CN217505014U - Temperature monitoring device - Google Patents
Temperature monitoring device Download PDFInfo
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- CN217505014U CN217505014U CN202221561356.9U CN202221561356U CN217505014U CN 217505014 U CN217505014 U CN 217505014U CN 202221561356 U CN202221561356 U CN 202221561356U CN 217505014 U CN217505014 U CN 217505014U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The utility model relates to a monitoring devices of temperature. The device sets up in the proof box, be equipped with in the proof box and wait to monitor the battery, the device includes: the device comprises an analog-to-digital conversion component, a thermistor and a high-precision resistor; wherein the thermistor and the high-precision resistor are connected in series; the analog-to-digital conversion assembly is electrically connected with the thermistor and the high-precision resistor and used for respectively acquiring a first voltage value at two ends of the thermistor and a second voltage value at two ends of the high-precision resistor and sending the first voltage value and the second voltage value to a processor so as to indicate the processor to determine the temperature corresponding to the resistance value of the thermistor according to the first voltage value and the second voltage value. The device can reduce the complexity and cost of building the battery temperature monitoring device.
Description
Technical Field
The utility model relates to a battery test technical field especially relates to a monitoring devices of temperature.
Background
In testing the performance of a mobile phone battery, it is often necessary to perform the test in a high and low temperature test chamber. During the test, the proof box can be divided into a plurality of independent test spaces, carries out the test of a plurality of batteries simultaneously, and in the testing process, the temperature of battery needs to be monitored, makes the battery temperature keep in a reasonable within range, guarantees that the test condition meets the requirements.
In the existing battery testing technology, a PCB load board is generally used to simulate a battery, and a section of PCB trace resistor and RTD thermistor for simulating the battery load are arranged on the PCB load board. In the test process, the heating behavior of the battery is simulated through the battery simulation board, and the temperature of the battery simulation board is monitored in real time through measuring the RTD thermistor. However, because a 4-wire method is needed to measure the RTD thermistor, 4 wires need to be led out from each independent test space to be connected to an external instrument, and this method has high complexity of environment construction, complex operation, expensive external acquisition instrument and high cost.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a temperature monitoring device for solving the problem of high complexity and cost of environment construction in battery temperature monitoring.
This embodiment provides a monitoring devices of temperature, the device sets up in the proof box, be equipped with in the proof box and wait to monitor the battery, the device includes:
the device comprises an analog-to-digital conversion component, a thermistor and a high-precision resistor;
wherein the thermistor and the high-precision resistor are connected in series;
the analog-to-digital conversion assembly is electrically connected with the thermistor and the high-precision resistor and used for respectively acquiring a first voltage value at two ends of the thermistor and a second voltage value at two ends of the high-precision resistor and sending the first voltage value and the second voltage value to a processor so as to indicate the processor to determine the temperature corresponding to the resistance value of the thermistor according to the first voltage value and the second voltage value.
In one embodiment, the device further comprises a gating switch assembly, and the thermistor and the high-precision resistor are electrically connected with the analog-to-digital conversion assembly through the gating switch assembly, wherein the analog-to-digital conversion assembly and the thermistor, and the analog-to-digital conversion assembly and the high-precision resistor are respectively switched on at different moments through the gating switch assembly.
In one embodiment, the apparatus further comprises a microcontroller, and the analog-to-digital conversion component and the processor are integrated on the microcontroller.
In one embodiment, the microcontroller employs an ADI ADuC834 MCU.
In one embodiment, the device further comprises a micro-current source component, wherein the micro-current source component is electrically connected with a first sub-circuit formed by connecting the thermistor and the high-precision resistor in series and used for supplying current to the first sub-circuit.
In one embodiment, the apparatus further includes a switch component, the switch component is connected in parallel with the thermistor and/or the high-precision resistor to form a second sub-circuit, the second sub-circuit is connected in series with an input end of the analog-to-digital conversion component, the analog-to-digital conversion component acquires a third voltage value when the switch component is closed, and sends the third voltage value to the processor to instruct the processor to calibrate the analog-to-digital conversion component.
In one embodiment, the switch component and the high-precision resistor are connected in parallel to form a second sub-circuit, and the second sub-circuit is connected with the input end of the analog-digital conversion component in series.
In one embodiment, the switch assembly is a mechanical relay switch assembly.
In one embodiment, the precision of the high-precision resistor is higher than a first preset precision, and the precision of the analog-to-digital conversion component is higher than a second preset precision.
In one embodiment, the device is arranged on a PCB, the PCB is also provided with a resistor assembly and a power supply assembly, the resistor assembly is electrically connected with the power supply assembly, and the distance between the resistor assembly and the thermistor is smaller than a preset value.
In the embodiment, a temperature monitoring device is arranged in a test box for battery test, the temperature monitoring device comprises an analog-to-digital conversion assembly, a thermistor and a high-precision resistor, the analog-to-digital conversion assembly is electrically connected with the thermistor and the high-precision resistor, and can acquire voltage values at two ends of the thermistor and the high-precision resistor and send the voltage values to a processor; the processor receives the voltage value of the thermistor and the voltage value of the high-precision resistor, combines the resistance value of the high-precision resistor, and determines the resistance value of the thermistor according to the relation between the resistance value and the voltage in ohm's law; because the resistance value of the thermistor is in corresponding relation with the temperature, the corresponding temperature value can be determined according to the resistance value of the thermistor, so that the real-time monitoring of the temperature can be realized, the connection to the outside is not needed, the operation is simple, and the complexity of the temperature monitoring device is reduced; expensive external instruments are not needed, and the cost is reduced; and a high-precision resistor is added, so that the temperature monitoring precision is ensured.
Drawings
FIG. 1 is a schematic structural view of a temperature monitoring device according to an embodiment;
fig. 2 is a schematic structural diagram of a temperature monitoring device in another embodiment.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In one embodiment, as shown in fig. 1, there is provided a temperature monitoring device disposed in a test chamber having a battery to be monitored therein, the device comprising:
the analog-to-digital conversion component 110, the thermistor 120 and the high-precision resistor 130;
wherein the thermistor 120 and the high precision resistor 130 are connected in series;
the analog-to-digital conversion component 110 is electrically connected to the thermistor 120 and the high-precision resistor 130, and is configured to obtain a first voltage value at two ends of the thermistor 120 and a second voltage value at two ends of the high-precision resistor 130, and send the first voltage value and the second voltage value to a processor, so as to instruct the processor to determine a temperature corresponding to a resistance value of the thermistor 120 according to the first voltage value and the second voltage value.
In this embodiment, when testing the battery, the battery is usually placed in a high and low temperature test box for testing, and the temperature monitoring device provided in this embodiment includes an analog-to-digital conversion component, a thermistor, and a high-precision resistor. An Analog-to-Digital Converter (ADC), which is a device for converting an Analog signal of a continuous variable into a discrete Digital signal; in this embodiment, the analog-to-digital conversion component is used to convert the electrical signal across the resistor into a digital signal. The thermistor is a sensor resistor, the resistance value of which changes with the change of temperature, that is, the corresponding relationship between the resistance value of the thermistor and the temperature can be known according to the definition and the principle of the thermistor. The high-precision resistor is a resistor which requires that various indexes such as resistance value error of the resistor, thermal stability (temperature coefficient) of the resistor, distribution parameters (distributed capacitance and distributed inductance) of the resistor and the like reach certain standards, and compared with a common resistor, the high-precision resistor has higher precision. The thermistor is connected with the high-precision resistor in series, and according to ohm's law and the principle of a series circuit, the voltage at the two ends of the thermistor and the high-precision resistor is in direct proportion to the resistor; the analog-to-digital conversion assembly is electrically connected with the thermistor and the high-precision resistor and used for acquiring voltage values at two ends of the thermistor and voltage values at two ends of the high-precision resistor, namely a first voltage value and a second voltage value, and sending the acquired first voltage value and second voltage value to the processor. Because the voltage value and the resistance value in the series circuit are in direct proportion, the ratio of the first voltage value to the second voltage value is equal to the ratio of the resistance value of the thermistor to the resistance value of the high-precision resistor; the processor obtains the resistance value of the thermistor according to the first voltage value, the second voltage value and the high-precision resistance value, and the temperature value corresponding to the thermistor can be obtained according to the definition of the thermistor, so that the temperature monitoring is realized.
In this embodiment, a temperature monitoring device is arranged in a test chamber for battery testing, the temperature monitoring device includes an analog-to-digital conversion component, a thermistor and a high-precision resistor, the analog-to-digital conversion component is electrically connected with the thermistor and the high-precision resistor, and can acquire voltage values at two ends of the thermistor and the high-precision resistor and send the voltage values to a processor; the processor receives the voltage value of the thermistor and the voltage value of the high-precision resistor, combines the resistance value of the high-precision resistor, and determines the resistance value of the thermistor according to the relation between the resistance value and the voltage in ohm's law; because the resistance value of the thermistor is in corresponding relation with the temperature, the corresponding temperature value can be determined according to the resistance value of the thermistor, so that the real-time monitoring of the temperature can be realized, the connection to the outside is not needed, the operation is simple, and the complexity of the temperature monitoring device is reduced; expensive external instruments are not needed, and the cost is reduced; and a high-precision resistor is added, so that the temperature monitoring precision is ensured.
In one embodiment, the device further comprises a gating switch assembly, and the thermistor and the high-precision resistor are electrically connected with the analog-to-digital conversion assembly through the gating switch assembly, wherein the analog-to-digital conversion assembly and the thermistor, and the analog-to-digital conversion assembly and the high-precision resistor are respectively switched on at different moments through the gating switch assembly.
In this embodiment, the temperature monitoring device further includes a gating switch assembly, and the thermistor and the high-precision resistor are electrically connected to the analog-to-digital conversion assembly through the gating switch assembly, wherein the gating switch assembly is controlled to change the internal port connection thereof, so that the analog-to-digital conversion assembly and the thermistor, and the analog-to-digital conversion assembly and the high-precision resistor are connected at different times, and thus the voltage values at the two ends of the thermistor and the voltage values at the two ends of the high-precision resistor can be measured.
According to the embodiment, the voltage values at two ends of the thermistor and the high-precision resistor can be simultaneously obtained under the condition that only one analog-to-digital conversion assembly is arranged through the gating switch assembly, so that the temperature value can be further obtained, and the cost and the building complexity of the temperature monitoring device are reduced.
In one embodiment, the apparatus further comprises a microcontroller, and the analog-to-digital conversion component and the processor are integrated on the microcontroller.
In this embodiment, the temperature monitoring apparatus further includes a microcontroller, and the analog-to-digital conversion module and the processor are integrated on the microcontroller. In one example, a gating switch component is also integrated on the microcontroller. In another example, the microcontroller further comprises a power supply capable of supplying current to the thermistor and the high precision resistor.
According to the temperature monitoring device, the integration of the temperature monitoring device is realized through the microcontroller integrated with the analog-to-digital conversion assembly and the processor, the structure of the temperature monitoring device is simplified while temperature monitoring can be realized, and the construction complexity of the temperature monitoring device is reduced.
In one embodiment, the microcontroller employs an ADI ADuC834 MCU.
In this embodiment, the microcontroller is an ADI ADuC834MCU, and includes an analog-to-digital conversion component capable of acquiring a voltage value; the temperature control circuit comprises a processor, a temperature sensor and a temperature sensor, wherein the processor can determine a temperature value according to a voltage value and a resistance value; the gating switch component is used for acquiring two voltage values by one analog-to-digital conversion component; the micro-current source is also included to provide current for the series circuit.
In the embodiment, by adopting the ADI ADuC834MCU, the integration of the analog-to-digital conversion component, the processor, the gating switch component and the micro-current source is realized, the temperature monitoring can be realized, the device is simple in structure, and the cost is reduced.
In one embodiment, the device further comprises a micro-current source component, wherein the micro-current source component is electrically connected with a first sub-circuit formed by connecting the thermistor and the high-precision resistor in series and used for supplying current to the first sub-circuit.
In this embodiment, the temperature monitoring device further includes a micro-current source assembly, a sub-circuit formed by connecting the thermistor and the high-precision resistor in series is electrically connected to the micro-current source, and the micro-current source can provide current for the thermistor and the high-precision resistor. In one example, the micro-current source assembly is integrated on a microcontroller.
According to the embodiment, a power supply can be provided for the circuit through the micro-current source component, so that the resistance value of the thermistor can be determined according to ohm's law and the principle of a series circuit, the temperature value is further determined, and the temperature is monitored.
In one embodiment, the apparatus further includes a switch component, the switch component is connected in parallel with the thermistor and/or the high-precision resistor to form a second sub-circuit, the second sub-circuit is connected in series with an input end of the analog-to-digital conversion component, the analog-to-digital conversion component acquires a third voltage value when the switch component is closed, and sends the third voltage value to the processor to instruct the processor to calibrate the analog-to-digital conversion component.
In this embodiment, the temperature monitoring device further includes a switch module, and since the analog-to-digital conversion module has an offset error, in order to eliminate the offset error, a zero voltage during a short circuit needs to be obtained. In the embodiment, a switch component is added, and the switch component can be connected with the thermistor in parallel, the high-precision resistor in parallel or a sub-circuit formed by connecting the thermistor and the high-precision resistor in series; and the second sub-circuit is connected with the input end of the analog-to-digital conversion component in series. Before temperature monitoring, firstly, the power supply and the switch component are turned off, and the analog-to-digital conversion component connected with the second sub-circuit in series outputs a voltage value corresponding to zero voltage at the moment, namely a third voltage value, and sends the third voltage value to the processor; and the processor calibrates the analog-to-digital conversion component according to the third voltage value. In one example, the second sub-circuit is electrically connected to the analog-to-digital conversion assembly through a gating switch assembly, before temperature monitoring, the gating switch assembly communicates the second sub-circuit and the analog-to-digital conversion assembly, the power supply and the switch assembly are turned off, and the analog-to-digital conversion assembly outputs a voltage value corresponding to zero voltage.
In the embodiment, the switch assembly is added into the device, before temperature monitoring, the voltage value of the analog-to-digital conversion assembly corresponding to zero voltage is firstly acquired, and the analog-to-digital conversion assembly is calibrated by the processor according to the voltage value at the moment, so that the offset error of the analog-to-digital conversion assembly can be eliminated, the accuracy of the acquired voltage value is improved, and the accuracy of temperature monitoring is further ensured.
In one embodiment, the switch assembly is connected in parallel with the high precision resistor to form a second sub-circuit, and the second sub-circuit is connected in series with the input end of the analog-to-digital conversion assembly.
In this embodiment, the switch component and the high-precision resistor are connected in parallel to form a second sub-circuit, and the second sub-circuit is connected in series with the input end of the analog-to-digital conversion component. Before temperature monitoring, the switch assembly is closed and the power supply is turned off, a voltage value corresponding to the analog-to-digital conversion assembly is obtained when zero voltage exists, and the processor is used for calibrating.
According to the embodiment, the voltage value of the analog-to-digital conversion assembly when the two ends of the high-precision resistor are short-circuited is obtained, the inaccuracy of error calibration caused by thermistor short-circuit calibration can be avoided, the precision of voltage value measurement is further improved, and the accuracy of temperature monitoring is improved.
In one embodiment, the switch assembly employs a mechanical relay switch assembly.
In this embodiment, the switch assembly is a mechanical relay switch assembly.
In the embodiment, the mechanical relay switch has the advantages of fast action, stable operation, long service life, small size and the like, and the efficiency and the stability of temperature monitoring are ensured.
In one embodiment, the precision of the high-precision resistor is higher than a first preset precision, and the precision of the analog-to-digital conversion component is higher than a second preset precision.
In this embodiment, the precision of the high-precision resistor is higher than a first preset precision, and the precision of the analog-to-digital conversion component is higher than a second preset precision, where the first preset precision and the second preset precision are precision thresholds selected according to an actual application scenario, and within this range, the precision of the temperature monitoring device is greater than or equal to the precision measured by an external instrument. In one example, a high precision resistor may employ a resistor with a precision of 0.2 ppm.
In the embodiment, the precision of the high-precision resistor and the precision of the analog-to-digital conversion assembly are selected, so that the precision value of the temperature monitoring device in the embodiment is greater than the precision of measurement of an external instrument, the structure of the temperature monitoring device is simplified, and the precision of temperature monitoring is guaranteed.
In one embodiment, the device is arranged on a PCB, the PCB is further provided with a resistor assembly and a power supply assembly, the resistor assembly is electrically connected with the power supply assembly, and the distance between the resistor assembly and the thermistor is smaller than a preset value.
In this embodiment, the monitoring devices of temperature sets up on the PCB board, still is provided with resistance component and power supply module on the PCB board, and wherein, resistance component is the resistance component that can simulate the battery condition of generating heat, with power supply module electric connection. On the PCB, because the resistor assembly is an analog battery, the position of a thermistor for measuring the temperature in the temperature monitoring device is close to the resistor assembly, and the distance between the thermistor and the resistor assembly is smaller than a preset value, wherein the preset value is a distance value determined according to an actual application scene, and within the distance, the temperature of the thermistor and the temperature of the resistor assembly can be considered to be consistent, so that the monitoring of the temperature of the battery is realized.
This embodiment, through the battery condition of generating heat of resistance module simulation, set up the distance between thermistor and the resistance module among the temperature monitoring devices to can realize confirming battery temperature through thermistor's resistance, just can realize the simulation of battery and the monitoring of temperature through a PCB board, the environment is built simply, has reduced temperature monitoring's cost.
Fig. 2 is a schematic structural diagram of a temperature monitoring device according to an exemplary embodiment, and as shown in fig. 2, the temperature monitoring device includes a RTD thermistor 210 to be measured, a 1Kohm 0.2ppm high-precision resistor 220, a mechanical relay switch 230, an MCU singlechip 240, an MCU singlechip internal gate switch 241, a micro-current source 242 inside the singlechip, and an MCU singlechip internal ADC (analog-to-digital conversion module) 243. The MCU is ADuC834MCU of ADI, and the model of the high-precision resistor can be Y16291K00000T9R of Vishay. Because the circuit board will be placed in the high low temperature test chamber, and the output precision of MCU internal current source is 200ppm, if direct measurement RTD resistance both ends voltage divide the electric current and calculate RTD resistance, then the precision is lower, can't reach the precision of using the measurement of external instrument. In this embodiment, a high precision resistor R (0.2ppm) is used to improve the monitoring accuracy. In the circuit, an RTD thermistor is connected with a high-precision 1Kohm resistor in series, and a micro-current source integrated in an MCU is used for providing current for the resistor. The voltages at the two ends of the RTD thermistor and the 1Kohm resistor are respectively connected to the input pins of the MCU, and the output of the internal gating switch is connected to the ADC of the MCU. The MCU provides a current I to the external resistor, and the voltage V of the RTD resistor can be respectively tested by the ADC in the MCU rtd And a voltage V of 1Kohm resistance R R . From ohm's law and the principle of series circuits
And then can obtain
The measurement target is changed into the ratio of the RTD resistance to the R voltage, and the precision influence of the current source is eliminated. In this embodiment, the measurement accuracy is mainly affected by the total non-linearity (INL), the offset Error (offset Error) of the ADC can be calibrated by closing the mechanical relay switch to measure the value of 0 measurement range of the ADC, and the Gain Error (Gain Error) and the high-precision resistance precision 0.2ppm of the ADC have little influence on the total accuracy, as shown in formula (1), where a represents the total accuracy of the device, and a represents the total accuracy of the device R Indicating the accuracy of the high precision resistor, the overall accuracy of the device in this example was calculated to be about 15 ppm.
When the device is used for temperature monitoring, firstly, a mechanical relay switch is closed, an MCU (microprogrammed control unit) closes an internal current source, an internal gating switch of the MCU gates a mechanical relay switch channel, and the voltage of a resistor of the closing switch (about 0hm) is measured and used for calibrating the offset error of an ADC (analog to digital converter); then, a mechanical relay switch is opened, a current source in the MCU outputs a small current, and the voltages at two ends of the RTD resistor and the 1Kohm high-precision resistor are respectively tested to be Vrtd and V R (ii) a Finally pass through
And calculating to obtain the resistance value of the thermistor, and using the ratio to counteract errors introduced by the internal current source. The precision of the resistance value of the obtained RTD is about 15.7ppm through tests.
The accuracy and cost of the solution of the present embodiment are shown in table 1.
TABLE 1
This embodiment is through using single MCU singlechip to add a high accuracy resistance, accomplish a PCB with battery analog board and MCU on, no longer need lead to outside test instrument, wiring complexity that can greatly reduced test environment. And the cost of the device is greatly reduced while the precision of temperature measurement is ensured.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
It is to be understood that each of the components of the present application may be a hardware structure or by means of an existing computer program; the communication between the individual components and the external arrangement can be realized by means of existing computer programs. The components and the connections between the components may be implemented by hardware, or by hardware in combination with existing computer programs, without involving modifications to the method.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A temperature monitoring device, wherein the device is disposed in a test chamber, a battery to be monitored is disposed in the test chamber, the device comprises:
the device comprises an analog-to-digital conversion component, a thermistor and a high-precision resistor;
wherein the thermistor and the high-precision resistor are connected in series;
the analog-to-digital conversion assembly is electrically connected with the thermistor and the high-precision resistor and used for respectively acquiring a first voltage value at two ends of the thermistor and a second voltage value at two ends of the high-precision resistor and sending the first voltage value and the second voltage value to a processor so as to indicate the processor to determine the temperature corresponding to the resistance value of the thermistor according to the first voltage value and the second voltage value.
2. The apparatus of claim 1, further comprising a gating switch assembly, wherein the thermistor and the high-precision resistor are electrically connected to the analog-to-digital conversion assembly through the gating switch assembly, and wherein the analog-to-digital conversion assembly and the thermistor, and the analog-to-digital conversion assembly and the high-precision resistor are respectively turned on at different times through the gating switch assembly.
3. The apparatus of claim 1, further comprising a microcontroller, the analog-to-digital conversion component and the processor being integrated on the microcontroller.
4. The apparatus of claim 3, wherein the microcontroller employs an ADI ADuC834 MCU.
5. The device of claim 1, further comprising a micro-current source assembly electrically connected to a first sub-circuit formed by the series connection of the thermistor and the high-precision resistor for providing current to the first sub-circuit.
6. The apparatus of claim 1, further comprising a switch assembly connected in parallel with the thermistor and/or the high-precision resistor to form a second sub-circuit, the second sub-circuit being connected in series with an input of the analog-to-digital conversion assembly, the analog-to-digital conversion assembly obtaining a third voltage value when the switch assembly is closed and sending the third voltage value to the processor to instruct the processor to calibrate the analog-to-digital conversion assembly.
7. The apparatus of claim 6, wherein the switching component is connected in parallel with the high precision resistor to form a second sub-circuit, the second sub-circuit being connected in series with the input of the analog-to-digital conversion component.
8. The apparatus of claim 6, wherein the switch assembly is a mechanical relay switch assembly.
9. The apparatus of claim 1, wherein the precision of the high precision resistor is higher than a first predetermined precision, and the precision of the analog-to-digital conversion component is higher than a second predetermined precision.
10. The device of claim 1, wherein the device is disposed on a PCB, the PCB further having a resistor assembly and a power supply assembly, the resistor assembly and the power supply assembly being electrically connected, and a distance between the resistor assembly and the thermistor being less than a predetermined value.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221561356.9U CN217505014U (en) | 2022-06-21 | 2022-06-21 | Temperature monitoring device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221561356.9U CN217505014U (en) | 2022-06-21 | 2022-06-21 | Temperature monitoring device |
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| CN217505014U true CN217505014U (en) | 2022-09-27 |
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