CN217470627U - Efficient spraying phase-change liquid cooling device for double-sided chip of server - Google Patents
Efficient spraying phase-change liquid cooling device for double-sided chip of server Download PDFInfo
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- CN217470627U CN217470627U CN202221175616.9U CN202221175616U CN217470627U CN 217470627 U CN217470627 U CN 217470627U CN 202221175616 U CN202221175616 U CN 202221175616U CN 217470627 U CN217470627 U CN 217470627U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
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Abstract
The utility model discloses a high-efficiency spraying phase-change liquid cooling device for a double-sided chip of a server, which comprises a first spraying liquid cooling component, a second spraying liquid cooling component, a third spraying liquid cooling component and a heat pipe, wherein the first spraying liquid cooling component, the second spraying liquid cooling component and the third spraying liquid cooling component are symmetrically distributed; the third spraying liquid cooling assembly is arranged on the side faces of the first spraying liquid cooling assembly and the second spraying liquid cooling assembly and is used for cooling the heat of the chip transferred to the condensation end from the evaporation end of the heat pipe. The device provided by the utility model adopts high-pressure non-condensable gas to assist the liquid cooling medium to realize atomization, the generated spray impact is intensified, and the cooling effect is better; the utility model discloses a heat pipe of array spraying hole and excellent temperature uniformity has reduced the inside temperature that produces local hotspot because of heat transfer is inhomogeneous of chip.
Description
Technical Field
The utility model relates to a data center server chip heat dissipation technical field especially relates to a two-sided chip of server is with high-efficient spraying liquid cooling plant that changes phase.
Background
As the number and size of global data centers has grown rapidly, high performance, high heat flux server equipment has increased. The existing server adopts more heat dissipation modes to perform air cooling heat dissipation, namely, a fan module is arranged in a server case to perform heat dissipation, the heat dissipation mode occupies large installation space, has high noise and has low heat dissipation efficiency, so the liquid cooling heat dissipation mode with high heat dissipation efficiency gradually receives attention of people in recent years, and the liquid cooling heat dissipation of the server usually adopts an external or internal heat pipe micro-channel water cooling module, so that the defects of large demand of liquid cooling media and uneven heat dissipation exist. Although people do much work on improving the heat dissipation of the server, the traditional air cooling or liquid cooling heat dissipation mode still cannot keep up with the continuously increased heat dissipation requirement of the high heat flow density chip of the server.
The spray cooling technology is a novel phase change cooling technology and has the advantages of small working medium demand, no thermal contact resistance with the surface of a heating solid in the cooling process, large spray area and the like. The heat pipe is a phase change element with high-efficient heat conduction and excellent temperature uniformity, if combine together it with spray cooling, can realize guaranteeing spray cooling's high-efficient heat dispersion's while, can also promote holistic temperature uniformity performance with the even transmission of heat, can reduce the local hot spot temperature of chip to the life of extension server chip. However, most of liquid cooling devices can only cool one chip at present, and in order to meet the continuously increased heat dissipation requirement of a server high-heat-flow-density chip and the cooling requirement of a double-sided chip, the efficient spraying phase-change liquid cooling device for the double-sided chip of the server is provided.
Disclosure of Invention
In order to solve the technical problem, the utility model aims at providing a two-sided chip of server is with high-efficient spraying phase transition liquid cooling plant.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides a server double-sided chip is with high-efficient spraying phase transition liquid cooling device, includes:
the first spraying liquid cooling component, the second spraying liquid cooling component, the third spraying liquid cooling component and the heat pipe are symmetrically distributed, and the heat pipe is connected with the first spraying liquid cooling component, the second spraying liquid cooling component and the third spraying liquid cooling component; the third spraying liquid cooling assembly is arranged on the side faces of the first spraying liquid cooling assembly and the second spraying liquid cooling assembly and is used for cooling the heat of the chip transferred to the condensation end from the evaporation end of the heat pipe.
Compared with the prior art, the utility model discloses an advantage can have as follows to one or more embodiments:
the utility model discloses a server high heat flux density chip's heat is partly taken away by the spraying liquid cooling subassembly of symmetric distribution, and partly heat is transmitted to the third spraying liquid cooling subassembly that the side set up fast through the heat pipe of high-efficient heat conduction and is cooled off, reaches the purpose that the heat of two high heat flux density chips is taken away by first spraying subassembly, second spraying liquid cooling subassembly and third spraying subassembly simultaneously, realizes high-efficient heat dissipation;
the atomization is realized by using high-pressure non-condensable gas to assist a liquid cooling medium, the generated spray impact is intensified, and the cooling effect is better;
meanwhile, the array-type spray holes are adopted, so that the spray area is increased, the cold quantity acting on the heat exchange surface is more uniform, and the temperature of local hot spots generated by nonuniform heat transfer in the chip is reduced;
by adopting the heat pipe with excellent temperature uniformity, the heat of the chip can be uniformly transferred to the spray condensation end plate for cooling, and the local hot spot temperature of the chip is further reduced.
Drawings
FIG. 1 is a schematic structural diagram of a high-efficiency spray phase-change liquid cooling device for a double-sided chip of a server;
FIG. 2 is a schematic structural diagram of another view angle of the efficient spray phase-change liquid cooling device for the double-sided chip of the server;
FIG. 3 is a schematic diagram of the structure of a first spray liquid cooling assembly;
FIG. 4 is a schematic cross-sectional view of a first spray liquid cooling assembly;
FIG. 5 is a schematic diagram of the second spray liquid cooling assembly (with the gas panel removed);
FIG. 6 is a schematic cross-sectional view of a second spray liquid cooling module (with the gas panel removed);
FIG. 7 is a schematic diagram of a third spray liquid cooling assembly;
FIG. 8 is a schematic cross-sectional view of a third spray liquid cooling assembly;
fig. 9 is a schematic view of a heat pipe structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.
As shown in fig. 1 and 2, the structure of the efficient spraying phase-change liquid cooling device for the double-sided chip of the server comprises: the spray cooling system comprises a first spray liquid cooling component 1, a second spray liquid cooling component 2, a third spray liquid cooling component 3 and a heat pipe 4 which is connected with the first spray liquid cooling component, the second spray liquid cooling component and the third spray liquid cooling component, wherein the first spray liquid cooling component, the second spray liquid cooling component and the third spray liquid cooling component are symmetrically distributed; the third spraying liquid cooling assembly is arranged on the side faces of the first spraying liquid cooling assembly and the second spraying liquid cooling assembly, the whole structure of the third spraying liquid cooling assembly is basically the same as that of the first spraying liquid cooling assembly, and the third spraying liquid cooling assembly is used for cooling the chip heat transferred to the condensation end from the evaporation end of the heat pipe.
The first spraying liquid cooling assembly and the second spraying liquid cooling assembly are respectively contacted with the heating surfaces of the server CPU chip or other high-heat-flow-density chips, the two chips can be cooled simultaneously, and the contact surfaces are uniformly coated with heat-conducting silicone grease.
As shown in fig. 1 to 8, the first spray liquid cooling module and the second spray liquid cooling module are distributed in mirror symmetry, and both share the gas storage plate 12, and the rest components are the same. The overall structure of the third spray liquid cooling module is basically the same as that of the first spray liquid cooling module, but the gas storage plate 32 and the spray condensation end plate 36 are slightly different from the gas storage plate 12 and the spray condensation end plate 16 of the first spray liquid cooling module 1.
As shown in fig. 3-8, the first, second, and third spray liquid cooling assemblies include gas storage plates 12, 32, gas inlet plates 13, 23, 33, spray plates 15, 25, 35, and spray liquid cooling end plates 16, 26, 36, which are sequentially stacked, wherein the gas storage plates, the gas inlet plates, and the spray liquid cooling end plates are respectively provided with gas inlet pipes 11, 31, liquid inlet pipes 14, 24, 34, and fluid outlet pipes 17, 27, 37 at their sides, and the gas inlet pipes, the liquid inlet pipes, and the fluid outlet pipes are parallel to each other and can be disposed at the same side or different sides of the spray liquid cooling assemblies according to installation requirements; the gas storage plate is provided with gas cavities 121 and 321 and gas inlet channels 122 and 322, and the gas cavity 121 is a hollow cavity, namely the height of the gas cavity 121 is equal to that of the gas storage plate 12; the gas cavity 321 is a concave cavity, that is, the height of the gas cavity 321 is less than that of the gas storage plate 32; the air inlet channels are respectively communicated with the air inlet pipelines 11 and 31 and the air cavities 121 and 321; the gas cavity is used for containing a high-pressure non-condensable gas medium;
the air inlet plates 13, 23 and 33 are provided with array air inlet holes 131, 231 and 331 which are in the shape of an inverted cone, and the sectional area of the air inlet holes is gradually reduced from top to bottom; the array air inlet is a channel for allowing a high-pressure non-condensable gas medium to enter the next layer of spray plate 15, 25 and 35 to form a parallel flow channel array; the spray plate is provided with flow dividing cavities 151, 251 and 351, parallel fins 152, 252 and 352, array parallel channels 153, 253 and 353, array spray holes 154, 254 and 354 and liquid inlet flow channels 155, 255 and 355; the liquid inlet flow channel is respectively communicated with the liquid inlet pipeline and the flow dividing cavity; the flow distribution cavity is in borderless communication with the array parallel channels and is used for providing a place for temporarily storing and distributing liquid cooling media; the array parallel channel and the array spray hole provide space for mixing gas-liquid cooling media; the array spraying holes are conical, namely the sectional area of the array spraying holes is gradually increased; the array spraying holes are equal to the array air inlet holes in number and are in one-to-one correspondence in position.
The air inlet plate and the spray plate provide conditions for the advanced atomization of spray cooling. After the high-pressure non-condensable gas medium enters from the array air inlet holes 131, 231 and 331, the gas velocity is increased along with the reduction of the cross-sectional areas of the array air inlet holes 131, 231 and 331, the gas pressure is gradually reduced according to the Bernoulli equation, and a low-pressure area is formed at the tail ends of the array air inlet holes 131, 231 and 331. At this time, the liquid cooling medium is sucked into the array parallel channels 153, 253 and 353 through the liquid inlet pipelines 14, 24 and 34, mixed with high-pressure gas and then enters the conical array spray holes 154, 254 and 354, the gas flow rate is gradually reduced and the pressure is gradually increased along with the gradual increase of the sectional areas of the conical array spray holes 154, 254 and 354, and under the action of high pressure, the liquid cooling medium is broken into fine liquid drop groups and is rapidly sprayed out from the tail ends of the array spray holes 154, 254 and 354; fluid outlet flow channels 164, 264 and 364 are arranged on the side surfaces of the spraying liquid- cooling end plates 16, 26 and 36, manifolds 161, 261 and 361 and spraying cavities 162, 262 and 362 are arranged on the upper surfaces, and heat pipe semicircular groove arrays 163, 263 and 363 are arranged on the lower surfaces.
Said fluid outlet channels 164, 264, 364 are in communication with fluid outlet conduits 17, 27, 37, manifolds 161, 261, 361, respectively; the manifold 161, 261, 361 communicates with the spray chamber 162, 262, 362 without a boundary; the spray cavities 162, 262, 362 provide necessary space for atomizing fine droplet groups, fine droplet groups sprayed at high speed from outlets of the array spray holes 154154, 254, 354 meet with the spray cavities 162, 262, 362 and internal static or low-speed airflow, gradually change from dropping, smooth flow and wave-shaped flow into mist fine groups and impact on the inner surfaces of the spray cavities 162, 262, 362 under the interaction of liquid surface tension, viscosity and air resistance, namely, the heat exchange surfaces of fluid and solid are taken away by the heat of the spray impact and droplet phase change heating surfaces, and fluid media subjected to heat exchange are collected in the collecting cavities 161, 261, 361 and then are discharged through the fluid outlet flow channels 164, 264, 364 and the outlet pipelines 17, 27, 37; the heat pipe semicircular groove arrays 163 and 263 are used for accommodating the evaporation end 41 of the heat pipe 4; the slotting direction of the heat pipe semicircular slot array 363 is perpendicular to the slotting direction of the heat pipe semicircular slot arrays 163 and 263, and the purpose of the slotting direction is to adapt to the bending shape of the heat pipe 4 so as to ensure that the heat pipe semicircular slot array 363 is in close contact with the circular condensation end 42 of the heat pipe 4. As shown in fig. 9, one end of the heat pipe 4 is a flat evaporation end 41, and the other end is a round condensation end 42, and the heat pipe 4 is bent at 90 degrees; the number of the heat pipes 4 is equal to the total number of the heat pipe semicircular groove arrays corresponding to the first spray liquid cooling assembly 1 and the second spray liquid cooling assembly 2; one of the two groups of heat pipe evaporation ends 41 is in close contact with the high heat flux density chip and the heat pipe semi-circular groove array 163 of the first spray liquid cooling assembly, the other group is in close contact with the high heat flux density chip and the heat pipe semi-circular groove array 263 of the second spray liquid cooling assembly 2, the two groups of heat pipe condensation ends 42 are in close contact with the heat pipe semi-circular groove array 363 of the third spray liquid cooling assembly, and all contact surfaces are uniformly coated with silicone grease.
Preferably, the slotting direction of the heat pipe semicircular slot array 363 on the spray condensation end plate 36 of the third spray liquid cooling assembly 3 may also be parallel to or intersect with the slotting directions of the heat pipe semicircular slot arrays 163 and 263 on the first and second spray liquid cooling assemblies 1 at a certain angle, specifically according to the bending shape of the heat pipe 4.
Preferably, the third spray liquid cooling assembly 3 may also be a microchannel liquid cooling plate, a jet cooling module, or the like; the heat pipe 4 can also be a flat heat pipe, a vapor chamber, a blown vapor chamber or other phase change heat transfer elements;
preferably, the inner surface of the spray cavity 162, 262, 362 of the spray condensation end plate 16, 26, 36 may be provided with a three-dimensional complex surface structure such as a micro-channel array or a micro-turbulence column array to increase the heat dissipation area and the degree of liquid turbulence, thereby enhancing the heat dissipation effect of the heat dissipation device;
preferably, the liquid cooling medium is deionized water or a low-boiling point liquid working medium (absolute ethyl alcohol, liquid ammonia, fluorinated liquid and the like); the gas medium is non-condensable gas such as air, nitrogen and the like.
The utility model discloses a working process does:
the high-efficiency spraying phase-change liquid cooling device is contacted with two high-heat-flow-density chips, part of heat of the chips is transferred to a spraying condensation end plate 16 of a first spraying assembly 1 and a spraying condensation end plate 26 of a second spraying liquid cooling assembly 2 which are contacted with the chips, and part of heat is transferred to a spraying condensation end plate 36 of a third spraying assembly 3 which is contacted with a circular condensation end of a heat pipe 4, so that the purpose that the heat of the two high-heat-flow-density chips is taken away by the first spraying assembly 1, the second spraying liquid cooling assembly 2 and the third spraying assembly 3 at the same time is achieved, and high-efficiency heat dissipation is realized;
3-9, high pressure non-condensable gas medium continuously enters the gas inlet chamber 121 and the array gas inlet holes 131, 231 with gradually reduced cross-sectional area from the gas inlet pipe 11 and the gas inlet channel 122, the gas speed is gradually increased, the gas pressure is gradually reduced, a low pressure area is formed at the tail ends of the array gas inlet holes 131, 231, at this time, the liquid cooling medium is sucked into the array parallel channels 153, 253 through the liquid inlet pipes 14, 24 to be mixed with the high pressure gas, then the gas-liquid mixed medium enters the cone array spray holes 154, 254, the gas flow speed is gradually reduced and the pressure is gradually increased due to the gradually increased cross-sectional area of the cone array spray holes 154, 254, under the action of high pressure, the liquid cooling medium is broken into fine liquid droplet groups and is rapidly sprayed out from the tail ends of the array spray holes 154, 254, and meets the static or low-speed gas flow in the spray chambers 162, 262, and is subjected to the surface tension force at the liquid surface, Under the interaction of viscosity and air resistance, the fluid medium is gradually converted into mist-shaped micro-clusters from dropping, smooth flow and wave-shaped flow and is impacted on the inner surfaces of the heated spray cavities 162 and 262, namely the heat exchange surfaces of fluid and solid, the heat of the heating surfaces is taken away by means of spray impact and liquid drop phase change, and the fluid medium after heat exchange is collected in the collecting cavities 161 and 261 and then is discharged through the fluid outlet flow channels 164 and 264 and the outlet pipelines 17 and 27. At the same time, the heat transferred to the spray condensation end plate of the third spray module 3 via the heat pipe 4 is also carried away by the action of spray impact and droplet phase change generated in the third spray module 3. Therefore, the efficient spraying phase-change liquid cooling device completes a heat dissipation process.
Although the embodiments of the present invention have been described above, the description is only for the convenience of understanding the present invention, and the present invention is not limited thereto. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A high-efficiency spraying phase-change liquid cooling device for a double-sided chip of a server is characterized by comprising a first spraying liquid cooling component, a second spraying liquid cooling component, a third spraying liquid cooling component and a heat pipe for connecting the first spraying liquid cooling component, the second spraying liquid cooling component and the third spraying liquid cooling component, wherein the first spraying liquid cooling component, the second spraying liquid cooling component and the third spraying liquid cooling component are symmetrically distributed; the third spraying liquid cooling assembly is arranged on the side faces of the first spraying liquid cooling assembly and the second spraying liquid cooling assembly and is used for cooling the heat of the chip transferred to the condensation end from the evaporation end of the heat pipe.
2. The efficient spray phase-change liquid cooling device for the double-sided chip of the server as claimed in claim 1, wherein the chips comprise a server CPU chip and a high heat flux density chip; the first spraying liquid cooling assembly and the second spraying liquid cooling assembly are respectively contacted with the heating surfaces of the chips, and simultaneously, the CPU chip of the server and the high heat flux chip are cooled, and the contact surfaces are uniformly coated with heat-conducting silicone grease.
3. The efficient spray phase-change liquid cooling device for the double-sided chip of the server according to claim 1, wherein the first spray liquid cooling assembly and the second spray liquid cooling assembly are distributed in a mirror symmetry manner and share an air storage plate; the third spraying liquid cooling assembly has the same integral structure as the first spraying liquid cooling assembly, but the gas storage plate and the spraying condensation end plate are different; the first, second and third spraying liquid cooling assemblies respectively comprise an air storage plate, an air inlet plate, a spraying plate and a spraying liquid cooling end plate which are sequentially stacked, and air inlet pipelines, liquid inlet pipelines and fluid outlet pipelines are distributed on the side edges of the air storage plate, the air inlet plate and the spraying liquid cooling end plate; the air inlet pipeline, the liquid inlet pipeline and the fluid outlet pipeline are parallel to each other and are arranged on the same side or different sides of the spraying liquid cooling assembly according to installation requirements.
4. The efficient spraying phase-change liquid cooling device for the double-sided chip of the server according to claim 3,
the gas storage plate is provided with a gas cavity and a gas inlet flow channel, and the gas cavity is a cavity and is used for containing a high-pressure non-condensable gas medium; the air inlet flow channel is respectively communicated with the air cavity and the air inlet pipeline;
the shape of air inlet plate is the back taper, and is equipped with the array inlet port on the air inlet plate, and the array inlet port is the passageway that high pressure non-condensable gas medium got into the parallel runner array of next layer of spraying board.
5. The efficient spraying phase-change liquid cooling device for the double-sided chip of the server as claimed in claim 3, wherein a shunting cavity, parallel fins, array parallel channels, array spraying holes and a liquid inlet flow channel are arranged on the spraying plate; the flow distribution cavity is in borderless communication with the array parallel channels and is used for providing a place for temporarily storing and distributing liquid cooling media; the array parallel channel and the array spray hole provide space for mixing gas-liquid cooling media; the array spray holes are conical; the number of the array spraying holes is equal to that of the array air inlet holes, and the positions of the array spraying holes correspond to those of the array air inlet holes one to one; the liquid inlet flow channel is respectively communicated with the liquid inlet pipeline and the flow dividing cavity.
6. The efficient spray phase-change liquid cooling device for the double-sided chip of the server as claimed in claim 3, wherein the side surface of the spray liquid cooling end plate is provided with a fluid outlet flow channel, the upper surface is provided with a manifold and a spray cavity, and the lower surface is provided with a heat pipe semi-circular groove array; the fluid outlet flow passage is respectively communicated with the fluid outlet pipeline and the manifold; the collecting cavity is communicated with the spraying cavity without boundaries; the heat pipe semicircular groove array is used for accommodating an evaporation end of the heat pipe.
7. The efficient spray phase-change liquid cooling device for the double-sided chip of the server as claimed in claim 1, wherein the gas storage plates of the first and third spray liquid cooling modules are provided with gas cavities and gas inlet channels; the gas cavity of the first spray liquid cooling assembly gas storage plate is a cavity, and the gas cavity of the third spray liquid cooling assembly gas storage plate is a concave cavity;
the slotting direction of the heat pipe semicircular groove array on the spray condensation end plate of the third spray liquid cooling assembly is vertical to the slotting direction of the heat pipe semicircular groove array on the spray condensation end plate of the first spray liquid cooling assembly, so that the heat pipe semicircular groove array adapts to the bending shape of the heat pipe and is in close contact with the round condensation end of the heat pipe.
8. The efficient spraying phase-change liquid cooling device for the double-sided chip of the server as claimed in claim 3, wherein one end of the heat pipe is a D-shaped evaporation end, the other end of the heat pipe is a circular condensation end, and the heat pipe is bent by 90 degrees; the heat pipes comprise two groups which are symmetrically arranged, wherein the evaporation end of one group of heat pipes is tightly contacted with the high heat flow density chip and the first spray liquid cooling assembly heat pipe semicircular groove array; the evaporation ends of the heat pipes in the other group are in close contact with the high heat flow density chip and the second spray liquid cooling assembly heat pipe semicircular groove array; the condensation end is in close contact with the heat pipe semicircular groove array of the third spray liquid cooling assembly, and silicone grease is uniformly coated on the contact surface.
9. The efficient spray phase-change liquid cooling device for the double-sided chip of the server according to claim 3 or 7,
the third spraying liquid cooling assembly is a micro-channel liquid cooling plate or a jet flow cooling module;
the heat pipe is a flat heat pipe, a vapor chamber, a blowing-up vapor chamber or other phase-change heat transfer elements;
the inner surfaces of the spray cavities of the first spray condensation end plate, the second spray condensation end plate and the third spray condensation end plate are provided with a micro-channel array or a micro-turbulence column array so as to increase the heat dissipation area and the liquid turbulence degree and further strengthen the heat dissipation effect of the heat dissipation device.
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CN202221175616.9U CN217470627U (en) | 2022-05-13 | 2022-05-13 | Efficient spraying phase-change liquid cooling device for double-sided chip of server |
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CN202221175616.9U CN217470627U (en) | 2022-05-13 | 2022-05-13 | Efficient spraying phase-change liquid cooling device for double-sided chip of server |
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