CN217541308U

CN217541308U - Wafer quick drying device

Info

Publication number: CN217541308U
Application number: CN202221482760.7U
Authority: CN
Inventors: 郭忠
Original assignee: Guangdong Full Core Semiconductor Co ltd
Current assignee: Guangdong Full Core Semiconductor Co ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2022-10-04
Anticipated expiration: 2032-06-14

Abstract

Relate to wafer drying equipment technical field, the application provides a wafer quick drying device, which comprises a housin, the top surface of casing is equipped with the business turn over material port, the inside position department that corresponds the business turn over material port of casing is equipped with the heat jacket that the heat jacket outside was located to heat jacket and cover, the inboard of heat jacket is equipped with the support body that is used for placing the wafer, heat jacket outer wall side is around the heat exchange wire that is equipped with helical structure, the both ends of heat jacket are equipped with the closing plate, heat jacket one side is equipped with the baffle, and is equipped with the ventiduct between baffle top and bottom and the casing correspondence inner wall. The utility model discloses, the wafer is placed on the support body, and the heat transfer silk in the heat conduction cover outside is the spiral, at first heats the heat conduction cover, and the heat conduction cover is heated the back, evenly dries the wafer of inside. In addition, for further guaranteeing the stoving in-process, each part is heated unanimously, drives inside air through the fan and flows for the air circulation after being heated flows, and then makes the air keep the temperature unanimous.

Description

Wafer quick drying device

Technical Field

The utility model relates to the technical field, concretely relates to wafer quick drying device.

Background

In the manufacturing process of the chip, a pattern conversion process is required, which includes a photolithography process, and the photolithography process is a pattern copying technology and is a key technology in the chip manufacturing process. Briefly, photolithography is inspired by photographic techniques to accurately replicate the pattern of a photolithographic mask plate to a photoresist coated wafer using the photosensitive properties of the photoresist. Before spin coating the photoresist on the wafer, the wafer surface needs to be baked because the wafer surface is liable to absorb moisture, which affects the adhesion of the photoresist. But the existing drying mode is difficult to uniformly dry the wafer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer quick drying device possesses the advantage that can evenly dry to the wafer, has solved current stoving mode, is difficult to the technical problem of evenly drying the wafer.

In order to achieve the above purpose, the utility model provides a following technical scheme:

the utility model provides a wafer quick drying device, includes the casing, the top surface of casing is equipped with the business turn over material port, the inside position department that corresponds the business turn over material port of casing is equipped with heat conduction cover and the heat insulating sleeve that the heat conduction cover outside was located to the cover, the inboard of heat conduction cover is equipped with the support body that is used for placing the wafer, the heat exchange wire of spiral structure is around being equipped with to heat conduction cover outer wall side, the both ends of heat conduction cover are equipped with the closing plate, heat insulating sleeve one side is equipped with the baffle, and is equipped with the ventiduct between baffle top and bottom and the casing correspondence inner wall, one side that the heat insulating sleeve was kept away from to the baffle is equipped with the fan that is used for making baffle both sides air cycle flow.

The edge of the sealing plate is connected with the partition plate and the inner wall of the shell, so that a heat insulation cavity is formed outside the heat insulation sleeve.

The rack body is of a net structure, and the top surface of the rack body is provided with a hollow limiting cylinder.

Wherein, the inlet and outlet port department is equipped with transparent structure's observation window.

Wherein, the material of support body is stainless steel.

Wherein the housing is located on a mobile platform.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses in, the wafer is placed on the support body, and the heat transfer silk in the heat conduction cover outside is the spiral, at first heats the heat conduction cover, and the heat conduction cover is heated the back, evenly dries the wafer of inside. In addition, for further guaranteeing the stoving in-process, each part is heated unanimously, drives inside air through the fan and flows for the air circulation after being heated flows, and then makes the air keep the temperature unanimous.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

FIG. 1 is a schematic view of an overall structure of a wafer rapid drying device;

fig. 2 is a top view of an internal structure of a wafer rapid drying device.

In the figure: 1. a housing; 2. a feed and discharge port; 3. a heat conducting sleeve; 4. a heat insulating sleeve; 5. a frame body; 6. heat exchange wires; 7. a sealing plate; 8. a partition plate; 9. an air duct; 10. a fan; 11. a heat preservation cavity; 12. a limiting cylinder; 13. and (4) an observation window.

Detailed Description

In order to make the implementation purpose, technical solution and advantages of the present invention clearer, the following will clearly and completely describe the technical solution of the present invention with reference to the embodiments of the present invention and the accompanying drawings. The embodiments recited in the present application are only a part of the embodiments of the present application, and should not be considered as all embodiments. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without making any creative effort, shall fall within the protection scope of the present application, and therefore the following detailed description of the specific embodiments provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but only to represent the preferred embodiments of the present invention.

Please refer to fig. 1-2:

the utility model provides a wafer quick drying device, which comprises a housin 1, casing 1's top surface is equipped with business turn over material port 2, 1 inside position department that corresponds business turn over material port 2 of casing is equipped with heat conduction cover 3 and the heat insulating sleeve 4 that the heat conduction cover 3 outside was located to the cover, the inboard of heat conduction cover 3 is equipped with the support body 5 that is used for placing the wafer, 3 outer wall sides of heat conduction cover are around the heat exchange wire 6 that is equipped with helical structure, the both ends of heat conduction cover 3 are equipped with closing plate 7, 4 one side of heat insulating sleeve is equipped with

baffle

8, and 8 tops of baffle and bottom and casing 1 correspond and be equipped with ventiduct 9 between the inner wall, one side that heat insulating sleeve 4 was kept away from to baffle 8 is equipped with the fan 10 that is used for making 8 both sides air cycle flow of baffle.

During preheating, the wafer is placed on support body 5, and the heat transfer silk 6 in the heat conduction cover 3 outside is the spiral, at first heats heat conduction cover 3, and heat conduction cover 3 is heated the back, evenly dries the wafer of inside. In addition, in order to further ensure that all parts are heated uniformly in the drying process, the fan 10 drives the internal air to flow, so that the heated air flows circularly, and the air is kept at the same temperature.

In one embodiment, the sealing plate 7 is connected at its edge to the partition 8 and the inner wall of the casing 1 to form a holding chamber 11 outside the insulating jacket 4. Is used for reducing heat radiation and realizing energy conservation and consumption reduction, and is matched with the fan 10 to form a circulating air duct.

In one embodiment, the frame body 5 is a net structure, the top surface of the frame body 5 is provided with a hollow-out limiting cylinder 12, the net structure and the hollow-out structure do not affect heat transfer, and only play a role in supporting and limiting, and the hollow-out limiting cylinder 12 is used for keeping the wafer in a vertical state.

In one embodiment, the material inlet/outlet port 2 is provided with an observation window 13 of a transparent structure for observing the heated drying state of the wafer.

In one embodiment, the frame body 5 is made of stainless steel, and has sufficient supporting strength, so that the wafer can be dried stably and safely.

In one embodiment, the housing 1 is located on a mobile platform to facilitate transfer and transport of the device.

The foregoing is merely a detailed description of the invention that enables those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the general inventive concept. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a wafer quick drying device, its characterized in that, includes casing (1), the top surface of casing (1) is equipped with business turn over material port (2), the inside position department that corresponds business turn over material port (2) of casing (1) is equipped with heat conduction cover (3) and overlaps heat insulating sleeve (4) of locating heat conduction cover (3) outside, the inboard of heat conduction cover (3) is equipped with support body (5) that are used for placing the wafer, heat conduction cover (3) outer wall side is around being equipped with helical structure's heat exchange wire (6), the both ends of heat conduction cover (3) are equipped with closing plate (7), heat insulating sleeve (4) one side is equipped with baffle (8), and is equipped with between baffle (8) top and bottom and casing (1) the corresponding inner wall ventiduct (9), one side that heat insulating sleeve (4) were kept away from in baffle (8) is equipped with fan (10) that are used for making baffle (8) both sides air cycle flow.

2. The wafer fast drying device of claim 1, characterized in that: the edge of the sealing plate (7) is connected with the partition plate (8) and the inner wall of the shell (1) so as to form a heat preservation cavity (11) outside the heat insulation sleeve (4).

3. The wafer fast drying device of claim 1, characterized in that: the frame body (5) is of a net structure, and the top surface of the frame body (5) is provided with a hollow-out limiting cylinder (12).

4. The wafer fast drying device of claim 1, characterized in that: and an observation window (13) with a transparent structure is arranged at the feeding and discharging port (2).

5. The wafer fast drying device of claim 1, characterized in that: the frame body (5) is made of stainless steel.

6. The wafer fast drying device of claim 1, characterized in that: the shell (1) is positioned on the mobile platform.