CN217517021U - Cover assembly and vapor deposition apparatus - Google Patents

Cover assembly and vapor deposition apparatus Download PDF

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Publication number
CN217517021U
CN217517021U CN202221484128.6U CN202221484128U CN217517021U CN 217517021 U CN217517021 U CN 217517021U CN 202221484128 U CN202221484128 U CN 202221484128U CN 217517021 U CN217517021 U CN 217517021U
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China
Prior art keywords
cover
lid
lid assembly
vapor deposition
deposition apparatus
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CN202221484128.6U
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Chinese (zh)
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李陶刘晨
李政
张金彪
高学东
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Zhongxin Nanfang Integrated Circuit Manufacturing Co ltd
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Zhongxin Nanfang Integrated Circuit Manufacturing Co ltd
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Abstract

The present application provides a cover assembly and a vapor deposition apparatus, the cover assembly includes a first cover, and the first cover includes: the cover main body covers part of the plasma conveying pipeline adjacent to the spray head device, and the top surface of the cover main body is a smooth surface and is provided with a heat dissipation hole; the mounting panel, with lid main part integral type shaping and be used for with the shower nozzle device is installed, the mounting panel with screw torsion when the shower nozzle device installation is not less than the default. The lid assembly of the present application can reduce arcing at the junction of the showerhead arrangement and the plasma delivery conduit.

Description

Cover assembly and vapor deposition apparatus
Technical Field
The present disclosure relates to a vapor deposition apparatus, and more particularly to a cover assembly and a vapor deposition apparatus.
Background
The vapor deposition device is a common apparatus for film deposition in the semiconductor field, and although the current vapor deposition device can meet the basic requirements of film deposition, the current vapor deposition device has many defects in the process of actual use. When a wafer is placed on one of the nozzles of the machine for film deposition, the other nozzle without the wafer can reflect more electromagnetic waves due to the absence of the wafer, so that the temperature of the other nozzle is increased. In addition, the connection part of the electromagnetic wave transmission pipeline and the spray head device often generates an electric arc phenomenon.
SUMMERY OF THE UTILITY MODEL
The technical problem that this application will be solved provides a lid subassembly can reduce the electric arc of shower nozzle device and plasma delivery pipe junction.
In order to solve the above technical problem, the present application provides a cover assembly installed in a vapor deposition apparatus, the vapor deposition apparatus including a showerhead device and a plasma delivery pipe connecting the showerhead device, the cover assembly including a first cover, and the first cover including: the cover main body covers on part of the plasma conveying pipeline adjacent to the spray head device, and the top surface of the cover main body is a smooth surface and is provided with a heat dissipation hole; the mounting panel, with lid main part integral type shaping and be used for with the shower nozzle device is installed, the mounting panel with screw torsion when the shower nozzle device installation is not less than the default.
In some embodiments, the screw torque is not less than 5N.
In some embodiments, the mounting plate has a width of 0.5cm to 3 cm.
In some embodiments, the width of the cap body is 2cm to 3 cm.
In some embodiments, the side wall of the cover main body is further provided with a positioning column.
In some embodiments, the cap assembly further comprises: and the second cover is used for covering the sprayer device, and at least one side of the second cover is of a mesh structure.
In some embodiments, three sides of the second cover are mesh structures, and the remaining one side and the top surface are non-mesh structures.
In some embodiments, at least one heat dissipation fan is embedded in the side face with the mesh structure.
In some embodiments, the power line of the heat dissipation fan is electrically connected with the power supply line of the vapor deposition device.
The present application further provides a vapor deposition apparatus comprising a showerhead device, a plasma delivery conduit connected to the showerhead device, and the aforementioned lid assembly.
Compared with the prior art, the cover assembly of the technical scheme at least has the following beneficial effects:
arranging a first cover, wherein a cover main body of the first cover covers a part of a plasma conveying pipeline adjacent to the sprayer device, and the top surface of the cover main body is a smooth surface and is provided with a heat dissipation hole, so that burrs are not generated on the top surface of the cover main body, and the possibility of point discharge is reduced; the mounting panel of first lid and lid main part integral type shaping just are used for installing with the shower nozzle device, and screw torsion when installing is not less than the default simultaneously to make the laminating of first lid and shower nozzle device inseparabler, further reduce the probability that electric arc phenomenon takes place.
Set up the second lid on the shower nozzle device, and the at least one side of second lid is mesh structure, it is concrete can to make three side be mesh structure, all the other sides and top surface are non-mesh structure, can neither reduce isolated electromagnetic radiation's ability, can increase the inside circulation of air of second lid again, be favorable to reducing the shower nozzle temperature, and then extension shower nozzle life-span, can also reduce the number of times that leads to constantly triggering the detection mechanism because of the system detects the temperature anomaly simultaneously, and then can reduce engineer's unnecessary inspection number of times. At least one cooling fan is embedded in the side face with the mesh structure, so that air circulation in the second cover can be further accelerated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural view of a showerhead apparatus according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a first cover according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a second cover according to an embodiment of the present application;
FIG. 4 is a schematic view of an assembly of a second cover and a gas dissociation device according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a second cover (with a heat dissipation fan) according to an embodiment of the present disclosure;
fig. 6 is a schematic view illustrating an assembly of the head unit and the second cover according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", and the like, are used in an orientation or positional relationship based on that shown in the figures, which is for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus, are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
A vapor deposition apparatus, such as a chemical vapor deposition apparatus, mainly includes a showerhead apparatus, a gas dissociation apparatus, and a plasma delivery conduit connecting the gas dissociation apparatus and the showerhead apparatus. The gas dissociation device can be used for gas (such as NF) dissociation during vapor deposition 3 ) And dissociating, wherein the dissociated plasma enters the spray head device through the plasma conveying pipeline and is sprayed onto the wafer by the spray head device.
Referring to fig. 1, the showerhead apparatus 1 mainly includes a first showerhead 1A and a second showerhead 1B for ejecting gas, and the first showerhead 1A and the second showerhead 1B may be operated simultaneously or individually. The temperature of the nozzle device 1 can reach more than 400 ℃, so that a protective cover needs to be arranged to cover the nozzle device 1 to prevent an operator from being scalded when touching the nozzle device by mistake. When the first nozzle 1A of the nozzle device 1 works and the second nozzle 1B does not work, since no wafer is arranged on the second nozzle 1B, in the deposition process, the electromagnetic field of the second nozzle 1B changes, the energy of reflected electromagnetic waves is larger, so that the temperature of the second nozzle 1B is higher, the system detects abnormal temperature and continuously triggers a detection mechanism, engineers can frequently go to check, and a series of operations are needed to continue the production line after the check is finished, so that the increase of the temperature of the nozzles not only can shorten the service life of the nozzles, but also can consume the labor cost and the time cost to ensure the normal operation of the production line.
Meanwhile, in order to prevent the leakage of electromagnetic waves at the connection between the plasma delivery pipe (not shown) and the showerhead device 1, a cover 2 is disposed on a portion of the plasma delivery pipe adjacent to the showerhead device 1, but if the cover 2 is not properly designed, an arc phenomenon occurs, which causes residual charges on the showerhead and affects the deposition process. At present lid 2 is combination formula lid, and its junction can cause electric arc phenomenon, can directly weld the wire netting on the lid surface for the heat dissipation simultaneously, consequently has more burr, very big probably produces point discharge phenomenon.
Based on this, the embodiment of the application provides a cover assembly, can reduce shower nozzle device and plasma conveying pipeline junction's electric arc, can also reduce shower nozzle device's temperature.
Referring to fig. 2, a cover assembly of the embodiment of the present application is installed in the vapor deposition apparatus, the cover assembly includes a first cover 2, and the first cover 2 includes a cover body 21 and a mounting plate 22, wherein the cover body 21 covers a portion of a plasma transport pipe adjacent to the showerhead apparatus 1, a top surface 210 of the cover body 21 is a smooth surface, and the top surface 210 is opened with a heat dissipation hole 23. The top surface 210 of the second cap 2 is directly perforated, so that the possibility of point discharge caused by burrs after the existing cap uses a wire mesh can be greatly reduced. The number and the distribution mode of the heat dissipation holes 23 are designed according to actual requirements.
The width of the cover main body 21 can be 2 cm-3 cm, and the wider cover main body can increase the contact area and reduce the point discharge caused by virtual connection.
The mounting plate 22 and the cover main body 21 are formed in an integrated mode, and the electric arc phenomenon of the combined cover caused by combination connection is avoided. Meanwhile, in order to further alleviate the arc phenomenon, the mounting plate 22 and the nozzle device 1 may be connected by threads, and the torsion of the screw during mounting is not lower than a preset value. In the embodiment of the present application, the screw torsion is not lower than 5N, so that the mounting plate 22 and the spray head device 1 are more attached, which is beneficial to reducing electric arcs. Meanwhile, the mounting plate 22 has a larger width to increase the contact area and reduce the point discharge caused by the virtual connection, and the width of the mounting plate 22 may be 0.5cm to 3 cm.
In order to fix the cover main body 21, the sidewall of the cover main body 21 may be further provided with a positioning column (not shown), and the specific position and shape of the positioning column are not required as long as the positioning effect can be achieved.
The internal structure of the first cover 2 is adapted to the plasma transport duct, which will not be described.
Referring to fig. 3, the cover assembly further includes a second cover 3, the second cover 3 is used for covering the spray head device 1, and at least one side of the second cover 3 is a mesh structure. The mesh structure does not reduce the ability of isolating electromagnetic radiation, but also increases the air circulation inside the second cover 3, which is beneficial to reducing the temperature of the spray head. In order to achieve a good air flow, as many surfaces as possible are provided in a mesh structure. In the embodiment of the present application, three of the side surfaces of the second cover 3 are made into a mesh structure, and the other side surface 31 and the top surface 32 are made into a non-mesh structure, wherein the non-mesh structure side surface 31 is used as a detaching surface to meet daily detaching requirements. The top surface 32 of the non-mesh structure may be provided with other means, such as a gas dissociation device 5 (see fig. 4). The gas dissociation device 5 is arranged on the top surface 32 of the second cover 3, and the length of the plasma conveying pipeline can be shortened. The gas dissociation means 5 and the second lid 3 may be fixed by screwing.
Referring to fig. 5, at least one heat dissipation fan 4 may be further embedded in the side surface having the mesh structure, and the heat dissipation fan 4 may accelerate air circulation in the second cover 3, thereby facilitating heat dissipation of the nozzle device 1. The power line of the heat dissipation fan 4 is electrically connected with the power supply line of the vapor deposition device, that is, the power supply of the vapor deposition device also supplies power to the heat dissipation fan 4. The power supply of the heat radiation fan 4 can also be provided by an external power circuit, and the heat radiation fan 4 can also be powered by a battery, but the battery power supply mode needs to be checked and replaced regularly, and the actual use is troublesome. The specific position of the heat dissipation fan 4 is not limited, and may be located on the side surface of the mesh structure. Fig. 4 shows one of the cases where the radiator fan 4 is located on a side 33, the side 33 being opposite to the side 31 of the non-grid structure.
Fig. 6 shows a schematic view of the assembly of the second cover 3 and the spray head device 1. The second cover 3 and the nozzle device 1 can be fixed by a threaded connection, for example, a fixing nut 11 is provided on the nozzle device 1, a bolt is provided at a corresponding position on the top surface of the second cover 3, and the second cover 3 is fixedly covered on the nozzle device 1 by the cooperation of the fixing nut and the bolt. The bottom of the side of the second cover 3 and the corresponding position of the spray head device 1 can also be fixed by means of screw connection.
An embodiment of the present application further provides a vapor deposition apparatus, including: shower nozzle device, connect the plasma delivery pipe of shower nozzle device and this application embodiment's lid subassembly.
In conclusion, upon reading the present detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure can be presented by way of example only, and not limitation. Those skilled in the art will appreciate that the present application is intended to cover various reasonable variations, adaptations, and modifications of the embodiments described herein, although not explicitly described herein. Such alterations, improvements, and modifications are intended to be suggested by this disclosure, and are within the spirit and scope of the exemplary embodiments of this disclosure.
Furthermore, certain terminology has been used in this application to describe embodiments of the disclosure. For example, "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. Therefore, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various portions of this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined as suitable in one or more embodiments of the disclosure.
It should be appreciated that in the foregoing description of embodiments of the disclosure, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure aiding in the understanding of the subject disclosure. Alternatively, various features may be dispersed throughout several embodiments of the application. This is not to be taken as an admission that any of the features of the claims are essential, and it is fully possible for a person skilled in the art to extract some of them as separate embodiments when reading the present application. That is, embodiments in the present application may also be understood as an integration of multiple sub-embodiments. And each sub-embodiment described herein is equally applicable in less than all features of a single foregoing disclosed embodiment.
Each patent, patent application, publication of a patent application, and other material, such as articles, books, descriptions, publications, documents, articles, and the like, cited herein is hereby incorporated by reference. All matters hithertofore set forth herein except as related to any prosecution history, may be inconsistent or conflicting with this document or any prosecution history which may have a limiting effect on the broadest scope of the claims. Now or later associated with this document. For example, if there is any inconsistency or conflict in the description, definition, and/or use of terms associated with any of the included materials with respect to the terms, descriptions, definitions, and/or uses associated with this document, the terms in this document are used.
Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Accordingly, the disclosed embodiments are presented by way of example only, and not limitation. Those skilled in the art may implement the present application in alternative configurations according to the embodiments of the present application. Thus, embodiments of the present application are not limited to those embodiments described with accuracy in the application.

Claims (10)

1. A lid assembly for installation in a vapor deposition apparatus comprising a showerhead arrangement and a plasma delivery conduit connected to the showerhead arrangement, wherein the lid assembly comprises a first lid comprising:
the cover main body covers part of the plasma conveying pipeline adjacent to the spray head device, and the top surface of the cover main body is a smooth surface and is provided with a heat dissipation hole;
the mounting panel, with lid main part integral type shaping and be used for with the shower nozzle device is installed, the mounting panel with screw torsion when the installation of shower nozzle device is not less than the default.
2. The lid assembly of claim 1, wherein the screw torque force is not less than 5N.
3. The lid assembly of claim 1, wherein the mounting plate has a width of 0.5cm to 3 cm.
4. The lid assembly of claim 1, wherein the lid body has a width of 2cm to 3 cm.
5. The lid assembly of claim 1, wherein the sidewall of the lid body is further provided with a positioning post.
6. The lid assembly of claim 1, further comprising: and the second cover is used for covering the sprayer device, and at least one side of the second cover is of a mesh structure.
7. The lid assembly of claim 6, wherein three sides of the second lid are mesh structures and the remaining side and top are non-mesh structures.
8. The lid assembly of claim 7, wherein the side having the mesh structure is further embedded with at least one heat dissipation fan.
9. The lid assembly of claim 8, wherein the power cord of the heat dissipation fan is electrically connected to the power cord of the vapor deposition apparatus.
10. A vapor deposition apparatus, comprising: a showerhead arrangement, a plasma delivery conduit connecting the showerhead arrangement, and a lid assembly as claimed in any one of claims 1 to 9.
CN202221484128.6U 2022-06-14 2022-06-14 Cover assembly and vapor deposition apparatus Active CN217517021U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221484128.6U CN217517021U (en) 2022-06-14 2022-06-14 Cover assembly and vapor deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221484128.6U CN217517021U (en) 2022-06-14 2022-06-14 Cover assembly and vapor deposition apparatus

Publications (1)

Publication Number Publication Date
CN217517021U true CN217517021U (en) 2022-09-30

Family

ID=83391964

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221484128.6U Active CN217517021U (en) 2022-06-14 2022-06-14 Cover assembly and vapor deposition apparatus

Country Status (1)

Country Link
CN (1) CN217517021U (en)

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