CN217486699U - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN217486699U CN217486699U CN202220103459.4U CN202220103459U CN217486699U CN 217486699 U CN217486699 U CN 217486699U CN 202220103459 U CN202220103459 U CN 202220103459U CN 217486699 U CN217486699 U CN 217486699U
- Authority
- CN
- China
- Prior art keywords
- signal
- inductive element
- electronic device
- signal transmission
- sensing element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Near-Field Transmission Systems (AREA)
Abstract
The application provides an electronic device, including: a printed circuit board including a signal transmission region; the first sensing element is arranged at a first position on a first surface of the printed circuit board, and the first position corresponds to the signal transmission area; the second sensing element is arranged at a second position on the second surface of the printed circuit board; the second location corresponds to the signal transmission region; wherein the first surface is opposite to the second surface; the magnetic field generated between the first inductive element and the second inductive element is at least partially cancelled.
Description
Technical Field
The present disclosure relates to signal transmission technologies, and particularly to an electronic device.
Background
When an inductance signal is output to an electrical element, due to the continuous and rapid change of the power supply of the inductance input end, relatively large coupled induced electromotive force and current are formed near the inductor, so that a signal layer area below the inductor cannot walk through a high-speed signal line.
SUMMERY OF THE UTILITY MODEL
The technical scheme of the application is realized as follows:
provided is an electronic device including:
a printed circuit board including a signal transmission region;
the first sensing element is arranged at a first position on a first surface of the printed circuit board, and the first position corresponds to the signal transmission area;
the second sensing element is arranged at a second position on the second surface of the printed circuit board; the second location corresponds to the signal transmission region; wherein the first surface is opposite to the second surface;
the magnetic field generated between the first inductive element and the second inductive element is at least partially cancelled.
In the above scheme, the layer in which the signal transmission region is located is different from the first sensing element and the second sensing element.
In the above scheme, the first sensing element and the second sensing element are connected in parallel to receive the same power signal.
In the above solution, the projection of the second position on the vertical direction of the first surface or the second surface completely overlaps or partially overlaps with the projection of the first position on the vertical direction of the first surface or the second surface.
In the above aspect, the coil winding direction of the first inductive element is opposite to the coil winding direction of the second inductive element.
In the above solution, the first sensing element and the second sensing element have the same specification parameters.
In the above scheme, the phase parameters of the first inductive element and the second inductive element are equal.
In the above scheme, the inductance values of the first and second sensing elements are equal.
In the above scheme, the signal transmission region is at least used for transmitting a first rate signal and/or a first frequency signal;
the transmission rate of the first rate signal is greater than a first rate threshold;
the transmission frequency of the first frequency signal is greater than a first frequency threshold.
In the above solution, the signal transmission region includes a first signal transmission region and a second signal transmission region;
the first signal transmission area is located at the first position or the second position and is used for transmitting the first speed signal and/or the first frequency signal, and the second signal transmission area is used for transmitting the second speed signal and/or the second frequency signal; wherein a transmission rate of the second rate signal is less than or equal to the first rate threshold; the transmission frequency of the second frequency signal is less than or equal to the first frequency threshold.
The electronic device provided by the application comprises a first sensing element arranged at a first position on a first surface of a printed circuit board, a second sensing element arranged at a second position on a second surface of the printed circuit board, and a magnetic field generated between the first sensing element and the second sensing element is at least partially offset, so that when the first sensing element and the second sensing element receive the same power supply signal, the power supply signal can be divided into two identical paths of signals to be output to a target electrical component through the first sensing element and the second sensing element which are connected in parallel, and therefore interference of the power supply signal can be reduced, and high-speed signals can be transmitted between the first sensing element and the second sensing element.
Drawings
FIG. 1 is a first schematic view of an electronic device according to the present application;
FIG. 2 is a schematic structural diagram of an electronic device according to the present application;
FIG. 3 is a third schematic view of the electronic device according to the present application;
FIG. 4 is a fourth schematic view of the electronic device according to the present application;
fig. 5 is a schematic structural diagram of an electronic device according to the present application.
Detailed Description
The technical solution of the present application is further described in detail with reference to the drawings and specific embodiments.
Fig. 1 is a schematic structural diagram of an electronic device in the present application, and as shown in fig. 1, the electronic device includes: a Printed Circuit Board (PCB) 10, a first inductive element 20, and a second inductive element 30.
The PCB 10 includes a signal transmission area (shown in fig. 2), and a signal transmission line may be disposed in the signal transmission area for transmitting signals of the electrical components on the PCB 10, and the signal transmission line may pass through the first inductive element 20 and/or the second inductive element 30, or may not pass through the first inductive element 20 and/or the second inductive element 30. The first sensing element 20 is disposed at a first position on the first surface of the PCB board 10, where the first position corresponds to a signal transmission area; the second sensing element 30 is disposed at a second position on the second surface of the PCB board 10, where the second position corresponds to the signal transmission area; wherein the first surface is opposite to the second surface.
For example, as shown in fig. 1, the first surface refers to an upper surface of the PCB board 10, and the second surface refers to a lower surface of the PCB board 10, the upper surface and the lower surface being opposite. And as viewed in the direction indicated by the arrow in fig. 1, the first position of the first sensing element 20 and the second position of the second sensing element 30 completely overlap with each other in a projection in a vertical direction of the first surface or the second surface of the PCB 10.
As shown in fig. 2, there is a certain misalignment between the first position of the first inductive element 20 and the second position of the second inductive element 30, specifically, when viewed in the direction indicated by the arrow on fig. 2, a projection of the first position of the first inductive element 20 and a projection of the second position of the second inductive element 30 in the vertical direction of the first surface or the second surface of the PCB board 10 at least partially overlap within the dashed box.
In the present application, the magnetic field generated between the first inductive element 20 and the second inductive element 30 is at least partially cancelled.
Specifically, in the present application, the first sensing element 20 and the second sensing element 30 are connected in parallel, and for a power output of the same path (such as a DC-DC power), the power output can be divided into two paths on a PCB, wherein one path is connected to the first sensing element 20, and the other path is connected to the second sensing element 30, so that the first sensing element 20 and the second sensing element 30 can receive a power signal of the same path and divide the power signal into two paths of signals, which are output to a target electrical component (such as a Central Processing Unit (CPU) on the PCB). The first inductive element 20 and the second inductive element 30 are symmetrically arranged and have the same specification parameters, and in addition, according to the principle that the inductive coil generates coupling induced current, the generated magnetic field is perpendicular to the plane of the PCB board, and the direction of the induced current generated in the corresponding other layer depends on the winding direction of the inductive coil, so the winding direction of the coil of the first inductive element 20 is opposite to the winding direction of the coil of the second inductive element 30. In this way, when the first inductive element 20 and the second inductive element 30 receive the same power signal, since the first inductive element 20 and the second inductive element 30 are completely or partially symmetrically disposed on the opposite surfaces of the PCB 10 and have the same specification parameters, the current changes received by the first inductive element 20 and the second inductive element 30 are equal, the change speed of the magnetic field generated between the first inductive element 20 and the second inductive element 30 is also the same, and since the winding direction of the coil of the first inductive element 20 is opposite to the winding direction of the coil of the second inductive element 30, the magnetic field generated between the first inductive element 20 and the second inductive element 30 and the induced current can be completely cancelled or at least partially cancelled.
Here, the specification parameters of the first sensing element 20 and the second sensing element 30 are the same, and specifically, the phase parameters and/or the inductance values between the first sensing element 20 and the second sensing element 30 may be the same.
In this application, the signal transmission area on the PCB 10 can be at least used for transmitting the first speed signal and/or the first frequency signal. Under the condition that the signal transmission area is used for transmitting a first speed signal and/or a first frequency signal, the transmission speed of the first speed signal is greater than a first speed threshold value; the transmission frequency of the first frequency signal is greater than a first frequency threshold.
For example, the first rate threshold is 12M/s, the transmission rate of the first rate signal is 480M/s, and the first rate signal is characterized as a high-speed signal. Here, the high-speed signal refers to a signal transmitted on a high-speed signal line, and when the rise time of the signal is less than 6 times the signal transmission delay time, the signal is considered as a high-speed signal. Such as clock signals, differential signals, DDR data signals, DDR control and command signals; high-speed signals include single-ended high-speed signals and differential signals. In one example, the USB signal is a high speed signal.
For another example, the first frequency threshold is 300kHz, the frequency of the first frequency signal is 30MHz, and the first frequency signal is a high frequency signal. Here, the high frequency signal refers to a signal transmitted on a high frequency signal line, and may also be referred to as an analog signal with a higher operating frequency, such as a radio frequency signal, which has a frequency range from 300kHz to 300GHz and a high frequency (greater than 10 kHz); radio frequencies (300kHz-300GHz) are the higher frequency bands of high frequencies. In one example, the high frequency signal is, for example, a cell phone signal.
When the signal transmission line of the first speed signal and/or the first frequency signal passes through the first sensing element 20 and/or the second sensing element 30, because the first sensing element 20 and the second sensing element 30 are located on the front and back sides of the PCB and are symmetrically routed, and the set specification parameters are the same, and the first sensing element 20 and the second sensing element 30 are connected in parallel, the current change and the magnetic field change of the same power signal received by the first sensing element 20 and the second sensing element 30 are the same, and when the same power signal received by the first sensing element 20 and the second sensing element 30 is divided into the same two paths to be output, and because the winding directions of the coils of the first sensing element 20 and the second sensing element 30 are opposite, the inductive crosstalk of the inductance between the first sensing element 20 and the second sensing element 30 can be eliminated, so that the signal line of the first sensing element 20 and/or the second sensing element 30 can also travel at a high speed, thereby providing more routing space for the high speed signal lines.
In the present application, the layers of the PCB board 10 where the signal transmission regions are located are different from the first and second sensing elements 20 and 30, respectively.
For example, as shown in fig. 3, the PCB board 10 includes three layers, namely a first layer 101, a second layer 102 and a third layer 103, wherein the first sensing element 20 is located on a first surface (as shown in the figure) of the first layer 101, the second element 30 is located on a second surface (as shown in the figure) of the third layer 103 of the sensing element, and the signal transmission area is located on a third surface and/or a fourth surface (as shown in the figure) of the second layer 102. A third surface of the second layer 102 is a surface of the second layer 102 contacting the first layer 101, and a fourth surface of the second layer 102 is a surface of the second layer 102 contacting the third layer 103. That is, the signal transmission region is located between the first layer 101 and the second layer 102, and between the second layer 102 and the third layer 103.
As shown in fig. 3, the second layer 102 is a signal transmission region, and the area of the second layer 102 may be equal to the area of the first layer 101 and the third layer 103, and it can also be understood that the coverage area of the signal transmission region is equal to the area of the first layer 101 and the third layer 102, so as to also illustrate that the first position of the first sensing element 20 on the PCB board 10 corresponds to the signal transmission region, and the second position of the second sensing element 30 on the PCB board 10 corresponds to the signal transmission region.
This application is through setting up signal transmission district in with first inductive element 20 and second inductive element 30 different layers, can not receive electrical components's position restriction, increases the wiring space of signal line and reduces the wiring cost and the wiring complexity of signal line.
As shown in fig. 4, in the present application, the signal transmission area on the PCB 10 may specifically include a first signal transmission area 1021 and a second signal transmission area 1022; the first signal transmission section 1021 is used for transmitting a first speed signal and/or a first frequency signal, and the first signal transmission section 1021 may be located at a first position or a second position of the PCB 10, where projections of the first position and the second position on the PCB 10 where the first signal transmission section 1021 is located are overlapped with projections of the first position and the second position on the PCB 10 where the first sensing element 20 and the second sensing element 30 are located, in a vertical direction of the first surface of the PCB 10. Overlapping here refers to relative overlap, not absolute overlap. In other words, the first signal transmission region is located directly below the first sensing element 20 or directly above the second sensing element 30.
The second signal transmission area 1022 is configured to transmit a second rate signal and/or a second frequency signal, where a transmission rate of the second rate signal is less than or equal to the first rate threshold; the transmission frequency of the second frequency signal is less than or equal to the first frequency threshold. The second signal transmission region 1022 may be located at a third position (as shown in fig. 4) different from the first position or the second position on the PCB 10, or may be located directly below the first sensing element 20 or directly above the second sensing element 30.
For example, the first rate threshold is 12M/s, the transmission rate of the first rate signal is 480M/s, the first rate signal may be a high-speed signal, the transmission rate of the second rate signal is 11M/s, and the second rate signal may be a low-speed signal, where the high-speed signal may be, for example, a USB signal, a clock signal DDR data signal, and the like.
The low-speed signal may be, for example, SPI (Serial peripheral interface), I2C (InterIntegrated Circuit), GPIO (general Purpose Input output), or the like.
The high frequency signal may be, for example, a radio frequency signal.
The intermediate frequency signal may be, for example, an image signal and an audio signal.
In the analog circuit, 0-455 KHZ is generally called as low frequency, 455-465 KHZ is generally called as intermediate frequency, or 455-6.5 Mhz is generally called as intermediate frequency, more than 10Mhz is called as high frequency or radio frequency, and more than Ghz is called as ultrahigh frequency. Whereas in a low frequency analog signal it is also possible to treat e.g. an audio signal as a low frequency signal.
In this way, by using the characteristics of the first and second inductive elements that the specifications are the same, the phases are the same, and the coil winding directions are opposite, when the first and second inductive elements 20 and 30 receive signals from the same power supply, the magnetic field generated between the first and second inductive elements 20 and 30 and the induced current can be completely cancelled out, so that when a high-speed signal is transmitted between the first and second inductive elements 20 and 30, signal crosstalk is not generated in the high-speed signal or is minimized.
As shown in fig. 5, a first sensing element is disposed on the top surface of the PCB, and a second sensing element is disposed on the bottom surface of the PCB, wherein the first sensing element and the second sensing element are vertically symmetrical, and the size and shape of the copper PADs (PAD) of the first sensing element and the second sensing element are completely the same, that is, the leads in the packages of the first sensing element and the second sensing element are completely the same, and the winding directions of the coils of the first sensing element and the second sensing element are opposite, for example, the first sensing element is wound in a clockwise direction, and the second sensing element is wound in a counterclockwise direction.
In one embodiment the first inductive element and the second inductive element are inductive elements.
Here, the first and second inductive elements are connected in parallel, when a digital power is input to the PCB, the same power output is divided into two paths on the PCB, wherein one path is connected to the first inductive element, and the other path is connected to the second inductive element, so that the first and second inductive elements can receive the same current change and generate the same electromagnetic change, and thus, by using the above arrangement of the first and second inductive elements, the inductive magnetic field generated between the first and second inductive elements can be completely cancelled, so that high-speed signal lines can be laid out under the first inductive element and over the second inductive element, and no signal crosstalk is caused to the high-speed signals.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An electronic device, comprising:
a printed circuit board including a signal transmission region;
the first sensing element is arranged at a first position on a first surface of the printed circuit board, and the first position corresponds to the signal transmission area;
the second sensing element is arranged at a second position on the second surface of the printed circuit board; the second location corresponds to the signal transmission region; wherein the first surface is opposite to the second surface;
the magnetic field generated between the first inductive element and the second inductive element is at least partially cancelled.
2. The electronic device of claim 1, wherein the signal transmission region is in a different layer than the first inductive element and the second inductive element, respectively.
3. The electronic device of claim 1, wherein the first inductive element and the second inductive element are connected in parallel to receive the same power signal.
4. The electronic device of claim 1, wherein the second location completely overlaps or partially overlaps a projection of the first location in a perpendicular direction to the first surface or the second surface.
5. The electronic device of claim 4, wherein a coil winding direction of the first inductive element is opposite relative to a coil winding direction of the second inductive element.
6. The electronic device of claim 4, wherein the first inductive element and the second inductive element have the same specification parameters.
7. The electronic device of claim 6, wherein a phase parameter is equal between the first inductive element and the second inductive element.
8. The electronic device of claim 6, wherein an inductance value is equal between the first inductive element and the second inductive element.
9. The electronic device according to any one of claims 1 to 8, wherein the signal transmission area is at least used for transmitting a first speed signal and/or a first frequency signal;
the transmission rate of the first rate signal is greater than a first rate threshold;
the transmission frequency of the first frequency signal is greater than a first frequency threshold.
10. The electronic device of claim 9, wherein the signal transmission region comprises a first signal transmission region and a second signal transmission region;
the first signal transmission area is located at the first position or the second position and is used for transmitting the first speed signal and/or the first frequency signal, and the second signal transmission area is used for transmitting the second speed signal and/or the second frequency signal;
a transmission rate of the second rate signal is less than or equal to the first rate threshold; the transmission frequency of the second frequency signal is less than or equal to the first frequency threshold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220103459.4U CN217486699U (en) | 2022-01-14 | 2022-01-14 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220103459.4U CN217486699U (en) | 2022-01-14 | 2022-01-14 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217486699U true CN217486699U (en) | 2022-09-23 |
Family
ID=83304376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220103459.4U Active CN217486699U (en) | 2022-01-14 | 2022-01-14 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217486699U (en) |
-
2022
- 2022-01-14 CN CN202220103459.4U patent/CN217486699U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102542787B1 (en) | Large-area expandable high-resonant wireless power coil | |
| US20230327491A1 (en) | Transmitting assembly for a universal wireless charging device and a method thereof | |
| US8174843B2 (en) | Printed circuit board | |
| JP5549818B2 (en) | Non-contact transmission device, and battery unit and battery lid unit including the same | |
| JP2023153958A (en) | Power transmission system and control method | |
| EP2811656A1 (en) | Antenna device and wireless communication device | |
| JP6391930B2 (en) | Integrated circuit package | |
| US11398753B2 (en) | Method and apparatus for wireless power transfer utilizing a magnetic shield | |
| CN107768789B (en) | Directional coupler and wireless communication device using same | |
| US10832862B2 (en) | Wireless system and wireless device | |
| JP2012115069A (en) | Antenna, power transmission device, power reception device, and non-contact communication device | |
| EP2763299B1 (en) | Gate drive circuit | |
| US6885258B2 (en) | Method and apparatus for reducing radiant noise energy by radiating noise energy from a quasi-ground into a signal wire | |
| KR20180101070A (en) | Coil module and wireless power transmitter using the same | |
| JP2012049714A (en) | Antenna module | |
| JP2006262054A (en) | Antenna module and portable information terminal provided with the same | |
| CN111903075B (en) | Improving EMI suppression of near field links | |
| CN217486699U (en) | Electronic device | |
| JPH11176676A (en) | Small-sized noncontact transmitter | |
| JP7222675B2 (en) | radio equipment | |
| CN107347228B (en) | High-frequency noise-handling circuit board | |
| JP7169172B2 (en) | Radio system and radio equipment | |
| EP3712912A1 (en) | Transformer | |
| EP4068502B1 (en) | Electrical isolator | |
| US11419205B1 (en) | Circuit board structure and layout structure thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |