CN217472901U - Etching solution desiliconization recovery system device - Google Patents
Etching solution desiliconization recovery system device Download PDFInfo
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- CN217472901U CN217472901U CN202221369806.4U CN202221369806U CN217472901U CN 217472901 U CN217472901 U CN 217472901U CN 202221369806 U CN202221369806 U CN 202221369806U CN 217472901 U CN217472901 U CN 217472901U
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Abstract
The utility model provides an etching solution desiliconization recovery system device, along the direction of delivery of etching solution, etching solution desiliconization recovery system device is including the storage unit, desiliconization unit and the separating element that connect gradually, the desiliconization unit includes reaction unit, reaction unit respectively with storage unit and separating element connect, reaction unit is external to have desiliconization agent supply unit, reaction unit's inside is provided with fluosilicic acid concentration detection device, fluosilicic acid concentration detection device detects fluosilicic acid concentration in the etching solution in real time to with signal transmission to the control unit, the control unit regulation and control desiliconization agent supply unit to the process of pouring into the desiliconization agent in the reaction unit. The utility model provides an etching solution desiliconization recovery system device can the fluosilicic acid concentration in the real-time detection etching solution, in time regulates and control desiliconization reaction process effectively, and fluosilicic acid concentration in the etching solution after the accurate control desiliconization promotes the etching solution quality of retrieving.
Description
Technical Field
The utility model belongs to the technical field of the glass attenuate, especially, relate to an etching solution desiliconization recovery system device.
Background
With the continuous development of electronic products, electronic display devices tend to be more and more light and thin, and the thickness of display glass screens is required to be smaller and smaller. In the manufacturing process of the display glass screen, the thinning treatment of the glass substrate is an important link for ensuring the completion of the process, and the quality of the thinning effect can directly influence the quality of the product. At present, the chemical etching treatment is the most common glass thinning method, and generally, an etching acid solution containing HF with a certain concentration is fully contacted with glass, and the HF in the etching acid solution and the SiO in the glass are fully contacted 2 The reaction makes the surface of the glass stripped, thereby realizing the purpose of thinning the glass.
In the chemical etching process, HF and SiO in the etching acid solution 2 Reaction to form SiF 4 And SiF 4 React rapidly with HF to produce fluosilicic acid (H) 2 SiF 6 ) As the reaction proceeds, the concentration of HF in the etching acid solution gradually decreases, H 2 SiF 6 The concentration of (2) is gradually increased, which not only reduces the etching capability of the etching acid solution and causes uneven etching on the surface of the glass substrate, thereby reducing the product quality and prolonging the etching treatment time, but also forms a large amount of etching waste liquid, wherein the waste liquid usually contains a large amount of unreacted acid raw materials such as HF and the like. Therefore, in order to avoid the direct discharge of the etching waste liquid and reduce the production running cost, the etching waste liquid is often recycled, i.e. the H in the etching waste liquid is recycled 2 SiF 6 Removal and simultaneous increase in HF concentration.
CN103373708A A treatment method for recycling hydrofluoric acid waste liquid, which comprises analyzing the silicon content in the hydrofluoric acid waste liquid, adding the compound of sodium, potassium or barium which is more than one time of the silicon content into the hydrofluoric acid waste liquid in a treatment tank, reacting the fluorine and silicon in the hydrofluoric acid waste liquid with the sodium, potassium or barium to generate the fluosilicate solid of sodium, potassium or barium fluosilicate, after the fluosilicate solid is settled, extracting the upper liquid and adding high-concentration hydrofluoric acid to make the upper liquid meet the hydrofluoric acid concentration value used in the original process, and then conveying the upper liquid back to the original process.
CN109626646A discloses a method for on-line recycling fluorine-containing glass thinning waste liquid in glass thinning industry, wherein, various acid component contents of the fluorine-containing glass thinning waste liquid are analyzed, and then organic acid alkali metal salt is added into the fluorine-containing glass thinning waste liquid for mixing according to molar ratio under continuous stirring; after the precipitate is settled, an alkali metal fluorosilicate solid is formed, so that the aim of reducing the thickness of the waste liquid and desiliconizing is fulfilled.
CN213376554U discloses a system for recycling mixed acid of a glass etching solution, which comprises a reaction tank, wherein the mixed acid from a workshop is connected to a feed inlet of the reaction tank through a pipeline, the reaction tank is also provided with a dosing port, and an outlet of the dosing tank is connected to the dosing port of the reaction tank; the discharge gate of retort is connected to the pressure filter, and pressure filter filtrating department mouth is connected to the pans, and the pans export is reconnected to precision filter, and precision filter filtrating export is connected to the retrieval and utilization storage tank, and this recovery system of recycling reaches the mesh of desilicication through adding the sodium fluoride reaction and generating the sodium fluosilicate solid in the etching solution.
In the above documents, the purpose of desiliconization is achieved by adding a desiliconization agent to react with fluosilicic acid in the etching solution to generate fluorosilicate solids, but the reaction process of the desiliconization agent and fluosilicic acid cannot be effectively regulated, so that the concentration of fluosilicic acid in the etching solution after desiliconization cannot be accurately controlled. Therefore, it is highly desirable to develop a new etching solution desilication process system.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide an etching solution desiliconization recovery system device can the fluosilicic acid concentration in the real-time detection etching solution to in time regulate and control desiliconization reaction process effectively, fluosilicic acid concentration in the etching solution after the accurate control desiliconization, and then promote the quality of the etching solution of retrieving, and the etching effect of follow-up recycling.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides an etching solution desiliconization recovery system device, along the direction of delivery of etching solution, etching solution desiliconization recovery system device is including the storage unit, desiliconization unit and the separating element that connect gradually, the desiliconization unit includes reaction unit, reaction unit respectively with the storage unit with the separating element is connected, reaction unit is external to have desiliconization agent supply unit, reaction unit's inside is provided with fluosilicic acid concentration detection device, fluosilicic acid concentration detection device detects fluosilicic acid concentration in the etching solution in real time to with signal transmission to the control unit, the control unit regulation and control desiliconization agent supply unit to the process of pouring into the desiliconization agent among the reaction unit.
The utility model provides an etching solution indicates the etching solution of treating desiliconization recovery, and etching solution in the storage unit passes through desiliconization unit and separating element in proper order, accomplishes and retrieves recycling behind the desorption to fluosilicic acid. Meanwhile, the utility model is provided with a fluosilicic acid concentration detection device, and the fluosilicic acid concentration detection device, the control unit and the desiliconization agent supply unit are electrically connected, thereby realizing the real-time detection of the fluosilicic acid concentration in the etching solution in the reaction device and the timely and effective regulation and control of the effect of the desiliconization reaction process; wherein, the utility model can not only regulate and control the injection amount of the desiliconization agent, but also regulate and control the injection speed of the desiliconization agent in the desiliconization reaction process; the specific regulation and control process is as follows:
after the etching solution enters the reaction device from the storage unit, the fluosilicic acid concentration detection device detects the fluosilicic acid concentration in the etching solution and transmits a signal to the control unit, the control unit analyzes and calculates the injection amount of the desiliconization agent, and then the desiliconization agent supply unit is controlled to inject the desiliconization agent into the reaction device; in the desilication reaction process, the fluosilicic acid concentration detection device detects the concentration of fluosilicic acid in the etching solution in real time, when the concentration of fluosilicic acid is close to the set value of the fluosilicic acid concentration, the control unit reduces the speed of injecting the desiliconization agent into the reaction device by the desiliconization agent supply unit, and when the concentration of fluosilicic acid in the etching solution is reduced to be lower than the set value of the fluosilicic acid concentration, the desiliconization agent supply unit stops injecting the desiliconization agent into the reaction device. Furthermore, the utility model discloses well fluosilicic acid concentration setting value can set up to 0.2 ~ 2 wt% according to the technology demand.
The utility model provides an etching solution desiliconization recovery system device can the fluosilicic acid concentration in the real-time detection etching solution to in time regulate and control desiliconization reaction process effectively, fluosilicic acid concentration in the etching solution after the accurate control desiliconization, and then promote the quality of the etching solution of retrieving, and the etching effect of follow-up recycling. In addition, will the utility model provides an etching solution desiliconization recovery system device is applied to and carries out desiliconization recovery processing to the etching solution that produces in the ultra-thin flexible glass (UTG) production process, demonstrates excellent desiliconization recovery effect.
As an optimal technical scheme, desiliconization agent supply unit includes mixing arrangement, mixing arrangement's entry linkage has desiliconization agent raw materials storage device, mixing arrangement's export with reaction unit connects, mixing arrangement is still external to have solvent storage device, and desiliconization agent raw materials and solvent are in mix the desiliconization agent that obtains in the mixing arrangement and pour into reaction unit.
The utility model discloses in, mix desiliconization agent that the preparation becomes standard concentration with desiliconization agent raw materials and solvent in mixing arrangement, for example standard concentration can be 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt% or different concentration values such as 40 wt% to be convenient for the control unit calculates the injection volume of required desiliconization agent. In addition, the raw material of the desiliconization agent can be a desiliconization agent stock solution (with higher concentration) or a desiliconization agent solid raw material, and the solvent can be deionized water.
In addition, the desiliconization agent supply unit of the utility model is provided with at least one mixing device, a desiliconization agent raw material storage device and a solvent storage device; meanwhile, the desiliconization agent raw material storage device and the solvent storage device can be tank bodies.
As an optimal technical scheme, the last stirring subassembly of installing of mixing arrangement, be provided with liquid level detection device on the desiliconization agent raw materials storage device.
A desiliconization agent raw material delivery pump is arranged on a connecting pipeline between the desiliconization agent raw material storage device and the mixing device, a desiliconization agent delivery pump is arranged on a connecting pipeline between the mixing device and the reaction device, and the control unit analyzes a signal transmitted by the fluosilicic acid concentration detection device and regulates and controls the flow rate of the desiliconization agent delivery pump.
The utility model discloses do not do concrete requirement and special restriction to the stirring subassembly, as long as can realize desiliconization agent raw materials and solvent stirring mixing effect's stirring subassembly all is applicable to in mixing arrangement the utility model discloses, technical personnel in the field can carry out adaptability ground adjustment according to actual production condition and technology demand. Illustratively, the stirring assembly may include a stirring shaft, a stirring paddle, and a motor.
The utility model discloses the preferred desiliconization agent stoste of well desiliconization agent raw materials can implement and detect and show the liquid level height of desiliconization agent stoste in the desiliconization agent raw materials storage device through liquid level detection device, and when the liquid level height reached the liquid level height upper limit value, liquid level detection device sent alarm information. Furthermore, the utility model discloses well liquid level height upper limit value indicates: the liquid level when the volume of the desiliconization raw material liquid is 3/4 times of the volume of the desiliconization raw material storage device. And simultaneously, the utility model discloses well control unit regulates and control the injection quantity and the injection rate of the injection reaction unit of desiliconization agent through the flow of regulation and control desiliconization agent delivery pump. Furthermore, the utility model discloses well desiliconization agent raw materials delivery pump and desiliconization agent delivery pump are the pneumatic pump.
Furthermore, the utility model discloses select the potassium hydroxide stoste of mass concentration for 40 wt% as desiliconization agent raw materials, mix with the deionized water and obtain standard concentration desiliconization agent, its reaction principle with fluosilicic acid is as follows:
H 2 SiF 6 +2KOH→K 2 SiF 6 ↓+2H 2 O
as an optimized technical scheme, the desiliconization unit still includes the circulating pump, reaction unit's export through first circulating line with the access connection of circulating pump, the backward flow mouth has still been seted up on the reaction unit, the export of circulating pump pass through the second circulating line with reaction unit's backward flow mouth is connected, reaction unit first circulating line the circulating pump with the second circulating line constitutes circulation circuit.
And a first valve is arranged on the second circulating pipeline, the fluosilicic acid concentration of the etching solution in the reaction device is greater than the fluosilicic acid concentration set value, the control unit regulates and controls the desiliconization agent supply unit to inject the desiliconization agent into the reaction device, controls the first valve and the circulating pump to be opened, and carries out desiliconization reaction under the circulating condition until the fluosilicic acid concentration of the etching solution in the reaction device is less than or equal to the fluosilicic acid concentration set value to obtain the desiliconized etching solution.
The utility model discloses well reaction stoste (desiliconization agent and etching solution mixed liquid) circulation flow in the circulation circuit that reaction unit, first circulating line, circulating pump and second circulating line constitute, it is also the desiliconization reaction under the circulation condition to go on with the form of developments, and not go on with static state in reaction unit, this is because the reaction form of developments can make desiliconization agent and etching solution fully contact and react, generates the fluorosilicate and deposits.
As an optimized technical scheme of the utility model, first valve member with between the circulating pump second circulating line goes up to be external to have an output pipeline, the last second valve member that is provided with of output pipeline.
After the desiliconization reaction is completed, the control unit regulates and controls the desiliconization agent supply unit to stop injecting the desiliconization agent into the reaction device, controls the first valve piece and the circulating pump to be closed, and then controls the second valve piece and the circulating pump to be opened, and conveys the desiliconized etching solution to the separation unit.
As an optimized technical scheme, the desilication unit still including set up in last temperature control assembly of reaction unit, temperature control assembly is used for real-time supervision and regulation and control temperature in the reaction unit.
The utility model discloses in detect and regulate and control the temperature in to reaction unit through temperature control component, effectively prevent the emergence of the unusual phenomenon of desiliconization reaction in-process temperature. In addition, the desiliconization unit of the utility model is provided with at least one reaction device which can be a reaction kettle.
As an optimized technical scheme of the utility model, follow the direction of delivery of desiliconization etching liquid, the separator unit is including the desiliconization etching liquid storage device and the separator who connect gradually.
The utility model discloses a desiliconization etching liquid storage device and separator all have one at least in the detaching unit, and wherein desiliconization etching liquid storage device can be the jar body. In addition, the separation unit separates and removes fluorosilicate solids generated by desiliconization reaction in the desiliconized etching solution and glass slag generated in the thinning process.
As an optimized technical scheme, be provided with liquid level induction system on the desiliconization etching liquid storage device, desiliconization etching liquid storage device with be provided with the desiliconization etching liquid delivery pump on the connecting tube between the separator, liquid level induction system responds to liquid level height in the desiliconization etching liquid storage device to with signal transmission to the control unit, the control unit control the desiliconization etching liquid delivery pump is opened.
The utility model discloses in, after liquid level height reached the liquid level specified value in the etching solution storage device that takes off silicon, the control unit control etching solution delivery pump that takes off silicon is opened, will take off silicon etching solution and carry to separator. The utility model discloses well liquid level fixed value indicates: the liquid level height when the volume of the desiliconized etching solution is 3/4 of the volume of the desiliconized etching solution storage device. Furthermore, the utility model discloses well desiliconization etching liquid delivery pump is the pneumatic pump.
As an optimal technical scheme, separator includes candle filter equipment, the export of filtrating and filter residue has been seted up on the candle filter equipment, the filtrating exit linkage has etching solution to mix the system unit, the filter residue exit linkage has discharge apparatus.
The utility model provides a filtrating is recoverable reutilization's etching solution promptly, and it gets into the etching solution and mixes the system unit, is used for the glass attenuate again after improving acid raw materials concentration such as HF.
As a preferred technical solution of the present invention, the storage unit includes at least one etching solution storage device, the etching solution storage device passes through the input pipeline and the reaction device is connected.
The utility model discloses in, different etching solution storage device can be connected with reaction unit through different input pipeline respectively. For example, the storage unit may include four etching solution storage devices, each for storing an etching solution having a different concentration of fluorosilicic acid, each connected to the reaction apparatus through four input pipes. Furthermore, the etching solution storage device of the present invention may be a tank.
Furthermore, the utility model discloses well material of storing unit, desiliconization agent supply unit, separation element and etching solution in the unit of mixing all possesses certain acid resistance.
The system refers to an equipment system, a device system or a production device.
Illustratively, when the etching solution desilication recovery system device provided by the utility model is adopted, firstly desiliconization agent raw materials and solvent are mixed in the mixing device by stirring, prepare into desiliconization agent with standard concentration, then the etching solution in the etching solution storage device is injected into the reaction device through the input pipeline, the fluosilicic acid concentration detection device detects the fluosilicic acid concentration in the etching solution, and transmit signals to the control unit, the control unit analyzes and calculates the injection amount of the desiliconization agent, then the control unit starts the desiliconization agent delivery pump, the desiliconization agent is injected into the reaction device, simultaneously, the first valve and the circulating pump are started, the desiliconization reaction is carried out under the circulating condition, in the desiliconization reaction process, the fluosilicic acid concentration detection device detects the fluosilicic acid concentration in the etching solution in real time, when the fluosilicic acid concentration detection device is close to the fluosilicic acid concentration set value, the control unit reduces the flow of the desiliconization agent delivery pump, thereby regulating and controlling the speed of injecting the desiliconization agent into the reaction device, when the concentration of fluosilicic acid in etching liquid in a reaction device is reduced to be below a set value of the concentration of fluosilicic acid, a desiliconization reaction is completed to obtain desiliconized etching liquid, a control unit controls a desiliconization agent supply unit to stop injecting a desiliconization agent into the reaction device, a first valve piece and a circulating pump are closed, then a second valve piece and the circulating pump are opened, the desiliconized etching liquid is conveyed to a desiliconized etching liquid storage device through an output pipeline, a liquid level sensing device senses the height of a liquid level in the desiliconized etching liquid storage device, the control unit controls the desiliconized etching liquid conveying pump to be opened after the height of the liquid level reaches a specified value, the desiliconized etching liquid is conveyed to a candle type filtering device, and a filtrate obtained after filtering is the etching liquid which can be recycled and reused, enters an etching liquid mixing unit, and is used for thinning glass again after the concentration of acid raw materials such as HF and the like is increased.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model provides an etching solution desiliconization recovery system device can the fluosilicic acid concentration in the real-time detection etching solution to in time regulate and control desiliconization reaction process effectively, fluosilicic acid concentration in the etching solution after the accurate control desiliconization, and then promote the quality of the etching solution of retrieving, and the etching effect of follow-up recycling. Furthermore, the utility model discloses whole etching solution desiliconization recovery process is automated control.
Drawings
Fig. 1 is a schematic structural diagram of an etching solution desilication recovery system device according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a desiliconizing agent supply unit according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a desilication unit according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a separation unit according to an embodiment of the present invention.
Wherein, 100-storage unit; 200-a desiliconization agent supply unit; 210-a desiliconization agent raw material storage device; 220-liquid level detection means; 230-desiliconization agent raw material delivery pump; 240-a mixing device; 250-a stirring component; 260-desiliconization agent delivery pump; 300-a desilication unit; 310-a reaction unit; 320-fluosilicic acid concentration detection device; 330-circulating pump; 340-a return port; 350-a first valve element; 360-an output pipeline; 370-a second valve element; 380-an input pipe; 390-a temperature control assembly; 400-a separation unit; 410-desiliconization etching solution storage device; 420-liquid level sensing means; 430-desiliconization etching liquid delivery pump; 440-a separation device; 500-etching solution mixing unit.
Detailed Description
It is to be understood that in the description of the present invention, the terms "central," "longitudinal," "lateral," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings only for the convenience of description and simplicity of description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of the indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly, and may for example be fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In a specific embodiment, the utility model provides an etching solution desiliconization recovery system device, as shown in fig. 1, along the direction of delivery of etching solution, etching solution desiliconization recovery system device is including storage unit 100, desiliconization unit 300 and the separating unit 400 that connects gradually, desiliconization unit 300 includes reaction unit 310, reaction unit 310 respectively with storage unit 100 with separating unit 400 connects, reaction unit 310 is external to have desiliconization agent supply unit 200, reaction unit 310's inside is provided with fluosilicic acid concentration detection device 320, fluosilicic acid concentration detection device 320 detects the concentration of fluosilicic acid in the etching solution in real time to with signal transmission to the control unit, the control unit regulation and control desiliconization agent supply unit 200 to the process of injecting the desiliconization agent in reaction unit 310.
The utility model provides an etching solution indicates the etching solution of treating desiliconization recovery, and etching solution in the storage unit 100 passes through desiliconization unit 300 and separating element 400 in proper order, accomplishes to retrieve after the desorption of fluosilicic acid and recycles. Meanwhile, the utility model is provided with a fluosilicic acid concentration detection device 320, and the fluosilicic acid concentration detection device 320, the control unit and the desiliconization agent supply unit 200 are electrically connected, thereby realizing the real-time detection of the fluosilicic acid concentration in the etching solution in the reaction device 310 and the timely and effective regulation and control of the effect of the desiliconization reaction process; wherein, the utility model can not only regulate and control the injection amount of the desiliconization agent, but also regulate and control the injection speed of the desiliconization agent in the desiliconization reaction process; the specific regulation and control process is as follows:
after the etching solution enters the reaction device 310 from the storage unit 100, the fluosilicic acid concentration detection device 320 detects the fluosilicic acid concentration in the etching solution, transmits a signal to the control unit, the control unit analyzes and calculates the injection amount of the desiliconization agent, and then controls the desiliconization agent supply unit 200 to inject the desiliconization agent into the reaction device 310; in the desilication reaction process, the fluosilicic acid concentration detection device 320 detects the concentration of the fluosilicic acid in the etching solution in real time, when the concentration of the fluosilicic acid is close to a set value of the fluosilicic acid concentration, the control unit reduces the speed of the desiliconization agent supply unit 200 for injecting the desiliconization agent into the reaction device 310, and when the concentration of the fluosilicic acid in the etching solution is reduced to be lower than the set value of the fluosilicic acid concentration, the desiliconization agent supply unit 200 stops injecting the desiliconization agent into the reaction device 310. Furthermore, the utility model discloses well fluosilicic acid concentration setting value can set up to 0.2 ~ 2 wt% according to the technology demand.
The utility model provides an etching solution desiliconization recovery system device can the fluosilicic acid concentration in the real-time detection etching solution to in time regulate and control desiliconization reaction process effectively, fluosilicic acid concentration in the etching solution after the accurate control desiliconization, and then promote the quality of the etching solution of retrieving, and the etching effect of follow-up recycling. Furthermore, will the utility model provides an etching solution desiliconization recovery system device is applied to and carries out desiliconization recovery processing to the etching solution that produces in the ultra-thin flexible glass (UTG) production process, demonstrates excellent desiliconization recovery effect.
Further, as shown in fig. 2, the desiliconization agent supply unit 200 includes a mixing device 240, an inlet of the mixing device 240 is connected to a desiliconization agent raw material storage device 210, an outlet of the mixing device 240 is connected to the reaction device 310, the mixing device 240 is externally connected to a solvent storage device, and the desiliconization agent obtained by mixing the desiliconization agent raw material and the solvent in the mixing device 240 is injected into the reaction device 310.
The utility model discloses in, mix desiliconization agent that the preparation becomes standard concentration with desiliconization agent raw materials and solvent in mixing arrangement 240, for example the standard concentration can be 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt% or different concentration values such as 40 wt% to be convenient for the control unit calculates the injection volume of required desiliconization agent. In addition, the raw material of the desiliconization agent can be a desiliconization agent stock solution (with higher concentration) or a desiliconization agent solid raw material, and the solvent can be deionized water.
In addition, the mixing device 240, the desiliconization raw material storage device 210 and the solvent storage device in the desiliconization agent supply unit 200 of the present invention are all at least one; meanwhile, both the desiliconization agent raw material storage device 210 and the solvent storage device may be tanks. Exhaust gas may be generated during the process of preparing the desiliconizing agent in the mixing device 240, and the exhaust gas is discharged through an exhaust pipe.
Further, a stirring assembly 250 is installed on the mixing device 240, and a liquid level detection device 220 is arranged on the desiliconization agent raw material storage device 210.
A desiliconization agent raw material delivery pump 230 is arranged on a connecting pipeline between the desiliconization agent raw material storage device 210 and the mixing device 240, a desiliconization agent delivery pump 260 is arranged on a connecting pipeline between the mixing device 240 and the reaction device 310, and the control unit analyzes a signal transmitted by the fluosilicic acid concentration detection device 320 and regulates and controls the flow rate of the desiliconization agent delivery pump 260.
The utility model discloses do not do concrete requirement and special restriction to stirring subassembly 250, as long as can realize desiliconization agent raw materials and solvent stirring mixing effect's stirring subassembly 250 all is applicable to in mixing arrangement 240 the utility model discloses, technical personnel in the art can carry out adaptability ground adjustment according to actual production condition and technology demand. Illustratively, the stirring assembly 250 may include a stirring shaft, a stirring paddle, and a motor.
The utility model discloses the preferred desiliconization agent stoste of well desiliconization agent raw materials can implement and detect and show the liquid level height of desiliconization agent stoste in desiliconization agent raw materials storage device 210 through liquid level detection device 220, and when the liquid level height reached the liquid level height upper limit value, liquid level detection device 220 sent alarm information. Furthermore, the utility model discloses well liquid level height upper limit value indicates: the liquid level when the volume of the desiliconization raw material liquid is 3/4 times of the volume of the desiliconization raw material storage device 210. And simultaneously, the utility model discloses well control unit regulates and control the injection quantity and the injection rate of the injection reaction unit 310 of desiliconization agent through the flow of regulation and control desiliconization agent delivery pump 260. Furthermore, the utility model discloses well desiliconization agent raw materials delivery pump 230 and desiliconization agent delivery pump 260 are pneumatic pumps.
Furthermore, the utility model discloses select the potassium hydroxide stoste of mass concentration for 40 wt% as desiliconization agent raw materials, mix with the deionized water and obtain standard concentration desiliconization agent, its reaction principle with fluosilicic acid is as follows:
H 2 SiF 6 +2KOH→K 2 SiF 6 ↓+2H 2 O
further, as shown in fig. 3, the desiliconization unit 300 further includes a circulation pump 330, an outlet of the reaction device 310 is connected to an inlet of the circulation pump 330 through a first circulation pipe, the reaction device 310 is further provided with a return port 340, an outlet of the circulation pump 330 is connected to the return port 340 of the reaction device 310 through a second circulation pipe, and the reaction device 310, the first circulation pipe, the circulation pump 330 and the second circulation pipe form a circulation loop.
The second circulation pipeline is provided with a first valve 350, the concentration of fluosilicic acid in the etching solution in the reaction device 310 is greater than the set value of fluosilicic acid concentration, the control unit regulates and controls the desiliconization agent supply unit 200 to inject the desiliconization agent into the reaction device 310, controls the first valve 350 and the circulation pump 330 to be both opened, and performs desiliconization reaction under a circulation condition until the concentration of fluosilicic acid in the etching solution in the reaction device 310 is less than or equal to the set value of fluosilicic acid concentration to obtain a desiliconized etching solution.
The utility model discloses well reaction stoste (desiliconization agent and etching solution mixed liquid) circulation flow in the circulation circuit that reaction unit 310, first circulating line, circulating pump 330 and second circulating line constitute, it is also the desiliconization reaction under the circulation condition to go on with the form of developments, and not go on with static state in reaction unit 310, this is because the reaction form of developments can make desiliconization agent and etching solution fully contact and react, generates the fluorosilicate and deposits. During the desilication reaction performed in the reaction apparatus 310, an exhaust gas may be generated and discharged through an exhaust pipe.
Further, an output pipeline 360 is externally connected to the second circulation pipeline between the first valve element 350 and the circulation pump 330, and a second valve element 370 is disposed on the output pipeline 360.
After the desilication reaction is completed, the control unit regulates the desilication agent supply unit 200 to stop injecting the desilication agent into the reaction device 310, controls the first valve member 350 and the circulating pump 330 to be closed, and then controls the second valve member 370 and the circulating pump 330 to be opened, so as to deliver the desilication etching solution to the separation unit 400.
Further, the desilication unit 300 further comprises a temperature control component 390 disposed on the reaction device 310, wherein the temperature control component 390 is configured to monitor and control the temperature inside the reaction device 310 in real time.
The utility model discloses in detect and regulate and control the temperature in reaction unit 310 through temperature control assembly 390, effectively prevent the emergence of the unusual phenomenon of desiliconization reaction in-process temperature. Illustratively, the temperature control component 390 can achieve temperature regulation within the reaction device 310 through circulation of a heat exchange medium. In addition, the desiliconization unit 300 of the present invention has at least one reaction device 310, and the reaction device 310 may be a reaction kettle.
Further, as shown in fig. 4, the separation unit 400 comprises a storage device 410 for the desiliconized etching solution and a separation device 440, which are connected in sequence along the conveying direction of the desiliconized etching solution.
The utility model discloses a desiliconization etching liquid storage device 410 and separator 440 all have at least one in the detaching unit 400, and wherein desiliconization etching liquid storage device 410 can be the jar body. In addition, the separation unit 400 separates and removes fluorosilicate solids generated by the desilication reaction in the desilication etching solution and glass slag generated in the thinning process. Waste gas may be generated in the storage device 410 for the desiliconized etching solution, and the waste gas is exhausted through a waste gas pipeline.
Further, a liquid level sensing device 420 is arranged on the storage device 410 for the desiliconized etching solution, a desiliconized etching solution delivery pump 430 is arranged on a connecting pipeline between the storage device 410 for the desiliconized etching solution and the separating device 440, the liquid level sensing device 420 senses the liquid level height in the storage device 410 for the desiliconized etching solution and transmits a signal to a control unit, and the control unit controls the desiliconized etching solution delivery pump 430 to be started.
The utility model discloses in, after the liquid level height reached the liquid level specified value in the etching solution storage device 410 that takes off silicon, the control unit control etching solution delivery pump 430 that takes off silicon is opened, will take off silicon etching solution and carry to separator 440. The utility model discloses well liquid level fixed value indicates: the liquid level when the volume of the desiliconized etching solution is 3/4 of the volume of the desiliconized etching solution storage device 410. In addition, the utility model discloses well desiliconization etching liquid delivery pump 430 is the pneumatic pump.
Further, separator 440 includes candle filter equipment, last filtrate export and the filter residue export of having seted up of candle filter equipment, filtrate exit linkage has etching solution to mix system unit 500, filter residue exit linkage has discharge apparatus.
The utility model provides a filtrating is recoverable reutilization's etching solution promptly, and it gets into etching solution and mixes system unit 500, is used for the glass attenuate again after improving acid raw materials concentration such as HF.
Further, the storage unit 100 includes at least one etching solution storage device connected to the reaction device 310 through an input pipe 380.
In the present invention, different etching solution storage devices can be connected to the reaction device 310 through different input pipes 380. For example, the storage unit 100 may include four etching solution storage devices for storing etching solutions having different concentrations of fluorosilicic acid, respectively, connected to the reaction apparatus 310 through four input pipes 380, respectively. Furthermore, the etching solution storage device of the present invention may be a tank.
In addition, the material of each device in the middle storage unit 100, the desiliconization agent supply unit 200, the desiliconization unit 300, the separation unit 400, and the etching solution mixing unit 500 of the present invention has certain acid resistance.
Illustratively, when the etching solution desilication recovery system device provided by the utility model is adopted, firstly, desiliconization agent raw materials and solvent are mixed in the mixing device 240 by stirring, desiliconization agent with standard concentration is prepared, then, etching solution in the etching solution storage device is injected into the reaction device 310 through the input pipeline 380, the fluosilicic acid concentration detection device 320 detects the fluosilicic acid concentration in the etching solution, and transmits signals to the control unit, the control unit analyzes and calculates the injection amount of the desiliconization agent, then the control unit starts the desiliconization agent delivery pump 260, injects desiliconization agent into the reaction device 310, simultaneously starts the first valve 350 and the circulating pump 330, desiliconization reaction is carried out under the circulating condition, in the desiliconization reaction process, the fluosilicic acid concentration detection device 320 detects the fluosilicic acid concentration in the etching solution in real time, when the fluosilicic acid concentration is close to the fluosilicic acid concentration set value, the control unit reduces the flow of the desiliconization agent delivery pump 260, thereby regulating and controlling the speed of injecting the desiliconization agent into the reaction device 310, when the concentration of the fluosilicic acid in the etching solution in the reaction device 310 is reduced to be below the set value of the concentration of the fluosilicic acid, the control unit controls the desiliconization agent supply unit 200 to stop injecting the desiliconization agent into the reaction device 310, and the first valve 350 and the circulating pump 330 are closed, then the second valve 370 and the circulating pump 330 are opened, the desiliconized etching solution is conveyed to the desiliconized etching solution storage device 410 through the output pipeline 360, the liquid level sensing device 420 senses the height of the liquid level in the desiliconized etching solution storage device 410, and after the height of the liquid level reaches the specified liquid level value, the control unit controls the desiliconization etching solution delivery pump 430 to be started, delivers the desiliconization etching solution to the candle type filtering device, obtains filtrate after filtration as recyclable etching solution, the glass enters an etching solution mixing unit 500, and the concentration of acid raw materials such as HF and the like is increased and then the glass is thinned again.
The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.
Claims (10)
1. A desiliconization recovery system device for etching solution is characterized in that along the conveying direction of the etching solution, the etching solution desiliconization recovery system device comprises a storage unit (100), a desiliconization unit (300) and a separation unit (400) which are connected in sequence, the desilication unit (300) comprises a reaction device (310), the reaction device (310) is respectively connected with the storage unit (100) and the separation unit (400), the reaction device (310) is externally connected with a desiliconization agent supply unit (200), a fluosilicic acid concentration detection device (320) is arranged in the reaction device (310), the fluosilicic acid concentration detection device (320) detects the concentration of fluosilicic acid in the etching solution in real time, and transmits a signal to a control unit that regulates the process of injecting the desiliconizing agent into the reaction device (310) by the desiliconizing agent supplying unit (200).
2. The etching solution desilication recovery system device according to claim 1, wherein the desiliconization agent supply unit (200) comprises a mixing device (240), an inlet of the mixing device (240) is connected with a desiliconization agent raw material storage device (210), an outlet of the mixing device (240) is connected with the reaction device (310), the mixing device (240) is further externally connected with a solvent storage device, and desiliconization agent obtained by mixing desiliconization agent raw material and solvent in the mixing device (240) is injected into the reaction device (310).
3. The etching solution desilication recovery system device according to claim 2, wherein a stirring assembly (250) is installed on the mixing device (240), and a liquid level detection device (220) is arranged on the desilication agent raw material storage device (210);
a desiliconization agent raw material delivery pump (230) is arranged on a connecting pipeline between the desiliconization agent raw material storage device (210) and the mixing device (240), a desiliconization agent delivery pump (260) is arranged on a connecting pipeline between the mixing device (240) and the reaction device (310), and the control unit analyzes a signal transmitted by the fluosilicic acid concentration detection device (320) and regulates and controls the flow rate of the desiliconization agent delivery pump (260).
4. The etching solution desilication recovery system device according to claim 1, wherein the desilication unit (300) further comprises a circulating pump (330), an outlet of the reaction device (310) is connected with an inlet of the circulating pump (330) through a first circulating pipeline, the reaction device (310) is further provided with a return port (340), an outlet of the circulating pump (330) is connected with the return port (340) of the reaction device (310) through a second circulating pipeline, and the reaction device (310), the first circulating pipeline, the circulating pump (330) and the second circulating pipeline form a circulating loop;
the second circulating pipeline is provided with a first valve (350), the fluosilicic acid concentration of the etching solution in the reaction device (310) is greater than the fluosilicic acid concentration set value, the control unit regulates and controls the desiliconization agent supply unit (200) to inject the desiliconization agent into the reaction device (310), controls the first valve (350) and the circulating pump (330) to be started, and conducts desiliconization reaction under the circulating condition until the fluosilicic acid concentration of the etching solution in the reaction device (310) is less than or equal to the fluosilicic acid concentration set value to obtain the desiliconized etching solution.
5. The etching solution desilication recovery system device according to claim 4, wherein an output pipeline (360) is externally connected to the second circulation pipeline between the first valve member (350) and the circulation pump (330), and a second valve member (370) is arranged on the output pipeline (360);
after the desilication reaction is completed, the control unit regulates and controls the desilication agent supply unit (200) to stop injecting the desilication agent into the reaction device (310), controls the first valve piece (350) and the circulating pump (330) to be closed, then controls the second valve piece (370) and the circulating pump (330) to be opened, and conveys the desilication etching liquid to the separation unit (400).
6. The etching solution desilication recovery system device according to claim 1, wherein the desilication unit (300) further comprises a temperature control component (390) disposed on the reaction device (310), the temperature control component (390) is used for monitoring and controlling the temperature in the reaction device (310) in real time.
7. The etching solution desilication recovery system device according to claim 5, wherein the separation unit (400) comprises a desilication etching solution storage device (410) and a separation device (440) which are connected in sequence along the conveying direction of the desilication etching solution.
8. The etching solution desilication recovery system device according to claim 7, wherein a liquid level sensing device (420) is arranged on the desilication etching solution storage device (410), a desilication etching solution delivery pump (430) is arranged on a connecting pipeline between the desilication etching solution storage device (410) and the separation device (440), the liquid level sensing device (420) senses the liquid level height in the desilication etching solution storage device (410) and transmits a signal to a control unit, and the control unit controls the desilication etching solution delivery pump (430) to be turned on.
9. The etching solution desilication recovery system device according to claim 7, wherein the separation device (440) comprises a candle type filtering device, a filtrate outlet and a residue outlet are formed on the candle type filtering device, the filtrate outlet is connected with the etching solution mixing unit (500), and the residue outlet is connected with a discharging device.
10. The etching solution desilication recovery system device according to claim 1, wherein the storage unit (100) comprises at least one etching solution storage device connected to the reaction device (310) through an input pipe (380).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221369806.4U CN217472901U (en) | 2022-06-01 | 2022-06-01 | Etching solution desiliconization recovery system device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221369806.4U CN217472901U (en) | 2022-06-01 | 2022-06-01 | Etching solution desiliconization recovery system device |
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| CN217472901U true CN217472901U (en) | 2022-09-23 |
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| CN202221369806.4U Active CN217472901U (en) | 2022-06-01 | 2022-06-01 | Etching solution desiliconization recovery system device |
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| CN (1) | CN217472901U (en) |
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