CN217509150U - Automatic line burning and supplementing device for PCB - Google Patents
Automatic line burning and supplementing device for PCB Download PDFInfo
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- CN217509150U CN217509150U CN202221172894.9U CN202221172894U CN217509150U CN 217509150 U CN217509150 U CN 217509150U CN 202221172894 U CN202221172894 U CN 202221172894U CN 217509150 U CN217509150 U CN 217509150U
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- 230000001502 supplementing effect Effects 0.000 title claims abstract description 38
- 238000012360 testing method Methods 0.000 claims abstract description 27
- 239000000523 sample Substances 0.000 claims description 13
- 238000012544 monitoring process Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 abstract description 6
- 230000008439 repair process Effects 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001931 thermography Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The utility model discloses an automatic line burning and supplementing device for a PCB, which comprises a frame, a PCB clamping device arranged in the frame, two vertical slide rails arranged at the two opposite outer sides of the frame and capable of sliding along the X axis, a CCD aligning device arranged on the vertical slide rails and capable of sliding along the Y axis, a flying needle testing device, a line burning device, a line feeding device, a line supplementing device and a control device; the CCD alignment device, the flying needle testing device, the wire burning device, the wire feeding device and the wire supplementing device are respectively and electrically connected with the control device. The utility model provides an automatic line device of mending of burning wire of PCB board, reducible or replace manual operation, short circuit, the maintenance of opening a way is efficient.
Description
Technical Field
The utility model relates to a technical field is repaired to the printed wiring board, concretely relates to automatic line device of mending of burning line of PCB board.
Background
The circuit board is one of the important parts in the electronic industry, and is a support body of electronic components and a carrier for connecting electric appliances, and the circuit board is conducted through a circuit arranged on the circuit board. In the production process, the phenomenon of open circuit or short circuit of the circuit may occur, and in order to solve the problem of open circuit and short circuit of the circuit board, the defective circuit board needs to be repaired.
The existing circuit board circuit open/short circuit maintenance process is as follows: and (4) electrically measuring and printing points- > manually finding and maintaining the points. This method has the following disadvantages: manual stations are occupied, and the operation is complicated; the manual operation can not be durable, and the wrong repair and the missed repair caused by fatigue are easy to occur; the manual operation efficiency is low, and the cost of labor is high.
Therefore, a method for replacing labor, time and labor saving and reducing production cost is urgently needed to be found for overcoming the defects existing in the PCB circuit open-short circuit maintenance process in the prior art.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide an automatic line device of mending of burning line of PCB board, reducible or replace manual operation, short circuit, open a way maintenance efficiency height.
In order to solve the above problem, the technical scheme of the utility model is as follows:
an automatic line burning and supplementing device for a PCB comprises a frame, a PCB clamping device arranged in the frame, vertical slide rails arranged on two opposite outer sides of the frame and capable of sliding along an X axis, a CCD (charge coupled device) aligning device arranged on the vertical slide rails and capable of sliding along a Y axis, a flying probe testing device, a line burning device, a line feeding device, a line supplementing device and a control device;
the CCD alignment device, the flying needle testing device, the wire burning device, the wire feeding device and the wire supplementing device are respectively and electrically connected with the control device.
Furthermore, at least two groups of vertical sliding rails are respectively arranged on two sides of the frame.
Further, the burning device and the line repairing device are ultraviolet picosecond lasers.
Further, the line supplementing device is an ultraviolet picosecond laser, and the line burning device is a low-voltage adjustable high-current line burning device.
Furthermore, two sets of vertical sliding rails are respectively arranged on two sides of the frame, one of the two sets of vertical sliding rails is provided with an ultraviolet picosecond laser, and the other set is provided with a wire feeding device.
Furthermore, two groups of vertical slide rails are respectively arranged on two sides of the frame, one of the two groups of vertical slide rails is provided with an ultraviolet picosecond laser, the other group is provided with a wire feeding device, and each group of vertical slide rails is provided with a low-voltage adjustable large-current wire burning device.
Furthermore, the ultraviolet picosecond laser is a coaxial CCD (charge coupled device) monitorable ultraviolet picosecond laser and comprises a laser optical fiber module, a laser calibration module, a laser light splitting module connected with the laser calibration module, a laser focusing module connected with one side of the laser light splitting module, a coaxial monitoring CCD connected with the other side of the laser light splitting module and a laser protection glass module connected with the laser focusing module.
Furthermore, the vertical slide rail is driven by a high-precision linear motor module to move along the X-axis direction;
the CCD alignment device, the flying needle testing device, the wire burning device, the wire feeding device and the wire supplementing device are driven by the high-precision linear motor module to move along the Y-axis direction.
Furthermore, two sets of vertical slide rails are respectively arranged on two sides of the frame, a set of flying probe testing device is correspondingly arranged on each set of vertical slide rails, and one side of each set of flying probe testing device is connected with a set of CCD aligning device.
Furthermore, the PCB clamping device comprises guide rails and a clamp, wherein the guide rails are arranged on two opposite inner sides of the frame and are arranged along the vertical direction, and the clamp slides along the guide rails.
Compared with the prior art, the utility model provides an automatic line device of mending that burns of PCB board, beneficial effect lies in:
one, the utility model provides an automatic line device of mending of burning of PCB board can realize flying the needle automatically and look for some tests, according to the automatic line of mending of burning and open circuit line of the automation that test result realized short circuit line, and the circuit maintenance is accurate, efficient.
Two, the utility model provides an automatic line device of mending of burning line of PCB board, reducible or replace manual operation, reduce the cost of labor, and improve work efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first embodiment of an automatic wire burning and repairing device for a PCB board provided by the present invention;
FIG. 2 is a view of the PCB shown in FIG. 1 taken along direction A;
FIG. 3 is a view of the PCB shown in FIG. 1, taken along the direction B, of the automatic wire burning and repairing device;
FIG. 4 is a schematic diagram of the structure of the UV picosecond laser of FIG. 2;
FIG. 5 is a schematic structural view of the copper wire feeding device in FIG. 2;
fig. 6 is a schematic partial structural view of a second embodiment of the automatic wire burning and repairing device for a PCB board according to the present invention;
fig. 7 is a schematic structural view of another angle of the automatic wire burning and repairing device for the PCB shown in fig. 6.
Detailed Description
In order to make the technical solution in the embodiments of the present invention better understood and make the above objects, features and advantages of the present invention more obvious and understandable, the following description of the embodiments of the present invention is provided with reference to the accompanying drawings.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example one
Please refer to fig. 1 to fig. 3, wherein fig. 1 is a schematic structural diagram of a first embodiment of an automatic wire burning and repairing device for a PCB board according to the present invention; FIG. 2 is a view of the PCB shown in FIG. 1 taken along direction A; fig. 3 is a view of the PCB panel of fig. 1 showing the automatic wire burning and repairing apparatus in the direction of B. The automatic line burning and supplementing device for the PCB comprises a frame 1, a PCB clamping device 2 arranged in the frame, vertical guide rails 3 arranged on two opposite outer sides of the frame 1, a CCD (charge coupled device) aligning device 4 arranged on the vertical guide rails 3 and capable of sliding along the Y axis, a flying probe testing device 5, a line burning device 6, a line feeding device 7, a line supplementing device 8 and a control device (not numbered). The CCD alignment device 4, the flying probe testing device 5, the wire burning device 6, the wire feeding device 7 and the wire supplementing device 8 are respectively electrically connected with the control device.
In this embodiment, the frame 1 includes a set of transverse beams 11 and a set of longitudinal beams 12 that are disposed oppositely, wherein the number of the set of transverse beams 11 and the set of longitudinal beams 12 is two, and two ends of the longitudinal beams 12 are connected with two ends of the transverse beams 11, so that the transverse frame and the longitudinal frame form a square frame.
The PCB clamping device 2 comprises a guide rail 21 arranged inside two longitudinal beams of the frame 1, and a clamp 22 connected with the guide rail 21. The guide rail 21 extends in a longitudinal direction and the clamp 22 is used for clamping the circuit board during operation. The clamp 22 comprises an upper clamp plate and a lower clamp plate, the upper clamp plate and the lower clamp plate respectively move up and down along the extending direction of the guide rail, and the positions of the upper clamp plate and the lower clamp plate are adjusted to adapt to the repair of circuit boards with different specifications and sizes.
The vertical guide rails 3 are distributed on two sides of the frame 1 and located on the outer side of the frame 1. The vertical guide 3 is movable in the extension direction of the transverse beam of the frame 1, i.e. slidable in the X-axis. Specifically, set up linear guide respectively in the both sides of two sets of transverse beams, vertical guide 3 is connected with the linear guide cooperation, and it passes through the drive of high-accuracy linear electric motor module to improve vertical guide's removal precision.
The vertical guide rail 3 needs to bear a CCD alignment device 4, a flying needle testing device 5, a wire burning device 6, a wire feeding device 7 and a wire supplementing device 8, and needs to detect and repair two surfaces of the circuit board, so that at least two groups of vertical slide rails are arranged on two sides of the frame respectively.
In this embodiment, frame both sides set up two sets of vertical slide rails 3 respectively, and CCD aligning device 4, flying needle testing arrangement 5, fever line device 6, send traditional thread binding putting 7 and mend traditional thread binding putting 8 rational arrangement on two sets of vertical slide rails. And CCD aligning device 4, flying needle testing arrangement 5, burn line device 6, send line device 7 and mend line device 8 and can slide from top to bottom in the extending direction of vertical slide rail, slide along Y axle direction promptly, and it adopts high-accuracy linear motor module drive equally to improve the moving accuracy of each part, make flying needle look for some, burn line and mend line operation more accurate.
In this embodiment, the CCD alignment devices 4 are four groups, that is, each group of vertical slide rails 3 is provided with a group of CCD alignment devices. The working principle of the CCD alignment device 4 is: the characteristic positions of the product are photographed and taken by a special CCD camera, an industrial lens and a light source, image data are collected by an image Processor (PC) to be processed, the actual position of the product is judged by position operation, the actual offset value of the product is calculated by comparing the actual offset value with a preset reference position (corresponding position in a circuit board image stored in a control device), and the product is moved to the preset reference position by controlling the movement of an alignment platform, so that the aims of rapidness, closed loop and high precision are fulfilled.
In this embodiment, it sets up a set of needle testing arrangement 5 that flies to correspond on every group vertical slide rail, and every group flies needle testing arrangement 5 one side and connects a set of CCD aligning device 4, forms paraxial CCD aligning device. The electric probe of the flying probe testing device 5 is contacted with the pin of the circuit board and carries out electric measurement, and transmits a detection signal to the control device, and the control device matches the detection signal with the parameter data of the preset circuit board to determine an open circuit and a short circuit point, so as to control the accurate action of the wire burning device and the wire supplementing device.
In this embodiment, the burning device 6 and the line repairing device 8 are ultraviolet picosecond lasers or carbon dioxide lasers. Please refer to fig. 4, which is a schematic structural diagram of the uv picosecond laser shown in fig. 2. The ultraviolet picosecond laser is a coaxial CCD (charge coupled device) monitorable ultraviolet picosecond laser and comprises a laser input optical fiber module 81, a laser calibration module 82, a laser splitting module 83 connected with the laser calibration module 82, a laser focusing module 84 connected with one side of the laser splitting module 83, a coaxial monitoring CCD 85 connected with the other side of the laser splitting module 83 and a laser protection glass module 86 connected with the laser focusing module 84.
The working principle of the ultraviolet picosecond laser is as follows: the laser control device comprises a control device, a laser calibration module, a laser focusing module, a laser protection glass module, a circuit board and a welding line, wherein the control device comprises a touch display screen, a laser working pulse width, frequency, wavelength and other parameters, and the laser calibration module receives laser through the laser optical fiber module → the laser calibration module calibrates the laser to the laser beam splitting module → the laser beam splitting module adjusts the light wavelength → the laser focusing module adjusts the laser light emitting focusing intensity → the laser protection glass module is arranged on the circuit board → the circuit board is burnt or welded. The working principle of the carbon dioxide laser is basically the same as that of the ultraviolet picosecond laser.
Wherein, the wire burning means that the place which is not connected between two or more lines is connected and conducted (short circuit), and the place which is not connected and conducted is burnt out by laser or common heavy current through strong current; the patch cord is disconnected at a place where the middle of the line should not be disconnected, and is connected by laser welding a copper wire.
The wire repairing process needs the matching of a wire repairing device and a wire feeding device, and the wire feeding device 7 is used for providing copper wires for positions needing wire repairing. Please refer to fig. 5, which is a schematic structural diagram of the copper wire feeding device in fig. 2. The wire feeding device 7 comprises a connecting plate 71 connected with the vertical guide rail 3, a copper wire feeding control plate 72 arranged on the connecting plate 71, a supporting plate 73 connected with one side of the connecting plate, a copper wire feeding motor 74 and a wire feeding head 75 arranged on one side of the supporting plate 73, and a copper wire 76 passing through the wire feeding head 75 and pulled by the copper wire feeding motor.
The automatic line burning and supplementing device for the PCB of the embodiment has the following working principle:
the wire burning principle is as follows:
generating a corresponding inspection line path according to a line GerBer file, controlling a flying probe testing device to find a short-circuit line part (two or more lines which are not conducted are conducted) according to path monitoring by a control device, applying low-voltage low current to the line to be tested, monitoring a line heating point by a paraxial CCD (charge coupled device) alignment device (infrared thermal imaging) and confirming the line short-circuit heating part;
the control device plans a line supplementing path according to a line GerBer file, generates the line supplementing path, controls the line burning device (an ultraviolet picosecond laser and/or a carbon dioxide laser) to move to a heating part, adjusts corresponding frequency and power, and removes ink at a short circuit part by using a laser beam without damaging a circuit board substrate;
and monitoring the state before line burning of the short circuit point of the circuit by a CCD (charge coupled device) alignment device (infrared thermal imaging), planning a line burning path by the control device according to a line GerBer file, controlling an ultraviolet picosecond laser to move according to the planned path, and setting corresponding power frequency by a program to burn a copper wire at the short circuit part without damaging a circuit board substrate or slightly damaging the circuit board substrate within a controllable range so as to repair the short circuit part of the circuit board.
The line supplementing principle is as follows:
generating a corresponding inspection line path according to the line GerBer file, and controlling the flying probe testing device to find a line open circuit position according to path monitoring by the control device;
the state before line repair is monitored by a paraxial CCG contraposition device (infrared thermal imaging), a control device plans a line repair path according to a line GerBer file and generates a line repair path, a line repair and feeding device is controlled to feed copper wires to an open circuit line according to the line repair path, meanwhile, ultraviolet picosecond laser welds the copper wires according to the planned line repair path, the state after line repair is monitored by the paraxial CCG contraposition device after welding is finished, and the line repair effect is electrically detected again.
Example two
Please refer to fig. 6 and fig. 7 in combination, wherein fig. 6 is a schematic partial structural diagram of a second embodiment of the automatic wire burning and repairing device for a PCB board according to the present invention; fig. 7 is a schematic structural view of the automatic wire burning and repairing device of the PCB shown in fig. 6 at another angle. Basically the same as the structure of the first embodiment, the difference is that: the wire burning device 6a in the automatic wire burning and wire supplementing device for the PCB adopts a low-voltage adjustable large-current wire burning device, and a low-voltage adjustable large-current wire burning device is arranged on each group of vertical slide rails. The low-voltage adjustable large-current wire burning device adopts a commercially available low-voltage large-current generator, and the specific structure is not described in detail herein.
In this embodiment, the line repair adopts an ultraviolet picosecond laser line repair mode, and correspondingly, the structure also needs to be provided with a copper wire feeding device and an ultraviolet picosecond laser, and the structures of the copper wire feeding device and the ultraviolet picosecond laser are the same as those of the first embodiment. In fig. 6 and 7, in order to show the structure and the installation position of the low-voltage adjustable large-current burn-in device, a copper wire feeding device and an ultraviolet picosecond laser are omitted in the drawings.
The automatic line burning and supplementing device for the PCB of the embodiment has the following working principle:
the wire burning principle is as follows:
generating a corresponding inspection line path according to a line GerBer file, controlling a flying probe testing device to find a short-circuit line part (two or more lines which are not conducted are conducted) according to path monitoring by a control device, applying low-voltage low current to the line to be tested, monitoring a line heating point by a paraxial CCD (charge coupled device) alignment device (infrared thermal imaging) and confirming the line short-circuit heating part;
the control device plans a line supplementing path according to a line GerBer file, generates the line supplementing path, controls the ultraviolet picosecond laser to move to a heating position, adjusts corresponding frequency and power, and removes ink at a short circuit position by a laser beam without damaging a circuit board substrate; it should be noted that this step is an unnecessary step;
monitoring the state before line burning of the short circuit point of the circuit again by a CCD (charge coupled device) alignment device (infrared thermal imaging), planning a line burning path by the control device according to a line GerBer file, and controlling a low-voltage adjustable high-current line burning device to apply high current to burn out a copper wire at the short circuit position without damaging a circuit board substrate or slightly damaging the circuit board substrate within a controllable range so as to repair the short circuit part of the circuit board;
and (5) detecting the circuit again, and repeating the wire burning process once if the circuit is not repaired.
The line-supplementing principle of this embodiment is the same as that of the first embodiment.
Compared with the prior art, the utility model provides an automatic line device of mending that burns of PCB board, beneficial effect lies in:
the utility model provides an automatic line device of mending of burning wire of PCB board can realize flying the needle automatically and look for some tests, according to the automatic line of mending of burning wire and the open circuit line of realizing the automation of short circuit line of test result, and the circuit maintenance is accurate, efficient.
Two, the utility model provides an automatic line device of mending of burning line of PCB board, reducible or replace manual operation, reduce the cost of labor, and improve work efficiency.
The embodiments of the present invention are described in detail with reference to the drawings, but the present invention is not limited to the described embodiments. Various changes, modifications, substitutions and alterations to these embodiments will occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (10)
1. An automatic line burning and supplementing device for a PCB is characterized by comprising a frame, a PCB clamping device arranged in the frame, vertical slide rails arranged on two opposite outer sides of the frame and capable of sliding along an X axis, a CCD aligning device arranged on the vertical slide rails and capable of sliding along a Y axis, a flying probe testing device, a line burning device, a line feeding device, a line supplementing device and a control device;
the CCD alignment device, the flying needle testing device, the wire burning device, the wire feeding device and the wire supplementing device are respectively and electrically connected with the control device.
2. The automatic wire burning and supplementing device for the PCB as recited in claim 1, wherein at least two sets of vertical sliding rails are respectively disposed on two sides of said frame.
3. The automatic line burning and supplementing device of the PCB board as claimed in claim 1, wherein the line burning device and the line supplementing device are ultraviolet picosecond lasers.
4. The automatic wire burning and supplementing device for the PCB as recited in claim 1, wherein the wire supplementing device is an ultraviolet picosecond laser, and the wire burning device is a low-voltage adjustable high-current wire burning device.
5. The automatic wire burning and supplementing device of the PCB as claimed in claim 3, wherein two sets of vertical sliding rails are respectively disposed at two sides of the frame, and one of the two sets of vertical sliding rails is disposed with an ultraviolet picosecond laser, and the other set is disposed with a wire feeding device.
6. The automatic wire burning and supplementing device for the PCB as recited in claim 4, wherein two sets of vertical sliding rails are respectively disposed at two sides of the frame, one of the two sets of vertical sliding rails is disposed with an ultraviolet picosecond laser, the other set is disposed with a wire feeding device, and each set of vertical sliding rails is disposed with a low-voltage adjustable high-current wire burning device.
7. The automatic line burning and supplementing device for the PCB as claimed in claim 3 or 4, wherein the ultraviolet picosecond laser is a coaxial CCD (charge coupled device) monitorable ultraviolet picosecond laser, and comprises a laser optical fiber module, a laser calibration module, a laser beam splitting module connected with the laser calibration module, a laser focusing module connected with one side of the laser beam splitting module, a coaxial monitoring CCD connected with the other side of the laser beam splitting module, and a laser protection glass module connected with the laser focusing module.
8. The automatic wire burning and supplementing device for the PCB as recited in claim 1, wherein the vertical slide rail is driven by a high precision linear motor module to move along the X-axis direction;
the CCD alignment device, the flying needle testing device, the wire burning device, the wire feeding device and the wire supplementing device are driven by the high-precision linear motor module to move along the Y-axis direction.
9. The automatic PCB wire burning and supplementing device according to claim 1, wherein two sets of vertical slide rails are respectively arranged on two sides of the frame, a set of flying probe testing device is correspondingly arranged on each set of vertical slide rails, and one side of each set of flying probe testing device is connected with a set of CCD alignment device.
10. The automatic wire burning and supplementing device for the PCB as claimed in claim 1, wherein the PCB clamping device comprises a guide rail and a clamp, the guide rail is arranged on two opposite inner sides of the frame and is arranged along a vertical direction, and the clamp slides along the guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221172894.9U CN217509150U (en) | 2022-05-16 | 2022-05-16 | Automatic line burning and supplementing device for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221172894.9U CN217509150U (en) | 2022-05-16 | 2022-05-16 | Automatic line burning and supplementing device for PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217509150U true CN217509150U (en) | 2022-09-27 |
Family
ID=83353813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221172894.9U Active CN217509150U (en) | 2022-05-16 | 2022-05-16 | Automatic line burning and supplementing device for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217509150U (en) |
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2022
- 2022-05-16 CN CN202221172894.9U patent/CN217509150U/en active Active
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Address after: 331601 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province, on the east side of Jingong Avenue and the south side of Jingong Avenue, Chengxi Industrial Park Patentee after: Jiangxi Xusheng Electronics Co.,Ltd. Country or region after: China Address before: 331600 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province Patentee before: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Country or region before: China |
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