CN217523098U

CN217523098U - Power semiconductor module substrate and power semiconductor module

Info

Publication number: CN217523098U
Application number: CN202221055932.2U
Authority: CN
Inventors: 张文军
Original assignee: Hubei Xiangzheng Rectifier Co ltd
Current assignee: Hubei Xiangzheng Rectifier Co ltd
Priority date: 2022-05-05
Filing date: 2022-05-05
Publication date: 2022-09-30
Anticipated expiration: 2032-05-05

Abstract

The utility model relates to a power semiconductor module substrate and power semiconductor module, including shell body substrate body, the symmetry is equipped with two stop gear on the substrate body, and movable groove has all been seted up to the side about the terminal surface around the substrate body, and spacing spout has all been seted up with every activity trench position department of correspondence to the top surface of substrate body, and spacing spout and the activity groove that corresponds communicate mutually, set up the constant head tank with substrate body looks adaptation on the inner wall of shell body, the bolt hole that matches with activity groove is all seted up on the left and right sides of terminal surface around the constant head tank inner chamber. The utility model provides a circuit board passes through two stop gear on the substrate body to make the circuit board be convenient for realize in the inside dismouting operation that realizes of shell body, when needs damage the electronic device on circuit board or the circuit board, the circuit board can be quick when dismantling from the shell body is inside, has shortened the takedown time, is favorable to improving power semiconductor module's maintenance efficiency.

Description

Power semiconductor module substrate and power semiconductor module

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a power semiconductor module substrate and power semiconductor module.

Background

The power semiconductor module is an assembly according to a certain function and mode, and the power semiconductor module is formed by combining and encapsulating high-power electronic power devices into a whole according to a certain function. The power semiconductor module can realize different functions according to different packaged components. At present, the connected mode between circuit board and the shell body among the power semiconductor module does, and the bottom surface of circuit board among the power semiconductor module is equipped with the substrate, is equipped with the recess that is used for holding the substrate on the inner wall of power semiconductor housing, and the fixed mode of substrate in the recess is: the silicone gel is injected into the groove, after the silicone gel is solidified and solidified, the circuit board in the power semiconductor module is fixedly mounted inside the outer shell, so that when the circuit board or an electronic device in the power semiconductor module is damaged, a worker is difficult to detach the circuit board in the power semiconductor module from the inside of the outer shell, great inconvenience is brought to maintenance of the power semiconductor module, the detachment time is prolonged, the maintenance efficiency of the power semiconductor module is reduced, and therefore the power semiconductor module substrate and the power semiconductor module are provided.

SUMMERY OF THE UTILITY MODEL

The utility model provides a power semiconductor module substrate and power semiconductor module has solved the technical problem among the prior art.

The utility model provides a scheme as follows of above-mentioned technical problem: a power semiconductor module substrate comprises an outer shell and a substrate body, wherein two limiting mechanisms are symmetrically arranged on the substrate body, movable grooves are formed in the left side and the right side of the front end face and the rear end face of the substrate body, a limiting sliding groove is formed in the position, corresponding to each movable groove, of the top face of the substrate body, the limiting sliding grooves are communicated with the corresponding movable grooves, a positioning groove matched with the substrate body is formed in the inner wall of the outer shell, and bolt holes matched with the movable grooves are formed in the left side and the right side of the front end face and the rear end face of an inner cavity of the positioning groove; the limiting mechanism comprises two supporting seats, the two supporting seats are arranged at intervals in the front-back direction, a bidirectional screw is arranged between the two supporting seats, bearings are fixedly sleeved on the peripheries of the front end and the rear end of the bidirectional screw, an external ring is fixedly sleeved on the periphery of the middle part of the bidirectional screw, two driven nuts matched with the bidirectional screw are further sleeved on the periphery of the bidirectional screw, a guide sliding block matched with the straight sliding groove is fixedly connected to the bottom of each driven nut, and a bolt rod matched with the movable groove is connected to the bottom end of each guide sliding block; the guide sliding block is movably inserted in the limiting sliding groove, the bolt rod is movably inserted in the movable groove, and the bolt rod penetrates through the movable groove and is movably inserted in the bolt hole.

On the basis of the technical scheme, the utility model discloses can also do following improvement.

Furthermore, the left end face and the right end face of the substrate body are both connected with lateral wing sliding blocks, the substrate body is movably inserted into the inner cavity of the positioning groove, straight sliding grooves matched with the lateral wall of the inner cavity of the positioning groove are formed in the positions corresponding to the lateral wing sliding blocks, and the lateral wing sliding blocks are respectively movably inserted into the corresponding straight sliding grooves.

Furthermore, the opposite surfaces of the two supporting seats are provided with mounting holes matched with the bearings in a penetrating manner, and each bearing is fixedly connected in the corresponding mounting hole respectively.

Further, two driven nuts are symmetrically arranged front and back, and the external ring is arranged between the two driven nuts.

Further, the supporting seat is fixedly connected to the top surface of the substrate body, and the periphery of the external ring is fixedly sleeved with the anti-slip sleeve.

A power semiconductor module comprises a module body, wherein the module substrate is arranged below the module body, and the module body is fixedly arranged on the substrate body of the module substrate.

The utility model has the advantages that: the utility model provides a power semiconductor module substrate and power semiconductor module has following advantage:

the utility model provides a circuit board passes through two stop gear on the substrate body to make the circuit board be convenient for realize in the inside dismouting operation that realizes of shell body, when needs damage the electronic device on circuit board or the circuit board, the circuit board can be quick when dismantling from the shell body is inside, has shortened the takedown time, is favorable to improving power semiconductor module's maintenance efficiency.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The following examples and the accompanying drawings illustrate specific embodiments of the present invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:

fig. 1 is a schematic structural diagram of a power semiconductor module substrate and a power semiconductor module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a power semiconductor module substrate and a limiting mechanism in the power semiconductor module provided in fig. 1;

fig. 3 is a cross-sectional view of a power semiconductor module substrate and a substrate in a power semiconductor module provided in fig. 1.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a circuit board; 2. a substrate body; 3. a side wing slider; 4. a supporting seat; 5. a bidirectional screw; 6. an external ring; 7. a driven nut; 8. a latch rod; 9. an outer housing; 10. a bearing; (ii) a 11. A guide slider; 12. a movable groove; 13. and a limiting sliding groove.

Detailed Description

The principles and features of the present invention will be described with reference to the accompanying fig. 1-3, which are provided for illustration only and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in a very simplified form and are not to precise scale, which is only used for the purpose of facilitating and clearly explaining the embodiments of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1-3, the utility model provides a power semiconductor module substrate, which comprises an outer shell 9, substrate body 2, be equipped with the different electron device of a plurality of functions on module body 1's the top surface, the symmetry is equipped with two stop gear on substrate body 2, movable groove 12 has all been seted up to the side about substrate body 2 front and back terminal surface, spacing spout 13 has all been seted up with every movable groove 12 position department of correspondence to substrate body 2's top surface and every movable groove 12, and spacing spout 13 is linked together with the movable groove 12 that corresponds, set up the constant head tank with substrate body 2 looks adaptation on housing body 9's the inner wall, the left and right sides of terminal surface all seted up around the constant head tank inner chamber with movable groove 12 assorted bolt hole.

Preferably, the left end face and the right end face of the substrate body 2 are both connected with the lateral wing sliding blocks 3, the substrate body 2 is movably inserted into the positioning groove inner cavity, the positions of the side wall of the positioning groove inner cavity corresponding to the lateral wing sliding blocks 3 are both provided with straight sliding grooves matched with the lateral wing sliding blocks, and the lateral wing sliding blocks 3 are respectively movably inserted into the corresponding straight sliding grooves.

Preferably, stop gear includes two supporting seats 4, the interval sets up around two supporting seats 4 are, be equipped with two-way screw rod 5 between two supporting seats 4, the periphery of 5 front and back ends of two-way screw rod all cup joints and is fixed with bearing 10, the periphery at 5 middle parts of two-way screw rod cup joints and is fixed with outer ring 6, the periphery of two-way screw rod 5 still overlaps and is equipped with two driven nuts 7 rather than the work of cooperating, the equal fixedly connected with in bottom of every driven nut 7 and straight spout assorted direction slider 11, the bottom of every direction slider 11 all is connected with and moves movable groove 12 assorted bolt pole 8. The guide sliding block 11 is movably inserted in the limiting sliding groove 13, the bolt rod 8 is movably inserted in the movable groove 12, and the bolt rod 8 penetrates through the movable groove 12 and is movably inserted in the bolt hole.

Preferably, the opposite surfaces of the two supporting seats 4 are all penetrated by mounting holes matched with the bearings 10, and each bearing 10 is respectively and fixedly connected in the corresponding mounting hole.

Preferably, the two driven nuts 7 are symmetrically arranged front and back, the external ring 6 is arranged between the two driven nuts 7, two sections of threads with different rotation directions, namely a right-handed thread and a left-handed thread, are arranged on the bidirectional screw 5, one driven nut 7 is positioned at the left-handed position, and the other driven nut 7 is positioned at the right-handed position.

Preferably, the supporting seat 4 is fixedly connected to the top surface of the substrate body 2, and the outer periphery of the outer ring 6 is fixedly sleeved with the anti-slip sleeve.

Preferably, the thickness of the substrate body 2 corresponds to the thickness of the positioning grooves.

The utility model discloses a concrete theory of operation and application method do:

the utility model provides a power semiconductor module substrate, when needs maintain the operation to the electron device on module body 1 or the module body 1, operating personnel drives two-way screw rod 5 rotation through external ring 6, there are two sections screw threads to different soon on the two-way screw rod 5, one section right-handed thread promptly, one section left-handed thread, one of them driven nut 7 is in left-handed department, another driven nut 7 is in right-handed department, when two-way screw rod 5 is rotatory, two driven nut 7 move in opposite directions, make bolt pole 8 break away from the bolt hole that corresponds, take out substrate body 2 from the constant head tank again, thereby realize taking down module body 1 quick from shell body 9 inside dismantlement, the dismantlement time has been shortened, be favorable to improving power semiconductor module's maintenance efficiency.

A power semiconductor module comprises a module body 1, a module substrate is arranged below the module body 1, and the module body 1 is fixedly arranged on a substrate body 2 of the module substrate.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way; the present invention can be smoothly implemented by those skilled in the art according to the drawings and the above description; however, those skilled in the art should understand that changes, modifications and variations made by the above-described technology can be made without departing from the scope of the present invention, and all such changes, modifications and variations are equivalent embodiments of the present invention; meanwhile, any changes, modifications, evolutions, etc. of equivalent changes made to the above embodiments according to the essential technology of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A power semiconductor module substrate comprises a shell (9) and a substrate body (2), and is characterized in that two limiting mechanisms are symmetrically arranged on the substrate body (2), movable grooves (12) are formed in the left side and the right side of the front end surface and the rear end surface of the substrate body (2), a limiting sliding groove (13) is formed in the position, corresponding to each movable groove (12), of the top surface of the substrate body (2), the limiting sliding grooves (13) are communicated with the corresponding movable grooves (12), positioning grooves matched with the substrate body (2) are formed in the inner wall of the shell (9), and bolt holes matched with the movable grooves (12) are formed in the left side and the right side of the front end surface and the rear end surface of an inner cavity of each positioning groove; the limiting mechanism comprises two supporting seats (4), the two supporting seats (4) are arranged at intervals in the front and back direction, a two-way screw (5) is arranged between the two supporting seats (4), bearings (10) are fixedly sleeved on the peripheries of the front end and the back end of the two-way screw (5), an external ring (6) is fixedly sleeved on the periphery of the middle part of the two-way screw (5), two driven nuts (7) which are matched with the two-way screw (5) are further sleeved on the periphery of the two-way screw (5), a guide sliding block (11) matched with a limiting sliding groove (13) is fixedly connected to the bottom of each driven nut (7), and a bolt rod (8) matched with a movable groove (12) is connected to the bottom end of each guide sliding block (11); the guide sliding block (11) is movably inserted in the limiting sliding groove (13), the bolt rod (8) is movably inserted in the movable groove (12), and the bolt rod (8) penetrates through the movable groove (12) and is movably inserted in the bolt hole.

2. The power semiconductor module substrate according to claim 1, wherein the left and right end surfaces of the substrate body (2) are connected with wing sliders (3), the substrate body (2) is movably inserted into the positioning groove inner cavity, a straight chute matched with the positioning groove inner cavity is formed in the position of the side wall of the positioning groove inner cavity corresponding to each wing slider (3), and each wing slider (3) is respectively and movably inserted into the corresponding straight chute.

3. A power semiconductor module substrate according to claim 1, characterized in that the thickness of the substrate body (2) corresponds to the thickness of the positioning slot.

4. The power semiconductor module substrate according to claim 3, wherein opposite surfaces of the two supporting bases (4) are respectively penetrated with mounting holes matched with the bearings (10), and each bearing (10) is respectively and fixedly connected in the corresponding mounting hole.

5. A power semiconductor module substrate according to claim 3, characterized in that two of the driven nuts (7) are arranged symmetrically in front and back, and the external ring (6) is located between the two driven nuts (7).

6. The power semiconductor module substrate according to claim 3, wherein the supporting base (4) is fixedly connected to the top surface of the substrate body (2), and an anti-slip sleeve is sleeved and fixed on the outer periphery of the external ring (6).

7. A power semiconductor module comprising a module body (1), characterized in that a module substrate according to any one of claims 1-6 is provided below the module body (1), and the module body (1) is fixedly mounted on a substrate body (2) of the module substrate.