CN217523102U

CN217523102U - PCB mechanism for planar capacitive sensor

Info

Publication number: CN217523102U
Application number: CN202221369747.0U
Authority: CN
Inventors: 陈鑫
Original assignee: Shenzhen Lexin Electronic Technology Co ltd
Current assignee: Shenzhen Lexin Electronic Technology Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-09-30
Anticipated expiration: 2032-06-01

Abstract

The utility model belongs to the technical field of sensor PCB board, a PCB board mechanism for planar capacitive sensor is disclosed, including PCB base plate main part, one side bolt joint of PCB base plate main part has first buffering body, first buffering body dorsad one side of PCB base plate main part is equipped with first shock attenuation board, first buffering body fixed mounting be in on the first shock attenuation board, first shock attenuation board is kept away from one side of first buffering body is connected with second shock attenuation board through the fixed column, second shock attenuation board with the fixed second buffering body that is equipped with between the first shock attenuation board, through this setting promptly, the utility model provides the shockproof performance of planar capacitive sensor PCB board.

Description

PCB mechanism for planar capacitive sensor

Technical Field

The utility model relates to a sensor PCB board technical field especially relates to a PCB board mechanism for planar capacitive sensor.

Background

The planar capacitive sensor is a conversion device which takes various types of capacitors as sensing elements and converts a physical quantity or a mechanical quantity to be measured into capacitance variation, and actually, the planar capacitive sensor is a capacitor with variable parameters. Capacitive sensors are widely used for measuring displacement, angle, vibration, velocity, pressure, composition analysis, and properties of media. The most commonly used are parallel plate capacitors or cylindrical capacitors.

In the prior art, planar capacitive sensors are provided with a custom-made PCB board. In some measurements, the planar capacitive sensor needs to be quickly displaced along with an object, so that the PCB of the planar capacitive sensor needs to have good shock resistance, but the shock resistance of some existing PCBs of the planar capacitive sensor is poor, so that the PCB of the planar capacitive sensor is easily damaged. This state of the art needs to be changed.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing a PCB board mechanism for plane capacitive sensor aims at improving the shock resistance of plane capacitive sensor PCB board.

In order to realize the purpose of the utility model, the adopted technical proposal is that: the PCB mechanism comprises a PCB substrate main body, wherein a first buffering body is bolted on one side of the PCB substrate main body, the first buffering body faces away from one side of the PCB substrate main body and is provided with a first damping plate, the first buffering body is fixedly installed on the first damping plate, one side, away from the first damping plate, of the first buffering body is connected with a second damping plate through a fixed column, and the second damping plate is fixedly provided with a second buffering body between the first damping plate and the second damping plate.

The utility model discloses further set up to: the first buffer body and the PCB base plate main body are provided with a plurality of threaded holes, and the threaded holes are arranged in a circular structure.

The utility model discloses further set up to: the first damping plate is provided with a plurality of connecting studs, and the connecting studs and the first damping plate are integrally formed.

The utility model discloses further set up to: the second buffer body is provided with heat dissipation holes in a penetrating mode, and the heat dissipation holes are evenly distributed in the second buffer body.

The utility model discloses further set up to: and anti-skid grains are arranged on the second damping plate.

The utility model discloses further set up to: and an auxiliary handle is arranged on one side of the second damping plate, which deviates from the first damping plate.

The utility model discloses further set up to: the PCB base plate main part with the outside of first buffering body is equipped with the rectangular channel, the rectangular channel is seted up on the first shock attenuation board.

The utility model discloses further set up to: the first damping plate and the second damping plate are both made of spring steel material.

The utility model discloses further set up to: the first buffer body is made of a chlorinated butyl rubber material.

The utility model discloses further set up to: the second buffer body is made of a mixture of butyl rubber and nitrile rubber materials.

To sum up, compare with prior art, the utility model provides the high shockproof performance of planar capacitive sensor PCB board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a PCB board mechanism for a planar capacitive sensor according to the present embodiment;

fig. 2 is a bottom view of a PCB board mechanism for a planar capacitive sensor provided in the present embodiment;

fig. 3 is a cross-sectional view of a PCB board mechanism for a planar capacitive sensor according to the present embodiment.

Reference numerals: 1. a PCB substrate body; 2. a first buffer body; 3. a first damper plate; 4. fixing a column; 5. a second damper plate; 6. a second buffer body; 7. a threaded hole; 8. connecting a stud; 9. heat dissipation holes; 10. anti-skid lines; 11. an auxiliary handle; 12. a rectangular groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments, it is to be understood that the specific embodiments described herein are only used for explaining the present invention, and are not used for limiting the present invention.

In the description of the present invention, it should be noted that the terms "front", "back", "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.

The utility model provides a PCB board mechanism for planar capacitive sensor, as shown in fig. 1-3, including PCB base plate main part 1, one side bolt joint of PCB base plate main part 1 has first buffering body 2, one side of first buffering body 2 dorsad PCB base plate main part 1 is equipped with first shock attenuation board 3, first buffering body 2 fixed mounting is on first shock attenuation board 3, one side that first buffering body 2 was kept away from to first shock attenuation board 3 is connected with second shock attenuation board 5 through fixed column 4, second shock attenuation board 5 and first shock attenuation board 3 between fixed second buffering body 6 that is equipped with.

Furthermore, a plurality of threaded holes 7 are formed in the first buffering body 2 and the PCB substrate main body 1, the threaded holes 7 are arranged in a circular structure, and in the specific implementation process, the PCB substrate main body 1 and the first buffering body 2 are tightly fastened through the threaded holes 7 by bolts, so that the PCB substrate main body 1 is tightly attached to the first buffering body 2 with the shockproof buffering effect, the vibration of the PCB substrate main body 1 is reduced, and the PCB substrate main body 1 is protected.

Furthermore, be equipped with a plurality of connecting screw 8 on the first shock attenuation board 3, a plurality of connecting screw 8 and first shock attenuation board 3 integrated into one piece, at the concrete implementation in-process, connect four connecting screw 8 on the 3 four corners of first shock attenuation board with first shock attenuation board 3 bolt on external equipment, improved the holistic steadiness of this embodiment.

Furthermore, the second buffer 6 is provided with heat dissipation holes 9 in a penetrating manner, the heat dissipation holes 9 are uniformly arranged on the second buffer 6, and in the specific implementation process, the heat generated by the PCB substrate body 1 is timely discharged through the heat dissipation holes 9 under the action of air flow, so that the normal operation of the embodiment is guaranteed.

Furthermore, the second damping plate 5 is provided with anti-slip lines 10, and in the specific implementation process, the anti-slip lines 10 play a role in anti-slip, so that the installation, the disassembly and other work of operators are facilitated.

Further, one side that second shock attenuation board 5 deviates from first shock attenuation board 3 is equipped with supplementary handle 11, and at concrete implementation in-process, supplementary handle 11 set up and has reduced the whole degree of difficulty of this embodiment of action personnel follow external equipment.

Further, the outer sides of the PCB substrate main body 1 and the first buffer body 2 are provided with a rectangular groove 12, the rectangular groove 12 is arranged on the first damping plate 3, and in the specific implementation process, ABS resin materials are filled in the rectangular groove 12, so that the stability and the damping performance of the PCB substrate main body 1 are enhanced.

Furthermore, in the specific implementation process, the first damping plate 3 and the second damping plate 5 are both made of spring steel material, and it should be noted that the first damping plate 3 and the second damping plate 5 made of spring steel material have the technical advantages of high tensile strength, high fatigue resistance, strong anti-seismic performance and the like.

Further, in the specific implementation process, the first buffer body 2 is made of a chlorinated butyl rubber material, and it should be noted that the first buffer body 2 made of a chlorinated butyl rubber material has the beneficial effects of high shock absorption performance, heat resistance, ozone resistance and the like.

Further, the second buffer body 6 is made of a mixture of butyl rubber and nitrile rubber, in the specific implementation process, the ratio of the butyl rubber to the nitrile rubber is 1:1, and the second buffer body 6 is arranged between the first damping plate 3 and the second damping plate 5, so that the overall vibration of the PCB substrate main body 1 is further reduced, and the PCB substrate main body 1 is further protected.

To sum up, the utility model discloses following beneficial effect has: the utility model discloses a PCB board mechanism for planar capacitive sensor, including PCB base plate main part 1, one side bolt joint of PCB base plate main part 1 has first buffering body 2, and one side of first buffering body 2 PCB base plate main part 1 dorsad is equipped with first shock attenuation board 3, and 2 fixed mounting of first buffering body are on first shock attenuation board 3, and one side that first buffering body 2 was kept away from to first shock attenuation board 3 is connected with second shock attenuation board 5 through fixed column 4, and fixed second buffering body 6 that is equipped with between second shock attenuation board 5 and the first shock attenuation board 3, through this setting promptly, the utility model provides the high shock resistance ability of planar capacitive sensor PCB board, meanwhile, the utility model discloses have beneficial effect such as fatigue-resistant, good heat dissipation and the operation is convenient.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A PCB board mechanism for planar capacitive sensor, includes PCB base plate main part (1), its characterized in that: one side bolt joint of PCB base plate main part (1) has first buffering body (2), first buffering body (2) dorsad one side of PCB base plate main part (1) is equipped with first shock attenuation board (3), first buffering body (2) fixed mounting be in on the first shock attenuation board (3), keep away from in first shock attenuation board (3) one side of the first buffering body (2) is connected with second shock attenuation board (5) through fixed column (4), second shock attenuation board (5) with fixed second buffering body (6) that are equipped with between first shock attenuation board (3).

2. The PCB board mechanism for the planar capacitive sensor according to claim 1, wherein a plurality of threaded holes (7) are formed on the first buffer body (2) and the PCB substrate main body (1), and the threaded holes (7) are arranged in a circular structure.

3. A PCB board structure for planar capacitive sensor according to claim 1, wherein a plurality of connecting studs (8) are provided on the first damping plate (3), and a plurality of connecting studs (8) are formed integrally with the first damping plate (3).

4. The PCB board mechanism for the planar capacitive sensor according to claim 1, wherein heat dissipation holes (9) are formed through the second buffer body (6), and the heat dissipation holes (9) are uniformly arranged on the second buffer body (6).

5. A PCB board structure for planar capacitive sensor according to claim 1, wherein the second shock absorbing board (5) is provided with anti-skid veins (10).

6. A PCB board structure for planar capacitive sensor according to claim 1, wherein the second damper board (5) is provided with an auxiliary handle (11) on the side facing away from the first damper board (3).

7. The PCB board mechanism for the planar capacitive sensor according to claim 1, wherein the outer sides of the PCB substrate body (1) and the first buffer body (2) are provided with rectangular grooves (12), and the rectangular grooves (12) are opened on the first damping plate (3).

8. A PCB board structure for planar capacitive sensor according to claim 1, wherein the first damper board (3) and the second damper board (5) are made of spring steel material.

9. The PCB board mechanism for the planar capacitive sensor according to claim 1, wherein the first buffer body (2) is made of chlorinated butyl rubber material.

10. The PCB board mechanism for the planar capacitive sensor according to claim 1, wherein the second buffer body (6) is made of a mixture of butyl rubber and nitrile rubber materials.