CN217514397U - Heating and pressing device - Google Patents

Abstract

The utility model belongs to the field of mold equipment, relates to a mold for manufacturing a PCB hole protective sleeve, and discloses a heating mold pressing device, which comprises a lower mold component and an upper mold component, wherein the lower mold component and the upper mold component are assembled to form a protective sleeve forming cavity and a material discharge hole, and the material discharge hole is connected with the forming cavity; and a heating unit and a temperature sensor are arranged in the lower die assembly. The utility model discloses heating mould pressing device can be according to the supporting production protective sheath of supply of material quantity of PCB board, and is with low costs, and the cycle is nimble, is favorable to impeling the product supply progress. Through setting up the hole of leaking for discharge unnecessary forming material, be favorable to the shaping chamber to be filled up by forming material completely, the protective sheath shaping is very complete, needn't very accurate control forming material's single addition.

Description

Heating and pressing device

Technical Field

The utility model belongs to the mould equipment field relates to the mould of preparation PCB diaphragm orifice protective sheath.

Background

In the attached drawings of the prior invention patent CN114554725B of the applicant, fig. 6 shows that a composite PCB has a conductive hole, and as the requirements of users on the application field of the composite PCB are higher and higher, especially the requirements on the quality of the hole wall of the conductive hole are very high, mechanical grinding and wiping are not allowed to be performed on the processed hole wall of the conductive hole, so as to avoid surface damage of the hole wall caused by any factor, mainly because the PCB is prevented from being broken down by high-voltage discharge in the use process.

Based on this, the applicant has developed a protective sleeve specially used for PCB board to prevent the hole wall from being scratched and dust from adhering, and the protective sleeve is not disclosed at present. The special protective sleeve is simple in structure, but the surface of the protective sleeve contacting with the hole of the PCB is required to be smooth, and damage to the surface of the hole wall of the conductive hole due to installation of the protective sleeve is avoided.

The inventor is accomplishing the utility model discloses an in-process, through document retrieval and market searching, find that there is not the special protective sheath of PCB board electrically conductive hole among the prior art, more do not make the mould of protective sheath.

According to the actual conditions of product inspection, at present, the temporary demand of protective sheath is still comparatively less, if adopt equipment production such as injection molding machine, injection mould, with high costs, cycle length, and the protective sheath needs to make usefulness now, avoids protective sheath surface itself by the fish tail or adhere to the dust, causes the damage to the electrically conductive hole of PCB board.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims to provide a make mould of special protective sheath of PCB board conductive hole.

The inventor provides a heating and pressing device which comprises a lower die assembly and an upper die assembly, wherein the lower die assembly and the upper die assembly are assembled to form a protective sleeve forming cavity and a material discharge hole, and the material discharge hole is connected with the forming cavity; and a heating unit and a temperature sensor are arranged in the lower die assembly.

According to an embodiment of the heating and molding device of the present invention, the lower mold assembly includes a lower mold substrate, a ring groove is disposed on the lower mold substrate, a limit ring is disposed in the ring groove, an inner diameter of the limit ring is larger than an inner diameter of the ring groove, an outer diameter of the limit ring is equal to an outer diameter of the ring groove, and a height of the limit ring is equal to a depth of the ring groove; the upper surface of the limiting ring and the transition part of the inner hole are provided with sunken annular steps, and the limiting ring is also provided with at least one first chute; the first discharging groove and the ring groove form a first discharging hole.

According to the utility model discloses heating mold pressing device's an embodiment, the annular lateral wall is provided with first location portion, the spacing ring lateral wall is provided with second location portion, and first location portion and the combination of second location portion constitute the locating hole, the locating pin is installed to the dismantlement formula on the locating hole.

According to an embodiment of the heating and molding device of the present invention, the heating unit is a heating rod, a heating rod mounting hole is provided in the lower mold substrate, and the heating rod mounting hole is horizontally disposed below the ring groove; the heating rod is fixedly arranged in the heating rod mounting hole.

According to the utility model discloses heating mold pressing device's an embodiment, be provided with the sensor mounting hole in the lower mould base plate, temperature sensor fixed mounting is in the sensor mounting hole.

According to the utility model discloses heating mold pressing device's an embodiment, the sensor mounting hole is a plurality of, sets up respectively in heating rod mounting hole both sides.

According to the utility model discloses heating mold pressing device's an embodiment, the bottom of annular is provided with the mould jackscrew hole to lower mould base plate bottom, goes up the downthehole mould jackscrew that installs of mould jackscrew.

According to an embodiment of the heating and pressing apparatus of the present invention, the upper mold assembly includes an upper mold base plate, and the upper mold base plate is detachably connected to the lower mold base plate; a first pressing die mounting hole is formed in the upper die base plate, and the diameter of the first pressing die mounting hole is equal to the outer diameter of the annular step; the first pressing die mounting hole is provided with a first pressing die, the first pressing die comprises a first pressing plate and a pressing ring, and the first pressing plate is detachably connected with the upper die substrate; the height of the pressure ring is equal to or close to the thickness of the upper die substrate, and the inner diameter of the pressure ring is equal to the inner diameter of the annular groove; a second discharging groove is formed in the lower bottom surface of the upper die base plate, extends to the outer edge of the upper die base plate, and forms a second discharging hole with the lower die base plate; the first discharging hole is communicated with the second discharging hole.

According to the utility model discloses an embodiment of heating die arrangement, the second moulding-die is installed to the dismantlement formula on the first moulding-die, the second moulding-die includes second clamp plate and compression leg, the second clamp plate is connected with first clamp plate dismantlement formula, the compression leg diameter equals the compression leg internal diameter, and the length of compression leg is greater than the height of first moulding-die.

According to the utility model discloses add hot-pressing device's an embodiment, be provided with first cotter hole on the lower mould base plate, upward be provided with second cotter hole on the mould base plate, first cotter hole with second cotter hole passes through pin joint.

Compared with the prior art, one of the technical solutions has the following advantages:

a) the composite PCB manufactured by the applicant is currently used in the special technical field, the demand of the protective sleeve is relatively small, and if the composite PCB is produced by adopting equipment such as an injection molding machine and an injection mold in small batches, the cost is high, and the period is long. The utility model discloses heating mould pressing device can be according to the supporting production protective sheath of the supply of material quantity of PCB board, and is with low costs, and the cycle is nimble, is favorable to advancing the product supply progress.

b) The utility model discloses heating mould pressing device both can adopt manual processing production protective sheath, and the later stage also can further realize semi-automatization or automated production according to the demand according to the increase of PCB board output.

c) The utility model discloses in the embodiment of heating mold pressing device, through setting up the hole of discharging for discharge unnecessary forming material, be favorable to the die cavity to be filled up by forming material completely, the protective sheath shaping is very complete, needn't very accurate control forming material's single use amount.

d) The utility model discloses in the embodiment of heating mould pressing device, through heating rod and temperature sensor, can real time control forming material's forming temperature.

e) The utility model discloses in the embodiment of heating die arrangement, through setting up first moulding-die and second moulding-die, can extrude the shaping intracavity with molten forming material.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a front view of a preferred embodiment of the heating and pressing apparatus of the present invention.

Fig. 2 is a schematic perspective view of fig. 1.

FIG. 3 is a schematic sectional view A-A of FIG. 1.

Fig. 4 is a schematic perspective exploded view of fig. 1.

Fig. 5 is a schematic perspective view of a spacing ring in a preferred embodiment of the heating and molding apparatus of the present invention.

Fig. 6 is a schematic cross-sectional view of a lower mold base plate in a preferred embodiment of the heating and pressing apparatus of the present invention.

Fig. 7 is a schematic perspective view of an upper mold substrate according to a preferred embodiment of the heating and molding apparatus of the present invention.

The labels in the figure are respectively:

100, a lower die base plate is arranged,

101, the ring grooves are arranged in the circular groove,

1011 a first positioning portion of the first positioning member,

102 heating the mounting hole of the rod and,

1021 heating the top thread hole of the rod,

103 a mounting hole for the sensor, and a mounting hole,

1031 a screw hole of the sensor,

104 a first one of the pin holes is,

105 a first screw hole of the first screw hole,

106, a die-top thread hole is formed,

110 of the position-limiting ring is arranged on the upper surface of the shell,

111 a first chute for discharging the liquid from the tank,

112 a second positioning portion of the second side of,

113 positioning pins for positioning the back-end of the back-end plate,

114 an annular step in the shape of a ring,

120 heating the rod by the heating device to heat the rod,

130 of the temperature of the liquid crystal display panel,

200 of an upper die base plate, 200 of a lower die base plate,

201 a first die mounting hole is provided,

202 a second chute, wherein the second chute is provided with a discharge opening,

203 the lower die is connected with the hole,

204 of the second pin hole of the second pin,

205 a second screw hole 205 of the first screw,

210 a first die-pressing step of a first die,

211 a first pressure plate to be pressed against the first,

2111 a second die mounting hole, and,

2112 a substrate connection hole is formed,

2113 a third screw hole, and a third screw hole,

212 the pressure of the pressure ring is pressed,

220 a second die-pressing step of pressing,

221 a second pressure plate, which is provided with a second pressure plate,

2211 the press-molding of the connecting hole,

222 the pressure of the column is increased by the pressure of the column,

300 protective sheath.

Detailed Description

The following description is made with reference to the accompanying drawings and a specific embodiment.

To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

The heating and molding apparatus described in this embodiment is used to heat and mold the protective sleeve 300. The protective sleeve 300 includes a ring-shaped substrate and a sleeve, and is formed by heating a water-soluble polymer material, such as water-soluble polyvinyl chloride (PVC), to melt the water-soluble polymer material, forming the water-soluble polymer material in a forming cavity, and performing a mold release process after cooling. The protection sleeve 300 is installed on the conductive hole of the PCB, so that the conductive hole of the PCB is protected. After the PCB board of installation protective sheath 300 transported many times, there is the pipe cuff of protective sheath 300 the possibility that has the friction damage, directly takes off protective sheath 300 and can cause the fish tail to the electrically conductive downthehole wall. Therefore, the applicant selects a water-soluble polymer material as the molding material of the protective sheath 300. When the protective sleeve 300 is taken, the protective sleeve 300 is dissolved in water through ultrasonic washing, and the problem of hole wall surface quality protection of a product can be perfectly solved by packaging a PCB.

See fig. 1-7. The heating mold pressing device that this embodiment described, including lower mould subassembly and last mould subassembly, lower mould subassembly and last mould subassembly are assembled and are constituted protective sheath molding cavity and blowdown hole, and the bottom in blowdown jogged joint molding cavity to extend to the surface that heats mold pressing device, blowdown jogged joint molding cavity. The discharging hole is Z-shaped and comprises a lower horizontal section, a vertical section and an upper horizontal section. A heating unit for melting the molding material and a temperature sensor 130 for detecting a heating temperature are installed in the lower mold assembly. The shape of the protective sheath forming cavity is the same as that of the protective sheath 300, and the material discharge hole is used for discharging redundant forming materials, namely water-soluble polymer materials, in the forming cavity, so that the protective sheath 300 is filled and formed more completely in the forming cavity.

The lower die assembly comprises a lower die base plate 100, referring to fig. 3 to 6, a ring groove 101 is arranged on the lower die base plate 100, a limit ring 110 is arranged in the ring groove 101, the inner diameter of the limit ring 110 is larger than the inner diameter of the ring groove 101, the outer diameter of the limit ring 110 is equal to the outer diameter of the ring groove 101, and the height of the limit ring 110 is equal to the depth of the ring groove 101; a pipe sleeve forming space is formed between the inner hole wall of the limiting ring 110 and the inner side wall of the ring groove 101. The transition part between the upper surface of the limiting ring 110 and the inner hole is provided with a sunken annular step 114, and the annular step 114 and the lower surface of the pressure ring 212 form an annular substrate forming space. The stop collar 110 is further provided with at least one first chute 111, specifically, at least one first chute 111 is provided from the lower surface of the stop collar 110 to the side wall of the stop collar 110, and fig. 6 shows 4 first chutes 111; the first discharging groove 111 and the ring groove 101 form a first discharging hole. The first discharging hole is a first section of the discharging hole, a first orifice of the first discharging hole is connected with the bottom of the forming cavity, the bottom of the first discharging hole extends outwards to guide flow through the limiting ring 110, the outer side wall of the limiting ring 110 guides flow upwards, the height of a second orifice of the first discharging hole is equal to the height of the ring groove 101, and it is guaranteed that the amount of the residual forming material in the forming cavity meets the requirement of complete forming of the protective sleeve 300.

In order to align the first discharging hole and the second discharging hole to form a complete discharging hole, the sidewall of the ring groove 101 is provided with a first positioning portion 1011, the outer sidewall of the stop ring 110 is provided with a second positioning portion 112, the first positioning portion 1011 and the second positioning portion 112 are combined to form a positioning hole, and the positioning hole is detachably provided with a positioning pin 113, so that the same mounting position of the stop ring 110 is ensured.

The heating unit is a heating rod 120, a heating rod mounting hole 102 is formed in the lower die substrate 100, and the heating rod mounting hole 102 is horizontally arranged below the annular groove 101; the heating rod 120 is fixedly installed in the heating rod installation hole 102. In the present embodiment, the heating rod 120 is fixed by a jackscrew, and specifically, referring to fig. 5, at the bottom of the lower mold substrate 100, a heating rod jackscrew hole 1021 is provided perpendicularly crossing the heating rod mounting hole 102, a heating rod jackscrew is mounted in the heating rod jackscrew hole 1021, and the heating rod 120 is fixed by the heating rod jackscrew. The heating rod 120 is a heating resistor, and generates heat when energized to heat the lower mold substrate 100, so that the molding material is melted in the molding cavity and then cooled to be molded.

A sensor mounting hole 103 is formed in the lower mold substrate 100, and the temperature sensor 130 is fixedly mounted in the sensor mounting hole 103. In this embodiment, the number of the temperature sensors 130 is 4, and the temperature sensors are symmetrically arranged on two sides of the hot rod mounting hole 102. Sensor plug holes 1031 are respectively provided at the top and bottom of the lower die base plate 100 so as to perpendicularly cross the sensor mounting holes 103, and sensor plugs are mounted in the sensor plug holes 1031 to fix the temperature sensor 130.

See fig. 5 and 6. An upper die jackscrew hole 106 is formed from the bottom of the annular groove 101 to the bottom of the lower die base plate 100, and an upper die jackscrew is installed in the upper die jackscrew hole 106. The upper die jackscrew is used for ejecting the limiting ring 110 in the ring groove 101 and the formed protective sleeve 300, removing residual materials at the position of the material discharge hole, smoothing the position of the material discharge hole at the end part of the sleeve, and taking down the protective sleeve 300 to be installed on the conductive hole of the PCB in time.

Referring to fig. 5 and 7, the upper mold assembly of the heating and pressing apparatus includes an upper mold base plate 200, and the upper mold base plate 200 is detachably coupled to the lower mold base plate 100. In this embodiment, the upper die base plate 200 is a ring plate. In this embodiment, a bolt connection is adopted. The lower die base plate 100 is provided with a first pin hole 104, the upper die base plate 200 is provided with a second pin hole 204, the first pin hole 104 is connected with the second pin hole 204 through a pin, and the mounting positions of the lower die base plate 100 and the upper die base plate 200 are fixed firstly, so that the first discharging hole is aligned with the second discharging hole. The upper surface of the lower mold base plate 100 is provided with a plurality of first screw holes 105, correspondingly, the upper mold base plate 200 is provided with a plurality of lower mold connecting holes 203, and the lower mold connecting holes 203 and the first screw holes 105 are connected by first bolts. The inner wall of the lower die connecting hole 203 is unthreaded, and the upper die base plate 200 is tightly attached to the lower die base plate 100 and the limit ring 110 under the action of the first bolt.

Further, referring to fig. 7, the upper die base plate 200 is provided with a first die mounting hole 201, and the diameter of the first die mounting hole 201 is equal to the outer diameter of the annular step 114; from the viewpoint of optimizing the structural dimensions, the lower surface of the upper die base plate 200 completely coincides with the upper surfaces of the lower die base plate 100 and the retainer ring 110. A second discharging groove 202 is arranged on the lower bottom surface of the upper die base plate 200, the second discharging groove 202 extends to the outer edge of the upper die base plate 200, and the second discharging groove 202 and the lower die base plate 100 form a second discharging hole; the first discharging hole is communicated with the second discharging hole to form a complete discharging hole.

Referring to fig. 1 to 4, a first stamper 210 is mounted on the first stamper mounting hole 201, the first stamper 210 includes a first pressing plate 211 and a pressing ring 212, and the first pressing plate 211 is detachably connected to the upper mold substrate 200; the height of clamping ring 212 equals or is close to the thickness of last mould base plate 200, the internal diameter of clamping ring 212 equals the annular 101 internal diameter. In this embodiment, the first pressing plate 211 is connected to the upper mold base 200 by bolts. Specifically, a plurality of second screw holes 205 are formed in the upper surface of the upper mold base plate 200, a plurality of base plate connection holes 2112 are correspondingly formed in the first pressing plate 211, the base plate connection holes 2112 and the second screw holes 205 are connected by second bolts, and the inner walls of the base plate connection holes 2112 are unthreaded. The molding material is subjected to a pressing process by adjusting a distance between the first stamper 210 and the upper mold substrate 200.

Referring to fig. 1 to 4, a second pressing die 220 is detachably mounted on the first pressing die 210, the second pressing die 220 includes a second pressing plate 221 and a pressing column 222, the second pressing plate 221 is detachably connected to the first pressing plate 211, the diameter of the pressing column 222 is equal to the inner diameter of the pressing ring 212, and the length of the pressing column 222 is greater than the height of the first pressing die 210. The inner hole of the press ring 212 is a second press die mounting hole 2111, and in this embodiment, the first press die 210 is connected to the second press die 220 through a bolt. Specifically, the first pressing plate 211 is provided with a plurality of third screw holes 2113, the second pressing plate 221 is correspondingly provided with a plurality of pressing die connecting holes 2211, the third screw holes 2113 and the pressing die connecting holes 2211 are connected through third bolts, and the inner walls of the pressing die connecting holes 2211 are not threaded. In the process of the present invention, the initial pressing mold design is integrated, and the first pressing mold 210 and the second pressing mold 220 are not designed separately, so that more molding material is extended from the top of the inner hole of the protection sleeve (based on the direction of the front view in fig. 3). The second stamper 220 is mainly used to press the molding material back into the molding cavity from between the pressing post 222 and the lower mold substrate 100, so that there is no molding material on the top of the inner hole of the protective sleeve, or there is only a thin film, which is simply processed.

In the description of the present invention, it is to be understood that the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The above are only preferred embodiments of the present invention, and it should be noted that the above preferred embodiments should not be considered as limitations of the present invention, and the scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the spirit and scope of the invention, and such modifications and enhancements are intended to be within the scope of the invention.

Claims (10)

1. The heating and pressing device is characterized by comprising a lower die component and an upper die component, wherein the lower die component and the upper die component are assembled to form a protective sleeve forming cavity and a material discharging hole, and the material discharging hole is connected with the forming cavity; and a heating unit and a temperature sensor are arranged in the lower die assembly.

2. The heated molding apparatus of claim 1, wherein the lower mold assembly comprises a lower mold base plate, the lower mold base plate is provided with a ring groove, a limit ring is placed in the ring groove, the inner diameter of the limit ring is larger than the inner diameter of the ring groove, the outer diameter of the limit ring is equal to the outer diameter of the ring groove, and the height of the limit ring is equal to the depth of the ring groove; the upper surface of the limiting ring and the transition part of the inner hole are provided with sunken annular steps, and the limiting ring is also provided with at least one first chute; the first discharge groove and the annular groove form a first discharge hole.

3. The heated molding apparatus as claimed in claim 2, wherein the side wall of the ring groove is provided with a first positioning portion, the outer side wall of the retainer ring is provided with a second positioning portion, the first positioning portion and the second positioning portion are combined to form a positioning hole, and a positioning pin is detachably mounted on the positioning hole.

4. The heating and molding device as claimed in claim 2, wherein said heating unit is a heating rod, and a heating rod mounting hole is provided in said lower mold base plate, and is horizontally disposed below the ring groove; the heating rod is fixedly arranged in the heating rod mounting hole.

5. The heating and molding device as claimed in claim 4, wherein said lower mold base plate has a sensor mounting hole therein, and the temperature sensor is fixedly mounted in the sensor mounting hole.

6. The heated die pressing apparatus as claimed in claim 5, wherein the sensor mounting holes are plural and are respectively provided on both sides of the heating rod mounting hole.

7. The heating and molding apparatus as claimed in claim 2, wherein an upper die screw hole is provided from the bottom of said ring groove to the bottom of said lower die base plate, and an upper die screw is installed in said upper die screw hole.

8. The heated molding press as claimed in any one of claims 2 to 7, wherein said upper die assembly comprises an upper die base plate, said upper die base plate being detachably connected to said lower die base plate; a first pressing die mounting hole is formed in the upper die base plate, and the diameter of the first pressing die mounting hole is equal to the outer diameter of the annular step; the first pressing die mounting hole is provided with a first pressing die, the first pressing die comprises a first pressing plate and a pressing ring, and the first pressing plate is detachably connected with the upper die substrate; the height of the pressure ring is equal to or close to the thickness of the upper die substrate, and the inner diameter of the pressure ring is equal to the inner diameter of the annular groove; a second discharge chute is arranged on the lower bottom surface of the upper die base plate, extends to the outer edge of the upper die base plate, and forms a second discharge hole with the lower die base plate; the first discharging hole is communicated with the second discharging hole.

9. The heated molding apparatus of claim 8 wherein said first die has a second die removably mounted thereon, said second die comprising a second platen removably attached to said first platen and a compression leg, said compression leg having a diameter equal to the inner diameter of said compression ring and a length greater than the height of said first die.

10. The heating and molding apparatus as claimed in claim 8, wherein said lower mold base plate has a first pin hole, said upper mold base plate has a second pin hole, and said first pin hole and said second pin hole are connected by a pin.

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