphite film;

310: a gasket; 320: a second housing.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of those features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the present application.

In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

A heat dissipating device according to an embodiment of the present application is described below with reference to fig. 1 to 13.

As shown in fig. 1, a heat dissipating device according to some embodiments of the present application includes: a loop heat pipe 110, a phase change heat storage plate 120, and a thermoelectric generator film 130.

In this embodiment, the heat dissipation device is used for heat dissipation and power supply of the electronic device.

The electronic device may be a mobile electronic device such as a mobile phone, a tablet computer, a watch, or a non-mobile electronic device such as a PC terminal or other terminals.

It should be noted that the heat dissipation device may be embedded in the electronic device, or may be independently disposed, and is attached to the electronic device to dissipate heat and supply power to the electronic device.

Loop Heat Pipe 110 (LHP) is a Loop Heat Pipe of the closed Loop type, including but not limited to: evaporator, condenser, reservoir, and liquid lines, etc. The working principle of the heat exchange device is that an evaporator is heated by a heat source, a working medium is evaporated into steam, and the steam flows to a condenser for cooling and then enters a liquid storage device for supplying, so that the heat exchange effect is circularly enhanced.

It is understood that the electronic device includes a large number of heat generating devices, such as a CPU and PMUs.

Electronic equipment is in the course of the work, and these devices that generate heat can produce a large amount of heats, if not dispel the heat in time, not only can influence electronic equipment's operating rate, still can shorten electronic equipment's life to influence user experience.

The loop heat pipe 110 includes: hot end 111, cold end 112, liquid phase line 114, and gas phase line 113.

Wherein the hot end 111 is an evaporation end. The hot end 111 is disposed at one end of the heat dissipation device close to the heat source, and a projection area of the hot end 111 covers a heating device of the electronic device.

As shown in fig. 3, the hot end 111 may be disposed at the upper end of the heat sink.

An evaporator may be provided in hot end 111 for evaporating the working fluid into hot vapor.

The cold end 112 is the condensing end. The cold end 112 is disposed at an end of the heat sink away from the heat source.

As shown in fig. 3, the cold end 112 may be disposed below the heat sink.

A condenser may be provided in the cold end 112 for condensing the hot vapor to produce condensed water.

A reservoir may also be provided in the cold end 112 for storing condensate.

One end of the hot end 111 is communicated with one end of the cold end 112 through a liquid phase pipeline 114, and the other end of the hot end 111 is communicated with the other end of the cold end 112 through a gas phase pipeline 113.

In the actual implementation process, through the annular structure, the internal working medium is heated at the hot end 111 and then evaporated into a gas phase, the hot steam generated in the hot end 111 is transmitted to the cold end 112 through the gas phase pipeline 113, the cold end 112 performs condensation treatment on the received hot steam to condense into a liquid phase, and transmits condensed water to the hot end 111 through the liquid phase pipeline 114, so that heat dissipation treatment is performed on a heating device in the electronic equipment, the condensed water is evaporated into the gas phase again, and the cycle is repeated.

In the application, the interaction between two-phase working media and a capillary structure can be avoided to the greatest extent by carrying out gas-liquid phase separation, the heat dissipation capacity is further improved, and the soaking effect is enhanced; in addition, the unique heat dissipation structure of the loop heat pipe 110 has small resistance of the whole loop, and can realize phase change heat exchange at a stable position, thereby maximally ensuring constant temperature difference of the cold and hot ends 111 and laying a foundation for the use of the thermoelectric generator film 130.

In the actual implementation process, the heat dissipation device is arranged near a heating device of the electronic equipment, the loop heat pipe 110 is arranged to generate hot steam near the heating device (one end of the heat dissipation device close to a heat source), the hot steam is condensed and converted into condensed water at one end of the heat dissipation device far away from the heat source, then the condensed water is adopted to cool the heating device, and the circulation is performed to enhance the heat exchange effect of the heat dissipation device on the electronic equipment.

By adopting the embedded application of the loop heat pipe 110, the condensation section and the evaporation section of the loop heat pipe 110 are separated to avoid the mixing action of gas and liquid phases, and the soaking effect is realized by the phase change circulation of the internal working medium to reduce the surface temperature of the electronic equipment; furthermore, the flow of hot steam and condensed working medium can be automatically adjusted according to the heat consumption of the hot end 111, the temperature difference between the cold end and the hot end is kept constant, and a good foundation of a waste heat recovery scheme is provided.

The phase change heat storage plate 120 is a plate made of Phase Change Material (PCM), and has a capability of changing a physical state within a certain temperature range.

The PCM has a characteristic of high latent heat of phase change, and can absorb a large amount of heat energy through a physical state change (solid → liquid). The phase change heat storage plate 120 can prevent the temperature rise of the electronic equipment from increasing too fast; and can keep more stable speed for heat release during the heat storage and release process.

As shown in fig. 4, the PCM can prevent the heat from rapidly rising in a heavy load scene, and can reduce the temperature rise in a steady state.

The latent heat of the PCM is 125kg/kJ to 165kg/kJ, and may be 130kg/kJ, 145kg/kJ, 160kg/kJ, or the like, for example.

The phase transition initiation temperature of the PCM is 33 ℃ to 42 ℃, for example 35 ℃ or 40 ℃.

As shown in fig. 2, the loop heat pipe 110 is disposed on one side of the phase change heat storage plate 120, and the phase change heat storage plate 120 slows down the rapid rise of heat through the characteristic of high phase change latent heat, and maintains a stable heat release speed.

The thermoelectric generator membrane 130 is a thermoelectric generator of a membrane-like structure, not a longitudinally stacked scheme.

Among them, a Thermoelectric Generator (TEG) is a device that converts thermal energy into electric energy by utilizing the seebeck effect of a semiconductor, and when one end of two different metal materials is connected to one thermocouple, and the temperature of the junction is higher than that of the other end, two cold ends 112 of the different materials generate thermoelectromotive force, and at this time, power can be transmitted to a load in a circuit. The heat transfer direction of the conventional thermoelectric generator is a longitudinal direction, that is, the heat transfer is performed in the thickness direction of the thermoelectric generator.

In the present application, the thermoelectric generator film 130 transfers heat in a planar direction, that is, in a direction in which the thermoelectric generator film 130 extends, and the thermoelectric generator film 130 converts heat into electric energy and recovers the electric energy.

The thermoelectric generator membrane 130 is disposed on a side of the phase change heat storage plate 120 away from the loop heat pipe 110.

Within the thermoelectric generator membrane 130 are disposed a plurality of P/N junctions, wherein the P/N junctions may be either P junctions 134 or N junctions 135.

The P/N junction can generate current under the action of temperature difference.

The plurality of P/N junctions of the thermoelectric generator film 130 are arranged along the arrangement direction of the hot side 111 and the cold side 112.

According to some embodiments of the present application, the thickness of the thermoelectric generator film 130 is 0.3mm to 0.5mm, which can maximally reduce the thickness space and meet the requirement of terminal equipment for lightness and thinness.

In some embodiments, the thermoelectric generator membrane 130 is a mixture of semiconductor and epoxy to enhance toughness and avoid being too brittle and brittle.

It can be understood that the phase change heat storage plate 120 can absorb a large amount of heat energy at one end of the heat sink close to the heat source, and maintain a stable heat release speed in the process of releasing heat to the thermoelectric generator film 130, so that the thermoelectric generator film 130 receives stable heat.

The phase change heat storage plate 120 is located at the end of the heat sink far from the heat source, and can slow down the rapid rise of heat, thereby ensuring that the temperature of the end of the heat source far from the heat sink is kept in a lower range.

On the basis that the loop heat pipe 110 is arranged to exchange heat with the heat dissipation device, the phase change heat storage plate 120 is added to maintain stable temperature rise and heat dissipation, so that the constant temperature difference between two ends of the thermoelectric generator film 130 can be further ensured.

The thermoelectric generator film 130 has a high temperature at one end close to the heat source of the heat sink and a low temperature at the other end far from the heat source of the heat sink, and transfers heat in the extending direction of the thermoelectric generator film 130 under the action of temperature difference, and the thermoelectric generator film 130 converts the heat into electric energy.

Finally, the electric energy can be directly supplied to the electronic equipment, or enter a battery to supplement the electric quantity of the battery, or be directly used for auxiliary functions (such as a fan, a breathing lamp and the like) so as to realize the endurance of the electronic equipment.

In this embodiment, the unique heat dissipation structure of the loop heat pipe 110 provides a small resistance for the entire loop, and can realize phase change heat exchange at a stable position, thereby maximally ensuring constant temperature difference at the cold end and the hot end, and laying a foundation for the use of the subsequent thermoelectric generator membrane 130.

By adopting the phase change heat storage plate 120, the heat of a heavy-load scene can be prevented from rising rapidly by utilizing the characteristics of phase change and high latent heat; the surface temperature rise of the electronic equipment is reduced in a stable state, and the heat dissipation capacity of the heat dissipation device is improved; the heat storage capacity can be enhanced, the heat can be slowly released after being stored, the temperature difference at the cold end and the hot end is ensured to be constant, and a foundation is laid for the use of the subsequent thermoelectric generator film 130.

The thermoelectric generator film 130 is arranged to convert the heat energy generated in the operation process of the electronic equipment into the electric energy, and the electric energy is used for the endurance of the electronic equipment, so that the endurance of the electronic equipment can be obviously improved on the premise of not increasing the capacity of a battery; in addition, through adopting membranous structure, can realize the electric energy recovery of plane direction, not only do benefit to laminating terminal equipment and use, also can reduce vertical thickness, accord with frivolous user demand.

According to the heat abstractor of this application embodiment, through combining loop heat pipe 110, phase change heat storage plate 120 and thermoelectric generation machine membrane 130, utilize loop heat pipe 110 to circulate the heat transfer, utilize phase change heat storage plate 120 to maintain stable intensification and heat dissipation, in order to guarantee the invariable difference in temperature in thermoelectric generation machine membrane 130 both ends, make thermoelectric generation machine membrane 130 can be with heat transformation electric energy in order to be used for the continuation of the journey of electronic equipment under the effect of stabilizing the difference in temperature, when promoting electronic equipment radiating effect, can also promote electronic equipment's continuation of the journey ability, and accord with frivolous user demand.

According to some embodiments of the present application, the thermoelectric generator film 130 may include a current collecting module 132.

In this embodiment, the current collecting module 132 is electrically connected to the plurality of P/N junctions for collecting the current generated by the thermoelectric generator film 130.

The current collecting module 132 has functions of current storage, voltage conversion and the like, and can convert the current generated by the thermoelectric generator film 130 into electric energy to be stored and then be pressurized, and finally the electric energy can be directly supplied to the electronic device, or enter a battery to supplement the electric quantity of the battery, or be directly used for an accessory function (such as a fan, a breathing lamp and the like) to realize the cruising of the electronic device.

In some embodiments, the current collection module 132 may be disposed at an end of the thermoelectric generator membrane 130 remote from the heat source.

According to the heat dissipation device of the embodiment of the application, the current collection module 132 is arranged to collect the electric energy generated by the thermoelectric generator film 130 so as to realize a real-time electric energy collection function, and the electric energy can be directly supplied to the electronic equipment or enter the battery to supplement the electric quantity of the battery through converting the current generated by the thermoelectric generator film 130 into the electric energy to be stored and then be pressurized so as to realize the cruising of the electronic equipment.

According to some embodiments of the present application, the plurality of P/N junctions are located on the same plane and are sequentially arranged in the same direction from the extension direction of the thermoelectric generator film 130.

In this embodiment, the regions where the plurality of P/N junctions are located are P-N junction regions 131.

In the P-N junction region 131, a plurality of P/N junctions are located on the same plane, and are sequentially arranged in the same direction from the extension direction of the thermoelectric generator film 130.

One end of the P-N junction region 131 is disposed at one end of the heat sink close to the heat source, one end of the P-N junction region 131 close to the heat source is a heat source region 133, the other end of the P-N junction region 131 is disposed at one end of the heat sink far away from the heat source, and a temperature difference is present between two ends of the P-N junction region 131.

The current collecting module 132 is disposed at an end of the P-N junction region 131 away from the heat source and electrically connected to the P/N junction.

The P-N junction region 131 can realize energy conversion from heat energy to electric energy by the seebeck effect under the action of the temperature difference between the two ends; specifically, during the conversion process, electric energy (current) will be generated in the P-N junction region 131, and the electric energy is superimposed layer by layer to finally form a path, which is collected to the current collection module 132, and the electric energy is stored by the current collection module 132 to provide electric energy for the electronic device in which the heat dissipation device is embedded or the attached electronic device, thereby improving the cruising ability of the electronic device.

The P-N junction region 131 including a plurality of P/N junctions may be represented as including only a plurality of P junctions 134, or may be represented as including only a plurality of N junctions 135, or may be represented as including both P junctions 134 and N junctions 135.

The plurality of P/N junctions are located on the same plane (i.e., on the plane of the thermoelectric generator film 130), and are sequentially arranged in the same direction from the extending direction of the thermoelectric generator film 130.

The sequential equidirectional arrangement from the extension direction comprises: in the plane of the thermoelectric generator film 130, the P/N junctions are arranged along the same direction from the hot side 111 to the cold side 112, forming a multi-row P/N junction arrangement structure.

In some embodiments, the P/N junctions may also be arranged in the same direction perpendicular to the direction from the hot side 111 to the cold side 112 in the plane of the thermoelectric generator membrane 130, forming a multi-column P/N junction arrangement.

In some embodiments, in the plane of the thermoelectric generator film 130, the P/N junctions may be arranged along the direction from the hot side 111 to the cold side 112, and arranged along the direction perpendicular to the direction from the hot side 111 to the cold side 112, respectively, to form a P/N junction arrangement with multiple rows and multiple columns.

According to the heat abstractor of this application embodiment, through adopting membranous structure to realize the electric energy recovery of plane direction, existing laminating terminal equipment that is favorable to uses, also can reduce vertical thickness, accord with frivolous user demand.

This embodiment is described below in connection with fig. 5-7 from three implementation perspectives.

First, according to some embodiments of the present application, in the case that the P/N junctions are all P junctions 134, the P junctions 134 are connected in parallel in multiple layers.

As shown in fig. 5, in this embodiment, the heat source of the heat dissipation device is located above, the current collection module 132 is located below, and the currents are stacked from top to bottom and transmitted to the current collection module 132 for collection. The arrangement mode has small requirement on plane space and high space utilization rate.

Second, according to other embodiments of the present application, where the plurality of P/N junctions are all N junctions 135, the plurality of N junctions 135 are connected in multiple layers in parallel.

As shown in fig. 6, in this embodiment, the heat source of the heat dissipation device is located below, the current collection module 132 is located above, and the currents are stacked from bottom to top and transmitted to the current collection module 132 for collection. The arrangement mode has small requirement on plane space and high space utilization rate.

Thirdly, in accordance with still further embodiments of the present application, where the plurality of P/N junctions includes P junction 134 and N junction 135, the P junction 134 and N junction 135 are connected in series in a single stage.

As shown in fig. 7, in this embodiment, the P-junctions 134 and the N-junctions 135 are spaced and arranged in parallel, the inside of the thermoelectric generator film 130 is changed from multi-layer parallel connection to single-stage series connection, and the P-junctions 134 and the N-junctions 135 are connected in series in sequence and finally transmitted to the current collecting module 132 for collection. This arrangement provides greater flexibility.

According to the heat dissipation device provided by the embodiment of the application, a user can flexibly design the distribution of P/N junctions in the thermoelectric generator film 130 based on actual requirements (such as heat source positions, current trends, or space requirements) in the actual use process by providing a plurality of arrangement modes, and the optimal arrangement mode is selected, so that the heat dissipation device is high in use flexibility and has strong universality.

According to some embodiments of the present application, the thermoelectric generator film 130 may be a multilayer.

In this embodiment, in the actual implementation process, at least two thermoelectric generator films are laminated and arranged, a stable voltage is generated through a constant temperature difference of a cold end and a hot end, a current is generated through a specific circuit, and the number of the P/N junctions connected in series can be increased through arranging the plurality of thermoelectric generator films 130, so that the power generation amount is increased, and the cruising ability of the electronic device is further enhanced.

It should be noted that the heat dissipation device provided in the present application can be applied to different carriers.

Two different application scenarios are described below.

1. The carrier being an electronic device

As shown in fig. 8, an electronic device according to some embodiments of the present application includes: the display screen 210, the outer frame 220, the circuit board 230, the first housing 240, and the heat sink as described above.

In this embodiment, the display screen 210 is disposed on a side of the heat sink adjacent to the thermoelectric generator film 130.

The outer frame 220 is a support of the main board upper cover, and surrounds the display screen 210 to play a supporting role.

The circuit board 230 is disposed on a side of the heat sink close to the loop heat pipe 110.

The loop heat pipe 110 adopts a circulation path heat dissipation mode, so that the heat dissipation capacity of the electronic equipment is improved, the soaking effect is enhanced, and meanwhile, the constant temperature difference of a cold end and a hot end can be ensured through phase change heat exchange at a stable position;

the phase change heat storage plate 120 has strong heat storage capacity and can keep stable heat release, and further ensures constant temperature difference of the cold end and the hot end of the heat dissipation device, thereby providing stable temperature difference for the thermoelectric generator membrane 130 and improving the conversion effect of the thermoelectric generator membrane 130;

the thermoelectric generator film 130 converts heat conducted by the phase change thermal storage plate 120 into electric energy to supply electric energy to the electronic device and reduce a longitudinal depth to improve a slimness of the electronic device.

The first casing 240 is disposed on a side of the circuit board 230 away from the display screen 210 for protection.

According to the electronic equipment of the embodiment of the application, the heat dissipation device is integrated in the electronic equipment, and the loop heat pipe 110, the phase change heat storage plate 120 and the thermoelectric generator film 130 are combined, so that the heat dissipation capability of the electronic equipment is improved, meanwhile, the electric energy recovery requirement can be realized, the cruising ability of the electronic equipment is enhanced, and the use experience of a user is improved.

According to some embodiments of the present application, the thermoelectric generator films are at least two.

In this embodiment, at least two thermoelectric generator films are stacked and the outer frame 220 is disposed between the at least two thermoelectric generator films, as shown in fig. 9, by increasing the number of layers of the thermoelectric generator films to increase the number of P/N junctions in series, the power generation amount is increased, and the cruising ability of the whole machine is further enhanced.

According to the electronic device of the embodiment of the present application, the conversion effect can be enhanced by using the multilayer thermoelectric generator film.

As shown in fig. 10, according to further embodiments of the present application, there is one thermoelectric generator membrane.

In this embodiment, the outer frame 220 is provided with through holes 221, as shown in fig. 11; the thermoelectric generator films are folded through the through holes 221 to be provided on both sides of the outer frame 220, as shown in fig. 12.

The P/N junctions in the regions of the thermoelectric generator film folded on both sides of the frame 220 are arranged in opposite directions.

In the actual implementation process, a thermoelectric generator membrane can be folded and arranged on two sides 1 of the outer frame 220 in a hole breaking mode of the outer frame 220 to increase the serial number of the P-N junctions 135, so that the power generation capacity is increased, and the endurance of the whole machine is further enhanced.

With continuing reference to fig. 8, according to some embodiments of the present application, the electronic device may further include: a screen-side graphite film 250 and a back-side graphite film 260.

In this embodiment, the screen side graphite film 250 (screen side PGS) is disposed between the display screen 210 and the heat dissipation device, and the back side graphite film 260 (back side PGS) is disposed between the circuit board 230 and the first housing 240 to enhance the heat dissipation effect.

2. Protective device with electronic carrier

As shown in fig. 13, a protection apparatus of an electronic device according to some embodiments of the present application includes: a spacer 310, a second housing 320, and a heat sink as described above.

In this embodiment, the protection device of the electronic device may be an accessory such as a protective sleeve.

The protection device of the electronic equipment is arranged outside the electronic equipment and used for protecting the electronic equipment.

The gasket 310 may be a silicone gasket or PET for buffering and insulation.

The second housing 320 may be a skin, glass, ceramic, plastic, or other housing.

The heat sink is disposed between the spacer 310 and the second casing 320, and the spacer 310 is disposed on a side of the heat sink close to the loop heat pipe 110. The method is used for carrying out heat dissipation and electric energy recovery processing on the electronic equipment under the condition that the electronic equipment is sensitive to the comprehensive application scheme of LHP + PCM + TEG.

The heat dissipation device is provided with an external interface and can be electrically connected with the electronic equipment through an external channel.

For example, in an actual implementation process, the current recovered by the heat dissipation device may be transmitted to the electronic device through an interface such as type C to continue the journey of the electronic device.

Of course, in other embodiments, the thermoelectric generator film in the heat dissipation device may be one or more layers, and the specific arrangement manner is similar to that described above, which is not described herein again.

According to the protection device of the electronic equipment, the heat dissipation device is loaded on the protection device of the electronic equipment, heat dissipation processing and heat energy conversion under various application scenes are achieved, the heat dissipation capacity of the electronic equipment is improved, meanwhile, the electric energy recovery requirement is met, the use flexibility is high, and the application scenes are wide.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A heat dissipating device, comprising:

a phase change heat storage plate;

the loop heat pipe is arranged on one surface of the phase change heat storage plate, the hot end of the loop heat pipe is arranged at one end, close to the heat source, of the heat dissipation device, and the cold end of the loop heat pipe is arranged at one end, far away from the heat source, of the heat dissipation device;

the thermoelectric generator membrane is arranged on one surface of the phase change heat storage plate, which is far away from the loop heat pipe, and a plurality of P/N junctions of the thermoelectric generator membrane are arranged along the arrangement directions of the hot end and the cold end.

2. The heat dissipation device of claim 1, wherein the thermoelectric generator membrane comprises a current collection module electrically connected to the plurality of P/N junctions.

3. The heat dissipating device of claim 1, wherein the plurality of P/N junctions are located in a same plane and arrayed from a direction of extension of the thermoelectric generator film.

4. The heat dissipating device of claim 3,

under the condition that the plurality of P/N junctions are all P junctions, the plurality of P junctions are connected in parallel in a multi-layer mode;

under the condition that the plurality of P/N junctions are all N junctions, the plurality of N junctions are connected in parallel in a multi-layer mode;

in the case where the plurality of P/N junctions include P junctions and N junctions, the P junctions and N junctions are connected in series in a single stage.

5. The heat dissipating device according to any one of claims 1 to 4, wherein the thermoelectric generator film is a plurality of layers, and the plurality of layers of thermoelectric generator film are stacked on a surface of the phase change thermal storage plate facing away from the loop heat pipe.

6. The heat dissipating device according to any one of claims 1 to 4, wherein the thermoelectric generator film has a thickness of 0.3mm to 0.5mm.

7. An electronic device, comprising:

the heat dissipation device of any of claims 1-6;

the display screen is arranged on one surface of the heat dissipation device close to the thermoelectric generator film;

the outer frame is arranged around the periphery of the display screen in a surrounding manner;

the circuit board is arranged on one surface of the heat dissipation device close to the loop heat pipe;

the first shell is arranged on one surface, deviating from the display screen, of the circuit board.

8. The electronic device of claim 7,

the number of the thermoelectric generator films is at least two, the at least two thermoelectric generator films are arranged in a laminated manner, and the outer frame is arranged between the at least two thermoelectric generator films;

or,

the frame is provided with through holes, the thermoelectric generator films penetrate through the through holes and are arranged on two sides of the frame in a folding mode, and the arrangement directions of the P/N junctions in the thermoelectric generator films in the areas arranged on the two sides of the frame in the folding mode are opposite.

9. The electronic device of claim 7 or 8, further comprising:

a screen-side graphite film disposed between the display screen and the heat sink;

a back graphite film disposed between the circuit board and the first housing.

10. A protection device for an electronic device, comprising:

a gasket;

a second housing;

the heat sink of any of claims 1-6, the heat sink disposed between the gasket and the second housing.

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