CN217520698U - Abnormal sound measuring device - Google Patents

Abstract

The embodiment of the application discloses abnormal sound measuring device. The abnormal sound measuring device comprises a supporting shaft piece, a placing platform, a fixing piece, a vibrator and a test element; the placing platform is used for placing a piece to be tested; the fixing piece is arranged on the placing platform and used for fixing the piece to be detected; the vibrator is used for vibrating the placing platform; the test element comprises at least one test unit, the test unit is carried on the supporting shaft piece to slide on the supporting shaft piece, the test element comprises a plurality of sound pickup elements, each sound pickup element is used for connecting one end of the sound guide element or the first sound pickup element, and each sound pickup element is positioned in an independent acoustic cavity; when the testing unit is driven by the electrical signal to slide on the device under test, the other end of the sound guide element or the sound collection element is used to receive the sound from the device under test. The method and the device have the advantages that the one-time product debugging is carried out in a mechanical and computerized mode, the debugging precision is improved, and the labor burden is saved.

Description

Abnormal sound measuring device

Technical Field

The application relates to the field of acoustic measurement, in particular to abnormal sound measuring device.

Background

Electronic devices and audio source devices, such as notebook computers, bluetooth speakers, keyboard devices, etc., have been indispensable products in work and daily life. However, when there are parts falling off or other foreign objects in these devices, abnormal sound is generated under the condition of resonance. In addition, if the product itself is a defective product, an internal defective structure or a flaw may cause generation of abnormal sound. The generation of such abnormal sounds may cause mental or physical discomfort to the listener, and even though the listener may not necessarily perceive the abnormal sounds clearly, the abnormal sounds may greatly affect the quality of the music when the device plays the music at the same time. Manufacturers of high-end notebook computers, smart phones and tablet computers have already been dedicated to improving the acoustic performance of products, however, how to locate the position of the product where noise occurs (for short, a hot spot) requires an engineer to perform comprehensive precision measurement, and a large amount of labor cost is consumed in both the product development stage and the product maintenance stage.

In view of the foregoing, there is a need for a novel detection device to improve the above-mentioned problems, and more specifically, to perform product debugging in a stable and mechanized manner, so as to improve the debugging accuracy and save the labor.

SUMMERY OF THE UTILITY MODEL

To solve the above problem, the embodiment of the application adopts an abnormal sound measuring device, which can well improve the problem of the prior art.

Specifically, the embodiment of the application discloses an abnormal sound measuring device, which comprises a base, an upper cover, a supporting shaft piece, a placing platform, a fixing piece, a vibrator and a test element, wherein the upper cover is connected to the base and forms a sealable box body with the base; the supporting shaft part is connected with the upper cover; the placing platform is used for placing a piece to be tested; the fixing piece is arranged on the placing platform and used for fixing the piece to be detected; the vibrator is used for vibrating the placing platform; the test element comprises at least one test unit, the test unit is carried on the supporting shaft piece to slide on the supporting shaft piece, the test element comprises a plurality of sound pickup elements, each sound pickup element is used for connecting one end of a sound guide element or a first sound collection element, and each sound pickup element is positioned in an independent acoustic cavity; when the testing element is driven by an electric signal to slide above the piece to be tested, the other end of the sound guide element or the sound collection element is used for receiving sound for the piece to be tested.

Optionally, in some embodiments of the present application, the to-be-tested device is disposed on a first surface of the placing platform, and the vibrator is disposed on the first surface or a second surface of the placing platform, where the first surface is opposite to the second surface.

Optionally, in some embodiments of the present application, the abnormal sound measuring device further includes a conducting element disposed between the vibrator and the placement platform and directly connected to the vibrator and the placement platform, respectively.

Optionally, in some embodiments of the present application, the test element further includes a plurality of through holes, each through hole is used to connect the sound guiding element or the sound collecting element, and a first distance is provided between each through hole and an adjacent through hole.

Optionally, in some embodiments of the present application, the sound guide element is a tubular structure.

Optionally, in some embodiments of the present application, the other end of the sound leading element is connected to the second sound collecting element.

Optionally, in some embodiments of the present application, the design criteria of the distance between two adjacent sound guiding elements or first sound collecting elements and the distance between the sound guiding element or the first sound collecting element and the object to be measured satisfy the following formula:

wherein x is the horizontal distance between two adjacent sound guiding elements or first sound collecting elements, and y isAnd the vertical distance between the piece to be tested and the sound guide element or the first sound collecting element, wherein dB is decibel unit.

Optionally, in some embodiments of the present application, the placing platform is provided with a plurality of supporting members, and each supporting member has a fixed distance from the adjacent supporting member.

Optionally, in some embodiments of the present application, the abnormal sound measuring apparatus further includes a signal processor, wherein the sound pickup element is a micro microphone unit, and the signal processor is coupled to each of the micro microphone units to convert an analog signal from each of the micro microphone units into a digital signal.

Optionally, in some embodiments of the present application, the acoustic cavity and the pickup element are disposed in the test unit.

Optionally, in some embodiments of the present application, the acoustic cavity and the pickup element are disposed within the signal processor.

Optionally, in some embodiments of the present application, sound insulation foam is disposed on both the side walls of the base and the top cover.

Optionally, in some embodiments of the present application, the abnormal sound measuring apparatus further includes a fastener for locking the base and the upper cover.

Optionally, in some embodiments of the present application, the top of the base is an inclined opening.

Optionally, in some embodiments of the present application, the opening has an inclination angle of 30 to 60 degrees.

Optionally, in some embodiments of the present application, when the sound pickup element is configured to connect to the sound leading element, the through hole includes an input port and an output port, the input port is configured to connect to the second sound collecting element, and the output port is configured to connect to the other end of the sound leading element. In summary, the present application effectively solves the problems of the prior art through the above novel scheme, and particularly can perform a one-time product debugging in a stable mechanized and computerized manner, thereby well improving the debugging accuracy and saving the labor burden. In addition, the method and the device do not increase too much cost, and well solve the problem that a large amount of labor cost is consumed to detect the hot spot position of the electronic product in the prior art under the condition of meeting the economic benefit.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following drawings in the description of the embodiments, which are used as needed, will be briefly introduced, and it is obvious that the drawings in the description below are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of an abnormal noise measurement apparatus according to an embodiment of the present application.

Fig. 2 is a front view of the abnormal sound measuring apparatus.

FIG. 3 is a schematic diagram of the abnormal sound measuring device with a plurality of adjacent sound guiding elements for sound reception.

Fig. 4 is a detailed structural diagram of each test column unit in the abnormal sound measurement apparatus according to an embodiment of the present application.

Fig. 5 is a detailed structural diagram of each test element in the abnormal sound measurement apparatus according to another embodiment of the present application.

Fig. 6 is an enlarged schematic view of a test element in the abnormal noise measuring apparatus corresponding to fig. 5.

Detailed Description

The following examples are given by way of illustration only, and since various changes and modifications within the spirit and scope of the disclosure will become apparent to those skilled in the art from this detailed description, the scope of the disclosure should be determined only by the appended claims. Throughout the specification and claims, unless the context clearly dictates otherwise, the words "a" and "an" include the word "a" and "the" including such elements or components. Furthermore, as used in this disclosure, the singular articles "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Moreover, as used in this description and throughout the claims that follow, the meaning of "in" can include "in" and "on" unless the content clearly dictates otherwise. The words used in the specification and claims have the ordinary meaning as is accorded to such words in the art, in the context of the disclosure herein and in the specific context unless otherwise indicated. Certain words used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to the practitioner in describing the disclosure. The use of examples anywhere throughout the specification, including any examples of words discussed herein, is intended merely to be illustrative, and certainly not to limit the scope or meaning of the disclosure or any exemplary words. As such, the present disclosure is not limited to the various embodiments set forth in this specification.

As used herein, the term "about" or "approximately" shall generally mean within 20%, and preferably within 10%, of a given value or error. Further, the amounts provided herein can be approximate, meaning that the word "about" or "approximately" can be used if not expressly stated. When an amount, concentration, or other value or parameter is given a range, preferred range or table listing upper and lower desired values, it is to be understood that all ranges formed from any upper and lower pair of values or desired values is specifically disclosed, regardless of whether ranges are separately disclosed. For example, if a range of lengths from X cm to Y cm is disclosed, it should be understood that lengths of H cm are disclosed and H can be any real number in between X and Y.

Further, "electrically coupled" or "electrically connected" herein includes any direct and indirect electrical connection means. For example, if a first device is electrically coupled to a second device, that connection may be through a direct connection, or through an indirect connection via other devices and connections. In addition, if transmission and provision of electrical signals are described, persons skilled in the art should understand that attenuation or other non-ideal changes may be accompanied in the transmission process of electrical signals, but the source and the receiving end of the electrical signal transmission or provision should be regarded as substantially the same signal unless otherwise stated. For example, if an electrical signal S is transmitted (or provided) from a terminal a of an electronic circuit to a terminal B of the electronic circuit, wherein a voltage drop may occur across the source and drain of a transistor switch and/or a possible stray capacitance, but this design is intended to achieve certain specific technical effects without deliberately using attenuation or other non-idealities that occur during transmission, the electrical signal S should be considered to be substantially the same signal at the terminals a and B of the electronic circuit.

It will be understood that the terms "comprising," "having," "including," and the like, as used herein, are open-ended terms that mean including, but not limited to. Moreover, not all objects, advantages, or features disclosed herein are necessarily achieved in any one embodiment or claim of the present application. In addition, the abstract and the title of the application are provided to assist the searching of the patent document and are not intended to limit the scope of the application.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In this application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in its actual use or operating state, particularly in the direction of the drawing figures, and the terms "inner" and "outer" refer to the contours of the device.

Refer to the drawings wherein like reference numbers represent like elements throughout. The following description is based on illustrated embodiments of the application and should not be taken as limiting the application with respect to other embodiments that are not detailed herein.

Referring to fig. 1 to 2, fig. 1 is a schematic view of an abnormal sound measuring apparatus 100 according to an embodiment of the present application, and fig. 2 is a front view of the abnormal sound measuring apparatus 100. As shown in fig. 1, the abnormal sound measuring apparatus 100 includes a base 10, an upper cover 20, a placement platform 30, a fixing surface 40, a fixing member 50, a vibrator 60 (shown in fig. 2), a conducting member 65 (shown in fig. 2), a supporting shaft member 22, a connecting member 23, a testing unit 72, a sound-insulating foam 80, and a fastener 90, wherein the fastener 90 is used for locking the base 10 and the upper cover 20, and the sound-insulating foam 80 is disposed on the sidewalls of the base 10 and the upper cover 20. The upper cover 20 is connected to the base 10 and forms a sealable box with the base 10. In other embodiments, the upper cover 20 and the base 10 can be connected by a pivot connection, but the present application is not limited thereto, and any mechanism can be used to connect the upper cover 20 and the base 10. The top of the base 10 may have an inclined opening, and the inclination angle of the opening is preferably between 30 degrees and 60 degrees, but the present application is not limited thereto. The top surface of the platform 30 is used for placing a device under test 110, and the device under test 110 may be an electronic or other electronic/mechanical device such as a notebook computer, a music device, a keyboard, etc., and the type of the device is not particularly limited in this application. The fixing surface 40 can be locked inside the base 10, and the placement platform 30 can be further locked above the fixing surface 40. The fixing member 50 can be locked above the placing platform 30 for fixing the dut 110 to prevent movement. The vibrator 60 is disposed on the lower surface of the placing platform 30, and the conducting element 65 is disposed between the vibrator 60 and the placing platform 30 and directly contacts with the vibrator 60 and the placing platform 30, respectively, and conducts the vibration generated by the vibrator 60 to the placing platform 30 by contact conduction, so as to vibrate the placing platform 30, so that the foreign object or the bad structure (such as the defect source B1 shown in fig. 3) on the object 110 to be tested vibrates to generate an undesired abnormal sound. The conductor 65 may be considered as a part of the vibrator 60, and the vibrator 60 may be a Voice Coil Motor (VCM), which is composed of a Coil, a magnet, and a suspension mechanism. Depending on the practical application, if the coil is fixed, the voice coil motor becomes a moving-iron type voice coil motor; if the magnet is fixed, the motor becomes a 'moving coil type' voice coil motor. The conductive element 65 is a part of the coil of the vibrator 605, that is, included in the vibrator 60, and the present embodiment may be applied as a fixed coil, and the magnet may perform repeated linear motion in the axial direction after alternating current signals are applied thereto, and since the magnet has a larger mass than the coil, the motion thereof generates a relatively large inertia (F ═ ma), and the vibration amount is relatively large, thereby providing a change in the vibration amount. In other embodiments, the conducting element 65 can be independently disposed outside the vibrator 60, and preferably, the outer portion thereof can be formed of a metal material. In another embodiment, the conductive member 65 may not be disposed between the vibrator 60 and the placing platform 30, and the vibrator 60 may be in direct contact with the placing platform 30 to vibrate the placing platform 30. In the present embodiment, the vibrator 60 may be a Voice Coil Motor (Voice Coil Motor), a Speaker (Speaker), a Transducer (Transducer) or other actuating device.

The connecting member 23 is used to connect the supporting shaft 22 and the testing unit 72, so that the testing unit 72 can slide left and right on the supporting shaft 22. The supporting shaft 22 may be a sliding rail or other elements, and the connecting member 23 may be a roller sliding on the sliding rail. The test unit 72 is driven by an electrical signal (e.g., electrically connected to the signal processor 71 as shown in FIG. 4). The length of the testing unit 72 can be designed to be larger than the width of the device under test 110, by sliding left and right, the testing unit 72 can perform uniform and complete sound pickup and scanning on the device under test 110, and the moving speed of the testing unit 72 can be controlled in a programmable manner, so as to change the moving frequency to match the actual detection requirement. In the present embodiment, a single supporting shaft 22 is disposed in the X direction and a single testing unit 72 is used to perform single-axis sound pickup scanning in the X direction, however, in another embodiment, more than two supporting shafts 22 may be disposed, for example, two supporting shafts are disposed in the X direction and the Y direction respectively, and one or more testing units 72 are used to perform overall sound pickup scanning in the X direction and the Y direction. Each testing unit 72 includes a plurality of through holes, wherein each through hole is used to connect a sound guiding element (refer to the connection relationship between the through hole 79 and the sound guiding tube 116 shown in the following fig. 5) or a sound collecting element (refer to the following fig. 4), and a first distance is provided between each through hole and an adjacent through hole, for example, the distance may be 1 to 5 centimeters, but not limited thereto. The sound guiding element and the sound collecting element can be soft or hard, and the material can be plastic, glass, metal, etc. The sound-guiding element may be an elongated tubular structure with a hollow design for sound transmission through air, but may also be designed to be solid and to transmit sound through the material itself.

As shown in fig. 2, the dut 110 is disposed on a first surface (i.e., upper surface) of the placing platform 30, and the vibrator 60 is disposed on a second surface (i.e., lower surface) of the placing platform 30 and is in direct contact with the second surface, but may be disposed on the first surface of the placing platform 30, wherein the first surface is opposite to the second surface. In addition, a plurality of supporting members 35 are disposed on the placing platform 30, and each supporting member has a second distance from the adjacent supporting member. The number of the supporting members 35 is not limited as long as the desired supporting effect can be achieved. The supporting member 35 is used to elevate the dut 110, so as to prevent the measurement from being affected by the unevenness of the platform of the placing platform 30 or the dust on the platform, and therefore the accuracy of the measurement can be further improved by the supporting member 35.

When the testing unit 72 covers the top of the device under test 110 and moves left and right, the sound guiding element (e.g., the sound guiding tube 116 in fig. 5) or the sound collecting element (e.g., the sound collecting element 75 in fig. 4) starts to perform close-range scanning type sound receiving detection on the device under test 110, where the testing unit 72 may actually touch the surface of the device under test 110 through the sound guiding element or the sound collecting element or approach (approximate) the device under test 110. For example, in fig. 3, a defect source (i.e., a hot spot) B1 inside the device under test 110 is located below the sound guide elements a 1-A3 or the sound collecting element 75, and the sound guide elements a 1-A3 can all receive noise from the defect source B1 in the device under test 110, and the exact position of the defect source B1 can be determined according to the difference in noise intensity received by the sound guide elements. For example, when the sound leading element A2 is located directly below the defect source B1 and the received noise level is 2 times the root of the sound leading element A3, it can be calculated that the defect source B1 is located directly below the sound leading element A2. Referring back to fig. 3, assuming that the horizontal distance between two adjacent sound guiding elements or sound collecting elements is x, and the vertical distance between the defect source B1 of the device under test 110 and the sound guiding element or sound collecting element in the vertical direction is y, the preferred design criteria of the distance between the adjacent sound guiding elements or sound collecting elements and the object to be tested can be set to satisfy the following formula:

the dB is decibel unit, and the detection signals have better intensity difference through the design rule, so that the accuracy of signal interpretation can be improved. In yet another embodiment, the design criteria may preferably be set to satisfy the following formula:

in another embodiment, the design criteria may be set to satisfy the following formula:

in the SNR, D2/D1, D2 is the maximum sound source signal amplitude received by the sound guide element a2 closest to the different sound source, D1 is the sound source signal amplitude received by the sound guide element a2 farthest from the different sound source, and it can be considered as the ambient noise (noise floor), and 20 log10(SNR) value generally falls within 10dB to 40dB, but not limited thereto.

Referring to fig. 4, fig. 4 is a detailed structural diagram of the testing unit 72 in the abnormal noise measuring apparatus 100 according to an embodiment of the present application. As shown in fig. 4, the abnormal sound measuring apparatus 100 may further include a signal processor 71, wherein the testing unit 72 and the signal processor 71 together form a testing element, each testing unit 72 includes a sound pickup module having a plurality of sound pickup elements 74 and a plurality of acoustic cavities 78, each acoustic cavity 78 is respectively provided with a through hole, and a sound pickup element 74 is provided corresponding to the through hole, that is, each sound pickup element 74 is located in an independent acoustic cavity 78, the acoustic cavities 78 are separated from each other by an acoustic shielding material, so as to prevent the sound pickup elements 74 from crosstalk with each other and interference with external sound, wherein the acoustic cavity 78 may be disposed on the top or the back of the testing unit 72, and is illustrated as being disposed on the back in this figure. A pickup element 74, such as a microphone, which may be a MEMS microphone or an EMC microphone or other type of microphone/pickup, preferably a miniature microphone, is disposed on the PCB 73 and within the acoustic cavity 78. In another embodiment, the sound-collecting element 74 may be directly disposed inside the acoustic cavity 78 and electrically connected to the PCB 73 without disposing a through hole inside the acoustic cavity 78. Since the pickup element 74 is fixed to the PCB board 73, the PCB board 73 is separated from the placement platform 30 without being affected and interfered by the vibration thereof.

The signal processor 71 may include a Pre-amplifier (Pre-amplifier) and a signal processing unit, and the signal processor 71 may be electrically connected to each of the pickup elements 74 through a shielded cable 79 or wirelessly to convert the analog signal from each of the pickup elements 74 into a digital signal. In addition, as shown in fig. 4, a corresponding sound collecting element 75, such as a sound collecting cone, is provided corresponding to each sound collecting element 74, and the sound collecting element 75 is communicated with the sound collecting element 74 through an acoustic cavity 78 to transmit the collected sound waves to the sound collecting element 74, in another embodiment, a sound guiding element (not shown) with a short length, such as a short sound guiding tube, may be provided between the sound collecting element 74 and the sound collecting element 75 for communicating. The sound collecting element 75 can cover the top cover 112 of the device under test 110 (e.g., a notebook computer) to detect the condition of the internal circuit 114 of the device under test 110 by sound reception, or to receive sound by approaching the top cover 112. Generally speaking, the sound collecting element 75 is preferably attached to the device under test or very close to the device under test for better sound receiving effect. In the stage of training the determination signal, a test element, such as a nail, a transistor, a dovetail clip, etc., may be disposed on the internal circuit 114 or the top cover 112 of the device under test 110 to generate an abnormal sound when the vibrator 60 vibrates. Since the position of the test element is known, the hot spot position can be used as one of the parameters of the AI algorithm. In this embodiment, the dut 110 may be a notebook computer, but the application is not limited thereto.

Because of the near-field sound receiving effect of the sound guiding element and the sound collecting element, the characteristic analysis of the signal is facilitated, and then the abnormal sound strengthening is carried out. In addition, different from the prior art that a common traditional microphone is used for far-field sound reception, the method and the device not only reduce the hardware cost, but also are beneficial to reducing the interference among pipelines and improving the signal characteristic analysis because the small-volume characteristic of the MEMS microphone or the EMC microphone is used and the near-field effect of the sound guide element and the sound collection element is matched. In other words, the present application, while detecting the object to be detected in the sound vibration mode, facilitates signal analysis and enhances feature acquisition by the near field effect of the sound guiding element and the sound collecting element, so as to detect the abnormal sound and the abnormal sound position, and further avoid using a general microphone to additionally adopt a beam forming (Beamforming) algorithm due to far field reception, thereby greatly improving the hot spot accuracy and reducing the cost of software.

Referring to fig. 5 and fig. 6, fig. 5 is a detailed structural diagram of each testing unit 72 in the abnormal noise measuring apparatus 100 according to another embodiment of the present application, and fig. 6 is an enlarged schematic view of another embodiment of the testing unit 72 in the abnormal noise measuring apparatus 100 corresponding to fig. 5. As shown in fig. 5, the testing unit 72 and the signal processor 71 together form a testing device, and in this embodiment, the signal processor 71 includes a pre-amplifier (pre-amplifier) and a signal processing unit, and a sound pickup module including a plurality of sound pickup devices 74. The sound guide tube 116 connected to the through hole of the test unit 72 is responsible for converging and focusing on a smaller sound receiving range, and the picked-up sound wave is transmitted to the sound pickup element 74 along the sound guide tube 116, so that the sound wave shielding effect is achieved by the wall of the sound guide tube 116, and the sound wave inside the sound guide tube 116 is prevented from escaping. It should be noted that, in other embodiments, the pickup module and the pickup element 74 thereof may also be disposed separately from the signal processor 71 and electrically connected to each other, i.e., the signal processor 71 is independent from the outside of the pickup module.

In this embodiment, one end of each sound guiding tube 116 is connected to the corresponding sound pickup element 74, and each sound pickup element 74 is located in a separate acoustic cavity 78. As shown in another embodiment of fig. 6, the sound waves picked up by the sound collecting element 75 are transmitted to the output port 77 and transmitted to the corresponding sound pickup element 74 through the sound guiding elements a 1-A3 (e.g., sound guiding tubes). According to the actual requirement, sound collecting elements 75 with different shapes and materials can be adapted to the input port 76 of the testing unit 72, wherein the sound collecting elements 75 are helpful for adjusting the focus size of sound collection focus, and the shape of the sound collecting elements 75 can be horn-shaped, cone-shaped or square-shaped. The sound collecting element 75 is connected to one end of the sound guiding elements A1-A3 and is communicated with each other. In addition, the length, diameter, shape, hardness and shielding of the sound guide elements A1-A3 can be freely adjusted. The support 81 of the receiver-end nozzle connects the input port 76 near the device under test 110 to the sound collecting element 75.

Referring again to fig. 5, the PCB 73 of the test element may be considered as a support for the pickup element 74, which is used to hold one or more pickup elements (e.g., a microphone or other pickup). Each pickup element 74 is located in a separate acoustic cavity 78, separated from adjacent acoustic cavities by an acoustic shielding material, to avoid crosstalk and external sound interference. Each independent cavity 78 is connected to an end of a corresponding sound tube 116. The sound pickup device 74 converts the sound wave signal into an electric signal, and then, a signal processing unit connected to the signal processor 71 at the rear end performs noise analysis and hot spot position determination. Particularly, although the sound collecting element 75 is disposed at one end of the sound guiding tube 116 or the sound guiding elements a 1-A3 of the test array unit 72 shown in fig. 5 and fig. 6, in other embodiments, the sound collecting element 75 is not disposed at one end of the sound guiding tube 116 or the sound guiding elements a 1-A3, and the sound guiding tube 116 or the ports of the sound guiding elements a 1-A3 can be directly used to perform near-field sound collection on the dut 110.

The present application can perform near-field, ultra-near-field, and even contact type sound reception through the structure of the sound guiding tube 116 or the sound collecting element 75, so as to achieve the goal of precise positioning. In addition, the size of the sound pickup focus (Focal Spot) can be adjusted, and the sound pickup element can be far away from the sound pickup port, so that the sound pickup port has great freedom to arrange the dot matrix (Spot array) modes of sound pickup according to the piece to be tested 110, such as arrangement mode, space and the like, and is not limited by the size of the sound pickup element and the influence of a cable line.

The application mainly realizes the detection of automatically detecting the noise source through the jig, especially the abnormal sound position positioning and diagnosis. Specifically, when the object or device to be examined is vibrated by the environment or the object collocated around to cause the abnormal sound phenomenon of the examined device caused by the resonance effect, in order to find the specific position causing the abnormal sound, the specific position is further used for the targeted maintenance treatment of the bad device. On the other hand, in the present application, the sound leading elements a1 to A3 or the sound collecting element 75 are mainly used for near-field (or very near-field) sound collection and conduction, and are converted into electric signals, and then the electric signals are automatically processed and interpreted by a computer. Because the near field signal characteristic is obtained through the signal processing mode and AI training, the abnormal sound can be strengthened and the seismic source sound can be removed, thereby achieving the high resolution effect. The sound leading elements A1-A3 or the sound collecting element 75 are used for multi-point sound detection, so that the effect of abnormal sound positioning can be achieved at one time, and the manual repeated single-point measurement can be avoided. For example, when the device to be tested is a keyboard or a notebook computer, the size of the device may be 13.3 to 17 inches, if the positions of the fixed points are scanned one by one manually, which is time-consuming and inefficient (the hot spot position cannot be found out by human error), and the abnormal sound measuring device 100 of the present application is used for one-time scanning and positioning in combination with the AI algorithm, the hot spot can be effectively positioned in a very short time, which is convenient for the engineering personnel to perform subsequent maintenance or design change.

In summary, the present application effectively solves the problems of the prior art through the above novel scheme, and particularly can perform a one-time product debugging in a stable mechanized and computerized manner, thereby well improving the debugging accuracy and saving the labor burden. In addition, the method and the device do not increase too much cost, and well solve the problem that a large amount of labor cost is consumed to detect the hot spot position of the electronic product in the prior art under the condition of meeting the economic benefit.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments. The embodiments described above are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present application, except for the design of the embodiments in the present application, which is consistent with the embodiments in the present application, belong to the protection scope of the present application.

The foregoing embodiments have been described in detail, and specific examples are used herein to explain the principles and implementations of the present application, and the above description of the embodiments is only used to help understand the technical solutions and their core ideas of the present application. Those of ordinary skill in the art will understand that: it is to be understood that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for some of the technical features thereof, without departing from the scope of the technical solutions of the embodiments of the present application.

In summary, although the present application has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be determined by the appended claims.

Claims (13)

1. An abnormal sound measuring apparatus, comprising:

supporting the shaft member;

the placing platform is used for placing the piece to be tested;

the fixing piece is arranged on the placing platform and used for fixing the piece to be detected;

the vibrator is used for vibrating the placing platform; and

the test element comprises at least one test unit, the test unit is carried on the supporting shaft piece to slide on the supporting shaft piece, the test element comprises a plurality of sound pickup elements, each sound pickup element is used for connecting one end of a sound guide element or a first sound collection element, and each sound pickup element is positioned in an independent acoustic cavity; the testing unit further comprises a plurality of through holes, each through hole is used for connecting the sound guide element or the first sound collecting element, and a first distance is formed between each through hole and the adjacent through hole; when the testing unit is driven by an electric signal to slide above the piece to be tested, the other end of the sound guide element or the first sound collecting element is used for receiving sound for the piece to be tested.

2. The abnormal sound measuring device according to claim 1, wherein the member to be measured is disposed on a first surface of the placement platform, and the vibrator is disposed on the first surface or a second surface of the placement platform, wherein the first surface is opposite to the second surface.

3. The abnormal sound measuring device of claim 1, further comprising a conductive member disposed between the vibrator and the placement platform and directly connected to the vibrator and the placement platform, respectively.

4. The abnormal sound measuring device according to claim 1, wherein the sound guide member has a tubular structure.

5. The abnormal sound measuring device according to claim 1, wherein said other end of said sound guide member is connected to a second sound collecting member.

6. The abnormal noise measuring device of claim 1, wherein the design criteria of the distance between two adjacent sound guiding elements or first sound collecting elements and the distance between the sound guiding elements or the first sound collecting elements and the object to be measured satisfy the following formula:

wherein x is a horizontal distance between two adjacent sound guide elements or first sound collecting elements, y is a vertical distance between the piece to be tested and the sound guide elements or the first sound collecting elements, and dB is a decibel unit.

7. The abnormal noise measuring device of claim 1, wherein the platform is provided with a plurality of supporting members, and each supporting member has a fixed distance from the adjacent supporting member.

8. The apparatus of claim 1, wherein the test element further comprises a signal processor, wherein the pickup element is a micro microphone unit, and the signal processor is coupled to each of the micro microphone units for converting the analog signal from each of the micro microphone units into a digital signal.

9. The abnormal sound measurement device of claim 1, wherein the acoustic cavity and the pickup element are disposed within the test unit.

10. The abnormal sound measurement device of claim 8, wherein the acoustic cavity and the pickup element are disposed within the signal processor.

11. The abnormal sound measuring device of claim 1, further comprising a base having an inclined opening at a top thereof, the opening having an inclination of 30 to 60 degrees.

12. The abnormal sound measuring device of claim 1, wherein when the sound pickup element is connected to the sound guide element, the through hole comprises an input port for connecting to a second sound collecting element and an output port for connecting to the other end of the sound guide element.

13. The abnormal sound measuring device according to claim 3, wherein the conductor is included in the vibrator and located above the vibrator.

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